Reliability Report

AOS Semiconductor
Product Reliability Report
AOT480L,
rev B
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOT480L. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOT480L passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
TM
The AOT480L is fabricated with SDMOS trench technology that combines excellent RDS(ON) with
low gate charge & low Qrr. The result is outstanding efficiency with controlled switching behavior.
This universal technology is well suited for PWM, load switching and general purpose
applications.
-RoHS Compliant
-Halogen Free
Details refer to the datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Moisture Level
AOT480L
Standard sub-micron
80V N channel MOSFET
TO220
Bare Cu
Soft solder
Al wire
Epoxy resin with silica filler
Up to Level 1
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III. Result of Reliability Stress for AOT480L
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
reflow@260°c
Temp = 150°c ,
Vgs=100% of
Vgsmax
-
15 lots
3234pcs
0
JESD22A113
168hrs
500 hrs
1000 hrs
2 lots
3 lots
4 lots
693pcs
0
JESD22A108
HTRB
Temp = 150°c ,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
(Note A*)
2 lots
3 lots
4 lots
77 pcs / lot
693pcs
0
JESD22A108
HAST
130°c , 85%RH,
33.3 psi, Vgs =
100% of Vgsmax
96 hrs
(Note A*)
12 lots
77 pcs / lot
924pcs
0
JESD22A110
Pressure Pot
121°c , 29.7psi,
RH=100%
96 hrs
(Note A*)
15 lots
77 pcs / lot
1155pcs
0
JESD22A102
(Note A*)
77 pcs / lot
0
JESD22A104
HTGB
Temperature
Cycle
-65°c to 150°c ,
air to air,
250 / 500
cycles
Lot
Attribution
15 lots
(Note A*)
Total
Sample size
Number
of
Failures
1155pcs
Reference
Standard
77 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 3.92
MTTF = 29102 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOT480L). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)]
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= 1.83 x 10 / [2x (4x77x168 +6x77x500 +8x77x1000) x259] = 3.92
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MTTF = 10 / FIT = 2.55 x 10 hrs = 29102 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
259
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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