Known Good Die (KGD)/Wafer Level Memories Introduction Die-level customers require a memory partner who can meet their many unique needs for high quality, long term support, guaranteed availability, and low total cost of ownership. ISSI is a provider of high quality specialty memory solutions for DRAMs, PSRAMs and SRAMs. Core to our strategy is to provide long term support for applications such as automotive, communications and industrial markets where design cycles can be 3-4 years from concept to production, followed by 5-6 years product life. Recognizing the unique fit of ISSI products with die-level customers needs, ISSI created a business unit to focus on die-level products to provide highest quality products with long term support. For your stacked die product to be successful you require a memory supplier who has extensive experience directly supporting the die-level market. This means a dedicated engineering team developing products which are specifically defined, designed, and tested to meet die customer needs. ISSI SOLUTIONS KGD CUSTOMER NEEDS • Low to medium density SDRAMs: 16Mb-512Mb, SDR, DDR, DDR2 • Broadest portfolio of SRAMs and PSRAMs in the industry Low Power Solutions • Lowest power mobile devices in the industry • 16Mb-512Mb LP-SDR & LP-DDR options, PSRAMs, Ultra-Low Power SRAMs Long Life Cycle • Long product life: 7-10 years typical • Advanced process nodes for future products High Quality (Low ppm) • KGD test flow includes Wafer Level Burn In (WLBI) & Speed-Sort • MCP Final Test Yield Target >99.9% for KGD Reliable Supply • Wafer Bank to support volume production • Volume wafer purchase for lower total cost Test Flow options • Full KGD test flow option • Proprietary voltage and temperature stress scheme emulates package level burn-in Custom Pad Layout • Pad layouts designed for KGD use • ReDistribution Layer (RDL) or Bumped Die for custom pad layout Product Portfolio Summary ISSI has a proven track record providing wafer & die solutions to many leading chipset and system companies. We are committed to working with our customers to provide them with the most cost-effective and highest quality products, so when you begin planning your next generation MCP or Stacked Die contact ISSI and see how we can “enable your MCP to be successful”. 1940 Zanker Rd. • San Jose, CA. 95112 • Tel: 408.969.6600 • [email protected] • www.issi.com Selecting a Die Product • Stacked die offers smallest form factor, lower cost, improved reliability • Bonding pads on two-edges • RDL & bumped die options for flip chip and CSP • LP-SDR, LP-DDR, SDR/DDR, DDR2, • EDO/Fast Page DRAM • PSRAM, SRAM • 1.8V, 2.5V and 3.3V • 5V option for EDO/FP DRAMs and Async. SRAMs • Speed and temperature grades • Technical support, assembly information, SIP/ MCP level testing Terminology • Wafer probe = Test die in wafer form using Probe Card • CP = Chip Probe (aka wafer probe test step) • WLBI = Wafer Level Burn In • Speed Sort = High speed wafer test • Sorted Die or Tested Die = Die that has limited testing, i.e. Sort test only • KGD = Known Good Die (fully tested die including WLBI and speed sort) • SIP = System In Package • MCP = Multi Chip Package • MCM = Multi-Chip Module • POP = Package on Package • COB = Chip On Board • SOC = System On Chip 1940 Zanker Rd. • San Jose, CA. 95112 • Tel: 408.969.6600 • [email protected] • www.issi.com SDRAM and PSRAM Selection Guide MEMORY TYPE(1) DENSITY CONFIG.(2) 16Mb 1Mx16 32Mb 2Mx16, 1Mx32 64Mb 4Mx16, 2Mx32 128Mb 8Mx16, 4Mx32 32Mb 2Mx16, 1Mx32 64Mb 4Mx16, 2Mx32 128Mb 8Mx16, 4Mx32 256Mb 16Mx16, 8Mx32 512Mb 32Mx16, 16Mx32 16Mb 1Mx16 32Mb 2Mx16 64Mb 4Mx16 16Mb 1Mx16 64Mb 4Mx16 128Mb 256Mb 512Mb 8Mx16, 4Mx32 16Mx16, 8Mx32 32Mx16, 16Mx32 MOBILE PRODUCTS LP-SDR LP-DDR SYNCHRONOUS DRAM PSRAM / CRAM SDR 64Mb DDR(4) 4Mx16, 2Mx32 4Mx16 128Mb 256Mb 512Mb 8Mx16, 4Mx32 16Mx16, 8Mx32 32Mx16, 16Mx32 PART # / DIE REVISION IS42SM16100G IS42RM16100G IS42VM16100G IS42SM16200C / 32100C IS42RM16200C / 32100C IS42VM16200C / 32100C IS42SM16400G / 32200G IS42RM16400G / 32200G IS42VM16400G / 32200G IS42SM16400K / 32200K(3) IS42RM16400K / 32200K(3) IS42VM16400K / 32200K(3) IS42SM16800G / 32400G IS42RM16800G / 32400G IS42VM16800G / 32400G IS43LSR16200C / 32100C IS43LRR16200C / 32100C IS43LR16200C / 32100C IS43LSR16400B / 32200B IS43LRR16400B / 32200B IS43LR16400B / 32200B IS43LSR16800F / 32400F IS43LRR16800F / 32400F IS43LR16800F / 32400F IS43LSR16160E / 32800E IS43LRR16160E / 32800E IS43LR16160E / 32800E IS43LSR16320C / 32160C IS43LRR16320C / 32160C IS43LR16320C / 32160C IS66WVC1M16ALL IS66WVD1M16ALL IS66WVE1M16ALL/BLL IS66WVC2M16ALL IS66WVD2M16ALL IS66WVE2M16ALL/BLL IS66WVC4M16ALL IS66WVD4M16ALL IS66WVE4M16ALL/BLL IS42S16100F IS42R16100F IS42VS16100F IS42S16400F / 16401F IS42S16400J(3) IS42S16800F / 32400F IS42S16160G / 32800G IS42S16320D / 32160D IS43R16400A / 32200A IS43R16401A / 32201A IS43R16400B(3) IS43R16800E / 32400E IS43R16160D / 32800D IS43R16320D / 32160D Notes: 1. SDR = Single Data rate, DDR = Double Data rate, LP = Low Power or Mobile 2. x16 and x32 configuration selected by bonding option 3. Die Shrink - recommended for new designs 4. ISSI continues to introduce new DDR2 devices in a range of densities VDD 3.3V 2.5V 1.8V 3.3V 2.5V 1.8V 3.3V 2.5V 1.8V 3.3V 2.5V 1.8V 3.3V 2.5V 1.8V 3.3V 2.5V 1.8V 3.3V 2.5V 1.8V 3.3V 2.5V 1.8V 3.3V 2.5V 1.8V 3.3V 2.5V 1.8V 1.8V 1.8V 1.8V/3.0V 1.8V 1.8V 1.8V/3.0V 1.8V 1.8V 1.8V/3.0V 3.3V 2.5V 1.8V 3.3V 3.3V 3.3V 3.3V 3.3V 2.5V 2.5V 2.5V MAX. SPEED 200Mhz 166Mhz 166Mhz 200Mhz 200Mhz 166Mhz 200Mhz 166Mhz 166Mhz 200Mhz 200Mhz 200Mhz 200Mhz 200Mhz 166Mhz 200Mhz 200Mhz 166Mhz 200Mhz 200Mhz 200Mhz 200Mhz 200Mhz 200Mhz 200Mhz 200Mhz 166Mhz 200Mhz 200Mhz 166Mhz 133Mhz 133Mhz 70ns 133Mhz 133Mhz 70ns 133Mhz 133Mhz 70ns 200Mhz 200Mhz 133Mhz 200Mhz 200Mhz 200Mhz 200Mhz 200Mhz 200Mhz 200Mhz 200Mhz STATUS Prod Prod Prod Prod Prod Prod Prod Prod Prod S=Q1/11 S=Q1/11 S=Q1/11 Prod Q1/11 Prod Q1/11 Prod Q1/11 Prod Prod Prod S=Q1/11 S=Q1/11 S=Q1/11 Prod Q1/11 Prod Q1/11 Prod Q1/11 Contact Marketing Contact Marketing Contact Marketing Contact Marketing Contact Marketing Contact Marketing Prod Q1/11 Prod Q1/11 Prod Q1/11 Contact Marketing Contact Marketing Contact Marketing Prod Prod Prod Prod Prod Prod Q1/11 Prod S=Q1/11 Contact Marketing Contact Marketing S=Q1/11 S=Q1/11 S=Q1/11 S=Q1/11 2.5V 2.5V 2.5V 200Mhz 200Mhz 200Mhz Contact Marketing Contact Marketing S=Q1/11 Status: S = Samples Prod = Production 1940 Zanker Rd. • San Jose, CA. 95112 • Tel: 408.969.6600 • [email protected] • www.issi.com EDO & Fast Page Mode DRAM Selection Guide MEMORY TYPE(1) DENSITY CONFIG.(2) 256Kx16 4Mb ASYNCHRONOUS DRAM 1Mx4 EDO 4Mx4 16M 1Mx16 256Kx16 4M 1Mx4 Fast Page (FP) 4Mx4 16M 1Mx16 PART # / DIE REVISION VDD MAX. SPEED IS41LV16256C 3.3V 35ns STATUS Prod Q1/11 IS41C16256C 5.0V 35ns Prod Q1/11 IS41LV4100C 3.3V 35ns Prod Q1/11 IS41C4100C 5.0V 35ns Prod Q1/11 IS41LV44002C 3.3V 50ns Prod Q1/11 IS41C44002C 5.0V 50ns Prod Q1/11 IS41LV16100C 3.3V 50ns Prod Q1/11 IS41C16100C 5.0V 50ns Prod Q1/11 IS41LV16257C 3.3V 35ns Prod Q1/11 IS41C16257C 5.0V 35ns Prod Q1/11 IS41LV4105C 3.3V 35ns Prod Q1/11 IS41C4105C 5.0V 35ns Prod Q1/11 IS41LV44052C 3.3V 50ns Prod Q1/11 IS41C44052C 5.0V 50ns Prod Q1/11 IS41LV16105C 3.3V 50ns Prod Q1/11 IS41C16105C 5.0V 50ns Prod Q1/11 IS41LV16100C 3.3V 50ns Prod Q1/11 IS41C16100C 5.0V 50ns Prod Q1/11 SRAM Selection Guide SYNCHRONOUS MEMORY TYPE(1) 5V Legacy 5V High Speed 5V Low Power 3.3V High Speed 2.5V-3.6V 1.65 - 3.6V Low Power Pipeline/ ASYNCHRONOUS VOLTAGE(2) 3.3V 1.65 - 3.6V 3.3V Flow Thru 2.5V 3.3V No-Wait (aka ZBT) 2.5V QUAD/ QUADP DDR-II/ DDR-IIP 1.8V 1.8V CONFIG(3) x8 x16 x8 x16 x8 x16 x16 x8 x16 x32 x8 x8 x16 x18 x32 x36 x72 x18 x36 x72 x18 x32 x36 x72 x18 x36 x72 x18 x36 x18 x36 64K ✓ 256K ✓ 512K ✓ ✓ ✓ ✓ 1M ✓ ✓ ✓ 2M ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ 4M ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ 8M 16M ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ 18M 36M ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ 72M ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ Note: 1. Refer to ISSI Product Selector Guide for complete list of SRAM types and part #. All products can be supported as Probed (sorted) Die 2. Check product datasheet for VCC and VCCQ specs 3. ISSI can support different speed/power and configurations. Contact Marketing for details. 1940 Zanker Rd. • San Jose, CA. 95112 • Tel: 408.969.6600 • [email protected] • www.issi.com Known Good Die (KGD) Production Flow Options 100% Wafer Level Burn In PD KGD KTD 100% Sort at Hot temp. Bad / Weak Cell Screen Process Defect Screen Simple DC Current and Function Test 100% Sort Hot temp. Bad / Weak Cell repair check Function Test 100% Sort at Cold temp. Bad / Weak Cell repair check Function Test 100% Speed Sort at Hot temp. Function Test High speed / AC Test Notes: • Specific details are defined in the test flow for each device with temperature and voltage guard-bands • High Speed Tester and “Speed Probe Card” used for CP4 Test Flow Definitions: KGD = Known Good Die: includes WLBI and Speed Sort KTD = Known Test Die: same as KGD, without Speed Sort PD = Probed (Sorted) Die: No WLBI, speed or temp sort, CP1 (Hot Temp.) + CP2 (Room Temp.) only 1940 Zanker Rd. • San Jose, CA. 95112 • Tel: 408.969.6600 • [email protected] • www.issi.com 1940 Zanker Rd. • San Jose, CA. 95112 • Tel: 408.969.6600 • [email protected] • www.issi.com XX XX Part Number XXX SRAM/PSRAM VDD ALL = 1.8V BLL = 3.0V SRAM Sub Family 61/63 = High Speed 62 = Low Power 66 = Pseudo SRAM PSRAM Sub Family WV = Wide Voltage A = ADMUX C= CRAM 1.5 D = CRAM 2.0 E = Asynch/Page XX Confirm exact part # from ISSI Die Datasheet Die Revision Memory Size 100 = 1M 200 = 2M 400 = 4M 800 = 8M 160 = 16M 320 = 32M Bus Width 8 = x8 16 = x16 32 = x32 DRAM Sub Family S = 3.3V SDR R = 2.5V SDR / DDR VS = 1.8V SDR SM = 3.3V Mobile SDR RM = 2.5V Mobile SDR VM = 1.8V Mobile SDR LR = 1.8V Mobile DDR1 LRR = 2.5V Mobile DDR1 LRS = 3.3V Mobile DDR1 DR = 1.8V DDR2 Product Family 41xx = EDO/FP DRAM 42xx/43xx = SDRAM 61xx/63xx = HS SRAM 62xx = LP SRAM 66xx = SRAM/PSRAM ISSI Prefix IS X XX Packing JP = JAR pack*1 WB = Wafer Boat WP = Waffle Pack TR = Tape & Reel Inking N = Inked U = Un-inked / Electronic Mapping File Back Grinding Thickness 29 = 29 mil 19 = 19 mil yy = other thickness (specify) – Die Type X = Die (Lead Free) R = RDL (pads, no bumping) L = Lead Free Bumping / RDL P = Leaded Bumping / RDL C = Cu Lead Free Bumping / RDL Test Flow*2 K = KGD at Level 1 temp 0 to +70C G = KGD at Level 2 temp -20 to +85C D = KGD at Level 3 temp (auto) -40 to +85C I = KTD C = Probed Die-PD (Sorted Die) X XX Speed Grade ‘x’ ns for KGD ‘blank’ for KTD & PD (default is slowest speed grade on datasheet) X 1* Jar Pack is default wafer packing option. For other options please contact KGD Product Marketing 2* Not all products are supported with all test flows. Contact KGD Product Marketing for detailed availability. X – XX ISSI DIE ORDERING INFORMATION Memory Products in Wafer Form Addressing the market need for a smaller form factor, lower cost solution, extreme temperature, or custom package, ISSI offers a broad range of memory products in die or wafer form. Consumer products require multi-chip packages (MCPs) to meet the stringent space requirements of cell phones, digital cameras, PDA’s and many other mobile-products. ISSI has experience providing low power KGD at millions of units per month run rate. For other applications such as harsh operating conditions ISSI can supply probed die in volumes starting from a single wafer. Whatever your application or volume requirements ISSI’s wafer level products provide the memories you are familiar with, in a fully tested wafer form, that can be readily used in your MCP or custom package. ISSI Specialist Die Distributor ISSI, in conjunction with our value added die distributor, can provide a wide range of solutions for your die related needs. www.micross.com Micross Components Team Corporate Headquarters Micross Components Austin, TX Tel: 1-888-330-8811 Fax: 512-339-6641 [email protected] EUROPE Micross Components Ltd, Norwich, UK Tel: +44 (0) 1603 788967 Fax: +44 (0) 1603 788920 USA Micross Components Reading, PA Tel: 610-374-3796 Fax: 610-374-0630 Micross Components Hatfield, PA Tel: 215-997-3200 Fax: 215-997-2966 Micross Components Fairfield, NJ Tel: 973-227-8007 Fax: 973-227-4766 ISSI Sales Offices *HEADQUARTERS Taiwan Office China Office Korea Office West Coast Office Hsin-Chu Shanghai Kyunggi-Do San Jose, CA 886-3-5780333 Tel. 86-21-50802288 Tel. 82-31-715-6406 Tel. 408-969-6600 Tel. 886-3-5783000 Fax 86-21-50802028 Fax 82-31-715-6209 Fax Europe Office Taiwan Office China Office Japan Office Devon England Taipei Shenzhen Tokyo 44-1803-840110 Tel. 886-2-26962140 Tel. 86-755-26633977 Tel. 81-3-5339-2950 Tel. 44-1803-865199 Fax 886-2-26962252 Fax 86-755-26633984 Fax 81-3-5339-2951 Fax Brazil Office China Office China Office 55-11-2574-7270 Tel. Beijing Hong Kong 55-11-7985-0505 Tel. 86-10-82274081 Tel. 852-23192211 Tel. 55-11-5181-2387 Fax 86-10-82274082 Tel. 852-23192004 Fax 408-969-7800 Fax 86-10-82274079 Fax For other locations contact [email protected] 1940 Zanker Rd. • San Jose, CA. 95112 • Tel: 408.969.6600 • [email protected] • www.issi.com