Package Details - TO-18 Mechanical Drawing DIMENSIONS INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX A (DIA) 0.209 0.230 5.31 5.84 B (DIA) 0.178 0.195 4.52 4.95 C 0.030 0.76 D 0.170 0.210 4.32 5.33 E 0.500 12.70 F (DIA) 0.016 0.019 0.41 0.48 0.100 2.54 G (DIA) 0.050 1.27 H I 0.036 0.046 0.91 1.17 J 0.028 0.048 0.71 1.22 TO-18 (REV: R1) LEAD CODE: SCR 1) CATHODE 2) GATE 3) ANODE * FET 1) SOURCE 2) GATE 3) DRAIN TRANSISTOR 1) EMITTER 2) BASE 3) COLLECTOR * Note: See individual device datasheet for pinout information or 1) SOURCE 2) DRAIN 3) GATE Packing Code: D D = White corrugated box with black conductive coating (surface resistivity of <105 ohms per square). Standard Packing Quantity: 2K Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R0 (21-June 2004) Material Composition Specification TO-18 Case Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312.4 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material Component Material Substance Substance (%wt) (mg) active device doped Si 1.6% 5.0 bond wire Al alloy 0.125% 0.39 header can alloy 183.71 (%wt) (mg) (ppm) Si 7440-21-3 1.6% 5.0 16,004 Al 7429-90-5 0.122% 0.38 1,216 Si 7440-21-3 0.003% 0.01 32 Fe 7439-89-6 22.161% 69.236 221,615 Ni 7440-02-0 14.511% 45.334 145,108 42 134,436 glass Kovar 58.8% (Fe/Ni/Co alloy) CAS No. Proprietary 13.444% Co 7440-48-4 7.808% 24.392 78,075 Mn 7439-96-5 0.217% 0.677 2,167 P 7723-14-0 0.18% 0.561 1,796 Si 7440-21-3 0.13% 0.406 1,300 Ag 7440-22-4 0.23% 0.72 2,305 C 1333-86-4 0.21% 0.067 214 Cu 7440-50-8 0.09% 0.28 896 S 7704-34-9 0.013% 0.041 131 Fe 7439-89-6 36.698% 114.65 366,979 C 1333-86-4 0.017% 0.052 166 Mn 7439-96-5 0.074% 0.23 736 Al 7429-90-5 0.019% 0.06 192 36.81% 114.99 can plating (inner layer) nickel 1.06% 3.32 Ni 7440-02-0 1.06% 3.32 10,627 can plating (outer layer) matte tin** 1.44% 4.5 Sn 7440-31-5 1.44% 4.5 14,404 lead free termination plating* matte tin** 0.16% 0.5 Sn 7440-31-5 0.16% 0.5 1,601 *For Lead Free termination plating, add suffix “LEAD FREE” to part number. **Contact the Central Semiconductor Sales Department for tin/lead plating availability. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R2 (25-November 2014) w w w. c e n t r a l s e m i . c o m