AOS Semiconductor Product Reliability Report AOB10B60D, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOB10B60D. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOB10B60D passes AOS quality and reliability requirements. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Appendix: Test data I. Product Description: TM The Alpha IGBT line of products offers best-in-class performance in conduction and switching losses, with robust short circuit capability. They are designed for ease of paralleling, minimal gate spike under high dV/dt conditions and resistance to oscillations. The soft copackage diode is targeted for minimal losses in motor control applications. Details refer to the datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bonding Mold Material Moisture Level AOB10B60D Standard sub-micron TM 600V Alpha IGBT with Diode TO263 Bare Cu Soft solder Al wire Epoxy resin with silica filler Up to Level 1 2 III. Result of Reliability Stress for AOB10B60D Test Item Test Condition Time Point MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vge=100% of Vgemax - 9 lots 168hrs 500 hrs 1000 hrs 3 lots 5 lots Temp = 150°c , Vce=80% of Vcemax 168hrs 500 hrs 1000 hrs 3 lots 5 lots 77 pcs / lot 130°c , 85%RH, 33.3 psi, Vce = 80% of Vcemax before arcing (typically ≤42V) 121°c , 29.7psi, RH=100% 96 hrs 9 lots 693pcs -65°c to 150°c , air to air, 250 / 500 cycles HTGB HTRB HAST Pressure Pot Lot Attribution 9 lots (Note A*) Temperature Cycle Number of Failures Reference Standard 2079pcs 0 JESD22A113 616pcs 0 JESD22A108 0 JESD22A108 0 JESD22A110 0 JESD22A102 0 JESD22A104 77 pcs / lot 616pcs (Note A*) 96 hrs Total Sample size 9 lots (Note A*) 77 pcs / lot 693pcs 77 pcs / lot 693pcs 77 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 3.52 MTTF = 32413 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOB10B60D). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate (FIT) = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.84 x 10 / [2x (6x77x500 +10x77x1000) x259] = 3.52 9 8 MTTF = 10 / FIT = 2.84 x 10 hrs = 32413 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C Af 259 87 32 13 5.64 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 x 10-5eV / K 130 deg C 150 deg C 2.59 1 3