Engl

BL1908
Shanghai Belling Corp., Ltd 810Yishan Rd., Shanghai, China.
zip: 200233 Tel: 86-021-24261000 Fax: 86-021-64854424
BL1908
2.5Gbps Tx Burst Mode Laser Transceiver For FTTX Applications
The BL1908 is a highly integrated, programmable burst mode laser driver and limiting amplifier intended for
ONU/ONT applications up to 2.5 Gbps. Using LVDS/PECL/CML differential burst and data inputs. The BL1908 laser
driver has burst enable/disable times of less than 3.3 ns and will automatically maintain the desired extinction ratio.
The laser bias and modulation currents can independently be controlled in one of 3 ways - (1) dual closed loop
control where the monitor photodiode dynamic response is held to target values, (2) single closed loop control
where the average monitor photodiode output is held to a target value or (3) open loop control where the bias
and/or modulation current are controlled by a temperature based look-up table. In the closed loop cases, the bias
and modulation current value for the first burst may also use the internal temperature sensor and external look-up
table.
The BL1908 limiting amplifier inputs have a selectable bandwidth and selectable output swing. The input sensitivity is
better than 4mV at 1.25Gbps and 5mV at 2.5Gbps.The limiting amplifier features a programmable signal level
detector with a typical 2dB of optical hysteresis and an internally programmed JAM function which can be used to
squelch chatter on the outputs when no signal is present. If the limiting amplifier is not needed, it may be powered
down.
Application Fields
- APON, BPON, EPON, WDM PON, GPON and GEPON FTTX ONU/ONT modules
- SFF/SFP modules
Features
- Laser driver modulation current up to 100 mA. Bias current up to 80 mA.
Typical rise/fall times < 60 ps. Burst on/off < 3.3 ns
- DDMI Compatible
- Auxiliary 9-bit DAC, 12-bit A/D
- Limiting Amplifier 5mV input sensitivity at 2.5 Gbps, selectable gain and bandwidth, signal detect and Jam functions
- Programmable SPI or 2-wire interface from external EEPROM or optional microcontroller. (Separate slave and master interfaces.)
- Supports IEC-60825 eye safety, including programmable bias and modulation current limits
- Tx system current reduced during Burst-off
- Operating temperature -40°C to +85°C, 5x5 QFN package
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BL1908
Block Diagram
RxOUTP
RxOUTN
RxINP
limiting
amplifier
output
buffer
RxINN
JAM
bias
Offset cancel
IREF
VDDR
VDDR
RSSI
comparator
LOS
level
detect
los
threshold
GNDR
JAM
SCL_M
/SDO
SDA_M
/CS
SCL_S/
SCLK
SDA_S/
SDI
control
register
LA and
LDD
master
I2C
slave
I2C
STSET
temp sensor
12bits
ADC
Inputs
select
12bits
ADC
9bits DAC
DAC_OUT
ADC_IN(i)
AUX_D
A/JAM/
AUX_A
D(I)
vdd monitor
POR
VDDT
RSSI
SPI
RSSI/
AUX_A
D(V)
I2C/
SPI
laser
driver
(data drive)
DINP
input
buffer
laser
predriver
OUTP
OUTN
TX power monitor
(IPIN current)
DINN
over current alarm
VDDT
low speed 1010
patern gen
BENP
internal osc
automatic and
open loop
power control
input
buffer
BENN
TX DIS
DIS
safety logic
& fault
detection
GNDT0
laser bias
IBIAS
OUT
VDDTA
IPIN
GNDT
FAIL
Ordering Information
Part number
Package
BL1908
QFN32
Operating temperature
Revision History
Revision
Level
Date
A
Preliminary
December 2013
Description
Belling Internal Release
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BL1908
TABLE OF CONTENTS
BL1908
1
APPLICATION FIELDS
1
FEATURES
1
BLOCK DIAGRAM
2
ORDERING INFORMATION 2
1.0 PRODUCT SPECIFICATION
4
1.1 A BSOLUTE M AXIMUM R ATINGS
4
1.2 R ECOMMENDED OPERATING C ONDITIONS 6
1.3 DC C HARACTERISTICS
6
1.4 AC C HARACTERISTICS
9
1.5 S AFETY L OGIC T IMING
10
1.6 INPUT /OUTPUT S PECIFICATIONS 10
1.6.1 Internally Generated Slow 1-0 Pattern
10
1.6.2 Two-wire I/O Specifications (Standard or Fast Mode Two-wire Serial)
11
1.6.3 Two-wire Timing Specifications (Standard Mode or Fast Mode Two-wire Serial)
1.7 SPI S PECIFICATIONS
12
1.8 A UXILIARY ADC S PECIFICATIONS 13
1.8.1 General Purpose 9-bit DAC Specification
14
1.9 BL1908 P ACKAGING S PECIFICATIONS
15
1.10 P IN D EFINITIONS
17
2.0 FUNCTIONAL DESCRIPTION
11
24
2.1 BL1908 L ASER D RIVER OVERVIEW
24
2.2 BL1908 L ASER D RIVER D ESCRIPTION
24
2.2.1 Bias and Modulation Current Control 25
2.2.2 Modulator Output
28
2.2.3 Data Inputs
29
2.2.4 Burst Enable Inputs
29
2.2.5 IPIN Input
29
2.3 BL1908 L IMITING A MPLIFIER OVERVIEW 30
2.3.1 Receive Inputs 31
2.3.2 DC Offset Compensation
31
2.3.3 CML Outputs 31
2.3.4 Loss of Signal (LOS) or Signal Detect 31
2.3.5 JAM Function 32
2.3.6 Peak-to-Peak Received Signal Strength Indicator (RSSIpp) 32
2.4 BL1908 S ERIAL C OMMUNICATIONS OVERVIEW
34
2.5 BL1908 L ASER E YE SAFETY
34
2.6 S AFETY CIRCUITRY
34
2.7 R OGUE ONU
34
3.0 APPLICATIONS
35
3.1
A PPLICATIONS INFORMATION 35
3.1.1 BL1908 Laser Driver Applications 35
3.2 C ONNECTING A L ASER TO THE BL1908
35
3.2.1 Serial Interface Functional Description
36
3.3 BL1908 L IMITING A MPLIFIER A PPLICATIONS INFORMATION
3.3.1 Reference Current Generation
41
3.3.2 Input AC-Coupling Capacitor Choosing
42
3.3.3 Rate Selection
42
3.3.4 Setting the Signal Detect Level
42
3.3.5 CMLP and CMLN Termination
43
3.3.6 JAM Function 43
3.4 M ONITORING THE T X AND R X C HANNELS WITH THE BL1908
4.0 REGISTERS
41
43
44
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BL1908
1. Product Specification
1.1 Absolute Maximum Ratings
These are the absolute maximum ratings at or beyond which the IC can be expected to fail or be damaged. Reliable operation at these extremes for any length of time is not implied.
NOTE: The package bottom must be adequately grounded to ensure correct thermal and electrical performance,
and it is recommended that vias are inserted through to a lower ground plane.
Table 1-1.
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VCC3R
Power supply voltage (VCC-GND)
-0.5 to +4V
V
VCC3T
Power supply voltage (VCC-GND)
-0.5 to +4V
V
TJctn
Junction temperature
-40 to +1251,
°C
TSTG
Storage temperature
-65 to +150
°C
RXOUTN,RXOUTP
CML Output pins voltage
VCC - 0.4 to VCC + 0.4
V
|RXINP - RXINN|
Absolute difference of voltage at data input pins
0.80
V
RXINP, RXINN
Data input pins voltage meeting |RXINP - RXINN| requirement
- 0.4 to VCC + 0.4
V
RSSIP-P/AUX A/D(V)
RSSI output or voltage A/D input
- 0.4 to VCC + 0.4
V
AUX DAC/JAM/AUX
A/D(I)
DAC output, JAM output or A/D input
- 0.4 to VCC + 0.4
LOS
Loss of Signal status output pin voltage
- 0.4 to VCC + 0.4
V
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BL1908
IA/D(I)
Current input A/D(I)
TBD
IREF
Current into Reference input
+120 to -120
μA
I(LOS)
Current into Loss of Signal pin
-100 to+1500
μA
IBOUT + IMOD
Sum of IBIAS and OUTP current
1202
mA
DINP/N
Data inputs
-0.4 to VCC + 0.4
V
BENP/N
Burst Enable inputs
-0.4 to VCC + 0.4
V
VIPIN
Photodiode anode voltage
-0.4 to VCC + 0.4
V
DIS
Disable input
-0.4 to VCC + 0.4
V
IPIN
Maximum sink current
4
mA
FAIL
Status flag
-0.4 to VCC + 0.4
V
OUTP, OUTN
Output
-0.4 to VCC + 0.4
V
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BL1908
1. QFN package:
Air Velocity
θJA
0 m/s
41.7 ºC/W
1 m/s
36.5 ºC/W
2.5 m/s
32.7 ºC/W
The above thermal resistance is based on a four layer JEDEC standard board (76.2 x 114.3 mm) with four vias under the
center pad. More vias will improve thermal performance. The internal temperature sensor should not be used to verify
compliance with the absolute maximum junction temperature above 100 ºC.
2. Higher currents are allowable, but operating temperature must be de-rated.
1.2 Recommended Operating Conditions
Table 1-2.
Recommended Operating Conditions
Parameter
Rating
Units
Power supply: (VCC-GND)
+3.3V ± 7.5%
V
Operating ambient
-40 to +85
°C
1.3 DC Characteristics
VCC = +3.3V ± 7.5%, TA = -40°C to +85°C, unless otherwise noted.
Typical specifications are for VCC = 3.3V, TA = 25°C, unless otherwise noted.
Table 1-3.
Symbol
General DC Characteristics
Parameter
Conditions
Min
Typ
Max
85 1,2,3
125
55
80
35
50
Units
0x16h[1:0] = 00b, 0x00h[3] = 0b
Due closed loop
ICC
Single Closed Loop
Setting register 0x06[4] = 1b will reduce current
by ~20 mA during burst-off.
0x16h[1:0] = 01b or 10b
0x00h[3] = 0b setting 0x04[1]=1b
Dual Open Loop
mA
0x16h[1:0] = 11b, 0x04h[1:0] = 11b
0x00h[3] = 0b
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BL1908
VIH
Input high voltage.
DIS, JAM, SCL_S,
SDA_S, SCLK, SDI
and Burst Enable
single-ended input
logic high voltage
2
–
VCC
V
VIL
Input low voltage.
DIS, JAM, SCL_S,
SDA_S, SCLK, SDI
and Burst Enable
single-ended input
logic high voltage
0
–
0.8
V
VOH
Output high voltage
FAIL, LOS, SDO
2.6
–
VCC
V
0
–
0.4
V
Output Low voltage
VOL
FAIL, LOS,
SDO,SCL_M, SDA_M
POR
Power-On SET/RESET
Sinking 2 mA or less
2.7
Set (for positive going supply voltage) Reset (for
negative going supply voltage)
V
2.6
Notes:
1. Excludes laser bias and modulation current.
2. Disabling the DAC will reduce the current by 270 μA + DAC programmed source current.
3. Disabling the limiting amplifier reduces the current consumption by TBD.
Table 1-4.
Symbol
IMODOUT
PWR_SAVE
IBIASOUT
Laser Driver DC Characteristics
Parameter
Conditions
Modulation Current
Range
Min.
Typ.
Max.
Units
-
0 to 100
--
mA
Reduction in Bias Current register 0x015h[0]=1b and bias current
above 30mA
During Burst Off1
Bias Current Range
60
%
–
0 to 80
--
mA
–
–
15
Ohm
IBIASOUT resistance to
VCC1
BEN = LOW, 40 mA bias current,
register 0x15h[0]=0b
Bias current DAC
resolution and accuracy
12 bit resolution, V(IBIASOUT) > 0.85V
measured at IBIASOUT =24mA
16.58
19.5
22.43
uA/
count
Modulation current DAC
resolution and accuracy
12 bit resolution, V(OUTP) >1.1V,
IMODOUT=50 mA 2
20.74
24.4
28.06
uA/
count
Monitor photodiode
average current
adjustment range
Single Closed loop bias current control
–
0 to 2000
–
uA
PAVE_TARGET
Monitor photodiode DAC
resolution
8 bit resolution
18h[3]=0b
18h[3]=1b, 0x08h[0]=0b
-
8.33
2.08
-
uA/
count
IMD_Threshold
Monitor photodiode
threshold current
adjustment range. (P0
current amplitude)
Dual Closed loop bias current control
–
0 to 1000
–
uA
RBOFF
IMD_AVE
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BL1908
8 bit resolution
18h[3]=0b
18h[3]=1b, 0x08h[0]=0b
-
4.169
1.042
-
uA/
count
Monitor photodiode peak Dual Closed loop modulation current
current adjustment range control
0
0 to 3000
–
uA
Monitor photodiode DAC
resolution 3000uA range
300uA range
-
12.5
3.125
-
P0TARGET
Monitor photodiode DAC
IMD_PEAK
P1TARGET
8 bit resolution
18h[3]=0b
18h[3]=1b, 0x08h[0]=0b
Maximum monitor
photodiode capacitance
for APC loop stability for
dual loop mode. Includes
all associated parasitic
capacitances.
Voltage at IPIN. This will
be the monitor
photodiode anode voltage
CPD_MAX
VIPIN
For dual closed loop bias and
modulation current control.
uA/
count
15
pF
For closed loop average bias or
average modulation current control.
56(3)
Average IPIN current < 2000 uA
1
V
Differential input
impedance
Data inputs (and Burst Enable inputs
when set to differential mode)
--
100
–
Ohm
Common-mode input
compliance voltage
Data inputs (and Burst Enable inputs
when set to differential mode)
1.15
–
VCC-0.2
V
VIN(DIFF)
Differential input voltage
= 2 x (DINPHIGH - DINPLOW) and 2 x
(BENPHIGH - BENPLOW) when Burst
Enable Inputs set to differential mode
200
–
1600
mVpp
Rogue ONU
Detect
Laser Forward Voltage
necessary to assert FAIL
during Burst OFF
VCC-700
mV
RIN_DIFF
VINCM
VFAULTL
Lower voltage threshold
for fault inputs IBIASOUT, FAIL asserts if any of these signals fall
below this value.
OUTP, IPIN
400
mV
VFAULTH
Upper voltage threshold
for fault input IPIN
2100
mV
FAIL asserts if any of these signals rise
above this value.
Notes:
1. Use power saver mode to insure laser is off during burst off at high temperatures and bias currents.
2. OUTP and OUTN will operate at voltages as low as 0.7V, however, open loop look-up table operation will be less accurate.
3. Up to 50pF of capacitance is allowed if isolated from IPIN by 100~200 ohms or equivalent inductance.
Table 1-5.
Symbol
Limiting Amplifier DC Characteristics
Parameter
Conditions
Min
Typ
Max
Units
VOUTL300
CML Output Low Voltage
(RxOUTP, RxOUTN)
300mV swing
Single ended; 50 Ohm load to VCC,
20 mvp-p input
0x00h[3]=0b
-
VCC-0.34
-
V
VOUTH300
CML Output High Voltage
(RXOUTP, RXOUTN)
300mV swing
Single ended; 50 Ohm load to VCC, 20
mvp-p input
0x00h[3]=0b
-
VCC0.002
VCC
V
VOUT300
IVOUTL300 - VOUTH300I
Output swing of CML
outputs
Single ended; 50 Ohm load to VCC on
RxOUTP and RxOUTN
0x00h[3]=0b
270
340
VOUTL500
CML Output Low Voltage
(RxOUTP, RxOUTN)
500mV swing
Single ended; 50 Ohm load to VCC,
20mvp-p input, -40°C to 100°C,
0x00h[3]=1b
-
VCC-0.6
mV
-
V
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BL1908
VOUTH500
CML Output High Voltage
(RXOUTP, RXOUTN)
500mV swing
Single ended; 50 Ohm load to VCC,
20mvp-p input, -40°C to 100°C
0x00h[3]=1b
VOUT500
IVOUTL500 - VOUTH500I
Output swing of CML
outputs
Single ended; 50 Ohm load to VCC on
RxOUTP and RxOUTN
0x00h[3]=1b
VCC-0.01
395
VRSSI_p-p Peak to Peak RSSI of RxIN
RINDIFF
Differential Input Resistance
V
590
40
Measured between RXINP and RXINN
785
mV
300
mV
–
120
1.4 AC Characteristics
VCC = +3.3V ± 7.5%, TA = -40°C to +85°C, input bit rate = 2.67 Gbps high rate mode (register RATESEL = 1b(1)),
50mA modulation current unless otherwise noted.
Typical specifications are for VCC = 3.3V, TA = 25°C, unless otherwise noted.
Table 1-6.
Laser Driver AC Characteristics
Symbol
Parameter
tr
Modulation output rise time
tf
Modulation output fall time
DJ
Deterministic jitter
Conditions
20% to 80% into 20 Ohm. For Imod =
50mA. Measured using 11110000
pattern at 2.67 Gbps
Min.
Typ.
–
60
ps
–
60
ps
Measured with 50 mA of modulation
current into a 21 Ohm load, 215 - 1
Max.
Units.
35
pspp
5.2
ns
4.8
ns
PRBS at 2.67 Gbps (includes DCD)
IBIAS_ON
50% BEN to 90% IBIAS
BEN low -> high, LVDS differential input
(measured electrically)
Configured for operation at less than
100 °C Register 0x15h[0]=0b
Propagation turn-on delay
between BEN and IBIAS.
Configured for operation up to 100
degrees C and bias currents greater than
DAC code 110000000000 (~30mA)
Register 0x15h[0]=1b
IBIAS_OFF
Propagation turn-off delay
between BEN and IBIAS.
50% BEN to 90% IBIAS
BEN low -> high, LVDS differential input
(measured electrically)
Configured for operation at less than
100 °C Register 0x15h[0]=0b
Configured for operation up to 100
degrees C and bias currents greater than
DAC code 110000000000 (~30mA)
Register 0x15h[0]=1b
Table 1-7.
Symbol
VIN(MIN)
Limiting Amplifier AC Characteristics
Parameter
Differential Input Sensitivity
Conditions
Laser Driver operating in burst mode or CW at
Gbps, 20 mA modulation and 0 mA bias
1.25 Gbps, BER < 10-12, (RATESEL = 0b)
2.5Gbps, BER < 10-12, (RATESEL = 1b)
VIN(MAX)
Input Overload
BER < 10-12, differential input 2.5 Gbps
BER < 10-12, single-ended input, 2.5 Gbps
Min
Typ
Max
Units
–
–
3
4.5
6
8
1200
–
–
mV
600
–
–
mV
mV
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BL1908
vn
RMS Input Referred Noise
RATESEL = 1b
–
280
–
uVRMS
VLOS
Loss of Signal Programmable
Differential inputs
Assert Range
10
–
50
mV
HYS
Signal Detect Hysteresis
Electrical; across LOS programmable range
2
3.5
5.5
dB
Differential input signal range
4
–
100
mV
Small-Signal –3dB Low
Frequency Cutoff
Excluding AC coupling capacitors
–
4
–
kHz
DJ
Deterministic Jitter (includes
DCD)
PRBS 2^15-1 pattern at 2.67 Gbps, 10 mVPP
input. High Rate mode (register 0x00h[5]=1b),
Laser Driver active.
–
25
48
ps
RJ
Random Jitter
10 mVPP input at 2.5Gbps. High Rate mode
(register 0x00h[5]=1b), Laser Driver active.
–
4.7
–
psRMS
Receive Data Output Rise
and Fall Times
20% to 80%; outputs terminated into 50 Ohm;
0 mVPP input. Measured using 11110000
pattern at 2.67 Gbps
High Rate mode (register 0x00h[5]=1b),
Low Rate mode (register 0x00h[5]=0b),
–
–
80
110
255
RSSIPK-PK Peak-to-peak received signal
strength indicator range
BWLF
tr / tf
ps
TLOS_ON
Time from LOS state until
LOS output is asserted
LOS assert time after 1 VPP input signal is
turned off; signal detect level set to 10 mV
2.3
–
80
μs
TLOS_OFF
Time from non-LOS state
until LOS is deasserted
LOS deassert time after input crosses signal
detect level; signal detect set to 10 mV with
applied input signal of 20 mVPP
2.3
–
80
μs
Notes:
1. Scales proportionally with the datarate. Value given for Gbps.
1.5 Safety Logic Timing
(VCC = 3.3V +/-7.5%, TA =-40 °C to +85 °C, unless otherwise noted).
Typical values are at VCC = 3.3 V, IBIASOUT = 20 mA, IMOD = 50 mA, TA = 25 °C, unless otherwise noted.
Table 1-8.
Symbol
Safety Logic Timing
Parameter
t_off
DIS assert time
t_init
Time to initialize part after
power-up
Conditions
Rising edge of DIS pin to falling edge of IBIAS
current and OUTP current below 10% of
nominal
Includes reading 48 bytes from EEPROM,
(48 X 8) X 2 X ( 3.75 us)
Min
Typ
2.9
Max
Units
0.1
μs
ms
1.6 Input/Output Specifications
1.6.1 Internally Generated Slow 1-0 Pattern
Symbol
Parameter
Slow 1-0 pattern at OUTP and OUTN
Conditions
Outputs
0x0Ch[0]=1b
10 MHz (+/-30%)1 1-0 pattern
Notes:
1. Guaranteed by design and characterization.
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BL1908
1.6.2 Two-wire I/O Specifications (Standard or Fast Mode Two-wire Serial)
Table 1-9.
Symbol
2-Wire Serial Interface CMOS I/O Electrical Specifications (1, 2)
Parameter
Conditions
Min
Typ
Max
Units
fixed address
9Ch for writing
9Dh for reading
Slave Address, pins 4 and 5
VOL
Output logic low voltage
IOL = 2 mA
0
–
0.4
V
IIH
Input current (logic high)
No RPULL-UP present
-10
–
10
μA
IIL
Input current (logic low)
No RPULL-UP present
-10
–
10
μA
CI
Capacitance of SDA and SCL pins
–
–
10
pF
Notes:
1. Guaranteed by design and characterization.
2. Specified at recommended operating conditions
1.6.3 Two-wire Timing Specifications (Standard Mode or Fast Mode Two-wire
Serial)
Table 1-10.
Master and Slave 2-Wire Timing Specifications (pins 4 and 5) (1, 2,3) (see Figure 1-1)
Parameter
Symbol
Conditions
fSCL_MASTER Clock Frequency, SCL
Min
Typ
Max
Units
–
–
400
kHz
tLOW
Clock Pulse Width Low
1.3
–
–
μs
tHIGH
Clock Pulse Width High
1.0
–
–
μs
tAA
Clock Low to Data Out Valid
0.05
–
0.9
μs
tBUF
Time the bus must be free before a new
transmission can start
1.3
–
–
μs
tHDSTA
Start Hold Time
0.6
–
–
μs
tSUSTA
Start Set-up Time
0.6
–
–
μs
tHDDAT
Data In Hold Time
0
–
–
ns
tSUDAT
Data In Set-up Time
100
–
–
ns
–
250
–
kOhm
Stop Set-up Time
0.6
–
–
μs
Data Out Hold Time
50
–
–
ns
RPULL-UP
tSUSTO
tDH
Outputs (SDA_M, SCL_M, SDA_S and
SCL_S) internal pull-up resistor value (4)
Notes:
1. Guaranteed by design and characterization.
2. Specified at recommended operating conditions
3. The master two wire bus is designed to be compatible with the ATMEL AT24C0X or equivalent. It does not necessarily comply
with any other 2-wire standard.
4. 4.7 kOhm should be added externally (typical).
Figure 1-1.
Host and EEPROM Controller Timing Diagram
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1.7 SPI Specifications
Figure 1-2.
SPI Sequential WRITE
Figure 1-3.
SPI Random WRITE
Figure 1-4.
SPI Sequential READ
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BL1908
Figure 1-5.
SPI Random READ
Table 1-11.
SPI Timing Specification
Symbol
Parameter
Notes
Min
Typ
Max
Units
Tds
Data set-up time
8
ns
Tdh
Data hold time
8
ns
Tcs
Enable xCS set-up time
8
ns
Tch
xCS hold time
8
ns
Tfreq
SPI clock frequency
1, 2
SCLK pulse width
Trdd
Read data output delay following rising edge of SCLK
1
25
MHz
45
55
%
3
12
ns
1. Maximum 25 MHz SCLK for write and 25 MHz for read.
2. To WRITE BL1908 registers with the SPI interface at a clock rate of less than 20 MHz requires that the register be written
twice.
1.8 Auxiliary ADC Specifications
Table 1-12.
A/D Electrical Specifications (12-bit)
Range
Input
Accuracy
Type
Notes
Minimum Maximum
Average IPIN Current
0
Units
1400
uA
400
nA
3.55
V
Minimum Maximum
Units
-3
+3
dB
1, 2
-4
+4
%
1, 6
Tx Power Monitor
LSB (12 bit)
Power Supply
(Internal) Voltage
2.7
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BL1908
Monitor
LSB (12 bit)
Internal Temperature
Monitor
(Internal)
Temperature
-40
+120
°C
0.231
°C/count
4
100
mV
0
2125
mV
519
uV
0
1470
uA
0
375
uA
-5
+5
%
1, 7
1
2
kHz
–
–
–
–
–
–
–
-1
-3
+1
+4
LSB
LSB
6
LSB (10-bit)
RSSI pk-pk
Voltage
AUX A/D (V)
1 mV
LSB (12 bit)
Current
AUX A/D (I)
Update Rate
Linearity:
DNL
INL
All ADCs
-3
+3
°C
1, 3, 8
-5
+5
%
1, 4, 5
7
Notes:
1. Single Point module calibration required for valid units and offset correction. 0 μA is ~ 100 counts.
2. Code FFFh means 1500 uA. However, the result is only valid in the range specified.
3. ADC output will be offset binary. Code 000h means the lowest temperature the ADC can measure, while FFFh means the
highest temperature the
ADC can measure.
4. Input impedance of ADC is larger than 100 kOhm.
5. Code 000h means 0 V, code FFFh means 3 V. However, the result is only valid in the range specified.
6. Measured at 3.05V, 3.3V and 3.55V.
7. 0x17h[3:2]=00b.
8. 0x00h[2]=1b (limiting amplifier powered down), 0x03h[7]=1b (laser driver output disabled), 0x04h=DBh (IPIN circuitry
powered down), 0x16h=03h (Dual Open Loop mode), 0x19h=6Fh (Temperature Sensor Slope)"
1.8.1 General Purpose 9-bit DAC Specification
Table 1-13.
General Purpose 9 bit DAC
Parameter
Resolution
Minimum
Typical
Maximum
Units
–
9
–
bits
-
mA
Current Mode Operation
Input format
Full scale output current (current sourcing)
(current sinking)
Offset binary: 000h = 0 mA
1FFh = full scale
1
0.2
LSB Step Size (current sourcing)
(current sinking)
Linearity:
DNL(current sourcing)
DNL (current sinking)
INL (current sourcing)
INL (current sinking)
2.08
0.41
-1
-1
A
-0.3
0.3
0.45
0.45
0.25
0.7
LSB
Offset
-1
–
1
uA
Settling time
–
10
–
us
VCC-2
0
–
Compliance (voltage for sourcing current)
(voltage for sinking)
1
V
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1.9 BL1908 Packaging Specifications
Figure 1-6.
QFN32 Package Information
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BL1908
32
RxOUTN
RxINP
RxINN
GND
RSSIP-P or
AUX A/D(I)
AUX DAC or JAM
or AUX A/D(I)
LOS
IREF
Pin Assignments for BL1908 Device
STSET
Figure 1-7.
25
24
1
VCC3R
RxOUTP
/I2C/SPI
VCC3R
VCC3T
5mm x 5mm
SCL_S
or SCLK
OUTN
SDA_S
or SDI
OUTP
GND, connect to
PCB ground with
an array of > 9
vias.
SCL_M
or SDO
GND0
IBIASOUT
SDA_M
or /CS
8
17
GND
IPIN
FAIL
DIS
DINN
DINP
BENN
16
BENP
9
VCC3TA
VCC3T
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BL1908
1.10 Pin Definitions
Table 1-14.
BL1908 Pin Definitions (1 of 7)
Pin Number
Pin Name
1
RxOUTN
2
RxOUTP
3
VCC3R
SCL_S
Pin Equivalent Load
Function
Inverting CML data output. To reverse the positions of
RxOUTN and RxOUTP set 0x01h[5] = 1b.
see RxOUTN drawing
Non-inverting CML data output.
3.3V supply for Limiting Amplifier circuitry
A decoupling capacitor should be added at this pin on
the same side of the PCB as the BL1908
2 wire interface serial clock input. This function is
selected when pin 23 is low. Attach to external
microcontroller if used.
A 4.7 kOhm to 10 kOhm external pull-up resistor to
VCC may be needed.
4
SCLK
SDA_S
SPI serial interface clock input. This function is selected
when pin 23 is high. Attach to external microcontroller if
used.
2 wire interface serial data input/output. This function is
selected when pin 23 is low. Attach to external
microcontroller if used.
A 4.7 kOhm to 10 kOhm external pull-up resistor to
VCC may be needed.
5
SPI serial interface data input. This function is selected
when pin 23 is high. Attach to external microcontroller if
used.
SDI
The SPI interface is as expected for clock rates of 20
MHz or higher. Clock rates of less than 20 MHz require
that the register be written twice.
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BL1908
2 wire interface serial clock output. Attach to external
EEPROM if used.
SCL_M
A 4.7 kOhm to 10 kOhm external pull-up resistor to
VCC should be used if an EEPROM is present.
6
SPI serial interface data output. This function is
selected when pin 23 is high. Attach to external
microcontroller if used.
SDO
2 wire interface serial data input/output. Attach to
external EEPROM if used.
SDA_M
7
8
same as pin SDA_S
A 4.7 kOhm to 10 kOhm external pull-up resistor to
VCC should be used if an EEPROM is present.
CS_bar
SPI serial interface chip select. This function is selected
when pin 23 is high. Active low.
VCC3T
3.3V supply for Laser Driver and I/O circuitry. A
decoupling capacitor should be added at this pin on the
same side of the PCB as the BL1908.
3.3V supply for IPIN circuitry.
9
VCC3TA
A decoupling capacitor should be added at this pin on
the same side of the PCB as the BL1908. Do not use
the same decoupling capacitor as is used for pin 8. The
decoupling capacitors for pins 8 and 9 should have
independent ground vias.
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BL1908
Non-inverting LVDS/PECL burst enable input. Optical
output enabled when BENP - BENN = high. To reverse
the positions of BENP and BENN set
[glob_ctrl1:polflip_ldd_ben] = 1b. To set BENP to
single-ended operation set [glob_ctrl1:set_ben_cmos] =
1b.
10
BENP
In single-ended operation the BENP threshold is
approximately VCC/2.
Register glob_ctrl1(0x01h) on page 36 of the data
sheet. Bit 3 squelches (forces) the BEN internally
regardless of the status of the pins. Bit 6 specifies the
polarity (H or L)
11
BENN
12
DINP
13
DINN
see pin BENP
Inverting LVDS/PECL burst enable input. Optical output
enabled when BENP - BENN = high. Leave open when
BENP is programmed for single- ended operation.
Non-inverting LVDS/PECL data input. OUTP will sink
current when DINP - DINN = high. To reverse the
positions of DINP and DINN set
[glob_ctrl1:polflip_ldd_din] = 1b.
See pin DINP
Inverting LVDS/PECL data input. OUTN will sink
current when DINP - DINN = low.
Bias and modulation output disable (TTL/CMOS).
14
DIS
When high the bias and modulation outputs are
disabled. Set low for normal operation.
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BL1908
15
FAIL
Safety circuit fault output (CMOS). Goes high when a
safety logic fault is detected. This output will also be
high when DIS is high. This output may be used to
drive the gate of a FET sourcing the laser current.
16
IPIN
Current input from monitor photodiode anode.
17
GND
Connect to circuit board ground.
Laser bias current output.
Connect directly to laser cathode or at higher bit rates
through a ferrite or a small resistor to isolate the
capacitance of this pin from the modulation driver, (~1
pF).
18
IBIASOUT
Maintain a voltage at least 0.85V above GND at this
pin.
When BEN is low, a 15Ohm internal resistor to VCC3T
is enabled which shunts the bias current away from the
laser.
Set register 0x015h[0] = 1b to reduce the bias current
during ―burstoff‖ to 1/3 of the ―burst-on‖ current (bias
current will only be reduced when it is greater than 30
mA).
19
GNDO
Ground for output stage. May be connected directly to
circuit board ground. Grounding 1 mm to 2 mm away
from the BL1908 may result in improved eye quality.
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BL1908
Positive modulation current output (DC coupled to
cathode of laser).
Sinks current when DINP is HIGH.
20
OUTP
Transient response will degrade if voltage at this pin
goes below < 0.7V.
The transient response of this output is optimized for a
25 Ohm load.
Negative modulation current output. Sinks current when
DINN is HIGH.
21
OUTN
similar to pin OUTP
Maintain a voltage > 1.1V at this pin.
The transient response of this output is optimized for a
25 Ohm load.
3.3V supply for Laser Driver and I/O circuitry.
22
A decoupling capacitor should be added at this pin on
the same side of the PCB as the BL1908.
VCC3T
Do not use the same decoupling capacitor as is used
for pin 24. The decoupling capacitors for pins 22 and 24
should have independent ground vias.
23
Select I2C or SPI serial protocol for pins 4,5,6 and 7.
This pin must be fixed at VCC or ground before VCC
reaches the power-on-reset voltage. This pin should not
change state after power-on.
I2C_bar/SPI similar to pin DIS
3.3V supply for limiting Amplifier circuitry.
24
VCC3R
A decoupling capacitor should be added at this pin on
the same side of the PCB as the BL1908.
VCC3R
1.2K
RxINP
25
60
RxINP
RxINN
60
Non-inverting data input. Internally terminated with 60
Ohm.
18K
26
RxINN
27
GND
see pin RxINP
Inverting data input. Internally terminated with 60 Ohm.
Connect to circuit board ground.
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BL1908
Receiver peak-to-peak input voltage monitor. Provides
a DC voltage (ground referenced) proportional to the
peak-to-peak input voltage swing.
RSSIPk-Pk
28
AUX_AD(V)
(if selected)
AUX_DAC
(if selected)
AUX_A/D(I)
(if selected)
Output disable input. When high, data outputs are
disabled (with non-inverting output held high and
inverting output held low).
29
JAM
Same as pin DIS
(if selected)
Connect to LOS output to disable outputs with loss of
signal. Outputs are enabled when JAM is low or
floating. Internal 150 kOhm resistor to ground.
If not used, connect to ground.
30
LOS
Same as pin FAIL
Loss of signal output. Goes high when input signal falls
below threshold set by STSET. CMOS output.
Internal reference current. Must be connected to
ground through a 12.5 kOhm 1% resistor.
31
IREF
32
STSET
The accuracy of this resistor will affect the accuracy of
limiting amplifier thresholds and laser driver output
currents.
Loss of signal threshold setting input. Connect a 1%
resistor between this pin and VCC to set the loss of
signal threshold.
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BL1908
CENTER
PAD
GND
Ground. Must be connected to ground through an array
of vias for proper thermal and electrical operation.
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BL1908
2. Functional Description
2.1 BL1908 Laser Driver Overview
The BL1908 contains a highly integrated burst mode laser driver intended for applications to 2.5 Gbps.
It is designed to meet the burst mode requirements of all PON applications and it supports fast and accurate turn- on
and turn-off of the laser bias and modulation currents. There is 0ns effective initialization time of the bias and
modulation current following the power-up sequence because the initial currents can be set by a temperature based
look-up table.
The configuration and control of the laser driver is accomplished by downloading register settings from an external
EEPROM or microcontroller.
Safety circuitry is included to signal fault conditions and support eye safety requirements.
Internal register settings may be read by an external microcontroller via a 2-wire interface or 3-wire SPI interface to
read digitized values of temperature, supply voltage, bias current, modulation current, transmit power and received
power for DDMI applications.
―Rogue ONU detection‖ is provided by monitoring the forward voltage of the laser during the burst-off state.
Figure 2-1.
BL1908 Laser Driver Block Diagram
SCL_M
/SDO
SDA_M
/CS
SCL_S/
SCLK
SDA_S/
SDI
master
I2C
slave
I2C
control
register
LA and
LDD
temp sensor
12bits
ADC
12bits
ADC
Inputs
select
DAC_OUT
9bits DAC
ADC_IN(i)
AUX_D
A/JAM/
AUX_A
D(I)
vdd monitor
POR
VDDT
RSSI
SPI
RSSI/
AUX_A
D(V)
I2C/
SPI
laser
driver
(data drive)
DINP
input
buffer
laser
predriver
OUTN
TX power monitor
(IPIN current)
DINN
GNDT0
over current alarm
VDDT
BENP
OUTP
low speed 1010
patern gen
internal osc
input
buffer
BENN
TX DIS
DIS
safety logic
& fault
detection
laser bias
automatic and
open loop
power control
IBIAS
OUT
VDDTA
IPIN
GNDT
FAIL
2.2 BL1908 Laser Driver Description
Table 2-1.
APC Control modes
Configuration
Dual Closed Loop,
with instant start-up
Bias Current Control
Modulation Current
Control
Benefits
• First burst instant start-up.
• Optimum extinction ratio performance over temperature.
Dynamic Monitor
Dynamic Monitor
• Automatic compensation for laser aging of threshold
photodiode controlphotodiode control,
current (bias current), slope efficiency (modulation
look-up table at start- look-up table at startcurrent) and temperature.
up
up
• Does not require a 50% Mark/Space duty factor to
maintain accurate bias and modulation current amplitudes.
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Dual Closed Loop,
continuous
Dynamic Monitor
photodiode control
Dynamic Monitor
photodiode control
• Optimum extinction ratio performance over temperature.
• Laser temperature characterization not necessary.
• Automatic compensation for laser aging of threshold
current (bias current), slope efficiency (modulation
current) and temperature.
• Does not require a 50% Mark/Space duty factor to
maintain accurate bias and modulation current amplitudes.
• Low power operation.
Single Closed Loop,
Bias Current Control
Average Monitor
Open Loop,
Photodiode current
Temperature based
control, look-up table
look-up table
at start-up
• First burst instant start-up.
• Automatic compensation of bias current over
temperature and aging.
• Look-up table temperature compensation for modulation
current.
Single Closed Loop,
Modulation Current
Control
Open Loop,
Temperature based
look-up table
• First burst instant start-up.
Average Monitor
• Automatic compensation of modulation current over
Photodiode Current,
temperature and aging.
look-up table at start• Look-up table temperature compensation for bias
up
current.
Dual Open Loop
Open Loop,
Temperature based
look-up table
Open Loop,
Temperature based
look-up table
• First burst instant start-up.
• Look-up table temperature compensation for both bias
and modulation current.
• No Monitor Photodiode needed.
2.2.1 Bias and Modulation Current Control
The bias and modulation currents may each be controlled in one of 3 configurations: dual closed loop, single closed
loop or dual open loop.
The modulation and bias current are controlled by 12 bit DACs. In both the closed loop and open loop configurations,
the bias and modulation currents can instantly be brought to the correct amplitude at the beginning of the first burst
after power-up with the use of a temperature based look-up table. When Burst Enable is low, the values in the
modulation and bias current DACs are frozen. When Burst Enable goes high the bias and modulation currents return
to their value at the end of the previous burst.
In both the open loop and closed loop configurations, the burst enable and burst disable time of the bias and
modulation current is less than 3.3 ns.
When burst enable is low, the modulation current is switched to the OUTN output and the bias current is switched
through an internal FET to VCC. The impedance of the internal FET is less than 15 Ohm. At high temperatures the
laser bias current may be large and the voltage drop across the 15 Ohm may be unacceptable. By setting 0x15h[0] =
1b, the bias current will be reduced during the burst off state to 1/3 of its value during the burst on state when the
bias current is 30 mA or greater. When the bias current is less than 30 mA the bias current will not be reduced
during the burst off state.
2.2.1.1 Dual Closed Loop with Instant Start-up
Dual Closed Loop allows an optical system to maintain its output power and extinction ratio even if the laser
performance degrades unpredictably over time.
Unlike traditional optical closed loop systems, the Belling’s dual closed loop system uses the monitor photodiode to
control both the bias and modulation current. This results in a stable P1 (optical high level) and a stable P0 (optical
low level). The minimum value of the monitor photodiode current is used to control the bias current (P0 level) and the
maximum value of the monitor photodiode current is used to control the modulation current (P1 level).
With the dual closed loop system, extinction ratio and optical power are held constant under all operating conditions.
It is not necessary to characterize the temperature characteristics of the laser because the laser bias and modulation
current will automatically adjust to hold the monitor photodiode P1 and P0 amplitudes, regardless of temperature or
aging.
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In systems using the average level, the Mark/Space (Data 1/Data 0) duty factor must be 50%. The BL1908 does not
require a 50% Mark/Space duty factor when operating in dual closed loop as the dual loop is data duty cycle
insensitive.
To hold the P1 and P0 monitor photodiode currents constant, the BL1908 determines when the monitor photodiode
current is settled at its high or low level. Then the BL1908 compares the monitor photodiode current with target
values. Using information from this comparison, internal DACs controlling the bias and modulation current are
adjusted to make the monitor photodiode current match the target amplitudes.
In many laser packages the laser anode and monitor photodiode cathode share a pin. The monitor photodiode signal
can be corrupted by electrical signals coupled from the laser anode. This results in a false reading of the minimum
and maximum monitor photodiode current values by the dual closed loop controller. IPIN Masking (or Glitch Mask) will
allow the Dual Closed Loop Controller to ignore the monitor photodiode current during these periods when the signal
is corrupted.
The high and low target amplitudes are stored in registers p1_target (0x09h) and p0_target (0x0Ah). The BL1908
determines when the monitor photodiode current is settled according to values loaded into registers apc_ctrl0
(0x05h[7:2]), apc_ctrl1 (0x06h[3:0]), apc_ctrl2 (0x07h[7:0]) and apc_tia (0x08h[0]). These registers control internal
clocks, digital filter settling times and internal TIA gain and bandwidth.
The monitor photodiode capacitance is the dominant factor in the settling time. For stability reasons, a maximum of 15
pF of capacitance is allowed on the IPIN node (includes monitor photodiode capacitance plus any parasites, higher
capacitances may be used if isolated by a series resistor). The photodiode settling time will need to be programmed
according to the monitor photodiode characteristics and the data pattern and bit rate.
It is possible to program the BL1908 to recognize the settling time at larger numbers of Marks or Spaces. However, the
loop will take longer to close in this case because this data pattern will occur less frequently. The frequency of
occurrence in the data pattern decreases by 50% for each Mark or Space added to the length of the settling time.
For instant start-up at power-up, the BL1908 will measure the temperature and digitize it with an internal A/D
convertor. Using this temperature measurement, a corresponding bias and modulation current amplitude is
automatically loaded into registers i0_msb (0x0Dh), ib0_lsb (0x0Eh) and im0_lsb (0x0Fh) from an external EEPROM or
these values should be loaded from an external microcontroller if no EEPROM is used. During operation, the BL1908
will automatically adjust the bias and modulation current amplitude for variation in temperature and aging of the laser.
When the high or low monitor photodiode current changes, the BL1908 will adjust the modulation or bias current
amplitude in registers i_msb (0x59h), im_lsb (0x5Bh) and ib_lsb (0x5Ah) until the monitor photodiode currents
again match p1_target (0x09h) and p0_target (0x0Ah).
I2.2.1.2
Continuous Mode - Dual Closed Loop
Continuous mode Dual Closed Loop allows multi-rate operation over temperature with a single point calibration at
room temperature.
For continuous mode operation, the burst enable input should be fixed in the enable state. This can be done either in
hardware by setting the BEN inputs to single-ended (0x01h[0]=1b) and connecting BENP (pin 10) to VCC.
Alternatively, it may be done in the register settings by setting bits 0x01h[3]=1b and 0x01h[6]=1b (BENP may be
connected to VCC, ground or left open in this case). In all cases BENN (pin 11) should be left open.
All of the DDMI monitoring functions will operate normally in continuous mode.
If the BL1908 registers are loaded from EEPROM, the instant start-up look-up table may be used in continuous mode
if it is desired that the bias and modulation current start at a value close to the optimum value. If the BL1908 registers
are loaded from an external microcontroller, the initial bias and modulation currents can be set in registers 0x0Dh,
0x0Eh and 0x0Fh.
2.2.1.3 Single Closed Loop - Bias Current Control
In this mode of operation, the bias current is adjusted to maintain a constant average laser monitor photodiode
current. The modulation current is controlled by a temperature based look-up table. This mode of operation is
selected by writing register 0x16h[1:0]=10b (selects the operating mode) and 0x16h[3]=1b. (enables averaging).
In burst mode applications, the monitor photodiode current will not instantly return to its average value when BEN is
enabled. As a result WAIT states should be enabled in the BL1908 when using single closed loop control. Use of
WAIT states is described in section IPIN INPUT (Section 2.2.5).
To allow the first burst after power-up to instantly come to the correct amplitude, the initial bias and modulation
current amplitudes can be selected from a temperature based look-up table, but over time the bias current is adjusted
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to make the digitized average photodiode current match a target value.
The target average monitor photodiode value is located in register p0_target (0x0Ah, 8.33 uA/cnt monitor photodiode
current resolution or 2.083 uA/cnt monitor photodiode current resolution if 0x18h[3]=1b).
After the BL1908 configuration registers are loaded, the BL1908 will measure the temperature and digitize it with an
internal A/D convertor. Using this temperature measurement a corresponding bias current amplitude and modulation
current amplitude will be automatically loaded into registers i0_msb (0x0Dh), ib0_lsb (0x0Eh) and im0_lsb (0x0Fh)
from an external EEPROM or these registers should be loaded by an external microcontroller at the same time the
other configuration registers are loaded.
12 bit DACs in the BL1908 will convert the values in register i0_msb (0x0Dh), ib0_lsb (0x0Eh) and im0_lsb (0x0Fh)
into analog currents which will be sunk at the IBIAS and OUTP outputs when the BL1908 DIS pin is low and BEN pin
is high. Then the bias control loop will take over and refine the bias output to more closely match p0_target (0x0Ah).
During operation, the BL1908 will automatically adjust the bias current amplitude for variation in temperature and
aging of the laser. When the average monitor photodiode current changes, the BL1908 will adjust the bias current
amplitude in registers i_msb (0x59h) and ib_lsb (0x5Ah) until the average monitor photodiode current again
matches the target average monitor photodiode current value.
The BL1908 temperature sensor will automatically measure the temperature and update the modulation current from
EEPROM when the temperature changes. If no EEPROM is used, an external microcontroller should periodically
read the temperature at register temp (0x58h [7:0] +0x57h[7:4]) and update the bias current amplitudes at registers
i0_msb (0x0Dh [3:0]) and ib0_lsb (0x0Eh).
2.2.1.4 Single Closed Loop Modulation Current Control
In this mode of operation, the modulation current is adjusted to maintain a constant average laser monitor
photodiode current. The bias current is controlled by a temperature based look-up table. Both the bias and
modulation current amplitude are digitized and when the burst is enabled following a burst off period they return to
the last digitized amplitude in 3.3 ns.
This mode of operation is not commonly used, but it is useful in very high extinction ratio applications where the bias
current is below the laser threshold current. The P1 level and the average power level will be controlled by the monitor
photodiode and will be very accurate.
In burst mode applications the monitor photodiode current will not instantly return to its average value when BEN is
enabled. As a result WAIT states should be enabled in the BL1908 when using single closed loop control. Use of
WAIT states is described in section IPIN INPUT (Section 2.2.5).
To allow the first burst after power-up to instantly come to the correct amplitude, the initial bias and modulation
current amplitudes are selected from a temperature based look-up table, but over time the modulation current is
adjusted to make the digitized average photodiode current match a target value.
At power-up a configuration register setting of value avg = 1b and lk_up = 01b is loaded automatically by EEPROM
into register opmode_ctrl (0x16h[3], 0x16h[1:0]). This instructs the BL1908 that single closed loop modulation
current control is to be used. The BL1908 will then download the target average monitor photodiode value into
register p0_target (0x0Ah) if an external EEPROM is used. The resolution of the setting is 8.33 uA/cnt or 2.083 uA/cnt
if 0x18h[3]=1b. If an external microprocessor is used, the above registers should be loaded at power-up.
Following the loading of the configuration registers, the BL1908 will measure the temperature and digitize it with an
internal A/D convertor. Using this temperature measurement a corresponding bias current amplitude and modulation
current amplitude will be automatically loaded into registers i0_msb (0x0Dh), ib0_lsb (0x0Eh) and im0_lsb (0x0Fh)
from an external EEPROM or these registers should be loaded by an external microcontroller.
12 bit DACs in the BL1908 will convert the values in register i0_msb (0x0Dh), ib0_lsb (0x0Eh) and im0_lsb (0x0Fh)
into analog currents which will be sunk at the IBIAS and OUTP outputs when the BL1908 DIS pin is low and BEN pin
is high. Then the modulation control loop will take over and refine the modulation output to more closely match the
target monitor photodiode level.
During operation, the BL1908 will automatically adjust the modulation current amplitude for variation in temperature
and aging of the laser. When the average monitor photodiode current changes, the BL1908 will adjust the modulation
current amplitude in registers i_msb (0x59h) and im_lsb (0x5Bh) until the digitized average monitor photodiode
current again matches the target average monitor photodiode current value.
The BL1908 temperature sensor will automatically measure the temperature and update the bias current from
27
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EEPROM when the temperature changes. If no EEPROM is used, an external microcontroller should periodically
read the temperature at register temp (0x0Bh[5:0]) or an external temperature sensor and update the modulation
current amplitudes at registers i0_msb (0x0Dh[7:4]) and im0_lsb (0x0Fh).
2.2.1.5 Dual Open Loop Control
If Dual Open Loop Control is selected, the bias and modulation current amplitudes are controlled by the internal
BL1908 temperature sensor or an external microcontroller. In this configuration the signal from the monitor
photodiode in the laser package is not used and the monitor photodiode is not needed.
At power-up a configuration register setting of value lk_up = 11b is loaded automatically by EEPROM into register
opmode_ctrl (0x16h[3], [1:0]). This instructs the BL1908 that Dual Open Loop control is to be used. If an external
microprocessor is used, the above register should be loaded at power-up to select Dual Open Loop control.
Following the loading of the control registers, the BL1908 will measure the temperature and digitize it with an internal
A/D convertor. Using this temperature measurement corresponding bias and modulation current amplitudes (12 bits)
will be automatically loaded into registers i0_msb (0x0Dh), ib0_lsb (0x0Eh) and im0_lsb (0x0Fh) from an external
EEPROM or the current amplitudes can be loaded into this register by an external microcontroller.
12 bit DACs in the BL1908 will convert the values in registers i0_msb (0x0Dh), ib0_lsb (0x0Eh) and im0_lsb (0x0Fh)
into analog currents which will be sunk at the IBIAS and OUTP outputs when the BL1908 DIS pin is low and BEN pin
is high.
During operation, the BL1908 will automatically adjust the bias and modulation current amplitudes for variation in
temperature if an external EEPROM is used. When the temperature changes, the BL1908 temperature sensor will
recognize the change and select the new corresponding bias and modulation current amplitudes from the external
EEPROM and load it into registers i0_msb (0x0Dh), ib0_lsb (0x0Eh) and im0_lsb (0x0Fh).
If an external microcontroller is used, the microcontroller will need to periodically read the temperature at BL1908
register temp (0x0Bh [5:0]) or any other external temperature sensor and adjust the bias and modulation current
amplitudes in registers i0_msb (0x0Dh), ib0_lsb (0x0Eh) and im0_lsb (0x0Fh) as necessary.
2.2.2 Modulator Output
The output stages OUTP and OUTN are designed to drive 0 Ohm to 50 Ohm or higher output loads over a wide
range of currents and circuit architectures. Nominally the output is critically damped for a 25 Ohm load, highly
underdamped for a 0 Ohm load and highly overdamped for a 50 Ohm load. The output should be DC coupled in burst
mode applications.
In burst mode applications, the OUTP and OUTN outputs are not interchangeable since the modulation current will be
switched to the OUTN output when BEN is low. In continuous mode applications the OUTP and OUTN outputs may
be switched when the data input polarity is reversed at register 0x01h[7].
In a typical application OUTP will be connected directly to the laser cathode through a series resistor. The series
combination of the laser and resistor is typically 10 Ohm to 30 Ohm. The choice of series resistance depends on the
minimum VCC and maximum modulation current and laser forward voltage. In general, choose the largest series
resistor which does not violate the minimum allowable voltage at OUTP. To maintain accuracy when a look-up table is
used, OUTP should stay above 1.1V (Dual Open Loop and Single Closed Loop (Bias). In closed loop applications
lookup table accuracy is not important and the series resistor should be chosen to keep OUTP above 0.8V. A higher
value series resistance will minimize overshoot and make it easier to achieve high extinction ratios with low jitter.
A corresponding 10 Ohm to 30 Ohm pull-up resistor to VCC is typically on the OUTN output.
The laser driver output stage is separately grounded from the rest of the circuitry (through GND0). At high data rates
(2.5 Gbps) GND0 may be connected to ground through a maximum of 15 nH of inductance to improve the transient
response. (In general, the inductor is not needed and eye quality is optimal with this pin connected directly to ground).
Care should be taken to insure that the modulation outputs are not driven below 0.7V or the eye margin of the optical
waveform will degrade. An RC snubbing network from OUTP to laser anode will probably be needed to compensate
for the parasitic inductance of the laser package.
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2.2.3 Data Inputs
In burst mode applications data inputs DINP and DINN are usually DC coupled at their inputs. The BL1908 will
automatically compensate for LVDS, PECL or CML input levels.
The pin location of the DIN inputs may be reversed in register polflip_ldd_din (0x01h[7] = 1) but the laser cathode
should always be connected to pin OUTP in burst mode applications since the modulation current will be shunted to
the OUTN output during ‖burst off‖ regardless of the polarity configuration of the data inputs.
When the data inputs are AC coupled, the internal self biasing will need to be enabled. This is done by setting
ac_coupl_ldd = 1 (0x01h[1] = 1).
There is an internal 100 Ohm termination resistor between DINP and DINN.
The BL1908 data inputs do not match the SFP MSA requirement of 500 mV to 2400 mV. However, the BL1908 inputs
are much more sensitive than the requirement so it is easy to attenuate the signal with series resistors at the data
inputs to exceed the requirement. The BL1908 sensitivity at the data inputs is specified for operation from 200 mV to
1600 mV. By adding 50 Ohm in series at pins DINP and DINN the acceptable input range is translated to 400 mV to
3200 mV which exceeds the SFP MSA.
2.2.4 Burst Enable Inputs
Burst enable inputs BENP and BENN should be DC coupled at their inputs. The BL1908 will automatically
compensate for LVDS, PECL, CML differential input levels (0x01h[0]=0b) and CMOS single-ended input levels
(0x01h[0]=1b).
The pin location of the BEN inputs may be reversed by bit polflip_ldd_ben = 1 in register glob_ctrl1 (0x01h[6] = 1).
Set sel_ben_cmos = 1 in register glob_ctrl1 (0x01h[0] = 1) to make pin BENP a single-ended input (leave pin
BENN open in this case). The threshold level for BENP in single-ended operation is approximately VCC/2.
In continuous mode applications, pin BENP should be connected to VCC and Set sel_ben_cmos = 1 in register
glob_ctrl1 (0x01h[0] = 1) to make pin BENP a single-ended input (leave pin BENN open).
For calibration purposes it is sometimes useful to force burst enable to the enable or disable state and ignore the
state of the Burst Enable pins. To force Burst Enable to the disable state (―squelch‖ burst enable) write registers
0x01h[3]=1b and 0x01[6]=0b. To force Burst Enable to the enable state) write registers 0x01h[3]=1b and 0x01[6]=1b.
Squelching burst enable is an alternative way to disable the laser output while keeping the system current constant
(the bias and modulation current are shunted away from the laser but remain at the operating level).
2.2.5 IPIN Input
Pin IPIN is the input to a high speed trans-impedance amplifier (TIA). If too much capacitance is connected to this pin,
this amplifier may become unstable. Up to 15 pF total capacitance (including the monitor photodiode and PCB
capacitance) may be connected directly to IPIN. If there is 100 Ohm between the capacitance and pin IPIN, up to 50
pF of capacitance may be attached.
If both the modulation and bias currents are operating in open loop mode, pin IPIN should be left open.
Care should be taken to avoid current spikes into IPIN which will overdrive the TIA and corrupt the operation of the
control loops for the bias and modulation current. External filtering may be required depending on the output
characteristics of the laser monitor photodiode. In Dual Closed Loop mode the settling time of the external filtering
and monitor PD should be less than the settling time programmed into the BL1908 at apc_ctrl2 (0x07h [7:4]).
In Single Closed Loop mode the internal filters (register 0x08h[5:2]) are adequate and no filtering is required between
the monitor photodiode and the IPIN input.
If spikes are present on the monitor photodiode signal in Dual Closed Loop mode, then it may be possible to mask
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them using the IPIN glitch mask. By default, the IPIN glitch mask is enabled. The IPIN glitch mask can be disabled by
setting registers 0x0Bh[1]=1b and 0x0Ch[1]=1b. The width of the IPIN glitch mask must be set to a value less than
the programmed settling time.
The IPIN TIA operating parameters will need to be programmed according to the monitor photodiode characteristics
and the data pattern, bit rate, and operating mode.
In both Dual and Single Closed Loop modes the TIA gain will need to be set at apc_tia (0x08h[0]) and
ipin_midrange (0x03h[1]). If the peak to peak monitor photodiode current is expected to range between 5 uA and
300 uA set 0x08h[0]=0b and 0x03h[1]=0b. If the peak to peak monitor photodiode current is expected to range
between 8.2 uA and 620 uA set this bit to 0x08h[0]=0b and 0x03h[1]=1b. If the peak to peak monitor photodiode
current is expected to range between 30 uA and 3000 uA set this bit to 0x08h[0]=1b and 0x03h[1]=0b.
The P1 and P0 settling times (p1_settling at 0x07h[3:0] and p0_settling at 0x07h[7:4]) and decimation factors
(deci_p1 at 0x05h[7:5] and deci_p0 at 0x05h[4:2]) must be set in Dual Closed Loop mode. The P1 settling times
should be chosen to be less than the bit duration multiplied by the maximum number of consecutive logic 1 states. For
example, GePON has a bit duration of 800 ps and is 8b10b encoded so not more than 5 consecutive 1’s or 0’s are
present in the data stream. As a result the P1 and P0 settling times should be set to 5 x 800ps = 4ns or less.
The decimation factor acts as a low pass filter on the loop that corrects the P1 and P0 optical levels. If the P1
decimation factor is set to 2, then the P1 level will not be adjusted until the loop control logic sees 2 consecutive P1
errors of the same polarity. If the P1 decimation factor is set to 64, then the P1 level will not be adjusted until the logic
sees 64 occurrences of P1 errors of the same polarity. Similarly with the P0 decimation factor.
When operating in Single Closed Loop mode, the PAVE decimation factors are set in apc_ctrl0 (0x05h [4:2]). The
PAVE settling times are set in apc_ctrl2 (0x05h [7:4]). The low pass filter bandwidth of the TIA is set at apc_tia
(0x08h[5:2]). In continuous mode operation the filter bandwidth of the TIA can be set to a very low frequency. In burst
mode applications it may be necessary to choose a higher frequency filter or a large number of WAIT states will be
required to insure that IPIN signal has settled before the single closed loop corrects the operating point.
The decimation factor in Single Closed Loop mode operates in the fashion as the decimation factor in Dual Closed
Loop mode.
It is necessary to set the WAIT states in Single Closed Loop mode. In burst mode applications the IPIN signal
bandwidth is low and the signal will not reach it settled level for several nanoseconds following a burst enable. The
WAIT state counts have a duration of 25 ns. The WAIT states should be set to a number of counts large enough to
allow the external and internal filters on IPIN to settle. The duration of the WAIT state must also be less than the
Burst Enable duration or no correction will be made to the bias current amplitude. For example, if the internal filter is
set to 17 MHz and there is no external filter then an appropriate WAIT state setting may be 16 (06h[5:2] = 110b)
which is a WAIT period of 400 ns.
WAIT states should be set to 0 for continuous operation (BENP always high) and greater than zero for burst mode
operation.
2.3 BL1908 Limiting Amplifier Overview
The BL1908 contains an integrated high-gain limiting amplifier. This limiting amplifier has selectable CML output
levels and is intended for use in applications to 2.5 Gbps. Full output swing is achieved even at minimum input
sensitivity. If the limiting amplifier function is not needed, it can be powered down by setting register 0x00h[1]=1b.
The CML output swing of 300mV can be increased to 500mV by setting register 0x00h[3]=1b. When the CML output
swing is increased, the current consumption of the BL1908 is increased by ~10mA
When rate select bit la_ratesel[5] = 0b in register glob_ctrl0 (0x00h[5] =0), the limiting amplifier is optimized for
downstream data rates ≤ 1.25 Gbps and the sensitivity is improved.
The BL1908 also includes a analog RSSI output proportional to the peak to peak input signal and a programmable
signal-level detector allows the user to set thresholds at which the logic outputs are enabled.
The pin location of the RxOUT outputs may be reversed by bit polflip_la = 1 in register glob_ctrl1 (0x01h[5] =1).
Figure 2-2.
BL1908 Limiting Amplifier Block Diagram
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BL1908
RxOUTP
RxOUTN
RxINP
limiting
amplifier
output
buffer
RxINN
JAM
bias
Offset cancel
IREF
VDDR
VDDR
RSSI
comparator
LOS
level
detect
los
threshold
JAM
STSET
GNDR
2.3.1 Receive Inputs
The data inputs RxINP and RxINN are internally connected to an internal reference voltage VTT via 60 Ohm
resistors, and generally need to be AC coupled to the TIA outputs. Referring to Figure 2-3, the nominal VTT bias
voltage is Vcc - 0.5V. See the applications information section for further details on choosing the AC-coupling
capacitor.
If the user want to use DC couple, Please set 0x00h[2]=1, The internal bias reference is disenabled.
Figure 2-3.
Receive Data Inputs
VCC3R
1.2K
RxINP
60
RxINN
60
18K
2.3.2 DC Offset Compensation
For video and OLT applications it is sometimes useful to get the low frequency cut-off as close as possible to 0 Hz.
The BL1908 low frequency cut-off is set by an internal DC auto-zero circuit that can remove the effect of DC offsets
without using external components. This circuit is configured such that the feedback is effective only at frequencies
well below the lowest frequency of interest in typical communications applications. The low frequency cut off is
typically 4 kHz.
The DC offset compensation can be disabled by setting register 0x02h[0]=1b. The low frequency cut off will then be
determined by the external coupling capacitors. However, this will degrade the input sensitivity of the limiting amplifier.
2.3.3 CML Outputs
The BL1908 features CML outputs. The outputs may be terminated using any standard AC or DC-coupling CML
termination technique. AC-coupling may be used in applications where the average DC content of the data is zero e.g.
GPON and GePON. The advantage of this approach is no susceptibility to DC offsets in supply voltages and
compatibility with non-CML interfaces such as PECL or LVDS.
2.3.4 Loss of Signal (LOS) or Signal Detect
The polarity of the LOS pin can be configured as either a loss of signal output (los_pol = 0) or signal detect output
(los_pol = 1) in register (0x02h[1]). Signal detect is simply an inverted LOS signal.
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BL1908
The BL1908 features input signal level detection over an extended range. Using an external resistor, RST, between pin
STSET and VCC the user can program the input signal threshold. The signal detect status is indicated on the LOS
output pin. The LOS signal is active when the signal is below the threshold value. The signal detection circuitry has
the equivalent of 3.5 dB (typical) electrical hysteresis.
RST establishes a threshold voltage at the STSET pin as shown in Figure 2-5. Internally, the input signal level is
monitored by the Level Detector which is the RSSIPP voltage. As described in the RSSIPP section, this voltage is
proportional to the input signal peak to peak value. The voltage at STSET is internally compared to the signal level
from the Level Detector. When the Level Detect voltage is less than V(STSET), LOS is asserted and will stay
asserted until the input signal level increases by a predefined amount of hysteresis. When the input level increases by
more than this hysteresis above V(STSET), LOS is deasserted. See the applications information section for the
selection of RST.
Note that STSET can be left open if the loss of signal detector function is not required. In this case LOS would be low.
Figure 2-4.
STset Input
VCC
VCC
Rst
STset
Vstset
2.3.5 JAM Function
The Jam function is available either at pin 29 when register 0x013[7] = 1b or as a register setting when 0x02h[2] = 1b.
When asserted, the JAM pin forces the limiting amplifier outputs to a logic ―one‖ state (RxOUTP high and RxOUTN
low). This ensures that no data is propagated through the system.
The JAM function is normally used to allow data to propagate only when the signal is above the user's bit-error-rate
requirement. It therefore inhibits the data outputs toggling due to noise when there is no signal present (this function
is sometimes referred to as ―squelch‖).
The loss of signal detection circuit can be used to automatically force the data outputs to a high state when the input
signal falls below the threshold. The connection between LOS and JAM may be made externally between the LOS pin
and the JAM pin. In this case the LOS pin must be defined as loss of signal (los_pol = 0b, register 0x02h[1]).
Jam can also be controlled by LOS without connecting the LOS pin to the JAM input. If register jam_los = 1b
(register 0x02h[2]) then the JAM function will be controlled by the internal state of the LOS function regardless of
whether the LOS pin is programmed to be the LOS or SD output.
2.3.6 Peak-to-Peak Received Signal Strength Indicator (RSSIpp)
The RSSIpp output voltage is logarithmically proportional to the peak-to-peak level of the input signal as shown in the
figures below.
Figure 2-5.
Typical RSSIpp Transfer Function (1.25G PRBS)
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BL1908
rssi
350
300
RSSI(mv)
250
200
150
100
50
0
0
Figure 2-6.
50
100
150
input(mV)
200
250
300
Typical RSSIpp Transfer Function (2.5G PRBS)
rssi
350
300
rssi(mv)
250
200
150
100
50
0
0
50
100
150
input(mV)
200
250
300
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BL1908
2.4 BL1908 Serial Communications Overview
The BL1908 has two 2-wire interfaces and a 3-wire SPI interface. The two 2-wire interfaces are active if pin 23 is low.
The 3-wire interface is active if pin 23 is high. Once the BL1908 has been powered, the state of pin 23 should not be
changed (it is not allowed to change from 2-wire communications to 3-wire communications after the chip has been
powered).
Pin 23 Status
Active Serial Interface
Low
I2C slave - Pins 4 and 5, I2C master – Pins 6 and 7
High
SPI – Pins 4, 5, 6 and 7
The primary interface (SCL_M and SDA_M, pins 6 and 7) connects the BL1908 to an AT24C08 EEPROM (if it is
present). In this case the BL1908 is the master and EEPROM is the slave. A second 2-wire interface (SCL_S and
SDA_S, pins 4 and 5) connect the BL1908 to an external microcontroller. In this case the microcontroller is the host
and the BL1908 is the slave.
At power-up, control registers 0x00h through 0x02Fh in the BL1908 need to be loaded using one of these 2-wire
interfaces or using the 3-wire interface. It is not necessary to use both an EEPROM and microcontroller, either is
sufficient.
If the bias and modulation current are being controlled in a dual closed loop configuration, no further interaction is
required between the BL1908 and the EEPROM or external microcontroller after loading the registers at power-up.
If the bias or modulation current are being controlled in an open loop configuration, the temperature sensor internal to
the BL1908 will update the bias and modulation control registers from EEPROM whenever the temperature changes.
If a microcontroller is used, the microcontroller will need to poll the BL1908 temperature sensor register (or an
external temperature sensor) and update the bias and modulation control registers when necessary.
Register information is also available to an external microcontroller after power-up via the second 2-wire bus. This
information includes digitized DDMI values.
2.5 BL1908 Laser Eye Safety
Using this laser driver in the manner described herein does not ensure that the resulting laser transmitter complies
with established standards such as IEC 825. Users must take the necessary precautions to ensure that eye safety
and other applicable standards are met. Note that determining and implementing the level of fault tolerance required
by the applications that this part is going into is the responsibility of the transmitter designer and manufacturer since
the application of this device cannot be controlled by Belling.
2.6 Safety Circuitry
Safety Circuitry in the BL1908 will assert the FAIL output immediately upon detecting a fault condition. In addition, if
the an external PFET controlled by FAIL is used to source the laser modulation and bias current the laser current will
immediately go open circuit and prevent any current from passing through the laser.
Fault detection circuit will monitor the voltage of IPIN, OUTP, OUTN, and monitor the bias and modulation current of laser diode to
guarantee the laser diode work properly in all conditions.
For an initialization or power-up sequence to be successful, all the fault detection monitors must signal that the chip is
―healthy‖.
When DIS goes low, pins are checked for shorts to ground or VCC and a FAIL condition is signalled if there is a fault.
The source of the fault can be determined by reading the status register at address 0x3Ch.
2.7 Rogue ONU
In addition to the conditions above, a ―rogue ONU‖ condition can also cause FAIL to assert if 0x018h[4]=0b
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BL1908
(rogue_dis). In PON applications a laser that continues to emit light when it should be off will disrupt communications
with all ONUs connected to the same OLT.
Rogue ONU will assert the FAIL pin when 0x018h[4]=0b, Burst Enable is low and OUTP is higher in voltage than
VCC-0.6V.
To determine whether Rogue ONU has caused FAIL to assert, toggle 0x18h[4] and see if the state of FAIL changes.
3. Applications
3.1 Applications Information
3.1.1 BL1908 Laser Driver Applications
Figure 3-1.
BL1908 Application Schematic
C3
C1
ROP
RON
JAM
C4
External MCU
R5
RSSI
Comp
LOS
TIA
RINN
Bias
Offset cancel
LIMITING
AMPLIFIER
VCC
RINP
Limiting
Amplifier
Output
Buffer
level
detect
IREF
LOS
Threshold
TOSA
JAM
SDA_M
/CSB
SCL_S/
SCLK
SDA_S/
SDI
R7
ROSA
R6
SCL_M
/SDO
External EEPROM
C2
ST_SET
R8
VCC
DAC_OUT
Aux DAC
Master
I2C
Control
Register
Slave
I2C
Aux
ADC
ADC_IN(i)
VCCT
R3
C6
Laser
POR
SPI
AUX_DAC/
JAM/
AUX_AD_I
VDDT
R1
Temp Sensor
I2CB/
SPI
RSSI
R9
RSSI/
AUX_AD_V
R2
TINP
TINN
Input
Buffer
Laser
Pre_driver
internal osc
BENP
BENN
Input
Buffer
APC and Mode
Control
Fault detection
DIS
TOP
Laser Diode
Driver
TON
Laser
Bias
L1
IBIAS
R4
IPIN
FAULT
R3
C5
LASER DRIVER
3.2 Connecting a Laser to the BL1908
The BL1908 is designed to operate with a minimal amount of external circuitry. Connecting a laser to the BL1908 is
best accomplished by using as few external resistors and capacitors as possible.
Ferrites or inductors may be used to improve the optical eye by isolating the BIASout pin and VCC. However, use of
ferrites and inductors will slow the burst-on of the laser so the lowest possible inductance value should be used in
ONT applications or the inductors should be shunted with low value resistors.
Differential currents are used at the output of the BL1908 laser driver, so decoupling capacitors near the laser are
usually not necessary and may degrade the optical eye.
The printed circuit board traces from OUTP and OUTN to the laser should ideally be 25 Ohm or lower impedance
transmission lines. This is often impractical, so the traces should be short and OUTP and OUTN should be sourced
from a common VCC point. Excess coupling capacitance between OUTN and OUTP should be avoided.
A PFET controlled by the FAIL output may be used to source VCC to the laser for eye safety compliance. Following is
a brief description of how to select each of the components shown in Figure 3-2.
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BL1908
Figure 3-2.
Connecting a Laser to the BL1908
VCC
0 Ohm to open
10Ω
10uF
120n
OUTN
27Ω
BL1908
200Ω
BOSA
2.2pF
OUTP
300Ω
5.6Ω
IBIASOUT
220nH
0~150Ω
IPIN
0~56pF
The resistor from OUTN to VCC should be as large a value as possible while guaranteeing that OUTN does not go
below 0.7V at all operating voltages and temperatures. By making OUTN large, less power is dissipated in the
BL1908.
The resistor from OUTP to the laser cathode should also be as large as possible while guaranteeing that OUTP does
not go below 0.7V. If this resistor is too small, the laser transient waveform is more likely to overshoot in both the
positive and negative direction which will make it difficult to achieve high extinction ratios.
The series resistor and capacitor from OUTP to the laser anode may be necessary to compensate for the parasitic
inductance of the laser package. The resistor should be as large as possible, but small enough to minimize the
amplitude of the turn-on spike at the laser cathode. The capacitor should be as small as possible, but large enough
that the RC time constant of the 2 components is similar to the LR time constant of the laser parasitic inductance and
the series resistance.
The resistor between IBIASout and the laser cathode should be at least 10 Ohm and eye quality is better if this resistor
is 50 Ohm or greater. It should be as large a value as possible, but small enough that the burst-on time is acceptable.
A ferrite or inductor is usually added in parallel with this resistor to make the DC impedance <10 Ohm.
IPIN may be left open if both the modulation and bias currents are operating in open loop modes. In dual closed loop
modes, care should be taken to avoid large positive or negative going spikes. The spikes may be absorbed by optional
RC filtering as shown in the figure. No more than 15 pF should be directly connected to pin IPIN (including monitor
photodiode capacitance and parasitic circuit board capacitance). Up to 50 pF of capacitance may be connected to
IPIN if it is isolated by at least 100 Ohm. In single closed loop modes the internal filtering is adequate and a small
series resistor of 50 Ohm is adequate.
3.2.1 Serial Interface Functional Description
3.2.1.1 BL1908 Chip Register Load from External Micro Controller Without EEPROM
For microcontroller use, follow these steps: Without EEPROM
1.
Write 06h to Host addr 4Bh (to terminate EEC).
2.
Write 02h to Host addr 4Bh (to enable EEC).
3.
Write to all necessary set-up registers different from the default values.
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4.
Write ―0‖ to bit 0 of address 27h to signaling to Analog circuit that all set-up registers are loaded.
5.
Polling bit 1 of address 49h (active high) to see if 8 bits temperature is ready for reading.
6.
Read the 8 MSB bits of the 10 bit temperature sensor at address 58h.
7.
Write 3 bytes data for Ibias/Imod to address 0Dh, 0Eh and 0Fh
8.
Write ―1‖ to bit 0 of address 4Eh to update 3-bytes of Ibia/Imod to digital filter generate dat_update pulse.
9.
Write ―1‖ to bit 0 of address 4Dh to send the initial ―OK‖ signal to Analog circuit.
For all other modes but the dual closed loop, continue the software routine from #6 and #7, #8 for every determined
period; for example at every 0.3ms interval.
3.2.1.2 Reading from EEPROM at Power-up
The BL1908 is designed and tested to be compatible with the Atmel 24C08A EEPROM. Other EEPROMs may be
compatible.
If an external EEPROM is present at pins SDA_M and SCL_M, a download from EEPROM to the BL1908 will
automatically be initiated.
4.7 kΩ pull-up resistors should be attached at SDA_M, SCL_M, SDA_S and SCL_S if these pins are used.
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Figure 3-3.
External EEPROM Memory Map
NOTE: See Section
3.2.1.3, ―Writing to
EEPROM‖ for different
EEPROM programming
techniques.
Table 3-1.
EEPROM Address for Temperature Based Bias and Modulation Current Lookup
Temperature
Modulation Current
MSB
Bias Current MSB
Bias Current LSB
Modulation Current
LSB
174 °C
3E0h[7:4]
3E0h[3:0]
3E1h[7:0]
3E2h[7:0]
173.1 °C
2FCh[7:4]
2FCh[3:0]
2FDh[7:0]
2FEh[7:0]
172.1 °C
2F9h[7:4]
2F9h[3:0]
2FAh[7:0]
2FBh[7:0]
Data not shown between 172.1 °C and 91.0 °C
91.0 °C
203h[7:4]
203h[3:0]
204h[7:0]
205h[7:0]
90.1 °C
200h[7:4]
200h[3:0]
201h[7:0]
202h[7:0]
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89.1 °C
1FCh[7:4]
1FCh[3:0]
1FDh[7:0]
1FEh[7:0]
88.1 °C
1F9h[7:4]
1F9h[3:0]
1FAh[7:0]
1FBh[7:0]
Data not shown between 7.1 °C and 88.1 °C
7.1 °C
103h[7:4]
103h[3:0]
104h[7:0]
105h[7:0]
6.1 °C
100h[7:4]
100h[3:0]
101h[7:0]
102h[7:0]
5.1 °C
0FCh[7:4]
0FCh[3:0]
0FDh[7:0]
0FEh[7:0]
4.1 °C
0F9h[7:4]
0F9h[3:0]
0FAh[7:0]
0FBh[7:0]
Data not shown between -76.9 °C and 4.1 °C
-76.9 °C
003h[7:4]
003h[3:0]
004h[7:0]
005h[7:0]
-77.9 °C
000h[7:4]
000h[3:0]
001h[7:0]
002h[7:0]
3.2.1.3 Writing to EEPROM
EEPROM used is 4 table select 2 byte addressing. When an external EEPROM is used, it may uploaded through the
BL1908. The data is sourced to the BL1908 through the slave port (SDA_S and SCL_S) which then transfers the
data to the EEPROM through the master port (SDA_M and SCL_M).
The 2-wire slave address of the BL1908 is fixed as 9Ch.
3.2.1.3.1 Writing Chip Registers and Look-up Table to EEPROM Using an External Controller
A new EEPROM comes preloaded with all registers set to FFh. It is recommended to use the ―Initialize Blank
EEPROM‖ as soon as the device connects to the microcontroller. This will load the EEPROM with the device chip
register defaults for you.
Uploading chip registers and the look-up table through the BL1908 can be slow. In production it may be preferable to
use an alternate upload method. This process will allow for uploading data into the EEPROM by passing the BL1908
altogether.
• Disable master I2C port control from BL1908 EVM.
• Connect the external I2C control to the EEPROM at EEPROM pins SDA and SCL.
• Upload data to EEPROM from the external controller then disconnect.
• Cycle the power and the BL1908 should automatically upload the new chip register values saved in the EEPROM.
Following is an example of a program that uses the BL1908 to initialize a blank EEPROM with the default chip values.
It is not necessary to initialize the EEPROM values if an external controller directly programs the EEPROM.
1.
Write 01h to register 0x4Fh.
2.
Write 06h to register 0x4Bh.
3.
Write 02h to register 0x4Bh.
4.
Write desired values to registers 0x00h through 0x1Bh.
5.
Calculate checksum and write the seed value to register 0x1Ch.
6.
Write 0x03h to register 0x60h to select page 3 of EEPROM.
7.
Write 0x01h to register 0x27h.
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8.
Write beginning memory byte address to register 0x48h.
9.
Write desired chip register values at register locations 0x40h – 47h (8 bytes at a time).
10.
Write 00h to register 0x4Bh.
11.
Write 0x03h to register 0x4Ah.
12.
Repeat steps 8 through 11 until all chip registers are programmed.
13.
Write 0x00h to register 0x4Bh.
14.
Perform soft reset or cycle power.
3.2.1.3.2 Writing the BL1908 Register Settings to EEPROM
To save BL1908 chip register settings to EEPROM, the BL1908 register settings (00h through 2Fh) are first written to
the corresponding location in the BL1908, then they are backed up to an external EEPROM simply by writing to
EEC_ctrl (4Ah[2:0] = 010b). An internal state machine in the BL1908 will then initiate and control the writing of the
chip register settings in the EEPROM.
The Checksum seed will need to be calculated and stored in register 0x1Ch. If the seed is correct 98h will be the
value in register 0x5Eh following EEPROM download.
Checksum Calculation Routine:
Seed = 9 8h
checksum = 0
regSum = 0
For i = 0 to 27
// add up the registers.
regSum = regSum + readReg(i)
Next i
// AND regSum with FFh to keep the value one byte in size.
regSum = regSum AND FFh
If regSum <= Seed Then
// if regSum = 64h then checksum would be 98h - 64h = 34h
checksum = Seed - regSum
Else
// Seed + 2's complement of regSum, so if regSum = E8h (2s complement = 18h)
// then the new checksum would be 98h + 18h = B0h.
checksum = Seed + Not(regSum) + 1
End if
// Write checksum to register 1Ch.
write(reg1Ch, checksum)
The Look-up Table spreadsheet will make this calculation for you.
3.2.1.3.3 Writing the Bias and Modulation Current Temperature-Based Look-up Tables to EEPROM
The EEPROM page select is determined by the value written to 0x60h[1:0]. See Chapter 4.0, ―Registers‖. It is
recommended that the EEPROM is written to directly from an external programming fixture as described in Section
3.2.1.3.1. The BL1908 writes the modulation and bias current look-up table to the EEPROM in blocks of 8 bytes. The
8 bytes of data are first written to BL1908 registers lkup0_dat, lkup1_dat, ...lkup7_dat, (addresses 0x40h through
0x47h). The EEPROM target address of lkup0_dat is written to lkup_addr (0x48h). The transfer from the BL1908 to
the EEPROM will occur after selecting write back look-up data in EEC_ctrl (4Ah[2:0] = 011b). The BL1908 will then
automatically write lkup0_dat to the location in lkup_addr and it will write lkup1_dat through lkup7_dat to
addresses in the EEPROM 1 to 7 counts above the address in lkup_addr.
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BL1908
The look-up table values for bias and modulation current at a specific temperature occupy 3 bytes. The first byte
contains the 4 most significant bits of the bias and modulation current, the next byte contains the 8 least significant
bits of the bias current, the final byte contains the 8 least significant bits of the modulation current.
EEPROM addresses (see Figure 3-3 for addresses) hold the bias and modulation current look-up tables using a
Microcontroller to load the BL1908 registers.
If a microcontroller is available to load the BL1908 registers, an external EEPROM is not needed.
When the BL1908 power-on reset sequence is complete, the BL1908 will attempt to download register data from an
external EEPROM for 6 ms even if one is not present.
An external microcontroller can abort the BL1908 download process from EEPROM by writing 1Ch to register 0x4Bh
(disable checksum, disable LUT read, terminate EEPROM download). The order of operation required by the BL1908
of the microcontroller is:
1.
Disable EEPROM reading by writing 1Ch to register 0x4Bh.
2.
Write 08h to register 0x4Bh.
3.
Write the desired values to all chip registers from 0x00h through 0x1Bh. (it is not necessary to write registers
with value 00h). If an instant start-up value other than 0 mA is to be used for the bias and modulation current, they
should be written to i0_msb at 0Dh, ib0_lsb at 0Eh and im0_lsb at 0Fh.
4.
Signal that download is complete so the chip can begin normal operation by writing dcomplete = 0b at 27h[0].
5.
Write ucontrol = 1b at 0x2Fh[0] (a 1b at this location signifies microcontroller control of the registers, 0b
signifies EEPROM control of the registers). In Single Closed Loop and Dual Open Loop modes perform the above 5
steps, then continue to loop through steps 6 through 11.
6.
Poll the temp_ready bit of Dig_status until it equals 1b, (49h[1]).
7.
Write 00h to register 0x4Bh.
8.
Read the 10-bit temperature sensor value at 0x58h[7:0] and 0x57h[1:0].
9.
Write the start-up bias current amplitude and modulation current amplitude into registers i0_msb (0Dh), ib0_lsb
(0Eh) and im0_lsb (0Fh).
10. Strobe the BL1908 to load the bias and modulation current values at 4Eh[0].
11.
Signal that the data received by the BL1908 is OK by writing a 1 at 4Dh[0].
3.3 BL1908 Limiting Amplifier Applications Information
3.3.1 Reference Current Generation
The BL1908 contains an accurate on-chip bias circuit that requires an external 11.6 kΩ 1% resistor, RREF, from pin
IREF to ground to set the LOS threshold voltage at STSET precisely and to set other precision internal references.
Figure 3-4.
Reference Current Generation
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BL1908
VCC
Vref
Iref
Rref=10.5K
3.3.2 Input AC-Coupling Capacitor Choosing
When AC-coupling the input the coupling capacitor should be of sufficient value to pass the lowest frequencies of
interest, bearing in mind the number of consecutive identical bits, and the input resistance of the part. A good rule of
thumb is to chose a coupling capacitor that has a cut-off frequency less than 1/(10, 000) of the input data rate. For
example, for 2.5 Gbps data, the coupling capacitor should be chosen as:
f CUTOFF ≤ (2.5 x 109 / 10 x 103) = 250 x 103
The -3 dB cutoff frequency of the low pass filter at the 50 Ohm input is found as:
f3dB = 1/ (2 * pi * 50 Ohm * CAC)
so solving for C where f3dB = fCUTOFF
CAC = 1/ (2 * pi * 50 Ohm * fCUTOFF) EQ.1
and in this case the minimum capacitor is 12 nF.
3.3.3 Rate Selection
When the la_rate_sel is high (0x00h[1]=1b), the BL1908 bandwidth is set to its maximum which allows the BL1908
to operate at data rates up to 2.5 Gbps.
When operating at data rates ≤ 1.25 Gbps, then la_rate_sel should be low (0x00h[1]=0b). This enables low-rate
mode which reduces the bandwidth (and thus the noise level) of the limiting amplifier.
3.3.4 Setting the Signal Detect Level
Table 3-3, show the value for RST is chosen to set the LOS threshold at the desired value(1.25G).
Table 3-3.
Suggested RST Values
RST_set (KΩ)
Assert level (mV)
Deassert level (mV)
6.18
2.94
4.66
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6.02
6.58
11.35
5.88
9.9
13.35
5.6
19.45
27.2
5.44
30.4
37
5.28
38.6
45.4
5.1
49.8
59.2
3.3.5 CMLP and CMLN Termination
The outputs of the BL1908 are CML compatible and any standard AC or DC-coupling termination technique can be
used. In both cases the transmission line should either be terminated the appropriate resistor (typically 100 Ohms
differentially or 50 ohms single-ended). If using transmission lines other than 50 Ohm, the shunt terminating resistance
ZT should equal twice the impedance of the transmission line (ZO).
AC-coupling is used in applications where the average DC content of the data is zero. The advantage of this
approach is no susceptibility to DC drift and compatibility with non-CML interfaces and CML interfaces using different
voltage supplies.
DC coupling has the advantage of lower component count (2 less capacitors). DC coupling is preferable in video
applications or if JAM is used. In these cases the outputs may be fixed in a near DC state.
3.3.6 JAM Function
LOS (loss of signal) can be internally connected to JAM regardless of whether pin 30 is assigned to be LOS or Signal
Detect. This is done by setting the jam_los bit high (0x02h[2] = 1b). The same thing can be done external to the
BL1908 by connecting the LOS output pin to the Jam input pin if pin 29 is assigned to be JAM (0x13h[7]=1b).
When LOS is connected to Jam (internally or externally) and LOS asserts, the Jam function sets the data outputs to
a fixed ―one‖ state (CMLP is held high and CMLN is held low). This is normally used to allow data to propagate only
when the signal is above the users' bit error rate (BER) requirement. It prevents the outputs from toggling due to
noise when no signal is present.
From the LOS assert and deassert figures above (Figure 3-5 through Figure 3-7), when an input signal is below the
LOS assert threshold, LOS asserts (LOS high) causing Jam to assert. When Jam asserts, the data outputs of the
BL1908 are disabled. If the input signal reaches or exceeds the LOS deassert threshold, LOS deasserts (LOS low)
causing Jam to deassert, and hence enables the data outputs.
3.4 Monitoring the Tx and Rx Channels with the BL1908
The BL1908 can digitize all the parameters needed for DDMI (Digital Diagnostics Monitoring Interface) compliance.
The BL1908 has an internal 12-bit A/D with six multiplexed inputs. All six channels are refreshed at a rate of 1kHz of
greater. The refreshing of the A/D can be verified by using the ―conversion complete‖ bit at 0x5Ch[0]. If a 1b is written
to this bit, it will clear itself to value 0b when the next A/D conversion is complete. The A/D convertor results can be
read at any time from registers below.
Table 3-4.
Parameters Monitored by the BL1908
Parameter
Pin (or internal)
Range
LSB
Register
Supply Voltage
internal
2.8V to 3.6V
0x52h[7:0] + 0x51h[3:0]
Temperature
internal
-40C to +125C
0x58h[7:0] + 0x57h[1:0]
Transmitted Power
internal
Receive Power (data)1
Pin 29
0x56h[7:0] + 0x57h[7:4]
0x11h[0]=0b
0x53h[7:0] + 0x54h[7:4]
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0x11h[0]=1b
Receive Power (video)1
Pin 28
0x50h[7:0] + 0x51h[7:4]
Receive Power (data, non-linear peak-to-peak)
internal
0x55h[7:0] + 0x54h[3:0]
Modulation Current
internal
0x59h[7:4] + 0x5Bh[7:0]
Bias Current
internal
0x59h[3:0] + 0x5Ah[7:0]
1. Pins 28 and 29 are general purpose A/D inputs that can be assigned to monitor any parameter.
Before pins 28 and 29 can be used as A/D convertors, they must be assigned this function. To assign pin 28 as a
voltage input A/D convertor input set 0x18h[6]=0b. To assign pin 29 as a current input A/D convertor input set
0x18h[5]=0b and 0x13h[7]=0b.
The accuracy of the A/D convertors degrades with load capacitance. To compensate the A/D clock can be slowed at
register 0x17h[3:2].
In Dual Open Loop mode, transmit power monitoring will only be active if the part is initialized in Single Closed Loop
mode at power up. To make transmit power monitoring active in Dual Open Loop mode, register 0x16h[1:0] must be
set to 01b or 10b and register 0x04[0]=0b prior to writing download complete (0x27h[0]=0b). After writing 0x27h[0]=0b,
the part may be changed to Dual Open Loop mode by writing0x16h[1:0]=11b, but 0x04h[0] must remain set to 0b for
transmit power monitoring.
4. Registers
Caution: Writing to reserved bits may result in unpredictable behavior at the BL1908 outputs. This can also occur
when reserved bits are written from a blank EEPROM. If an external EEPROM is to be programmed through the
BL1908 registers 0x40h - 0x048h then first use an initialization program to pre-program EEPROMs with the default
values before loading desired register values.
Limiting Amplifier Control (glob_ctrl0: Address 0x00h)
Bits
Type
Default
Lab
el
7:6
00
RSVD
Reserved
5
R/W
0
la_ratesel
Description
0: 1.25Gbs and below data rate.
1: 2.5Gbs data rate.
Reserved
0: RxOUT CML 300mV swing
1: RxOUT CML 500mV swing
4
-
0
RSVD
3
R/W
0
cml_hi
2
R/W
0
dc_couple_la
0:ac couple
1: dc couplel
1
R/W
0
la_powerdown
0: limiting amplifier - operational
1: limiting amplifier - powered down
This bit should be set during initial loading of registers.
may not be powered up after the initial loading.
0
-
0
RSVD
The limiting amplifier
Reserved
Data and BEN Input Configuration (glob_ctrl1: Address 0x01h)
Bits
Type
Default
Label
7
R/W
0
polflip_ldd_din
6
R/W
0
polflip_ldd_ben
5
R/W
0
polflip_la
Description
Laser Driver Data input polarity flip.
0: normal polarity
1: reversed polarity
Laser Driver BEN polarity flip.
0: normal polarity
1: reversed polarity
Limiting Amplifier polarity flip.
0: normal polarity
1: reversed polarity
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4
R/W
0
squelch_ldd_din
3
R/W
0
squelch_ldd_ben
2
R/W
0
RSVD
1
R/W
0
ac_coupl_ldd
0
R/W
0
ben_cmos
0: normal operation, modulation outputs controlled by data inputs
1: data inputs ignored. OUTN modulation output active if
0x01h[7]=0b. OUTP modulation output active if 0x01h[7]=1b.
0: normal operation, burst enable state controlled by burst enable inputs
1: burst enable inputs ignored. Burst off state at modulation and bias outputs if
0x01h[6]=0b. Burst on state if 0x01h[6]=1b.
Reserved
Laser Driver Data input AC coupling, set to 1 for self biasing of data inputs.
0: DC coupled
1: AC coupled
0: BEN differential mode
1: BEN single-ended CMOS/LVTTL
LOS, JAM and DC Restore (la_ctrl0: Address 0x02h)
Bits
Type
Default
Label
733
23
-----
1
R/W
0
—
R/W
0
0
0
0
00
0
0
0
Description
RSVD
Reserved
jam_los
0: No squelch of limiting amplifier or it is controlled by pin 29 if 0x13h[7]=1b.
1: Limiting Amplifier squelch controlled by internal LOS state.
0: LOS pin is LOS (loss of signal).
1: LOS pin is SD (signal detect).
0: Normal operation.
1: Limiting Amplifier DC Restore disabled, sensitivity reduced.
los_pol
la_dc_restore
IPIN Control (la_ctrl1: Address 0x03h)
Bits
Type
Default
Label
Descriptio
n
7
R/W
0
soft_dis
Disable laser outputs.
0: laser may be enabled
1: laser disabled
6:4
-
000
RSVD
Reserved
3
R/W
0
RSVD
Reserved
2
--
0
RSVD
Reserved
1
R/W
0
ipin_midrange
0
R/W
0
RSVD
0: No effect on IPIN gain.
1: IPIN range of 8.2uA to 620uA when register 0x08h[0]=1.
Reserved
Open Loop Current Reduction (pd_ldd_ctrl: Address 0x04h)
Bits
Type
Default
Label
Description
7:3
2
-R/W
00000
0
RSVD
pd_ad
1
R/W
0
RSVD
Reserved
Power down A/D convertor.
0: A/D operational
1: A/D powered down (not recommended)
Reserved
0
R/W
0
RSVD
Reserved
Closed Loop Decimation Factor (apc_ctrl0: Address 0x05h)
Bits
Type
Default
Label
7:5
R/W
000
deci_p1[2:0]
4:2
R/W
000
deci_p0[2:0]
1:0
--
00
RSVD
Description
Select decimation factor for p1 loop.
000: 1 001: 2
010: 4
011: 8
100: 16 101: 32 110: 64
Select decimation factor for p0 loop.
000: 1 001: 2
010: 4
011: 8
100: 16 101: 32 110: 64
Reserved
Closed Loop WAIT States (apc_ctrl1: Address 0x06h)
Bits
7:5
Type
R/W
Default
000
Label
wait_state[2:0]
Description
Select WAIT states in single closed loop mode. Set to 0 in continuous mode
applications.
000: 0
001: 2
010: 4
011: 8
100: 16
101: 32
110: 64
111: 64
45
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zip: 200233 Tel: 86-021-24261000 Fax: 86-021-64854424
BL1908
4
3:0
R/W
0
RSVD
Reserved
--
0000
RSVD
Reserved
MonitorPhotodiode Setting Time (apc_ctrl2: Address 0x07h)
Bits
Type
Default
Label
Description
7:4
R/W
0000
p0_settling[3:0]
Programs settling time of PD from data falling edge.
1111: 25.6ns
1110: 19.2ns
1101: 16ns
1011: 9.6ns
1010: 8ns
1001: 6.4ns
0111: 4ns
0110: N/A
0101: 3.2ns
0011: 2.4ns
0010: 2ns
0001: 1.6ns
3:0
R/W
0000
p1_settling[3:0]
Programs settling time of PD from data rising edge.
1111: 25.6 ns
1110: 19.2 ns
1101: 16 ns
1011: 9.6 ns
1010: 8 ns
1001: 6.4 ns
0111: 4 ns
0110: N/A
0101: 3.2 ns
0011: 2.4 ns
0010: 2 ns
0001: 1.6 ns
1100: 12.8ns
1000: 4.8ns
0100: 2.8ns
0000: N/A
1100: 12.8 ns
1000: 4.8 ns
0100: 2.8 n
0000: N/A
Single Closed Loop Filter, IPIN Mid-range (apc_tia: Address 0x08h)
Bits
Type
7:6
--
5:2
R/W
Default
00
0000
RSVD
La
be
l
lpfave[3:0]
Description
Reserved
Select low pass filter for single closed loop operation
If lk_up[1:0]=10/01, lpfave_sw[5]=1
Lpfave[3:0]
lpfave_sw[4:0]
1010 17MHz
1_1111
1001 8.5MHz
0_1111
1000 4.25MHz
0_0111
0111 2.125MHz
0_0011
0110 1.0625MHz
0_0001
0000 LPF off
0_0000
If lk_up[1:0]=11/00, lpfave_sw[5]=0
lpfave_sw[4:0]=5’b0_0000
1
--
0
RSVD
0
R/W
0
tia_gain
Reserved
Select TIA gain. Also see register 0x03h[1] for mid-range gain.
0:IPIN [5 μA:300 μA]
1:IPIN [30 μA:3 mA]
IPIN P1 Target (p1_target: Address 0x09h)
Bits
Type
Default
Label
7:0
R/W
00000000
p1_t[7:0]
Description
Sets P1 target in 12.5 μA steps/count in Dual Closed Loop.
00000000: 0 μA
00000001: 12.5 μA
…
11111111: 3.1875 mA
note: If 0x18h[3]=1b, then the P1 target step size is 3.125μA/count.
IPIN P0 Target (p0_target: Address 0x0Ah)
Bits
Type
Default
Label
7:0
R/W
00000000
p0_t[7:0]
Description
Sets P0 target in 4.165 μA steps/count in Dual Closed Loop or Pavg target in
8.33 μA steps/count in Single Closed Loop mode.
00000000: 0/0 μA
00000001: 4.165/8.33 μA
…
11111111: 1.062/2.124 mA
note: If 0x18h[3]=1b, then the P0 target step size is 1.041μA/count and the
SCL Pave target step size is 2.083μA/count.
P1 Glitch Mask and DCL Power Saving for CW Operation (p1_glitch: Address 0x0Bh)
Bits
Type
Default
Label
Description
7
R/W
0
RSVD
Reserved
6
--
0
RSVD
Reserved
p1mask[3:0]
P1 Mask width, , if p1m_dis=1, p1mask=0000
1111: 6.0 ns
1110: 5.6 ns
1101: 5.2 ns
1011: 4.4 ns
1010: 4.0 ns
1001: 3.6 ns
0111: 2.8 ns
0110: 2.4ns
0101: 2.0 ns
0011: 1.2 ns
0010: 0.8 ns
0001: 0.4 ns
5:2
R/W
0000
1100: 4.8 ns
1000: 3.2 ns
0100: 1.6 ns
0000: 0 ns
46
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zip: 200233 Tel: 86-021-24261000 Fax: 86-021-64854424
BL1908
1
R/W
0
p1m_dis
0: P1 glitch mask enabled
1: P1 glitch mask disabled
0
R/W
0
RSVD
Reserved
P0 Glitch Mask, 1010 Pattern Generator, FAIL control (p0_glitch: Address 0x0Ch)
Bits
Type
Default
Label
Description
7
6
—
--
0
fail_dis
0: FAIL and DIS are independent
1: FAIL low if DIS is high
0
RSVD
Reserved
5:2
R/W
0000
p0mask[3:0]
1
R/W
0
p0m_dis
0
R/W
0
p1010
P0 Mask width, (if p0m_dis=1, p0mask=0000)
1111: 6.0 ns
1110: 5.6 ns
1101: 5.2 ns
1011: 4.4 ns
1010: 4.0 ns
1001: 3.6 ns
0111: 2.8 ns
0110: 2.4ns
0101: 2.0 ns
0011: 1.2 ns
0010: 0.8 ns
0001: 0.4 ns
0: P0 glitch mask enabled
1: P0 glitch mask disabled
1100: 4.8 ns
1000: 3.2 ns
0100: 1.6 ns
0000: 0 ns
0: normal operation, outputs controlled by data inputs
1: data inputs ignored, 20 MHz internal clock output at OUTP and OUTN for dual
closed loop calibration of P1 and P0 targets.
Initial Bias and Modulation Current MSB (i0_msb: Address 0x0Dh)
Bits
Type
Default
Label
Description
7:4
R/W
0000
im0[11:8]
Initial modulation current MSB.
3:0
R/W
0000
ib0[11:8]
Initial bias current MSB.
Initial Bias Current LSB (ib0_lsb: Address 0x0Eh)
Bits
Type
Default
Label
7:0
R/W
00000000
ib0[7:0]
Description
Initial bias current LSB.
Initial Modulation Current LSB (im0_msb: Address 0x0Fh)
Bits
Type
Default
7:0
R/W
00000000
Label
im0[7:0]
Description
Initial modulation current LSB.
DAC MSB (DAC_msb: Address 0x10h)
Bits
Type
Default
Label
7:0
R/W
00000000
dac[8:1]
Description
8 most significant bits of 9 bit Auxiliary DAC,
DAC and A/D Control (ddmi_ctrl1: Address 0x11h)
Bits
Type
Default
Label
Description
7
R/W
0
dac[0]
Auxiliary DAC lsb, see 0x10h for MSBs
6
R/W
0
dac_pwr
5
R/W
1
dac_pol
4
--
0
RSVD
0: Auxiliary
1: Auxiliary
0: Auxiliary
1: Auxiliary
Reserved
3
R/W
1
vsense_pwr
2
--
1
Temp_ad
1
R/W
1
rxp_pwr
0
R/W
0
rxp_x4
DAC enabled
DAC powered down
DAC sinks current
DAC sources current
1: VCC sense A/D enabled
0: VCC sense A/D powered down
1: Temperature sensor A/D enabled
0: Temperature sensor A/D powered down
1: Pin 29 A/D enabled
0: Pin 29 A/D powered down
0: Pin 29 A/D normal gain and range
1: Pin 29 A/D x4 gain and 1/4 range
DDMI A/D Control 2 (ddmi_ctrl2: Address 0x12h)
Bits
7
Type
--
Default
0
Label
RSVD
Description
Reserved
47
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zip: 200233 Tel: 86-021-24261000 Fax: 86-021-64854424
BL1908
6
R/W
1
rssi_ad
1: RSSI A/D channel enabled
0: RSSI A/D channel powered down
5
--
0
RSVD
Reserved
4
R/W
1
pin28_ad
1: Pin 28 A/D channel enabled
0: Pin 28 A/D channel powered down
3
--
0
RSVD
Reserved
2
R/W
0
RSVD
Reserved
1
--
0
RSVD
Reserved
0
R/W
1
txp_ad
1: TxP A/D channel enabled
0: TxP A/D channel powered down
JAM PIN and PD current (jam: Address 0x13h)
Bits
Type
Default
Label
Description
7
R/W
0
6:3
R/W
0000
RSVD
2
R/W
0
RSVD
1: Assign JAM function to Pin 29
0: Pin 29 is assigned to Aux DAC or Aux A/D(I).
Reserved
Reserved
1
R/W
0
RSVD
Reserved
0
R/W
0
pd_current
0: normal operation
1: Photodiode current mirror disabled for TxP
jam_pin
Disable IPIN Laser FAIL Detector (safety_logic: Address 0x14h)
Bits
Type
Default
Label
7:4
3
2:0
-R/W
--
0000
0
000
Description
RSVD
Reserved
ipinfail_dis
0: normal operation (IPIN must be between [0.4V;1.8V] for FAIL = L).
1: IPIN can be tied to VCC or VEE without triggering FAIL (open loop operation).
Reserved
RSVD
Bias Current Power (bias_ctrl: Address 0x15h)
Bits
Type
7:3
--
4
3:1
0
R/W
-R/W
Default
0000
0
00
0
Label
Description
RSVD
Reserved
dcd_correction
0: DCD correction disabled. Use this setting when 0x03[3]=1b
1: DCD correction enabled. Use this setting when 0x03[3]=0b
Reserved
RSVD
bias_ctrl
1: Recommended operation: Bias current shunted away from laser and reduced by
2/3 during burst-off when Ibias > 30 mA.
0: Bias current shunted away from laser but not reduced during burst off.
Select Laser Driver Operating Mode (opmode_ctrl: Address 0x16h)
Bits
Type
Default
Label
7:4
--
0000
Reserved
0
avg
1: Single closed loop mode. 0x16h[1:0] = 01b or 10b.
0: Dual open loop or dual closed loop mode. 0x16h[1:0] = 00b or 11b.
Reserved
3
R/W
2
R/W
0
RSVD
1:0
R/W
00
lk_up[1:0]
Modes of operation:
00b: Dual closed loop: bias and modulation controlled by P0 and P1 monitor
photodiode levels.
01b: Single closed loop (modulation control) bias current look-up table,
modulation current controlled by average monitor photodiode current.
10b: Single closed loop (bias control) modulation current look-up table, bias
current controlled by average monitor photodiode current.
11b: Dual open loop: bias and modulation current look-up table.
A/D Clock (A/D Clock Rate: Address 0x17h)
Bits
Type
Default
Label
7:4
--
Description
RSVD
0000
RSVD
Description
Reserved
48
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zip: 200233 Tel: 86-021-24261000 Fax: 86-021-64854424
BL1908
3:2
R/W
11
ad_clk[1:0]
A/D Clock rate for all monitoring functions and external A/D inputs. Clock rate can
be reduced for improved accuracy. Clock rate should be reduced for capacitive
loads >10 pF at A/D inputs at pins 28 or 29.
11 - 312 kHz
10 - 156 kHz
01 - 78 kHz
00 - 39 kHz
1:0
--
00
RSVD
Reserved
Rogue ONU, Pin 28/29 Def, MPD target Curr. Resol, Burst-off power down (rogue: Addr.0x18h)
Bits
Type
Default
Label
Description
7
--
0
RSVD
Reserved
6
R/W
0
pin28_def
5
R/W
0
pin29_def
0b:
1b:
0b:
1b:
4
R/W
0
rogue_dis
3
R/W
0
ptar_div4
2
R/W
0
boff_pd
1:0
--
00
RSVD
Assign AUX A/D(V) to pin 28, results in 0x50h and 0x51h
Assign analog RSSIPP output to pin 28.
Assign AUX A/D(I) to pin 29, results in 0x53h and 0x54h
Assign AUX DAC to pin 29, source value in 0x10h and 0x11h
0x13h[7]=1b will override this setting and assign pin 29 to JAM
0b: FAIL will assert if rogue ONU detected.
1b: FAIL will not assert if rogue ONU detected
0b: P1, P0 and Pave target scaling normal
1b: P1, P0 and Pave target scaling divided by 4
0b: recommended operation
1b: power down laser driver closed loop control during burst off (50 mA).
modulation and bias current amplitude may be inaccurate for bursts less than
500 ns in length.
Reserved
Temp Sensor (RSVD: Address 0x19h)
Bits
Type
Default
7:0
R/W
00111111
Label
temp_slope
Description
Temperature slop default is 3FH
Bias Current Limit (bias_lim: Address 0x1Ah)
Bits
Type
Default
Label
7:0
R/W
11111111
Description
These 8 bits are compared to the 8 MSBs of the bias current output (0x59h and
0x5Ah). When these values are exceeded, FAIL will assert.
bias_lim
Modulation Current Limit (mod_lim: Address 0x1Bh)
Bits
7:0
Type
R/W
Default
11111111
Label
Description
These 8 bits are compared to the 8 MSBs of the modulation current output (0x59h
and 0x5Bh). When these values are exceeded, FAIL will assert.
mod_lim
Checksum (checksum: Address 0x1Ch)
Bits
Type
Default
Label
7:0
R/W
00000000
Description
The sum of register values in 0x00h through 0x1Bh plus the value in this register
should be 98h.
The correct value must be loaded into this register before writing to EEPROM
(0x4Ah[2:0]=010b). When the correct value is in this register, 0x5Eh=98h.
Checksum
Register Loading Complete (dcomplete: Address 0x27h)
Bits
Type
Default
7:1
--
0000000
0
R/W
1
Label
Description
RSVD
Reserved
dcomplete
0b: Register Download Complete. (registers 0x00h through 0x27h)
1b: Register Download not Complete.
Temp Offset ( Address 0x29h)
Bits
Type
Default
7:0
R/W
00000000
Label
temp_offset
Description
Temperature offset register use to compensate the junction temperature
and offset of temperature sensor
49
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zip: 200233 Tel: 86-021-24261000 Fax: 86-021-64854424
BL1908
EEPROM or MCU control (ucontrol: Address 0x2Fh)
Bits
Type
Default
7:1
--
0000000
0
R/W
1
Label
Description
RSVD
Reserved
ucontrol
0b: EEPROM control
1b: Microcontroller control.
Chip Registers
Bits
Type
7:4
--
3:0
R/W
Default
0000
0000
Label
Description
RSVD
Reserved
div_sel
I2C clock divider register.
FAIL Flags (status: Address 0x3Ch)
Bits
Type
7:6
--
Default
00
Label
Description
RSVD
Reserved
5
R
0
fail_mod
Mod current digital code overflow.
4
R
0
fail_bias
Bias current digital code overflow.
3
R
0
fail_ibiasout
IBIASOUT pin is below 400 mV.
2
R
0
fail_iout
OUT+ pin is below 400 mV.
1
R
0
fail_ipin
IPIN voltage is not between 400 mV and 1.8V.
0
R
0
fail
Fail pin status.
Write EEPROM Look-up Table Byte 0-7 (Address 0x40h--0x47h)
Bits
Type
Default
Label
Description
7:0
R/W
00000000
lkup0_dat
1st byte of look-up table data to be transferred to EEPROM.
7:0
R/W
00000000
lkup1_dat
2nd byte of look-up table data to be transferred to EEPROM.
7:0
R/W
00000000
lkup2_dat
3rd byte of look-up table data to be transferred to EEPROM.
7:0
R/W
00000000
lkup3_dat
4th byte of look-up table data to be transferred to EEPROM.
7:0
R/W
00000000
lkup4_dat
5th byte of look-up table data to be transferred to EEPROM.
7:0
R/W
00000000
lkup5_dat
6th byte of look-up table data to be transferred to EEPROM.
7:0
R/W
00000000
lkup6_dat
7th byte of look-up table data to be transferred to EEPROM.
7:0
R/W
00000000
lkup7_dat
8th byte of look-up table data to be transferred to EEPROM.
Address of Look-up Table Byte 0 (lkup_addr Address 0x48h)
Bits
Type
Default
7:0
R/W
00000000
Label
lkup_addr
Description
Target EEPROM address for lkup0_dat. This address should be divisible by 8.
Temperature Sensor and EEPROM Status (Dig_status Address 0x49h)
Bits
Type
Default
Label
Description
7:2
--
000000
RSVD
Reserved
1
R
0
temp_ready
1: Temperature sensor output ready for reading.
0: Not ready.
0
R
0
RSVD
Reserved
EEPROM Read/Write (EEC_ctrl Address 0x4Ah)
Bits
Type
Default
Label
7:3
--
00000
RSVD
Description
Reserved
50
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zip: 200233 Tel: 86-021-24261000 Fax: 86-021-64854424
BL1908
2:0
R/W (selfclr)
000
eec_ctrl[2:0]
000: Idle.
001: Read temperature dependent current data to register 0x0D,
0x0E, 0x0F from EEPROM.
010: Write BL1908 registers 0x00-0x2F to EEPROM.
011: Write 8 byte block of look-up data to EEPROM.
100: Read BL1908 register 0x00-0x2F from EEPROM.
EEPROM Download Disable (I2C_ctrl: Address 0x4Bh)
Bits
Type
Default
Label
7:5
--
000
RSVD
Reserved
1: Disable checksum calculation following download from EEPROM
0: Normal EEPROM READ operation with checksum.
1: Disable reading of external look-up table.
0: Normal operation.
1: Terminate download from EEPROM.
0: Download from EEPROM active.
Reserved
4
R/W
0
dis_chksm
3
R/W
0
dis_norm_read
2
R/W
0
term_eeprom
1:0
--
00
RSVD
DAC Status (Data_OK: Address 0x4Dh)
Bits
Type
Default
Label
7:1
0
-R/W
Description
Description
0000000
RSVD
Reserved
0
RSVD
Reserved
WRITE Initial Bias and Modulation Current into DACs (Strobe: Address 0x4Eh)
Bits
Type
Default
Label
Description
7:2
--
000000
RSVD
Reserved
1
R/W
(self-clr)
0
auxdac_strobe
Load AUX DACs.
0
R/W
(self-clr)
0
strobe
Load bias and modulation current to output DACs.
RESET (Soft_RESET: Address 0x4Fh)
Bits
Type
Default
Label
7:1
0
-R/W
(self-clr)
READ STATUS
Bits
Type
0000000
0
Default
RSVD
Reserved
soft_reset
RESET
Label
R
Bits
Type
7:4
R
0000
adv_lsb<3:0>
Pin 28 A/D(V). 4 LSBs.
3:0
R
0000
ads_lsb<3:0>
Digitized supply voltage. 4 LSBs.
Bits
Type
7:0
R
Bits
Type
7:0
R
Bits
Type
7:4
R
3:0
R
Type
7:0
R
Default
Default
00000000
Default
00000000
Default
adv_msb<11:4>
(Address 0x50h)
7:0
Bits
00000000
Description
Label
Label
ads_msb<11:4>
Label
adi_msb<11:4>
Label
Pin 28 A/D(V). 8 MSBs.
(Address 0x51h)
(Address 0x52h)
Digitized supply voltage. 8 MSBs.
(Address 0x53h)
Pin 29 A/D(I). 8 MSBs.
(Address 0x54h)
0000
adi_lsb<3:0>
Pin 29 A/D(I). 4 LSBs.
0000
adr_lsb<3:0>
Digitized internal RSSIpp voltage. 4 LSBs.
Default
00000000
Label
adr_msb<11:4>
(Address 0x55h)
Digitized internal RSSIpp voltage. 8 MSBs.
51
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zip: 200233 Tel: 86-021-24261000 Fax: 86-021-64854424
BL1908
Bits
Type
7:0
R
Bits
Type
7:4
R
1:0
R
Bits
Type
7:0
R
Bits
Type
7:4
R
3:0
R
Bits
Type
7:0
R
Bits
Type
7:0
R
Default
00000000
Default
0000
00
Default
00000000
Default
Label
(Address 0x56h)
txp_msb<11:4>
Digitized transmit power, 8 MSBs.
Label
(Address 0x57h)
txp_lsb<3:0>
Digitized transmit power. 4 LSBs.
temp_lsb<1:0>
Digitized internal temperature..
Label
(Address 0x58h)
temp_msb<9:2>
Digitized internal temperature sensor. 8 MSBs.
Label
(Address 0x59h)
0000
Im_msb[11:8]
Current modulation current MSB.
0000
ib_msb[11:8]
Current bias current MSB.
Default
00000000
Default
00000000
Label
(Address 0x5Ah)
ib_lsb[7:0]
Current bias current LSB.
Label
(Address 0x5Bh)
lm_lsb[7:0]
Current modulation current LSB.
A/D Conversion Done (conv_done: Address 0x5Ch)
Bits
Type
Default
Label
7:1
--
0000000
RSVD
Reserved
0
R/W
self clr
0
RSVD
Reserved
Description
Read Current Limit and Checksum Status (ilim_stat: Address 0x5Dh)
Bits
Type
Default
7:2
--
000000
Label
Description
RSVD
Reserved
1b: Either the modulation current limit or the bias current limit has been exceeded
0b: Neither the modulation current limit nor the bias current limit has been exceeded
1
R
0
i_limit_fail
0
R
0
checksum_fail 1b: Checksum failed during EEPROM download
0b: Normal operation.
Read Checksum (checksum: Address 0x5Eh)
Bits
Type
Default
Label
7:0
R
00000000
checksum[7:0]
Description
The sum of register bits in 0x00h through 0x1Bh plus the value in register 0x1Ch.
If the seed value in 0x1Ch is correct, this register will have value 98h. (If not,
correct value in 0x1Ch).
Select EEPROM page, Freeze DDMI data (eeprom_page: Address 0x60h)
Bits
Type
7:3
--
Default
00000
Label
Description
RSVD
Reserved
1b: Freeze A/D data in 0x50h through 0x58h
0b: 0x50h through 0x58h update at 1kHz
Select EEPROM page
00b: page 0
01b: page 1
10b: page 2
11b: page 3
2
R/W
0
freeze_ddmi
1:0
R/W
00
eeprom_page
Temp_cal ( Address 0x61h)
Bits
Type
Default
7
R/W
1
6:0
R/W
0101100
Label
Description
temp_en
enable signal of temperature sensor High active
RSVD
Reserved
52
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zip: 200233 Tel: 86-021-24261000 Fax: 86-021-64854424
BL1908
APC clock control( Address 0x65h)
Bits
Type
Default
Label
7
R/W
0
6:5
R/W
00
4:3
R/W
00
3:2
R/W
00
0
R/W
0
Description
Select APC clock source system clk or slicer clock. 0: Use slicer clock recovery
from data input of LDD; 1: Use internal system clock to saving power
due_loop_clk_sel
due loop mode clk div selection for p1 for slicer clk. 00: No divide; 01: Divide by
2; 01: Divide by 2; 10: Divide by 4; 11: Divide by 8
p1_clk_div[1:0]
due loop mode clk div selection for p0 for slicer clk. 00: No divide; 01: Divide by
2; 01: Divide by 2; 10: Divide by 4; 11: Divide by 8
p0_clk_div[1:0]
Average mode[single loop] clk div selection. 00: No divide; 01: Divide by 2; 01:
Divide by 2; 10: Divide by 4; 11: Divide by 8
avg_clk_div[1:0]
RSVD
reserved
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