20160329112635323

APW7566/A
The Synchronous Buck Converter with 300mA LDO
Features
General Description
•
Wide Input Operating Range: 4.5V~5.5V
The APW7566 is P-channel low dropout linear regulator
•
Synchronous Buck Regulators for SoC:
and synchronous buck converter which needs input voltage from 4.5 to 5.5V.
-Fixed 1.05V (For APW7566)
-Fixed 1.2V (For APW7566A)
Synchronous buck converter is integrated high side and
low side power MOSFET. It is equipped with an auto-
- 1.2A peak Output Current for Core Power
- 2MHz Switching Frequency
•
matic PSM/PWM mode operation. At light load, the IC operates in the PSM mode to reduce the switching losses.
Low-Dropout Linear Regulators for System Power:
At heavy load, the IC works in PWM mode.
Low dropout linear regulator delivers current up to 300mA
- Fixed 3.3V, 300mA Output Current with high PSRR
•
Thermal-Overload Protection
•
Power-OK Indicator after LDO Ready
•
TDFN2x2-8 Package
•
Lead Free Green Devices Available (RoHS
to set output voltage, and it also can work with low ESR
ceramic capacitors. Typical dropout voltage is only 240mV
at 300mA loading.
The APW7566 is equipped with Power-on-reset, shut-
Compliant)
down control, soft start, over-temperature and currentlimit into a single package to protect the device against
Applications
wrong logic control and over-temperature and current
over-loads.
•
•
IP-Cam
The APW7566 available TDFN2x2-8 provides a very compact system solution external components and PCB area.
•
Security
Car Recorder
Simplified Application Circuit
VPWM
VIN
L
VDD
LX
Cout
Cin
EN
POK
POK
PGND
PWM_FB
VLDO
VLDO
AGND
CLDO
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2016
1
www.anpec.com.tw
APW7566/A
Ordering and Marking Information
P a ckage C o de
Q B :T Q F N 2 x 2 - 8
O p e r a tin g A m b ie n t T e m p e ra tu r e R a n g e
A P W 7 5 6 6 /A
L e a d F re e C o d e
H a n d lin g C o d e
T e m p e ra tu r e R a n g e
P a ckage C o de
P ro d u c t C o d e
I : - 4 0 to 8 5 ° C
O u t p u t V o lta g e C o d e:
B la n k :1 .0 5 V
A :1 .2 V
H a n d lin g C o d e
TR : Tape & Reel
A s s e m b ly M a te r ia l
G :H a lo g e n a n d L e e d F re e D e v ic e
APW 7566 Q B:
W 566
XXXXX
X X X X X- -D a te C o d e
APW 7566AQ B:
W 66A
XXXXX
X X X X X- -D a te C o d e
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Pin Configuration
PGND
LX
1
8
AGND
2
7 PWM_FB
EN
3
6
VDD
POK
4
5
VLDO
TDFN2x2-8
(TOP View)
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
VDD,VLDO to GND Voltage
LX to GND Voltage
All other pins
Power Dissipation
TJ
TSTG
TSDR
Rating
Unit
-0.3 ~ 7
V
>20ns
-1 ~ (VVDD)+0.3
V
<20ns
-3 ~ (VVDD )+3
V
-0.3 ~7
V
Internally Limited
Maximum Junction Temperature
Storage Temperature
Maximum Lead Soldering Temperature (10 Seconds)
W
-40 ~ 150
o
-65 ~ 150
o
260
o
C
C
C
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2016
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APW7566/A
Thermal Characteristics
Symbol
Parameter
Typical Value
Junction-to-Ambient Resistance in free air (Note 2)
θJA
TDFN 2x2-8
165
o
20
o
Junction-to-Case Resistance in free air (Note 3)
θJC
Unit
TDFN 2x2-8
C/W
C/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
is soldered directly on the PCB.
Note 3: The case temperature is measured at the center of the exposed pad on the underside.
Recommended Operating Conditions (Note 4)
Symbol
P arame ter
VVD D
V DD Sup ply Voltage
I OUT
P eak Con ve rte r O utput Cur rent
I LDO
V LDO Output Cu rrent
L
Indu ctor
COUT
V OUT Ou tpu t Capacitor
C LDO
V LDO Output Ca pacitor
TA
Amb ient Temp erature
TJ
Junction Tempera tu re
Range
Unit
4 .5 ~ 5 .5
V
0 ~ 1 .2
A
0 ~ 0 .3
A
0 .4 7~2 .2
µH
4 .7~22
µF
1 ~22
µF
- 40 ~ 85
o
-40 ~ 1 25
o
C
C
Note 4: Refer to the typical application circuit.
Electrical Characteristics
Unless otherwise specified, these specifications apply over VDD=5V. Typical values are at TA=25oC.
AP W7566
S ym bol
Parameter
Te st Conditions
Unit
Min
Typ
M ax
-
250
300
μA
-
-
5
μA
PO R Threshol d
2 .3
2.6
2.85
V
PO R Hystere sis
-
0.1
-
V
SUPPLY CURRENT
IVDD
Qui esce nt Curre nt
ISD
Shu tdo wn Quiescent
VPWM_ FB=0.6V
POWER-ON-RES ET (PWM/LDO)
OUTPUT VOLTAGE (PWM)
Outpu t Voltage Accur acy
APW75 66
APW75 66A
Line Reg ulation
IOUT =1mA, VVDD =4.5V to 5.5V
Loa d Re gulation
IPWM=30 0mA to 800mA , VVDD = 5V
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2016
3
1.03
1.0 5
1.07
V
1.17 6
1.2
1.224
V
-
-
0.7
%/V
0.5
%
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APW7566/A
Electrical Characteristics
Unless otherwise specified, these specifications apply over VDD=5V. Typical values are at TA=25oC.
APW75 66
Pa ram eter
S ym bol
Test Conditions
Unit
Min
Typ
Max
3.218
3 .3
3.382
V
OUTPUT VOLTAGE (LDO)
Output Vo ltag e Accuracy
V DROP
PS RR
IL DO =1mA~0.3 A,
o
T A=-40 ~85 C
Line Regu lation
IL DO =1mA,
VVDD=4.5V to 5 .5V
-
-
0 .2
%/V
Load Regu lation
IL DO =1mA to 300mA,
VVDD=4.5V
-
-
0 .9
%
Dr opout Volta ge
IL DO =300 mA
-
24 0
33 0
mV
Power Sup ply Reje ction Ratio
IL DO =50mA,
C LDO =2.2µF
-
50
-
dB
-
1
-
KΩ
f=1kHz
Di scha rge Resistance
POWER MOS FE TS(PWM)
R P-FET
Hi gh Side P- MOS RD S(ON)
IL X=200 mA
-
0.35
0 .4
Ω
R N-FET
Low S ide N-MOS R DS(ON)
IL X=200 mA
-
0.35
0 .4
Ω
De ad Time
(Note 5 )
TD
10
ns
POWER-OK AND DELAY
POK Thresho ld(POK goes high)
Risi ng
-
90% V LDO
-
V
POK Dela y Time
The time from V LDO =90% *V LDO
to POK goes high
-
16
-
ms
-
10 0
-
µs
-
50 0
-
Ω
POK Debo unce Time
POK P ull Low Resista nce
VPOK=0.1V
ENABLE AND SHUTDO WN
Enab le Vo ltag e Thre sh old
VEN Risi ng
1
-
-
V
Shutdown Voltage Threshold
VEN Falling
-
-
0 .4
V
1.5
1 .6
-
A
PROTECTIONS(PWM)
Ma ximu m Inductor Current-Limit
Soft-Start Time
-
0 .7
-
ms
1.7
2
2 .3
MHz
Un der Voltage Protection
-
40
50
%
Ma ximu m Duty Cycle
-
95
-
%
330
45 0
75 0
mA
F SW
Switchi ng Fr equen cy
UV P
VPWM_ FB =0 .6V
PROTECTIONS(LDO)
Cu rrent Limit
Copyright  ANPEC Electronics Corp.
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APW7566/A
Electrical Characteristics
Unless otherwise specified, these specifications apply over VDD=5V. Typical values are at TA=25oC.
Symbol
Parameter
Test Conditions
APW7566
Min
Typ
Max
Unit
PROTECTIONS(PWM, LDO)
T OTP
Over-Temperature Protection
T J Rising
-
150
-
°C
Over-Temperature Protection
Hysteresis
T J Falling
-
30
-
°C
Note 5: Guaranteed by design.
Copyright  ANPEC Electronics Corp.
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APW7566/A
Typical Operating Characteristics
VPWM Voltage VS Input Volatge
5
1.08
4
1.07
VPWM Voltage (V)
Current (uA)
Shutdown Current VS Input Voltage
3
2
1
0
1.06
1.05
1.04
2
2.5
3
3.5
4
4.5
5
5.5
1.03
6
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Input Voltage (V)
Efficiency VS Input Voltage
No Switch Current VS Input Voltage
100
6
500
90
400
70
Current (uA)
Efficiency (%)
80
60
50
40
300
200
30
20
100
10
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
0
1
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Output Loading (A)
LDO Voltage VS Input Voltage
3.33
LDO Voltage (V)
3.32
3.31
3.3
3.29
3.28
3.27
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
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APW7566/A
Operating Waveforms
Normal Operation – Loading=0.8A
Power on VIN – Loading=0.8A
CH2
CH2
CH1
CH1
CH3
CH3
CH4
CH4
VIN=12V,Freq=400KHz,ILEDx=120mA,16S4P
CH1:VLDO-2V/div
CH2:VPWM-1V/div
CH3:VIN-5V/div
CH4:IL-500mA/div
Time:1us/div
CH1:VLDO-50V/div
CH2:VPWM-500mV/div
CH3:VIN-5V/div
CH4:IL-1A/div
Time:2ms/div
Power on VIN – Loading=0.8A
Power on VIN - POK
CH2
CH2
CH1
CH1
CH3
CH3
CH4
CH4
CH1:VLDO-2V/div
CH2:VPOK-2V/div
CH3:VVIN-5V/div
CH4:IL-200mA/div
Time:5ms/div
CH1:VPOK-2V/div
CH2:VLDO-2V/div
CH3:VIN-5V/div
CH4:IL-1A/div
Time:5ms/div
Copyright  ANPEC Electronics Corp.
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APW7566/A
Operating Waveforms
Load Transient
0.3A to 0.8A to 0.3A
LDO Load Transient - 0A to 0.3A to 0A
CH1
CH1
CH2
CH2
VIN=12V,Freq=400KHz,ILEDx=120mA
16S4P,DC Mode
CH1:VLDO-100mV/div
CH2:ILDO-200mA/div
Time:2ms/div
CH1:VPWM-20mV/div
CH2:IL-500mA/div
Time:50us/div
OTP – Loading=0.8A
CH2
CH3
CH4
CH1
CH1:VPOK-5V/div
CH2:VPWM-1V/div
CH3:VLDO-5V/Div
CH4:IL-1A/div
Time:500ms/div
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APW7566/A
Pin Description
PIN
NO.
Name
1
LX
2
AGND
3
EN
4
POK
5
VLDO
6
VDD
7
PWM_FB
8
PGND
Function
Po wer S witchin g Output. The LX is the ju nctio n o f the high -sid e and low-side po we r MO SFET to supply
power to the output LC filter.
Conne ct th is pi n with larg e cop per area to neg ative termin als of th e input and outpu t capacitors.
En able Control In put. Forcing th is pin above 1.0V enab les the device, or fo rcing thi s pin belo w 0.4V to shut it
down. In shu tdo wn , all functions a re disable d. This p in is floating as the d evice will be e nabli ng.
Po wer G ood function. Its monitor VL DO o utput voltage .
Regul ator Output Pin.
Po wer Inpu t. Conne ct a cer amic bypass cap acitor from VDD to GND. VDD is suppl y VL DO ou tp ut po we r.
Ou tp ut Feedb ack In put. Th e APW7 566 senses the feedba ck vo ltag e via PWM_FB and regu lates the vol tag e
at 1.05V/1.2V.
Conne ct th is pi n with larg e cop per area to neg ative termin als of th e input and outpu t capacitors.
Copyright  ANPEC Electronics Corp.
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APW7566/A
Block Diagram
VLDO
AVDD
POK
POK
Circuit
EA
Slop
Compensation
Oscillator
S
ICOMP
VDD
PWM_FB
0.6V
EN
EA
UVLO
VDD
Shutdown
IRCMP
PGND
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2016
LX
Control
Logic
R Q
S Q
10
AGND
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APW7566/A
Typical Application Circuit
VPWM
VIN
6
AVDD
LX
1
L1 2.2uH
C1
22uF/6.3V
3
PGND
EN
8
C2
22uF/6.3V
APW7566/A
4
POK
POK
PWM_FB
7
VLDO
5
AGND
VLDO
2
C4
4.7uF/6.3V
*Recommend:
The C1 capacitor must be close to the IC side less than 3mm.
Copyright  ANPEC Electronics Corp.
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APW7566/A
Function Description
Power-On-Reset (POR)
Power Sequence
The APW7566 monitors the input voltage to prevent wrong
logic control. The POR function initiates a soft-start pro-
The APW7566 provides difference power Sequences to
choose for different applications. Figure 1 show the tim-
cess after input voltage exceeds its rising POR threshold
during power on. The POR function also shuts off the
ing diagram of different version of the APW7566.
output when the input voltage falls below its falling
threshold.
VDD
Internal Soft-Start
EN
An internal soft-start function controls rising rate of the
output voltage to limit the surge current at start-up.
Vout
Current-Limit protection
The buck converter monitors the output current, flows
through the high-side and low-side power MOSFETs, and
LDO
POK
limits the current peak at current-limit level to prevent the
IC from damaging during overload, short-circuit
2ms 10ms
0.7ms
conditions.
Figure 1. Power Sequence
Thermal Shutdown
A thermal shutdown circuit limits the junction tempera-
Under Voltage Protection
ture of APW7566. When the junction temperature exceeds
+150oC, a thermal sensor turns off the output PMOS, al-
The APW7566 had UVP function. In the process of
operation, if a short-circuit occurs, the output voltage will
lowing the device to cool down. The regulator regulates
the output against through initiation of a new soft-start
drop quickly. When load current is bigger than current
limit threshold value, the output voltage will fall out of the
cycle after the junction temperature cools by 150oC. The
thermal shutdown is designed with a 30oC hysteresis to
required regulation range. If a load step is strong enough
to pull the output voltage lower than the under voltage
lower the average junction temperature during continuous thermal overload conditions, extending lifetime of
threshold (40% of normal output voltage), APW7566 shuts
down the output gradually and latches off both high and
the device.
low side MOSFETs.
Power OK Indicator
POK is actively held low in shutdown and soft-start status.
In the soft-start process, the POK is an open-drain, after
Converter is ready, the POK is released.
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APW7566/A
Application Information
Input Capacitor Selection
Output Capacitor
The buck converters in APW7566 have a pulsating input
current; a low ESR input capacitor is required. This re-
The buck converter in APW7566 allows the use of tiny
ceramic capacitors. The higher capacitor value provides
the good load transients response. Ceramic capacitors
sults in the best input voltage filtering, minimizing the
interference with other circuits caused by high input volt-
with low ESR values have the lowest output voltage ripple
and are recommended. If required, tantalum capacitors
age spikes. Also, the input capacitor must be sufficiently
large to stabilize the input voltage during heavy load
may be used as well. The output ripple is the sum of the
voltages across the ESR and the ideal output capacitor.
transients. For good input voltage filtering, usually a 22µF
input capacitor is sufficient. It can be increased without
any limit for better input-voltage filtering. Ceramic capacitors show better performance because of the low ESR
VOUT
)
1
VIN
(ESR +
)
⋅L
8 ⋅ FSW ⋅ C OUT
VOUT ⋅ (1 −
ΔV OUT ≅
value, and they are less sensitive against voltage transients and spikes compared to tantalum capacitors. Place
the input capacitor as close as possible to the VDD to
GND pin of the device for better performance.
FSW
When choosing the input and output ceramic capacitors,
choose the X5R or X7R dielectric formulations. These
Inductor Selection
dielectrics have the best temperature and voltage characteristics of all the ceramics for a given value and size.
For high efficiencies, the inductor should have a low DC
resistance to minimize conduction losses. Especially at
The LDO regulator in APW7566 needs a proper output
capacitor to maintain circuit stability and improve transient
high-switching frequencies, the core material has a
response over temperature and current. In order to in-
higher impact on efficiency. W hen using small chip
inductors, the efficiency is reduced mainly due to higher
sure the circuit stability, the proper output capacitor value
should be larger than 4.7µF. With X5R and X7R dielectrics,
inductor core losses. This needs to be considered when
selecting the appropriate inductor. The inductor value
4.7µF is sufficient at all operating temperatures. Large
output capacitor value can reduce noise and improve load-
determines the inductor ripple current. The larger the inductor value, the smaller the inductor ripple current and
transient response and PSRR.
the lower the conduction losses of the converter.
Conversely, larger inductor values cause a slower load
transient response. A reasonable starting point for setting ripple current, ∆IL, is 40% of maximum output current.
The recommended inductor value can be calculated as
below:
L≥
VOUT
)
VIN
⋅ ∆IL
VOUT (1 −
FSW
IL(MAX)=IOUT(MAX)+1/2x∆IL
To avoid the saturation of the inductor, the inductor should
be rated at least for the maximum output current of the
converter plus the inductor ripple current.
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APW7566/A
Application Information
Layout Consideration
The layout is an important step in the design; especially
at high peak currents and switching frequencies. If the
layout is not carefully done, the regulator might show
noise problems and duty cycle jitter.
1. The input capacitor should be placed close to the VDD
and GND. Connecting the capacitor and VDD to GND with
short and wide trace without any via holes for good input
voltage filtering. The distance between VDD to GND to
capacitor less than 2mm respectively is recommended.
2. To minimize copper trace connections that can inject
noise into the system, the inductor should be placed as
close as possible to the LX pin to minimize the noise
coupling into other circuits.
3. The output capacitor should be place closed to LX and
GND.
4. Since the feedback pin and network is a high impedance circuit the feedback network should be routed away
from the inductor. The feedback pin and feedback network should be shielded with a ground plane or trace to
minimize noise coupling into this circuit.
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APW7566/A
Package Information
TDFN2x2-8
A
b
E
D
D2
A1
E2
A3
L
Pin 1 Corner
e
S
Y
M
B
O
L
MIN.
MAX.
MIN.
MAX.
A
0.70
0.80
0.028
0.031
A1
0.00
0.05
0.000
0.002
0.30
0.007
0.012
0.083
TDFN2x2-8
MILLIMETERS
A3
b
INCHES
0.20 REF
0.18
0.008 REF
D
1.90
2.10
0.075
D2
1.00
1.60
0.039
0.063
E
1.90
2.10
0.075
0.083
E2
0.60
1.00
0.024
0.039
0.45
0.012
e
L
0.50 BSC
0.30
0.020 BSC
0.018
Note : 1. Follow from JEDEC MO-229 WCCD-3.
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APW7566/A
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
TDFN2x2-8
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.20
1.75±0.10
3.50±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
2.35 MIN
2.35 MIN
1.00±0.20
4.0±0.10
4.0±0.10
1.5 0.6+0.00
MIN.
-0.4
(mm)
Devices Per Unit
Package Type
Unit
Quantity
TDFN2x2-8
Tape & Reel
3000
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APW7566/A
Taping Direction Information
TDFN2x2-8
USER DIRECTION OF FEED
Classification Profile
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APW7566/A
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2016
18
Description
5 Sec, 245°C
1000 Hrs, Bias @ 125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
www.anpec.com.tw
APW7566/A
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
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Taipei Branch :
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Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jan., 2016
19
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