44tqfp14mmHF

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package: 44 TQFP (1.4mm) with matte Sn Plating
Total Device Weight 0.34
Grams
August, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
1.55%
0.0053
Mold
77.04%
0.2619
D/A Epoxy
0.19%
% of Total
Weight (g)
Pkg. Wt.
Halogen Free
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Notes / Assumptions
Silicon chip
7440-21-3
Die size: 2.1 x 3.0 mm
65.49%
4.62%
3.85%
0.31%
2.77%
0.2227
0.0157
0.0131
0.0010
0.0094
Silica Fused
Epoxy Resin
Phenol Resin
Carbon black
Other (trade secret)
60676-86-0
1333-86-4
-
Mold Compound Density between 1.7 and 2.1 grams/cc
75 to 95% (LSC uses 85% in our calculation)
3 to 10% (LSC uses 6% in our calculation)
2 to 8% (LSC uses 5% in our calculation)
0.1 to 0.5% (LSC uses 0.4% in our calculation)
0 to 5% (LSC uses 3.6% in our calculation)
0.151%
0.038%
0.0005
0.0001
Silver (Ag)
Esters & resins
7440-22-4
-
(silver content: 70-90%; LSC uses 80% in our calculation)
Die attach epoxy Density: 4 grams/cc
0.0006
Wire
0.38%
0.0013
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per package lead; wire length 3 mm
Leadframe Plating
2.08%
0.0071
Tin (Sn)
7440-31-5
Plating is 100% Sn; thickness is 0.015mm
Leadframe
18.76%
0.0638
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
7440-50-8
7440-02-0
7440-21-3
7439-95-4
C7025
96.2% Cu
3% Ni
0.65% Si
0.15% Mg
18.05%
0.56%
0.122%
0.03%
0.0614
0.0019
0.00041
0.00010
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Rev. F
Similar pages