Package Details SMBFL Case Mechanical Drawing Lead Code: Part Marking: 3-7 Character Alpha/Numeric Code Reference individual device datasheet. Mounting Pad Geometry (Dimensions in mm) R0 (27-March 2013) w w w. c e n t r a l s e m i . c o m Package Details SMBFL Case Tape Dimensions and Orientation (Dimensions in mm) Devices are taped in accordance with Electronic Industries Association Standard EIA-481-D Tape Width: 12mm Direction of Unreeling Packaging Base 13” Reel = 5,000 pcs. Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order Number, Quantity, Lot Number, Date Code and Ship Date. Reel Packing Information Reel Size 13” Reels per Box (Maximum) Parts per Box (Maximum) INCH CM LB KG 5 25,000 15x4x15 38x10x38 9 5 Box Dimensions Shipping Weight (Max.) 14 70,000 15x15x9 38x38x23 23 11 26 130,000 15x15x18 38x38x46 42 20 Ordering Information • For devices taped and reeled on 13” reels, add TR13 suffix to part number. • All SMDs are available in small quantities for prototype and manual placement applications. R0 (27-March 2013) w w w. c e n t r a l s e m i . c o m Material Composition Specification SMBFL Case Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material Component Material (%wt) (mg) active device doped Si 1.54% 0.77 leadframe copper alloy 50.08% 25.038 die attach encapsulation* plating high temperature solder paste EMC GREEN matte tin Substance Substance CAS No. 4.95% 42.23% 1.2% (%wt) (mg) (ppm) Si 7440-21-3 1.54% 0.77 15,400 Cu 7440-50-8 50% 25 500,000 Fe 7439-89-6 0.08% 0.038 760 Pb 7439-92-1 4.58% 2.29 45,800 Sn 7440-31-5 0.25% 0.124 2,480 Ag 7440-22-4 0.12% 0.062 1,240 silica (fused) 60676-86-0 32.52% 16.26 325,200 epoxy resin 29690-82-2 4.22% 2.11 42,200 21.116 phenol resin 9003-35-4 4.1% 2.05 41,000 carbon black 1333-86-4 0.13% 0.063 1,260 metal hydroxide 1309-42-8 1.27% 0.633 12,660 Sn 7440-31-5 1.2% 0.6 12,000 2.476 0.6 *EMC GREEN molding compound is Halogen-Free. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R0 (13-August 2012) w w w. c e n t r a l s e m i . c o m