Package Details DPAK Case Mechanical Drawing Lead Code: Part Marking: Full Part Number Reference individual device datasheet. Mounting Pad Geometry (Dimensions in mm) R0 (7-January 2013) w w w. c e n t r a l s e m i . c o m Package Details DPAK Case Tape Dimensions and Orientation (Dimensions in mm) Devices are taped in accordance with Electronic Industries Association Standard EIA-481-D Tape Width: 16mm Direction of Unreeling Packaging Base 13” Reel = 2,500 pcs. Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order Number, Quantity, Lot Number, Date Code and Ship Date. Reel Packing Information Reel Size 13” Reels per Box (Maximum) Parts per Box (Maximum) INCH CM LB 4 10,000 15x4x15 38x10x38 14 7 9 22,500 15x15x9 38x38x23 29 14 18 45,000 15x15x18 38x38x46 57 26 Box Dimensions Shipping Weight (Max.) KG Ordering Information • For devices taped and reeled on 13” reels, add TR13 suffix to part number. • All SMDs are available in small quantities for prototype and manual placement applications. R0 (7-January 2013) w w w. c e n t r a l s e m i . c o m Material Composition Specification DPAK Case Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material Component Material Substance Substance CAS No. (%wt) (mg) (%wt) (mg) (ppm) active device doped Si 0.75% 2.2 Si 7440-21-3 0.74% 2.2 7,407 bond wire aluminum 1.55% 4.6 Al 7429-90-5 1.55% 4.6 15,488 Cu 7440-50-8 52.46% 155.8 524,579 leadframe Cu alloy 52.53% 156 Fe 7439-89-6 0.07% 0.2 673 Pb 7439-92-1 3.74% 11.1 37,374 Sn 7440-31-5 0.2% 0.6 2,020 Ag 7440-22-4 0.1% 0.3 1,010 silica 7631-86-9 26.01% 77.26 260,135 epoxy resin 29690-82-2 7.65% 22.73 76,532 phenol resin 9003-35-4 3.82% 11.35 38,215 Sb2O3 1309-64-4 0.38% 1.13 3,805 Br 7726-95-6 0.38% 1.13 3,805 silica (fused) 60676-86-0 29.44% 87.43 294,377 epoxy resin 29690-82-2 3.82% 11.36 38,249 phenol resin 9003-35-4 3.71% 11.02 37,104 carbon black 1333-86-4 0.11% 0.34 1,145 metal hydroxide 1309-42-8 1.16% 3.45 11,616 Sn 7440-31-5 2.6% 7.74 26,061 Pb 7439-92-1 0.29% 0.86 2,896 Sn 7440-31-5 2.90% 8.60 28,956 die attach high temperature solder paste EMC 4.04% 38.25% 12 113.6 encapsulation* EMC GREEN tin/lead process 38.25% 2.9% 113.6 8.6 plating** matte tin 2.9% 8.6 *EMC GREEN molding compound is Halogen-Free. **For Lead Free plating, add suffix “LEAD FREE” to part number. For Tin/Lead plating, add suffix “TIN/LEAD” to part number. No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R3 (25-February 2013) w w w. c e n t r a l s e m i . c o m