Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight 144 TQFP (1.4mm) 1.40 Grams with matte Sn Plating Copper Bond Wire Version Halogen Free MSL: 3 - Peak Reflow Temp: 260°C Die % of Total Pkg. Wt. 1.20% Mold 79.25% August, 2012 D/A Epoxy 0.11% Weight (g) % of Total Pkg. Wt. Weight (g) 0.0170 Substance CAS # Silicon chip 7440-21-3 Die size: 4.00 x 5.05 mm Notes / Assumptions: 68.79% 6.34% 3.17% 0.79% 0.16% 0.9630 0.0888 0.0444 0.0111 0.0022 Silica Fused Epoxy Resin Phenol Resin Carbon black Other (trade secret) 60676-86-0 1333-86-4 - Mold Compound Density between 1.7 and 2.1 grams/cc 75 to 95% (LSC uses 85% in our calculation) 3 to 10% (LSC uses 6% in our calculation) 2 to 8% (LSC uses 5% in our calculation) 0.1 to 0.5% (LSC uses 0.4% in our calculation) 0 to 5% (LSC uses 3.6% in our calculation) 0.09% 0.02% 0.0012 0.0003 Silver (Ag) Esters & resins 7440-22-4 - (silver content: 70-90%; LSC uses 80% in our calculation) Die attach epoxy Density: 4 grams/cc 1.1095 0.0015 Wire 0.09% 0.0012 Copper (Cu) 7440-50-8 0.8 to 1.0 mil diameter; 1 wire per package lead; wire length 3 mm Lead Plating 1.13% 0.0159 Tin (Sn) 7440-31-5 Plating is 100% Sn; thickness is 0.015mm Leadframe 18.22% 0.2550 Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) 7440-50-8 7440-02-0 7440-21-3 7439-95-4 Leadframe thickness is nominal (per Case Outline) 96.2% Cu 3% Ni 0.65% Si 0.15% Mg 17.53% 0.55% 0.12% 0.03% 0.2454 0.0077 0.0017 0.0004 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B