Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: 44 TQFP (1.4mm) with matte Sn Plating Total Device Weight 0.34 Grams August, 2012 % of Total Pkg. Wt. Weight (g) Die 1.55% 0.0053 Mold 77.04% 0.2619 D/A Epoxy 0.19% % of Total Weight (g) Pkg. Wt. Halogen Free MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Notes / Assumptions Silicon chip 7440-21-3 Die size: 2.1 x 3.0 mm 65.49% 4.62% 3.85% 0.31% 2.77% 0.2227 0.0157 0.0131 0.0010 0.0094 Silica Fused Epoxy Resin Phenol Resin Carbon black Other (trade secret) 60676-86-0 1333-86-4 - Mold Compound Density between 1.7 and 2.1 grams/cc 75 to 95% (LSC uses 85% in our calculation) 3 to 10% (LSC uses 6% in our calculation) 2 to 8% (LSC uses 5% in our calculation) 0.1 to 0.5% (LSC uses 0.4% in our calculation) 0 to 5% (LSC uses 3.6% in our calculation) 0.151% 0.038% 0.0005 0.0001 Silver (Ag) Esters & resins 7440-22-4 - (silver content: 70-90%; LSC uses 80% in our calculation) Die attach epoxy Density: 4 grams/cc 0.0006 Wire 0.38% 0.0013 Gold (Au) 7440-57-5 0.8 to 1.0 mil diameter; 1 wire per package lead; wire length 3 mm Leadframe Plating 2.08% 0.0071 Tin (Sn) 7440-31-5 Plating is 100% Sn; thickness is 0.015mm Leadframe 18.76% 0.0638 Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) 7440-50-8 7440-02-0 7440-21-3 7439-95-4 C7025 96.2% Cu 3% Ni 0.65% Si 0.15% Mg 18.05% 0.56% 0.122% 0.03% 0.0614 0.0019 0.00041 0.00010 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. F