AOS Semiconductor Product Reliability Report AOTF11S65, rev B Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOTF11S65. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOTF11S65 passes AOS quality and reliability requirements. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Reliability Stress Test Summary and Result Reliability Evaluation Appendix: Test data I. Product Description: The AOTF11S65 has been fabricated using the advanced MOS high voltage process that is designed to deliver high levels of performance and robustness in switching applications. By providing low RDS(on), Qg and EOSS along with guaranteed avalanche capability these parts can be adopted quickly into new and existing offline power supply designs. TM For Halogen Free add "L" suffix to part number: AOTF11S65L Details refer to the datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bonding Mold Material Moisture Level AOTF11S65 Standard sub-micron 650V Power Transistor TO220F Bare Cu Soft solder Al wire Epoxy resin with silica filler Up to Level 1 2 III. Result of Reliability Stress for AOTF11S65 Test Item Test Condition Time Point MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax - 21 lots 168hrs 500 hrs 1000 hrs 3 lots 5 lots Temp = 150°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 3 lots 5 lots 77 pcs / lot HAST 130°c , 85%RH, 33.3 psi, Vgs = 100% of Vgs max 96 hrs 15 lots Pressure Pot 121°c , 29.7psi, RH=100% 96 hrs HTGB HTRB Temperature Cycle -65°c to 150°c , air to air, 250 / 500 cycles Lot Attribution Total Sample size Number of Failures Reference Standard 4158pcs 0 JESD22A113 616pcs 0 JESD22A108 0 JESD22A108 1155pcs 0 JESD22A110 (Note A*) 18 lots 77 pcs / lot 1386pcs 0 JESD22A102 (Note A*) 77 pcs / lot 0 JESD22A104 77 pcs / lot 616pcs 21 lots (Note A*) 1617pcs 77 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 3.52 MTTF = 32413 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOTF11S65). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate (FIT) = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (8x77x500 +10x77x1000) x259] = 3.52 9 8 MTTF = 10 / FIT = 2.84 x 10 hrs = 32413 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C Af 259 87 32 13 5.64 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 x 10-5eV / K 130 deg C 150 deg C 2.59 1 3