1.9 MB

The following document contains information on Cypress products.
S6J3110 Series
32-bit Microcontroller
Spansion® TraveoTM Family
S6J311EJAA
Data Sheet (Preliminary)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. The Preliminary status of this document indicates that product qualification
has been completed, and that initial production has begun. Due to the phases of the manufacturing
process that require maintaining efficiency and quality, this document may be revised by subsequent
versions or modifications due to changes in technical specifications.
Publication Number S6J311E_DS708-00002
CONFIDENTIAL
Revision 0.1
Issue Date June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers
of product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to
verify that they have the latest information before finalizing their design. The following descriptions of
Spansion data sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
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Spansion Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion
Inc. The information is intended to help you evaluate this product. Do not design in this product
without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on
this proposed product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a
commitment to production has taken place. This designation covers several aspects of the product life
cycle, including product qualification, initial production, and the subsequent phases in the manufacturing
process that occur before full production is achieved. Changes to the technical specifications presented
in a Preliminary document should be expected while keeping these aspects of production under
consideration. Spansion places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification
has been completed, and that initial production has begun. Due to the phases of the
manufacturing process that require maintaining efficiency and quality, this document may be
revised by subsequent versions or modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
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designations wherever necessary, typically on the first page, the ordering information page, and pages
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disclaimer on the first page refers the reader to the notice on this page.
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When a product has been in production for a period of time such that no changes or only nominal
changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes
may include those affecting the number of ordering part numbers available, such as the addition or
deletion of a speed option, temperature range, package type, or VIO range. Changes may also include
those needed to clarify a description or to correct a typographical error or incorrect specification.
Spansion Inc. applies the following conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production
volume such that subsequent versions of this document are not expected to change. However,
typographical or specification corrections, or modifications to the valid combinations offered
may occur.”
Questions regarding these document designations may be directed to your local sales office.
2
CONFIDENTIAL
S6J311E_DS708-00002-0v01-E, June 25, 2014
S6J3110 Series
32-bit Microcontroller
Spansion® TraveoTM Family
S6J311EJAA
Data Sheet (Preliminary)
1. DESCRIPTION
This section provides an overview of the S6J3110 series.
®
The S6J3110 series is a set of 32-bit microcontrollers designed for in-vehicle use. It uses the ARM
Cortex-R5 CPU as a CPU.
Publication Number S6J311E_DS708-00002
CONFIDENTIAL
Revision 0.1
Issue Date June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
Table of Contents
1.
DESCRIPTION ..................................................................................................................................... 3
2.
FEATURES .......................................................................................................................................... 5
2.1
Cortex-R5 Core ........................................................................................................................ 5
2.2
Peripheral Functions ................................................................................................................ 6
3.
PRODUCT LINEUP ............................................................................................................................. 9
4.
PIN ASSIGNMENT ............................................................................................................................ 11
5.
PIN DESCRIPTION ............................................................................................................................ 12
6.
I/O CIRCUIT TYPES .......................................................................................................................... 27
7.
HANDLING PRECAUTIONS ............................................................................................................. 29
7.1
Precautions for Product Design.............................................................................................. 29
7.2
Precautions for Package Mounting ........................................................................................ 31
7.3
Precautions for Use Environment........................................................................................... 33
8.
HANDLING DEVICES ........................................................................................................................ 34
9.
BLOCK DIAGRAM ............................................................................................................................ 37
10. MEMORY MAP .................................................................................................................................. 38
11. PIN STATUSES IN CPU STATUS ..................................................................................................... 43
12. ELECTRICAL CHARACTERISTICS ................................................................................................. 46
12.1 Absolute Maximum Ratings.................................................................................................... 46
12.2 Recommended operating conditions ...................................................................................... 48
12.3 DC characteristics .................................................................................................................. 49
12.4 AC characteristics .................................................................................................................. 53
12.4.1 Source clock timing .................................................................................................... 53
12.4.2 Internal clock timing ................................................................................................... 54
12.4.3 Reset input ................................................................................................................. 57
12.4.4 Power-on and power-on conditions ............................................................................ 58
12.4.5 Multi-function serial .................................................................................................... 59
12.5 Timer input timing ................................................................................................................... 79
12.6 Trigger input timing ................................................................................................................ 80
12.7 NMI input timing ..................................................................................................................... 81
12.8 Low-voltage detection (external low-voltage detection).......................................................... 82
12.9 Low-voltage detection (internal low-voltage detection)........................................................... 83
12.10 Low-voltage detection (1.2 V power supply low-voltage detection) ........................................ 83
12.11 A/D converter ......................................................................................................................... 84
12.11.1
Electrical characteristics ................................................................................... 84
12.11.2
Notes on A/D converters .................................................................................. 85
12.11.3
Glossary ........................................................................................................... 86
12.12 Flash memory ........................................................................................................................ 88
13. ORDERING INFORMATION .............................................................................................................. 89
14. PART NUMBER OPTION .................................................................................................................. 89
15. PACKAGE DIMENSIONS .................................................................................................................. 90
16. MAJOR CHANGES IN THIS EDITION .............................................................................................. 91
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D a t a S h e e t ( P r e l i m i n a r y )
2. FEATURES
This section explains the features of the S6J3110 series.
2.1
Cortex-R5 Core
This section explains the Cortex-R5 CPU core.
− ARM® Cortex®-R5
− 32-bit ARM architecture
−
2-instruction issuance super scalar
−
8-stage pipeline
− ARMv7/Thumb®-2 instruction set
− MPU (memory protection) equipped
−
16-area support
− ECC support for the TCM ports
1-bit error correction and 2-bit error detection (SEC-DED)
− TCM ports
2 TCM ports
−
ATCM port
−
BTCM port (B0TCM, B1TCM)
− Caches
−
Instruction cache 16 KB
−
Data cache 16 KB
− VIC port
Low latency interrupt
− AXI master interface
64-bit AXI interface (instruction/data access)
32-bit AXI interface (I/O access)
− AXI slave interface
64-bit AXI interface (TCM port access)
− ETM-R5 trace
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2.2
Peripheral Functions
This section explains peripheral functions.
− Clock generation
−
Main clock oscillation (4 MHz)
−
No sub clock oscillation
−
CR oscillation (100 kHz)
−
CR oscillation (4 MHz)
− Built-in flash memory size
−
Program: 4096 K + 64 KB (S6J311EJAA)
−
Work: 112 KB (S6J311EJAA)
− Built-in RAM size
−
TCRAM 64 KB
−
System SRAM 256 KB (S6J311EJAA)
−
Backup RAM 64 KB (S6J311EJAA)
− General-purpose ports: 150 channels (S6J311EJAA)
− DMA controller
−
Up to 16 channels can be activated simultaneously.
− A/D converter (successive approximation type)
−
12-bit resolution, 2 units mounted: Max 64 channels (32 channels + 32 channels)
− External interrupt input: 16 channels
−
Level ("H"/"L") and edge (rising/falling) can be detected.
− Multi-function serial (transmission and reception FIFOs mounted) :Max 22 channels
<UART (asynchronous serial interface) >
−
Full duplex, double buffering system; 64-byte transmission FIFO, 64-byte reception FIFO
−
Parity check can be enabled/disabled.
−
Built-in dedicated baud rate generator
−
An external clock can be used as a transfer clock.
−
Parity, frame, overrun error detection functions are available.
−
DMA transfer is supported (only for ch.0 to 7).
<CSIO (synchronous serial interface) >
−
Full duplex, double buffering system; 64-byte transmission FIFO, 64-byte reception FIFO
−
Support for SPI. Both master and slave roles are supported. Data length in bits can be set to a
value from 5 to 16 or one of the values of 20, 24, and 32.
−
Built-in dedicated baud rate generator (master operation)
−
External clock input is enabled (slave operation).
−
Overrun error detection function is available.
−
DMA transfer is supported (only for ch.0 to ch.7).
−
Serial chip select SPI function
<LIN-UART (asynchronous serial interface for LIN) >
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CONFIDENTIAL
−
Full duplex, double buffering system; 64-byte transmission FIFO, 64-byte reception FIFO
−
Support for LIN protocol revision 2.1
−
Both master and slave roles are supported.
−
Framing error and overrun error detection
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
−
LIN Synch break generation and detection, LIN Synch Delimiter generation
−
Built-in dedicated baud rate generator
−
The external clock can be adjusted by the reload counter.
DMA transfer is supported (only for ch.0 to ch.7).
− CAN controller: CAN-FD Max 2 channel
−
CAN transfer speed :1Mbps
−
CAN Clock :Max 40MHz
−
192 message buffers/channel
− Base timer: MAX 30 channels
−
16bit Timer.
−
It is selectable by 4 functions of the PWM/PPG/PWC/Reload Timer.
−
2-channel cascade connection enables operation as a 32-bit timer.(PWC and Reload Timer)
− Free-run timer: Max 6 channels
−
32bit Timer.
−
Main clock oscillation and CR oscillation are available.
−
Free-run timer output can work in combination with an input capture and an output compare.
− Input capture: Max 12 channels
−
32bit Timer.
− Output compare: Max 12 channels
−
32bit Timer.
− Real time clock (RTC) (day/hour/minute/second)
−
Main clock oscillation or CR oscillation (100 kHz) can be selected as an operation clock.
− Calibration: Real time clock (RTC) driven by the CR clock
−
Correction can be done by configuring the prescaler of the real time clock based on the ratio
between the main clock and the CR clock.
− Clock supervisor
−
Abnormality (such as damaged crystal) of the main clock oscillation (4 MHz) can be monitored.
−
The clock can switch to the CR clock when an abnormality is detected.
−
PLL abnormality can be detected.
− CRC generation
−
Fixed-length CRC
−
CCITT CRC16 generator polynomial: 0x1021
−
IEEE-802.3 CRC32 generator polynomial: 0x04C11DB7
− Watchdog timer
−
Hardware watchdog
−
Software watchdog
− NMI
− I/O relocation
−
Peripheral function pin locations can be changed.
− Low-power consumption control
−
Standby function
−
Power-off function
−
Partial wakeup function
− Power-on reset
− Low-voltage detection reset
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− Security
−
Flash security
−
Interface security (JTAG + test port)
−
SHE
−
Unique device ID
− Package: LEP176 (S6J311EJAA)
− CMOS 55 nm technology
− Power supply
8
CONFIDENTIAL
−
5 V single power supply
−
The voltage step-down circuit generates internal 1.2 V from 5 V.
−
5 V power supply is used for I/O.
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
3. PRODUCT LINEUP
The following table lists the models available in the S6J3110 series.
Table 3-1Comparison of models available
S6J311EJAA
CPU core
Coretex-R5
CMOS 55 nm technology
55 nm
Package
LEP176
Main clock
4 MHz
100 kHz
Built-in CR oscillator
4 MHz
Maximum CPU operating frequency
144 MHz (target)
4096K bytes
Flash
Program
Small sector (8 KB x 8)
Work
RAM
+
112K bytes
TCRAM
64K bytes
System SRAM
256K bytes
Backup RAM
64K bytes
Watchdog timer
1 channel (hardware)
1 channel (software)
Clock supervisor
Available
External power supply, low-voltage detection reset
Available
Internal power supply, low-voltage detection reset
Available
NMI request
Available
External interrupt
16 channels
DMA controller
16 channels
CAN-FD
Multi-function serial
2 channels
(192 msg buffers/ch)
22 channels
12-bit (2 units)
A/D converter
Unit 0 x 32 channels
Unit 1 x 32 channels
Free-run timer
6 channels
Input capture
12 channels
Output compare
12 channels
Base timer (16-bit)
30 channels
Real time clock (RTC)
1 channel
CR clock calibration
Available
CRC generation
Low-power consumption mode
June 25, 2014, S6J311E_DS708-00002-0v01-E
CONFIDENTIAL
Available
Standby function
Power-off function
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S6J311EJAA
Partial wakeup function
SHE
General-purpose port GPIO
Available
150 channels
Power supply
5 V + 5% to 10%
Operation assurance temperature (Ta)
-40 °C to +105 °C
On-chip debugger (JTAG)
10
CONFIDENTIAL
Available
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
4. PIN ASSIGNMENT
The following figures show the pin assignment of the S6J3110 series.
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
VCC
P421/SIN2_1/SCS120_0/TRACECTL
P420/SCK2_1/SCK12_0/TRACECLK
P419/SCS23_0/SOT12_0/TIOA27_1
P418/SCS22_0/SIN12_0/INT14_0
P417/SOT7_1/SCS110_0/TIOA23_1/INT15_1
P416/IN5_0/SIN7_1/SCK11_0/TIOA22_1
P415/SOT11_0/TIOA26_1/INT13_0
P414/SCS21_0/SIN11_0
P413/SCS73_1/SCS20_0/INT14_1
P412/SCS72_1/TIOA25_1
P411/SCS71_1/SCK2_0/INT13_1/TRACEDATA7
P410/SCS70_1
P409/SOT2_0/TIOA24_1/TRACEDATA6
P408/SIN2_0/INT12_0/TRACEDATA5
P407/SCK7_1/SCK9_0/TRACEDATA4
P406/SOT9_0/TRACEDATA3
P405/IN4_0/SIN9_0/INT11_0/TRACEDATA2
P404/IN3_0/TRACEDATA1
P403/IN2_0/TRACEDATA0
P402/IN1_0/RX1_0/SCS63_1/SCS90_0/INT2_0
P401/IN0_0/TX1_0/SCS62_1
C
VSS
VCC
RSTX
P400/SCS61_1
P331/SCS60_1
VSS
X1
X0
MD
P330
P329/SIN6_1
P328/SOT6_1/SCS210_0
P327/SCK6_1/SCK21_0
P326/SOT21_0
P325/SIN21_0/INT10_0
TCK
TMS
TDI/P324
TDO/P323
TRST/P322
VCC
Figure 4-1 Pin Assignment for S6J311EJAA
VSS
P000/SOT2_1
P001/SCS20_1
P002/SCS21_1/TIOA0_1
P003/SCS22_1
P004/SCS23_1/TIOA1_1
P005/IN6_0/SIN3_0
P006/IN7_0/SOT3_0
P007/IN8_0/SCK18_1/SCK3_0
P008/IN9_0/SCS180_1/SCS30_0/TIOA0_0
P009/IN10_0/SIN8_0/TIOA1_0/INT0_1
P010/IN11_0/SOT8_0/TIOA2_0
P011/SIN18_1/TIOA2_1
P012/OUT5_0/SCK8_0/TIOA3_0
P013/OUT6_0/SCS80_0/TIOA4_0
P014/SOT18_1/TIOA3_1
P015/OUT7_0/SCS81_0/TIOA5_0
P016/OUT8_0/SCS82_0/TIOA6_0
P017/OUT9_0/SCS83_0/TIOA7_0
P018/OUT10_0/TIOA8_0
P019/OUT11_0/TIOB0_0/TEXT0_0
P020/SOT0_0/TIOB1_0/TEXT1_0
P021/SCK4_1/SCK0_0/TIOB2_0
P022/SIN0_0/TIOB3_0/INT3_0
P023/SIN4_1/SCS0_0/TIOB4_0
P024/SOT4_1/TIOB5_0
P025/SCS40_1
P026/SCS41_1
P027/SCS42_1/TIOA4_1/TIOB6_0/INT1_1/TEXT0_1
P028/OUT0_1/SIN1_0/TIOB7_0/INT4_0
P029/OUT1_1/SOT1_0/AN0
P030/OUT2_1/SCS43_1
P031/OUT3_1/SCS1_0/AN1
P100/OUT4_1/SCK1_0/AN2
P101/OUT5_1/AN3
P102/AN4
P103/OUT6_1/SIN17_0/AN5
P104/SOT17_0
P105/OUT7_1/SCK17_0/TIOA9_0
P106/OUT8_1/TX1_2/SCS170_0
P107/OUT9_1/RX1_2/SIN19_0/TIOA10_0/INT2_1
P108/OUT10_1/SOT19_0/AN6/TIOA11_0/INT3_1
P109/OUT11_1/SIN19_1/SCK19_0/TIOA12_0
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
●
TOP VIEW
LEP176
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
VSS
P321
P320/PWUTRG
P319/SIN7_0/AN63/INT12_1
P318/RX1_1/TIOA10_1/INT9_0
P317/TX1_1/AN62/TIOA9_1/INT11_1
P316/TIOA21_1
P315/IN5_1/SCS70_0/AN61/TIOA8_1
P314/IN4_1/SCK7_0/AN60/TIOA7_1
P313/IN3_1/SOT7_0/AN59/INT10_1
P312/IN2_1/SCS71_0/AN58
P311/SOT13_0
P310/SIN13_0/INT15_0
P309/IN1_1/SCS130_0/AN57/TIOA29_1
P308/IN0_1/SCK13_0/AN56/TIOA28_1
P307/RX0_0/SCS72_0/AN55/INT1_0
P306/TX0_0/SCS73_0/AN54
NMIX
P305/SCS140_0/AN53/TIOA29_0/TEXT5_0
P304/SCK14_0/AN52/TIOA20_1/TEXT4_0
P303/SOT14_0
P302/SIN14_0/AN51/TIOA19_1
P301/OUT4_0/SCS100_0/AN50/TIOA18_1
P300/OUT3_0/SCS101_0/AN49/TIOA28_0
P231/OUT2_0/SCS102_0/AN48/TIOA27_0
P230/OUT1_0/PWU_AN7/SCS103_0/AN47/TIOA26_0
P229/OUT0_0/PWU_AN6/RX0_1/SIN10_0/AN46/TIOA25_0/INT8_0
P228/PWU_AN5/TX0_1/SOT10_0/AN45/TIOA24_0
P227/PWU_AN4/SCK10_0/AN44/TIOA23_0
AVCC1
AVRH1
AVSS1/AVRL1
P226/IN11_2/PWU_AN3/SCK5_0/AN43/TIOA17_1
P225/IN10_2/PWU_AN2/RX0_2/SOT5_0/AN42/INT0_0
P224/IN9_2/PWU_AN1/TX0_2/SCS50_0/AN41
P223/IN8_2/PWU_AN0/SCS51_0/AN40
P222/IN7_2/SIN5_0/AN39/INT7_0
P221/SCS52_0
P220/IN6_2/SCS53_0/AN38
P219/SCS150_0/AN37/TEXT3_0
P218/SCK15_0/AN36/TEXT2_0
P217/SOT15_0
P216/SIN15_0
VSS
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
VCC
P215/IN5_2/SCK5_1/TIOA16_1/INT9_1
P214/IN4_2/SOT5_1/TIOA15_1
P213/IN3_2/SIN5_1/TIOA14_1/INT8_1
P212/IN2_2/SCS50_1/SCS41_0/AN35/TIOA13_1
P211/IN1_2/SCS40_0/AN34/TIOA22_0
P210/IN0_2/SIN4_0/AN33/TIOA21_0/INT6_0
P209/SOT4_0/AN32/TIOA20_0
P208/SCS42_0/AN31/TIOA19_0
P207/SCK4_0/AN30/INT7_1/TEXT5_1
P206/SCS43_0/AN29/TEXT4_1
P205/SCK20_0/AN28/TEXT3_1
P204/IN11_1/SOT20_0/AN27
P203/IN10_1
P202/IN9_1/SCK6_0/INT6_1
P201/SIN20_0/AN26/TIOA18_0
P200/SCS202_0/AN25/TIOA17_0
P131/IN8_1/SOT6_0/AN24
P130/IN7_1/SIN6_0/AN23/INT5_0
P129/IN6_1/SCS201_0/AN22
P128/SCS200_0/AN21/TEXT2_1
P127/SCS203_0/AN20/TEXT1_1
P126/SCK16_0/AN19
P125/SOT16_0/TIOA16_0
P124/SIN16_0/TIOA15_0
P123/SCS63_0/AN18/TIOA12_1
P122/SCS62_0/AN17/TIOA11_1
P121/SCS160_0/AN16/TIOA14_0
P120/SCS61_0/AN15
P119/SCS60_0/AN14
P118/AN13/INT5_1
P117/AN12/INT4_1
P116/AN11
P115
AVSS0/AVRL0
AVRH0
AVCC0
P114/SCS180_0/AN10/TIOA6_1
P113/SOT19_1/SCK18_0/TIOA5_1
P112/SOT18_0/AN9/TIOA13_0
P111/SIN18_0/AN8
P110/SCS190_0/AN7
C
VSS
June 25, 2014, S6J311E_DS708-00002-0v01-E
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D a t a S h e e t ( P r e l i m i n a r y )
5. PIN DESCRIPTION
This section provides a list of the pin functions of the S6J3110 series
Table 5-1 S6J311EJAA Pin Functions
I/O
Pin No.
Pin Name
S6J311EJAA
2
3
Polarity
Circuit
Type
P000
SOT2_1
P001
SCS20_1
-
A
-
A
-
A
P002
4
SCS21_1
P003
SCS22_1
7
8
9
SCS23_1
-
A
12
13
CONFIDENTIAL
General-purpose I/O port
Serial chip select 2-2 output pin (1)
-
A
Serial chip select 2-3 output pin (1)
Base timer ch.1 TIOA output pin (1)
P005
General-purpose I/O port
IN6_0
-
A
Input capture ch.6 input pin (0)
SIN3_0
Multi-function serial ch.3 serial data input pin (0)
P006
General-purpose I/O port
IN7_0
-
A
Input capture ch.7 input pin (0)
SOT3_0
Multi-function serial ch.3 serial data output pin (0)
P007
General-purpose I/O port
IN8_0
SCK18_1
-
A
Input capture ch.8 input pin (0)
Multi-function serial ch.18 clock I/O pin (1)
Multi-function serial ch.3 clock I/O pin (0)
P008
General-purpose I/O port
IN9_0
Input capture ch.9 input pin (0)
SCS180_1
-
A
Serial chip select 18-0 I/O pin (1)
SCS30_0
Serial chip select 3-0 I/O pin (0)
TIOA0_0
Base timer ch.0 TIOA output pin (0)
P009
General-purpose I/O port
SIN8_0
Input capture ch.10 input pin (0)
-
A
Multi-function serial ch.8 serial data input pin (0)
TIOA1_0
Base timer ch.1 TIOA I/O pin (0)
INT0_1
INT0 external interrupt input pin (1)
P010
General-purpose I/O port
IN11_0
SOT8_0
-
A
Input capture ch.11 input pin (0)
Multi-function serial ch.8 serial data output pin (0)
TIOA2_0
Base timer ch.2 TIOA output pin (0)
P011
General-purpose I/O port
SIN18_1
TIOA2_1
12
Serial chip select 2-1 output pin (1)
TIOA1_1
IN10_0
11
Serial chip select 2-0 I/O pin (1)
General-purpose I/O port
SCK3_0
10
General-purpose I/O port
Base timer ch.0 TIOA output pin (1)
P004
6
General-purpose I/O port
Multi-function serial ch.2 serial data output pin (1)
General-purpose I/O port
TIOA0_1
5
Functions
-
A
Multi-function serial ch.18 serial data input pin (1)
Base timer ch.2 TIOA output pin (1)
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
Polarity
Circuit
P012
14
SCK8_0
TIOA3_0
General-purpose I/O port
-
A
OUT5_0
15
16
18
P013
General-purpose I/O port
SCS80_0
Serial chip select 8-0 I/O pin (0)
TIOA4_0
-
A
Output compare ch.6 output pin (0)
P014
General-purpose I/O port
SOT18_1
-
A
P015
General-purpose I/O port
SCS81_0
Serial chip select 8-1 output pin (0)
TIOA5_0
-
A
Output compare ch.7 output pin (0)
P016
General-purpose I/O port
SCS82_0
TIOA6_0
-
A
23
General-purpose I/O port
SCS83_0
Serial chip select 8-3 output pin (0)
TIOA7_0
TIOA8_0
-
A
Base timer ch.7 TIOA I/O pin (0)
Output compare ch.9 output pin (0)
General-purpose I/O port
-
A
Base timer ch.8 TIOA output pin (0)
Output compare ch.10 output pin (0)
P019
General-purpose I/O port
OUT11_0
Output compare ch.11 output pin (0)
TIOB0_0
-
A
Base timer ch.0 TIOB input pin (0)
TEXT0_0
Free-run timer 0 clock input pin (0)
P020
General-purpose I/O port
SOT0_0
TIOB1_0
-
A
Multi-function serial ch.0 serial data output pin (0)
Base timer ch.1 TIOB input pin (0)
TEXT1_0
Free-run timer 1 clock input pin (0)
P021
General-purpose I/O port
SCK4_1
TIOB2_0
-
A
Multi-function serial ch.4 clock I/O pin (1)
Base timer ch.2 TIOB input pin (0)
Multi-function serial ch.0 clock I/O pin (0)
P022
General-purpose I/O port
SIN0_0
Multi-function serial ch.0 serial data input pin (0)
TIOB3_0
INT3_0
June 25, 2014, S6J311E_DS708-00002-0v01-E
CONFIDENTIAL
Base timer ch.6 TIOA output pin (0)
P017
SCK0_0
24
Serial chip select 8-2 output pin (0)
Output compare ch.8 output pin (0)
OUT10_0
22
Base timer ch.5 TIOA I/O pin (0)
OUT7_0
P018
21
Multi-function serial ch.18 serial data output pin (1)
Base timer ch.3 TIOA output pin (1)
OUT9_0
20
Base timer ch.4 TIOA output pin (0)
OUT6_0
OUT8_0
19
Multi-function serial ch.8 clock I/O pin (0)
Base timer ch.3 TIOA I/O pin (0)
Output compare ch.5 output pin (0)
TIOA3_1
17
Functions
Type
-
A
Base timer ch.3 TIOB input pin (0)
INT3 external interrupt input pin (0)
13
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
Polarity
Circuit
P023
25
SIN4_1
SCS0_0
General-purpose I/O port
-
A
TIOB4_0
SOT4_1
General-purpose I/O port
-
A
TIOB5_0
27
28
29
30
31
P025
SCS40_1
P026
SCS41_1
-
A
-
A
35
14
CONFIDENTIAL
Serial chip select 4-1 output pin (1)
General-purpose I/O port
Serial chip select 4-2 output pin (1)
TIOA4_1
TIOB6_0
-
A
Base timer ch.4 TIOA output pin (1)
Base timer ch.6 TIOB input pin (0)
INT1_1
INT1 external interrupt input pin (1)
TEXT0_1
Free-run timer 0 clock input pin (1)
P028
General-purpose I/O port
SIN1_0
Multi-function serial ch.1 serial data input pin (0)
TIOB7_0
-
A
Base timer ch.7 TIOB input pin (0)
INT4_0
INT4 external interrupt input pin (0)
OUT0_1
Output compare ch.0 output pin (1)
P029
General-purpose I/O port
SOT1_0
AN0
-
A
SCS43_1
Multi-function serial ch.1 serial data output pin (0)
ADC analog 0 input pin
Output compare ch.1 output pin (1)
General-purpose I/O port
-
A
Serial chip select 4-3 output pin (1)
Output compare ch.2 output pin (1)
P031
General-purpose I/O port
SCS1_0
Serial chip select 1 I/O pin (0)
AN1
-
A
ADC analog 1 input pin
OUT3_1
Output compare ch.3 output pin (1)
P100
General-purpose I/O port
SCK1_0
AN2
-
A
Multi-function serial ch.1 clock I/O pin (0)
ADC analog 2 input pin
OUT4_1
Output compare ch.4 output pin (1)
P101
General-purpose I/O port
AN3
-
A
OUT5_1
36
General-purpose I/O port
SCS42_1
OUT2_1
34
General-purpose I/O port
Serial chip select 4-0 I/O pin (1)
P027
P030
33
Multi-function serial ch.4 serial data output pin (1)
Base timer ch.5 TIOB input pin (0)
OUT1_1
32
Multi-function serial ch.4 serial data input pin (1)
Serial chip select 0 I/O pin (0)
Base timer ch.4 TIOB input pin (0)
P024
26
Functions
Type
P102
AN4
ADC analog 3 input pin
Output compare ch.5 output pin (1)
-
A
General-purpose I/O port
ADC analog 4 input pin
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
Polarity
Circuit
P103
37
SIN17_0
AN5
General-purpose I/O port
-
A
OUT6_1
38
P104
SOT17_0
40
SCK17_0
TIOA9_0
-
A
42
43
-
A
Output compare ch.7 output pin (1)
P106
General-purpose I/O port
TX1_2
SCS170_0
-
A
General-purpose I/O port
RX1_2
CAN reception data 1 input pin (2)
SIN19_0
TIOA10_0
-
A
Multi-function serial ch.19 serial data input pin (0)
Base timer ch.10 TIOA output pin (0)
INT2_1
INT2 external interrupt input pin (1)
OUT9_1
Output compare ch.9 output pin (1)
P108
General-purpose I/O port
SOT19_0
Multi-function serial ch.19 serial data output pin (0)
AN6
TIOA11_0
-
A
ADC analog 6 input pin
Base timer ch.11 TIOA output pin (0)
INT3_1
INT3 external interrupt input pin (1)
OUT10_1
Output compare ch.10 output pin (1)
P109
General-purpose I/O port
SIN19_1
Multi-function serial ch.19 serial data input pin (1)
SCK19_0
-
A
Multi-function serial ch.19 clock I/O pin (0)
TIOA12_0
Base timer ch.12 TIOA output pin (0)
OUT11_1
Output compare ch.11 output pin (1)
SCS190_0
General-purpose I/O port
-
A
SIN18_0
Serial chip select 19-0 I/O pin (0)
ADC analog 7 input pin
General-purpose I/O port
-
A
AN8
Multi-function serial ch.18 serial data input pin (0)
ADC analog 8 input pin
P112
General-purpose I/O port
SOT18_0
Multi-function serial ch.18 serial data output pin (0)
AN9
TIOA13_0
June 25, 2014, S6J311E_DS708-00002-0v01-E
CONFIDENTIAL
Serial chip select 17-0 I/O pin (0)
P107
P111
49
CAN transmission data 1 output pin (2)
Output compare ch.8 output pin (1)
AN7
48
Multi-function serial ch.17 clock I/O pin (0)
Base timer ch.9 TIOA output pin (0)
OUT7_1
P110
47
General-purpose I/O port
Multi-function serial ch.17 serial data output pin (0)
General-purpose I/O port
OUT8_1
41
Multi-function serial ch.17 serial data input pin (0)
ADC analog 5 input pin
Output compare ch.6 output pin (1)
P105
39
Functions
Type
-
A
ADC analog 9 input pin
Base timer ch.13 TIOA output pin (0)
15
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
Polarity
Circuit
P113
50
SOT19_1
SCK18_0
General-purpose I/O port
-
A
TIOA5_1
51
56
P114
General-purpose I/O port
SCS180_0
Serial chip select 18-0 I/O pin (0)
AN10
-
A
P115
P116
AN11
58
59
60
61
62
AN12
-
A
-
A
64
65
66
CONFIDENTIAL
General-purpose I/O port
ADC analog 11 input pin
-
A
ADC analog 12 input pin
INT4_1
INT4 external interrupt input pin (1)
P118
General-purpose I/O port
AN13
-
A
ADC analog 13 input pin
INT5_1
INT5 external interrupt input pin (1)
P119
General-purpose I/O port
SCS60_0
-
A
Serial chip select 6-0 I/O pin (0)
AN14
ADC analog 14 input pin
P120
General-purpose I/O port
SCS61_0
-
A
Serial chip select 6-1 output pin (0)
AN15
ADC analog 15 input pin
P121
General-purpose I/O port
SCS160_0
AN16
-
A
Serial chip select 16-0 I/O pin (0)
ADC analog 16 input pin
TIOA14_0
Base timer ch.14 TIOA output pin (0)
P122
General-purpose I/O port
SCS62_0
AN17
-
A
Serial chip select 6-2 output pin (0)
ADC analog 17 input pin
Base timer ch.11 TIOA output pin (1)
P123
General-purpose I/O port
SCS63_0
Serial chip select 6-3 output pin (0)
AN18
-
A
ADC analog 18 input pin
TIOA12_1
Base timer ch.12 TIOA output pin (1)
P124
General-purpose I/O port
SIN16_0
-
A
Multi-function serial ch.16 serial data input pin (0)
TIOA15_0
Base timer ch.15 TIOA output pin (0)
P125
General-purpose I/O port
SOT16_0
-
A
Multi-function serial ch.16 serial data output pin (0)
TIOA16_0
Base timer ch.16 TIOA output pin (0)
P126
General-purpose I/O port
SCK16_0
AN19
16
General-purpose I/O port
General-purpose I/O port
TIOA11_1
63
ADC analog 10 input pin
Base timer ch.6 TIOA output pin (1)
P117
57
Multi-function serial ch.19 serial data output pin (1)
Multi-function serial ch.18 clock I/O pin (0)
Base timer ch.5 TIOA output pin (1)
TIOA6_1
55
Functions
Type
-
A
Multi-function serial ch.16 clock I/O pin (0)
ADC analog 19 input pin
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
Polarity
Circuit
P127
67
SCS203_0
AN20
General-purpose I/O port
-
A
TEXT1_1
68
69
71
72
74
General-purpose I/O port
SCS200_0
Serial chip select 20-0 I/O pin (0)
AN21
-
A
76
77
Free-run timer 2 clock input pin (1)
P129
General-purpose I/O port
IN6_1
SCS201_0
-
A
Input capture ch.6 input pin (1)
Serial chip select 20-1 output pin (0)
AN22
ADC analog 22 input pin
P130
General-purpose I/O port
SIN6_0
Input capture ch.7 input pin (1)
-
A
Multi-function serial ch.6 serial data input pin (0)
AN23
ADC analog 23 input pin
INT5_0
INT5 external interrupt input pin (0)
P131
General-purpose I/O port
IN8_1
SOT6_0
-
A
Input capture ch.8 input pin (1)
Multi-function serial ch.6 serial data output pin (0)
AN24
ADC analog 24 input pin
P200
General-purpose I/O port
SCS202_0
AN25
-
A
Serial chip select 20-2 output pin (0)
ADC analog 25 input pin
Base timer ch.17 TIOA output pin (0)
P201
General-purpose I/O port
SIN20_0
Multi-function serial ch.20 serial data input pin (0)
AN26
-
A
ADC analog 26 input pin
TIOA18_0
Base timer ch.18 TIOA output pin (0)
P202
General-purpose I/O port
IN9_1
SCK6_0
P203
IN10_1
-
A
Input capture ch.9 input pin (1)
Multi-function serial ch.6 clock I/O pin (0)
INT6 external interrupt input pin (1)
-
A
General-purpose I/O port
Input capture ch.10 input pin (1)
P204
General-purpose I/O port
IN11_1
Input capture ch.11 input pin (1)
SOT20_0
-
A
Multi-function serial ch.20 serial data output pin (0)
AN27
ADC analog 27 input pin
P205
General-purpose I/O port
SCK20_0
AN28
TEXT3_1
June 25, 2014, S6J311E_DS708-00002-0v01-E
CONFIDENTIAL
ADC analog 21 input pin
TEXT2_1
INT6_1
75
ADC analog 20 input pin
P128
TIOA17_0
73
Serial chip select 20-3 output pin (0)
Free-run timer 1 clock input pin (1)
IN7_1
70
Functions
Type
-
A
Multi-function serial ch.20 clock I/O pin (0)
ADC analog 28 input pin
Free-run timer 3 clock input pin (1)
17
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
Polarity
Circuit
P206
78
SCS43_0
AN29
General-purpose I/O port
-
A
TEXT4_1
79
80
82
83
84
85
86
CONFIDENTIAL
ADC analog 29 input pin
P207
General-purpose I/O port
SCK4_0
Multi-function serial ch.4 clock I/O pin (0)
AN30
-
A
ADC analog 30 input pin
INT7_1
INT7 external interrupt input pin (1)
TEXT5_1
Free-run timer 5 clock input pin (1)
P208
General-purpose I/O port
SCS42_0
AN31
-
A
Serial chip select 4-2 output pin (0)
ADC analog 31 input pin
Base timer ch.19 TIOA output pin (0)
P209
General-purpose I/O port
SOT4_0
Multi-function serial ch.4 serial data output pin (0)
AN32
-
A
ADC analog 32 input pin
TIOA20_0
Base timer ch.20 TIOA output pin (0)
P210
General-purpose I/O port
IN0_2
Input capture ch.0 input pin (2)
SIN4_0
AN33
-
A
Multi-function serial ch.4 serial data input pin (0)
ADC analog 33 input pin
TIOA21_0
Base timer ch.21 TIOA output pin (0)
INT6_0
INT6 external interrupt input pin (0)
P211
General-purpose I/O port
IN1_2
Input capture ch.1 input pin (2)
SCS40_0
-
A
Serial chip select 4-0 I/O pin (0)
AN34
ADC analog 34 input pin
TIOA22_0
Base timer ch.22 TIOA output pin (0)
P212
General-purpose I/O port
IN2_2
Input capture ch.2 input pin (2)
SCS50_1
SCS41_0
-
A
Serial chip select 5-0 I/O pin (1)
Serial chip select 4-1 output pin (0)
AN35
ADC analog 35 input pin
TIOA13_1
Base timer ch.13 TIOA output pin (1)
P213
General-purpose I/O port
IN3_2
Input capture ch.3 input pin (2)
SIN5_1
-
A
Multi-function serial ch.5 serial data input pin (1)
TIOA14_1
Base timer ch.14 TIOA output pin (1)
INT8_1
INT8 external interrupt input pin (1)
P214
General-purpose I/O port
IN4_2
SOT5_1
TIOA15_1
18
Serial chip select 4-3 output pin (0)
Free-run timer 4 clock input pin (1)
TIOA19_0
81
Functions
Type
-
A
Input capture ch.4 input pin (2)
Multi-function serial ch.5 serial data output pin (1)
Base timer ch.15 TIOA output pin (1)
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
Polarity
Circuit
P215
General-purpose I/O port
IN5_2
87
90
91
SCK5_1
Input capture ch.5 input pin (2)
-
A
93
Base timer ch.16 TIOA output pin (1)
INT9_1
INT9 external interrupt input pin (1)
P216
SIN15_0
P217
SOT15_0
-
A
-
A
SCK15_0
AN36
-
A
96
98
Multi-function serial ch.15 clock I/O pin (0)
ADC analog 36 input pin
P219
General-purpose I/O port
SCS150_0
AN37
-
A
Serial chip select 15-0 I/O pin (0)
ADC analog 37 input pin
Free-run timer 3 clock input pin (0)
P220
General-purpose I/O port
IN6_2
Input capture ch.6 input pin (2)
SCS53_0
P221
SCS52_0
-
A
Serial chip select 5-3 output pin (0)
ADC analog 38 input pin
-
A
General-purpose I/O port
Serial chip select 5-2 output pin (0)
P222
General-purpose I/O port
IN7_2
Input capture ch.7 input pin (2)
SIN5_0
-
A
Multi-function serial ch.5 serial data input pin (0)
AN39
ADC analog 39 input pin
INT7_0
INT7 external interrupt input pin (0)
P223
General-purpose I/O port
PWU_AN0
Input capture ch.8 input pin (2)
-
A
Partial wakeup ADC analog 0 input pin
SCS51_0
Serial chip select 5-1 output pin (0)
AN40
ADC analog 40 input pin
P224
General-purpose I/O port
IN9_2
Input capture ch.9 input pin (2)
PWU_AN1
TX0_2
-
A
Partial wakeup ADC analog 1 input pin
CAN transmission data 0 output pin (2)
SCS50_0
Serial chip select 5-0 I/O pin (0)
AN41
ADC analog 41 input pin
June 25, 2014, S6J311E_DS708-00002-0v01-E
CONFIDENTIAL
General-purpose I/O port
Multi-function serial ch.15 serial data output pin (0)
Free-run timer 2 clock input pin (0)
IN8_2
97
Multi-function serial ch.15 serial data input pin (0)
TEXT2_0
AN38
95
General-purpose I/O port
General-purpose I/O port
TEXT3_0
94
Multi-function serial ch.5 clock I/O pin (1)
TIOA16_1
P218
92
Functions
Type
19
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
99
100
104
105
106
107
Polarity
Circuit
P225
General-purpose I/O port
IN10_2
Input capture ch.10 input pin (2)
PWU_AN2
Partial wakeup ADC analog 2 input pin
RX0_2
-
A
20
CONFIDENTIAL
CAN reception data 0 input pin (2)
SOT5_0
Multi-function serial ch.5 serial data output pin (0)
AN42
ADC analog 42 input pin
INT0_0
INT0 external interrupt input pin (0)
P226
General-purpose I/O port
IN11_2
Input capture ch.11 input pin (2)
PWU_AN3
SCK5_0
-
A
Partial wakeup ADC analog 3 input pin
Multi-function serial ch.5 clock I/O pin (0)
AN43
ADC analog 43 input pin
TIOA17_1
Base timer ch.17 TIOA output pin (1)
P227
General-purpose I/O port
PWU_AN4
Partial wakeup ADC analog 4 input pin
SCK10_0
-
A
Multi-function serial ch.10 clock I/O pin (0)
AN44
ADC analog 44 input pin
TIOA23_0
Base timer ch.23 TIOA output pin (0)
P228
General-purpose I/O port
PWU_AN5
Partial wakeup ADC analog 5 input pin
TX0_1
CAN transmission data 0 output pin (1)
SOT10_0
-
A
Multi-function serial ch.10 serial data output pin (0)
AN45
ADC analog 45 input pin
TIOA24_0
Base timer ch.24 TIOA output pin (0)
P229
General-purpose I/O port
PWU_AN6
Partial wakeup ADC analog 6 input pin
RX0_1
CAN reception data 0 input pin (1)
SIN10_0
AN46
-
A
Multi-function serial ch.10 serial data input pin (0)
ADC analog 46 input pin
TIOA25_0
Base timer ch.25 TIOA output pin (0)
INT8_0
INT8 external interrupt input pin (0)
OUT0_0
Output compare ch.0 output pin (0)
P230
General-purpose I/O port
PWU_AN7
Partial wakeup ADC analog 7 input pin
SCS103_0
Serial chip select 10-3 output pin (0)
AN47
-
A
ADC analog 47 input pin
TIOA26_0
Base timer ch.26 TIOA output pin (0)
OUT1_0
Output compare ch.1 output pin (0)
P231
General-purpose I/O port
SCS102_0
108
Functions
Type
AN48
Serial chip select 10-2 output pin (0)
-
A
ADC analog 48 input pin
TIOA27_0
Base timer ch.27 TIOA output pin (0)
OUT2_0
Output compare ch.2 output pin (0)
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
Polarity
Circuit
P300
General-purpose I/O port
SCS101_0
109
AN49
Serial chip select 10-1 output pin (0)
-
A
TIOA28_0
110
111
113
OUT3_0
Output compare ch.3 output pin (0)
P301
General-purpose I/O port
SCS100_0
Serial chip select 10-0 I/O pin (0)
AN50
-
A
115
116
117
118
Base timer ch.18 TIOA output pin (1)
OUT4_0
Output compare ch.4 output pin (0)
P302
General-purpose I/O port
SIN14_0
Multi-function serial ch.14 serial data input pin (0)
AN51
P303
SOT14_0
-
A
ADC analog 51 input pin
Base timer ch.19 TIOA output pin (1)
-
A
General-purpose I/O port
Multi-function serial ch.14 serial data output pin (0)
P304
General-purpose I/O port
SCK14_0
Multi-function serial ch.14 clock I/O pin (2)
AN52
-
A
ADC analog 52 input pin
TIOA20_1
Base timer ch.20 TIOA output pin (1)
TEXT4_0
Free-run timer 4 clock input pin (0)
P305
General-purpose I/O port
AN53
Serial chip select 14-0 I/O pin (0)
-
A
ADC analog 53 input pin
TIOA29_0
Base timer ch.29 TIOA output pin (0)
TEXT5_0
Free-run timer 5 clock input pin (0)
NMIX
N
F
Non-maskable interrupt input pin
P306
General-purpose I/O port
TX0_0
CAN transmission data 0 output pin (0)
SCS73_0
-
A
Serial chip select 7-3 output pin (0)
AN54
ADC analog 54 input pin
P307
General-purpose I/O port
RX0_0
CAN reception data 0 input pin (0)
SCS72_0
-
A
Serial chip select 7-2 output pin (0)
AN55
ADC analog 55 input pin
INT1_0
INT1 external interrupt input pin (0)
P308
General-purpose I/O port
IN0_1
Input capture ch.0 input pin (1)
SCK13_0
-
A
Multi-function serial ch.13 clock I/O pin (0)
AN56
ADC analog 56 input pin
TIOA28_1
Base timer ch.28 TIOA output pin (1)
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CONFIDENTIAL
ADC analog 50 input pin
TIOA18_1
SCS140_0
114
ADC analog 49 input pin
Base timer ch.28 TIOA output pin (0)
TIOA19_1
112
Functions
Type
21
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
Polarity
Circuit
P309
General-purpose I/O port
IN1_1
119
120
SCS130_0
Input capture ch.1 input pin (1)
-
A
ADC analog 57 input pin
TIOA29_1
Base timer ch.29 TIOA output pin (1)
P310
General-purpose I/O port
SIN13_0
-
A
P311
SOT13_0
IN2_1
SCS71_0
-
A
124
-
A
126
129
General-purpose I/O port
Input capture ch.3 input pin (1)
SOT7_0
-
A
CONFIDENTIAL
Multi-function serial ch.7 serial data output pin (0)
AN59
ADC analog 59 input pin
INT10_1
INT10 external interrupt input pin (1)
P314
General-purpose I/O port
IN4_1
Input capture ch.4 input pin (1)
SCK7_0
-
A
Multi-function serial ch.7 clock I/O pin (0)
AN60
ADC analog 60 input pin
TIOA7_1
Base timer ch.7 TIOA output pin (1)
P315
General-purpose I/O port
SCS70_0
Input capture ch.5 input pin (1)
-
A
Serial chip select 7-0 I/O pin (0)
AN61
ADC analog 61 input pin
TIOA8_1
Base timer ch.8 TIOA output pin (1)
P316
TIOA21_1
AN62
-
A
General-purpose I/O port
Base timer ch.21 TIOA output pin (1)
General-purpose I/O port
CAN transmission data 1 output pin (1)
-
A
ADC analog 62 input pin
TIOA9_1
Base timer ch.9 TIOA output pin (1)
INT11_1
INT11 external interrupt input pin (1)
P318
General-purpose I/O port
RX1_1
TIOA10_1
-
A
CAN reception data 1 input pin (1)
Base timer ch.10 TIOA output pin (1)
INT9_0
INT9 external interrupt input pin (0)
P319
General-purpose I/O port
SIN7_0
AN63
INT12_1
22
Serial chip select 7-1 output pin (0)
IN3_1
TX1_1
128
Input capture ch.2 input pin (1)
P313
P317
127
Multi-function serial ch.13 serial data output pin (0)
ADC analog 58 input pin
IN5_1
125
General-purpose I/O port
General-purpose I/O port
AN58
123
Multi-function serial ch.13 serial data input pin (0)
INT15 external interrupt input pin (0)
P312
122
Serial chip select 13-0 I/O pin (0)
AN57
INT15_0
121
Functions
Type
-
A
Multi-function serial ch.7 serial data input pin (0)
ADC analog 63 input pin
INT12 external interrupt input pin (1)
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
130
131
134
135
136
Polarity
Circuit
Functions
Type
P320
-
A
P321
-
D
TRST
N
P322
-
PWUTRG
TDO
P323
TDI
P324
J
-
I
-
D
General-purpose I/O port
Partial wakeup trigger output pin
General-purpose output port
JTAG test reset input pin
General-purpose output port
JTAG test data output pin
General-purpose output port
JTAG test data input pin
General-purpose output port
137
TMS
-
E
JTAG test mode state input pin
138
TCK
-
E
JTAG test clock input pin
-
A
Multi-function serial ch.21 serial data input pin (0)
P325
139
SIN21_0
General-purpose I/O port
INT10_0
140
P326
SOT21_0
INT10 external interrupt input pin (0)
-
A
P327
141
142
SCK6_1
Multi-function serial ch.21 serial data output pin (0)
General-purpose I/O port
-
A
Multi-function serial ch.6 clock I/O pin (1)
SCK21_0
Multi-function serial ch.21 clock I/O pin (0)
P328
General-purpose I/O port
SOT6_1
-
A
SCS210_0
143
General-purpose I/O port
P329
SIN6_1
Multi-function serial ch.6 serial data output pin (1)
Serial chip select 21-0 I/O pin (0)
-
A
General-purpose I/O port
Multi-function serial ch.6 serial data input pin (1)
144
P330
-
A
General-purpose I/O port
145
MD
-
C
Mode pin
146
X0
-
G
Main clock oscillation input pin
147
X1
-
G
Main clock oscillation output pin
-
A
-
A
N
F
149
150
151
P331
SCS60_1
P400
SCS61_1
RSTX
P401
155
IN0_0
TX1_0
SCS62_1
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CONFIDENTIAL
General-purpose I/O port
Serial chip select 6-0 I/O pin (1)
General-purpose I/O port
Serial chip select 6-1 output pin (1)
External reset input pin
General-purpose I/O port
-
B
Input capture ch.0 input pin (0)
CAN transmission data 1 output pin (0)
Serial chip select 6-2 output pin (1)
23
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
156
157
158
Polarity
Circuit
P402
General-purpose I/O port
IN1_0
Input capture ch.1 input pin (0)
RX1_0
SCS63_1
-
B
160
161
162
Serial chip select 9-0 I/O pin (0)
INT2 external interrupt input pin (0)
P403
General-purpose I/O port
IN2_0
-
B
Trace data 0 output pin
P404
General-purpose I/O port
IN3_0
-
B
Trace data 1 output pin
P405
General-purpose I/O port
SIN9_0
Input capture ch.4 input pin (0)
-
B
INT11 external interrupt input pin (0)
TRACEDATA2
Trace data 2 output pin
P406
General-purpose I/O port
SOT9_0
-
B
CONFIDENTIAL
Multi-function serial ch.9 serial data output pin (0)
TRACEDATA3
Trace data 3 output pin
P407
General-purpose I/O port
SCK7_1
SCK9_0
-
B
Multi-function serial ch.7 clock I/O pin (1)
Multi-function serial ch.9 clock I/O pin (0)
TRACEDATA4
Trace data 4 output pin
P408
General-purpose I/O port
SIN2_0
INT12_0
-
B
Multi-function serial ch.2 serial data input pin (0)
INT12 external interrupt input pin (0)
Trace data 5 output pin
P409
General-purpose I/O port
SOT2_0
Multi-function serial ch.2 serial data output pin (0)
TIOA24_1
P410
SCS70_1
SCK2_0
-
B
Base timer ch.24 TIOA output pin (1)
Trace data 6 output pin
-
B
General-purpose I/O port
Serial chip select 7-0 I/O pin (1)
General-purpose I/O port
Serial chip select 7-1 output pin (1)
-
B
Multi-function serial ch.2 clock I/O pin (0)
INT13_1
INT13 external interrupt input pin (1)
TRACEDATA7
Trace data 7 output pin
P412
General-purpose I/O port
SCS72_1
TIOA25_1
24
Multi-function serial ch.9 serial data input pin (0)
INT11_0
SCS71_1
166
Input capture ch.3 input pin (0)
TRACEDATA1
P411
165
Input capture ch.2 input pin (0)
TRACEDATA0
TRACEDATA6
164
Serial chip select 6-3 output pin (1)
INT2_0
TRACEDATA5
163
CAN reception data 1 input pin (0)
SCS90_0
IN4_0
159
Functions
Type
-
B
Serial chip select 7-2 output pin (1)
Base timer ch.25 TIOA output pin (1)
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
Polarity
Circuit
P413
167
SCS73_1
SCS20_0
General-purpose I/O port
-
B
INT14_1
SCS21_0
General-purpose I/O port
-
B
SIN11_0
169
171
172
P415
General-purpose I/O port
SOT11_0
Multi-function serial ch.11 serial data output pin (0)
TIOA26_1
-
B
174
175
Base timer ch.26 TIOA output pin (1)
INT13 external interrupt input pin (0)
P416
General-purpose I/O port
IN5_0
Input capture ch.5 input pin (0)
SIN7_1
-
B
Multi-function serial ch.7 serial data input pin (1)
SCK11_0
Multi-function serial ch.11 clock I/O pin (0)
TIOA22_1
Base timer ch.22 TIOA output pin (1)
P417
General-purpose I/O port
SOT7_1
Multi-function serial ch.7 serial data output pin (1)
SCS110_0
-
B
Serial chip select 11-0 I/O pin (0)
TIOA23_1
Base timer ch.23 TIOA output pin (1)
INT15_1
INT15 external interrupt input pin (1)
P418
General-purpose I/O port
SCS22_0
SIN12_0
-
B
INT14_0
173
Serial chip select 2-1 output pin (0)
Multi-function serial ch.11 serial data input pin (0)
INT13_0
170
Serial chip select 7-3 output pin (1)
Serial chip select 2-0 I/O pin (0)
INT14 external interrupt input pin (1)
P414
168
Functions
Type
Serial chip select 2-2 output pin (0)
Multi-function serial ch.12 serial data input pin (0)
INT14 external interrupt input pin (0)
P419
General-purpose I/O port
SCS23_0
Serial chip select 2-3 output pin (0)
SOT12_0
-
B
Multi-function serial ch.12 serial data output pin (0)
TIOA27_1
Base timer ch.27 TIOA output pin (1)
P420
General-purpose I/O port
SCK2_1
SCK12_0
-
B
Multi-function serial ch.2 clock I/O pin (1)
Multi-function serial ch.12 clock I/O pin (0)
TRACECLK
Trace clock
P421
General-purpose I/O port
SIN2_1
SCS120_0
-
B
TRACECTL
Multi-function serial ch.2 serial data input pin (1)
Serial chip select 12-0 I/O pin (0)
Trace control
52
AVCC0
-
-
Analog power supply pin for AD converter unit 0
103
AVCC1
-
-
Analog power supply pin for AD converter unit 1
53
AVRH0
-
-
Upper-limit reference voltage pin for AD converter unit 0
102
AVRH1
-
-
Upper-limit reference voltage pin for AD converter unit 1
-
-
54
AVSS0
AVRL0
June 25, 2014, S6J311E_DS708-00002-0v01-E
CONFIDENTIAL
GND pin for AD converter unit 0
Lower-limit reference voltage pin for AD converter unit 0
25
D a t a S h e e t ( P r e l i m i n a r y )
I/O
Pin No.
Pin Name
S6J311EJAA
101
46
154
Polarity
Circuit
Functions
Type
AVSS1
GND pin for AD converter unit 1
-
-
C
-
-
External capacity connection output pin
VCC
-
-
Power supply pin
VSS
-
-
GND
AVRL1
Lower-limit reference voltage pin for AD converter unit 1
44
88
133
152
176
1
45
89
132
148
153
26
CONFIDENTIAL
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
6. I/O CIRCUIT TYPES
This section explains I/O circuit types.
Type
A
Circuit
Overview
Pull-up control
Digital output
Digital output
− General-purpose I/O port with analog input
− Output of 1 mA or 2 mA selectable
− 50 kΩ with pull-up resistor control
− 50 kΩ with pull-down resistor control
− CMOS hysteresis input
Pull-down
CMOS
PSS
Analog
input
B
Pull-up control
Digital output
Digital output
Pull-down
Automotive/
CMOS input
PSS
Analog
input
C
− General-purpose I/O port with analog input
− Output of 1 mA or 2 mA selectable
− 50 kΩ with pull-up resistor control
− 50 kΩ with pull-down resistor control
− Automotive/CMOS hysteresis input selectable
− Mode input
− CMOS hysteresis input
Mode
input
Control
D
− JTAG
Pull-up
Digital output
Digital output
− General-purpose output port
− Output of 2 mA
− 50 kΩ with pull-up resistor control
− TTL input
TTL input
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D a t a S h e e t ( P r e l i m i n a r y )
Type
E
Circuit
Overview
− JTAG
Pull-up control
− 50 kΩ with pull-up resistor control
− TTL input
TTL input
F
− CMOS hysteresis input
− 50 kΩ with pull-up resistor
CMOS-hys
G
Input
− Main oscillation I/O
Standby
control
I
− JTAG
Digital output
− Output of 2 mA
Digital
J
− JTAG
Digital output
Digital
Pull-down control
− General-purpose output port
− Output of 2 mA
− 50 kΩ with pull-down resistor control
− TTL input
TTL input
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S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
7. HANDLING PRECAUTIONS
Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly
affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This
page describes precautions that must be observed to minimize the chance of failure and to obtain higher
reliability from your Spansion semiconductor devices.
7.1
Precautions for Product Design
This section describes precautions when designing electronic equipment using semiconductor devices.
Absolute Maximum Ratings
Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of certain established limits, called absolute maximum ratings. Do not
exceed these ratings.
Recommended Operating Conditions
Recommended operating conditions are normal operating ranges for the semiconductor device. All the
device's electrical characteristics are warranted when operated within these ranges.
Always use semiconductor devices within the recommended operating conditions. Operation outside
these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on the
data sheet. Users considering application outside the listed conditions are advised to contact their sales
representative beforehand.
Processing and Protection of Pins
These precautions must be followed when handling the pins which connect semiconductor devices to
power supply and input/output functions.
(1) Preventing Over-Voltage and Over-Current Conditions
Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to
cause deterioration within the device, and in extreme cases leads to permanent damage of
the device. Try to prevent such overvoltage or over-current conditions at the design stage.
(2) Protection of Output Pins
Shorting of output pins to supply pins or other output pins, or connection to large
capacitance can cause large current flows. Such conditions if present for extended periods
of time can damage the device.
Therefore, avoid this type of connection.
(3) Handling of Unused Input Pins
Unconnected input pins with very high impedance levels can adversely affect stability of
operation. Such pins should be connected through an appropriate resistance to a power
supply pin or ground pin.
June 25, 2014, S6J311E_DS708-00002-0v01-E
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D a t a S h e e t ( P r e l i m i n a r y )
Latch-up
Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate.
When subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor
structures) may be formed, causing large current levels in excess of several hundred mA to flow
continuously at the power supply pin. This condition is called latch-up.
CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but
can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the
following:
(1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This
should include attention to abnormal noise, surge levels, etc.
(2) Be sure that abnormal current flows do not occur during the power-on sequence.
Observance of Safety Regulations and Standards
Most countries in the world have established standards and regulations regarding safety, protection from
electromagnetic interference, etc. Customers are requested to observe applicable regulations and
standards in the design of products.
Fail-Safe Design
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury,
damage or loss from such failures by incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions.
Precautions Related to Usage of Devices
Spansion semiconductor devices are intended for use in standard applications (computers, office
automation and other office equipment, industrial, communications, and measurement equipment,
personal or household devices, etc.).
CAUTION: Customers considering the use of our products in special applications where failure or
abnormal operation may directly affect human lives or cause physical injury or property damage, or
where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy
controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are
requested to consult with sales representatives before such use. The company will not be responsible for
damages arising from such use without prior approval.
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D a t a S h e e t ( P r e l i m i n a r y )
7.2
Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat
resistance during soldering, you should only mount under Spansion’s recommended conditions. For
detailed information about mount conditions, contact your sales representative.
Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct
soldering on the board, or mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the
board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the
soldering process usually causes leads to be subjected to thermal stress in excess of the absolute
ratings for storage temperature. Mounting processes should conform to Spansion recommended
mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces
can lead to contact deterioration after long periods. For this reason it is recommended that the surface
treatment of socket contacts and IC leads be verified before mounting.
Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore
leads are more easily deformed or bent. The use of packages with higher pin counts and narrower pin
pitch results in increased susceptibility to open connections caused by deformed pins, or shorting due to
solder bridges.
You must use appropriate mounting techniques. Spansion recommends the solder reflow method, and
has established a ranking of mounting conditions for each product. Users are advised to mount packages
in accordance with Spansion ranking of recommended conditions.
Lead-Free Packaging
CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic
soldering, junction strength may be reduced under some conditions of use.
Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental
conditions will cause absorption of moisture. During mounting, the application of heat to a package that
has absorbed moisture can cause surfaces to peel, reducing moisture resistance and causing packages
to crack. To prevent, do the following:
(1) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the
product.
Store products in locations where temperature changes are slight.
(2) Use dry boxes for product storage. Products should be stored below 70% relative humidity,
and at temperatures between 5 ˚C and 30 ˚C.
When you open Dry Package that recommends humidity 40% to 70% relative humidity.
(3) When necessary, Spansion packages semiconductor devices in highly moisture-resistant
aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their
aluminum laminate bags for storage.
(4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
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D a t a S h e e t ( P r e l i m i n a r y )
Baking
Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the
Spansion recommended conditions for baking.
Condition: 125 ˚C/24 h
Static Electricity
Because semiconductor devices are particularly susceptible to damage by static electricity, you must
take the following precautions:
(1) Maintain relative humidity in the working environment between 40% and 70%.
Use of an apparatus for ion generation may be needed to remove electricity.
(2) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
(3) Eliminate static body electricity by the use of rings or bracelets connected to ground through
high resistance (on the level of 1 MΩ).
Wearing of conductive clothing and shoes, use of conductive floor mats and other measures
to minimize shock loads is recommended.
(4) Ground all fixtures and instruments, or protect with anti-static measures.
(5) Avoid the use of styrofoam or other highly static-prone materials for storage of completed
board assemblies.
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D a t a S h e e t ( P r e l i m i n a r y )
7.3
Precautions for Use Environment
Reliability of semiconductor devices depends on ambient temperature and other conditions as described
above.
For reliable performance, do the following:
(1) Humidity
Prolonged use in high humidity can lead to leakage in devices as well as printed circuit
boards. If high humidity levels are anticipated, consider anti-humidity processing.
(2) Discharge of Static Electricity
When high-voltage charges exist close to semiconductor devices, discharges can cause
abnormal operation. In such cases, use anti-static measures or processing to prevent
discharges.
(3) Corrosive Gases, Dust, or Oil
Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that
will adversely affect the device. If you use devices in such conditions, consider ways to
prevent such exposure or to protect the devices.
(4) Radiation, Including Cosmic Radiation
Most devices are not designed for environments involving exposure to radiation or cosmic
radiation. Users should provide shielding as appropriate.
(5) Smoke, Flame
CAUTION: Plastic molded devices are flammable, and therefore should not be used near
combustible substances. If devices begin to smoke or burn, there is danger of the release of
toxic gases.
Customers considering the use of Spansion products in other special environmental conditions should
consult with sales representatives.
Please check the latest handling precautions at the following URL.
http://www.spansion.com/fjdocuments/fj/datasheet/e-ds/DS00-00004.pdf
June 25, 2014, S6J311E_DS708-00002-0v01-E
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D a t a S h e e t ( P r e l i m i n a r y )
8. HANDLING DEVICES
For latch-up prevention
The latch-up phenomenon may occur on a CMOS IC in the following cases: the voltage applied to an
input or output pin is higher than VCC or lower than VSS; or the voltage applied between a VCC pin
and a VSS pin exceeds the rating. A latch-up causes a rapid increase in the power supply current,
possibly resulting in thermal damage to an element. When using the device, take sufficient care not to
exceed the maximum rating.
Also be careful that analog power supplies (AVCC0, AVCC1, AVRH0, and AVRH1) and analog inputs
do not exceed the digital power supply (VCC) at the analog system power-on and power-off times.
The power-on sequence is as follows. Simultaneously turn on the digital supply voltage (VCC) and
analog supply voltages (AVCC0, AVCC1, AVRH0, and AVRH1), or turn on the digital supply voltage
(VCC) and then the analog supply voltages (AVCC0, AVCC1, AVRH0, and AVRH1).
About handling unused pins
Leaving unused input pins open may cause permanent damage from a malfunction or latch-up. Take
measures for unused pins, such as pulling up or pulling down the voltage with resistors of 2 kiloohms
or higher.
If there are any unused input/output pins, set them to the output state and then open them, or set them
to the input state and handle them in the same way as input pins.
About power supply pins
If the device has multiple VCC and VSS pins, the device is designed in such a way that the pins that
should be at the same potential are connected to each other inside the device to prevent malfunctions
such as latch-up. However, to reduce unwanted emissions, prevent malfunctions of strobe signals
caused by an increase of the ground level, and observe standards on total output current, be sure to
connect all the VCC and VSS pins to the power source and ground externally. Also handle all the VSS
power supply pins in this way as shown in the following diagram. If there are multiple VCC or VSS
systems, the device does not operate normally even within the guaranteed operating range.
34
CONFIDENTIAL
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
Figure 8-1 Pin Assignment
In addition, consider connecting with low impedance from the power supply source to the VCC and
VSS of this device.
We recommend connecting a ceramic capacitor as a bypass capacitor between VCC and VSS, near
this device.
About the crystal oscillation circuit
Noise entering the X0 or X1 pin may cause a malfunction. Design the printed circuit board in such a
way that the X0 and X1 pins, the crystal oscillator (or ceramic resonator), and a bypass capacitor to
ground are located very close to the device.
We recommend that the printed circuit board artwork have the X0 and X1 pins enclosed by ground.
About the mode pin (MD)
Use mode pin MD by directly connecting it to a VCC or VSS pin. To prevent noise from causing the
device to accidentally enter test mode, reduce the pattern length between each mode pin and a VCC
or VSS pin on the printed circuit board, and connect them with low impedance.
About the power-on time
To prevent the internal built-in voltage step-down circuit from malfunctioning, secure a voltage rising
time of 50 µs (between 0.2 V and 2.7 V) or longer at the power-on time.
Point to note during PLL clock operation
While a PLL clock is selected, if the oscillator breaks off or input stops, the PLL clock may continue
operating with the free running frequency of the internal self-oscillator circuit. This operation is outside
of the guaranteed range.
Power supply pin processing of an A/D converter
Even when no A/D converter is used, establish a connection such that AVCC=AVRH=VCC and
AVSS/AVRL=VSS.
June 25, 2014, S6J311E_DS708-00002-0v01-E
CONFIDENTIAL
35
D a t a S h e e t ( P r e l i m i n a r y )
Points to note about using external clocks
External clocks are not supported.
External direct clock input cannot be used.
Power-on sequence of the power supply analog inputs of an A/D converter
Be sure to turn on the digital power supply (VCC) before the application of the power supplies (AVCC,
AVRH, and AVRL) and analog inputs (AN0 to AN63) of an A/D converter.
At the power-off time, turn off the power supplies and analog inputs of the A/D converter, and then turn
off the digital power supply (VCC). Perform these power-on and power-off operations without AVRH
exceeding AVCC. Even when using a pin shared with an analog input as an input port, do not allow the
input voltage to exceed AVCC. (Turning on or off the analog supply voltage and digital supply voltage
simultaneously is not a problem.)
About C pin processing
This device has a built-in voltage step-down circuit. Be sure to connect a capacitor to the C pin (pin
154 in S6J311EJAA specifications) for internal stabilization of the device. For the standard values, see
"Recommended operating conditions" in the latest data sheet.
Precautions on designing a mounting substrate
Measures against heat generation from the package must be taken for the mounting substrate to
observe the absolute maximum rating (operating temperature). Design a mounting substrate with 4 or
more layers. Connect the back of the package stage and the substrate pad with solder paste. Arrange
thermal via holes on the substrate pad.
Notes on writing to a register containing a status flag
In writing to a register containing a status flag (particularly an interrupt request flag, etc.) to control a
function, it is important to take care not to accidentally clear the status flag.
Therefore, before the write operation, configure the status bit such that the flag is not cleared, and then
set the control bit to the desired value.
Especially for control bits configured as a set of multiple bits, bit instructions cannot be used (bit
instructions have only 1-bit access). In such cases, byte, half-word, or word access is used to write to
the control bits and a status flag simultaneously. However, at this time, be careful not to accidentally
clear bits other than the intended ones (the status flag bit in this case).
Note: Bit instructions take this point into account for registers that support bit-band units, so it does not
need to be a concern. You need to take care when using bit instructions for registers that do not
support bit-band units.
36
CONFIDENTIAL
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
9. BLOCK DIAGRAM
This section provides block diagrams of the S6J3110 series.
Figure 9-1 S6J311EJAA Block Diagram
Trace I/F(8Pin)
Debug I/F (JTAG/SWD)
Power Domain 2
JTAG_SWCLKTCK
JTAG Wakeup
Debug Group
(CoreSightTM)
Bus Config Group
From/To PPU-SLAVEs
- Bus Performance Counters
- Misc Register Module
DAP
CLK_DBG
CLK_LLPBM2
Security
APB-M
PPU Master
APB-S
AHB-M
CLK_HPM
Debug APB
CLK_HPM
Trace Group
CLK_CPU
CLK_DBG
ATB
CLK_ATB
Core Group (1-Core)
Power Domain 3
Security
Checker
ETB (Trace Buffer)
16KB
CLK_TRC
From/To
CommonPERI#2
From/To
CommonPERI#2
AHB2APB
(Priviledge
Protection)
APB-32
CLK_LLPBM2
Debug APB
TCFLASH #0
4MB + 64KB
+
EEFlash #0
112KB
WorkFlash
TCF
AHB-64
AHB-64
(Reg & Data) (Reg)
AHB-64
CLK_MEMC
AXI-64
AHB-32
CLK_SHE
TCF
AXI-64
(data)
CLK_MEMC
CLK_FCLK
CLK_SHE
CLK_CPU
Flash Group
SHE Group
CLK_SHE
From/To
Memory Config Grp.
ETMTM
#0
TCF
ATCM #0
Procceser
TCRAM #0
(2bank)
64KB
(32KB×2)
AXI-64
- DMAC 16.ch
- ReloadTimer 4ch
CLK_DMA
MPU
#0
AXI-64
CLK_CPU
D$
#0
I$
#0
16KB
16KB
CLK_HPM
LLPP
AXI32-M AHB32
AXI-M AXI-S
CLK_CPU
DMAC Complex #0
CortexTM -R5F
ATCM
#0
AHB-64
CLK_MEMC
From/To
Memory Config Grp.
CPU #0
B0TCM
B1TCM
#0
AXI-64
CLK_CPU
AXI-32
CLK_CPU
From/To CommonPERI#2
DMAC Config
AHB-32
CLK_CPU
AHB-32
CLK_HPM2
AHB-64
CLK_HPM
AHB-32
CLK_HPM2
High Performance Matrix (HPM)
AXI-64
CLK_HPM
System SRAM
256KB
AHB-32
AXI-64
AHB-32
CLK_HPM
CLK_SYSC1
EAM
CLK_MEMC
CLK_HPM
AHB-32
CLK_CPU
AHB-64
CLK_HPM
From/To
Flash Group
BBU
BBU
AHB-32
CLK_LLPBM
Low Latency Peripheral Bus Matrix (LLPBM)
AHB-32
CLK_LLPBM
AHB-32
BBU
BBU
CLK_SYSC0H
Power Domain 6_0
System
Controller(SYSC)
(CLK_CAN)
Reset manage
CLK_LCP
BootROM
16KB
SW-Watchdog
CSV(for PLL)
Timing
Protection
(TPU) #0
SYSC1
CLK_SYSC1
Power manage
Source Clock
Timer
LVD
CSV
Fast-CR
Slow-CR
PLL0
SSCG PLL0
CLK_MEMC
State manage
CLK_CAN
CLK_LCP0A
CRC
4ch
P
M.F.S
22ch
Peripheral
Bus Bridge
CLK_LLPBM2
P
Bus Config
Group
(Config)
GPIO
DMAC
Complex #0
(Config)
32Bit FRT
6ch
#0 TCRAM
(Config)
Peripheral
Bus Bridge
CLK_HPM
Base Timer
30ch
Wakeup
Request #0
32Bit ICU
12ch
PPU Master
(Cnofig)
32Bit OCU
12ch
Memory & Config Group
CLK_MEMC
Power Domain 3
C
Peripheral
Bus Bridge
RAM
RAM
PONR
CLK_LCP0A
CAN-FD
2ch
IRC #0
512 Vectors
Clock manage
EICU 16ch
CAN prescaler
Backup RAM 32KB
(8+5 bit width RAM x 4)
Power
Domain 4_1
CLK_RAM1H
Power CLK_RAM0H
Domain 4_0
Backup RAM 32KB
(8+5 bit width RAM x 4)
ECC-ed RAM I/F
Flash Group I/F
Clock divide
and distribution
CLK_COMH
CLK_LLPBM
BBU
CLK_LLPBM
CLK_LLPBM
From/To
Core-Group
AHB-32
State manage (2)
Common PERI #0
Group
12Bit A/DC
Unit0×32ch
Common PERI #1
Group
Common PERI #2
Group
Wakeup-detect
RTC
Clock Calibration
H/W Watchdog
EXT-IRQ
16ch
Pertial Wake up
12Bit A/DC
Unit1×32ch
Common PERI #0
Group
Power Domain 1 (Always on)
NMI
MCU Config Group
Power Domain 1
(Always on)
June 25, 2014, S6J311E_DS708-00002-0v01-E
CONFIDENTIAL
37
D a t a S h e e t ( P r e l i m i n a r y )
10. MEMORY MAP
This section explains the memory map.
Figure 10-1 Memory Map
S6J311EJAA
ADRESS
START
END
group
0x0000_0000
part
TCRAM
0x0000_FFFF
(Main 64KByte)
0x0001_0000
0x007F_FFFF
Reserved
0x0080_0000
0x008F_FFFF
Reserved
0x009F_0000
TCM_FLASH
0x009F_FFFF
(Small Sector 8KByte×8)
0x00A0_0000
TCM_FLASH
0x00AF_FFFF
Internal area for CR5
0x00B0_0000
0x00DF_FFFF
0x00E0_0000
0x00FF_FFFF
0x0100_0000
0x018F_FFFF
(Code 4MByte)
Complex
Reserved
Reserved
0x019F_0000
AXI_FLASH_MEMORY
0x019F_FFFF
(Small Sector 8KByte×8 *Mirror)
0x01A0_0000
AXI_FLASH_MEMORY
0x01AF_FFFF
(Code 4MByte *Mirror)
0x01B0_0000
0x01DF_FFFF
0x01E0_0000
0x01FF_FFFF
Reserved
0x0200_0000
SYSTEM SRAM
0x0200_3FFF
(256KByte)
0x0200_4000
0x0203_FFFF
0x0204_0000
0x027F_FFFF
Reserved
0x0280_0000
0x0280_002F
Exclusive Access Memory
0x0280_0030
0x03FF_FFFF
Reserved
0x0400_0000
0x05FF_FFFF
AXI_SLAVE_CORE0
0x0600_0000
Reserved
0x0DFF_FFFF
0x0E00_0000
WORK_FLASH
0x0E00_BFFF
0x0E00_C000
0x0E01_BFFF
0x0E01_C000
0x0E0F_FFFF
0x0E10_0000
0x0E1F_FFFF
0x0E20_0000
(112KByte mirror area 1)
Shared Flash and memory
area
0x0E21_BFFF
0x0E21_C000
0x0E2F_FFFF
(112KByte mirror area 3)
Reserved
0x0E30_0000
WORK_FLASH
0x0E30_BFFF
0x0E30_C000
0x0E31_BFFF
0x0E31_C000
0x0E3F_FFFF
0x0E40_0000
0x0E7F_FFFF
(112KByte mirror area 4)
Reserved
Reserved
0x0E80_0000
Backup RAM
0x0E80_1FFF
0x0E80_2000
0x0E80_FFFF
0x0E81_0000
0x0E87_FFFF
Reserved
WORK_FLASH
0x0E20_BFFF
0x0E20_C000
Reserved
64KByte
Reserved
0x0E88_0000
Reserved
0x0FFF_FFFF
0x1000_0000
Reserved
Reserved
0xAFFF_FFFF
0xB000_0000
0xB483_FFFF
Peri_area
0xB484_0000
0xB484_FFFF
APPS#5
0xB485_0000
Peri area
Peri_area
0xB7FF_FFFF
0xB800_0000
Reserved
Reserved
0xFFFE_DFFF
38
CONFIDENTIAL
0xFFFE_E000
0xFFFE_FFFF
0xFFFF_0000
0xFFFF_3FFF
0xFFFF_4000
0xFFFF_FFFF
ERRCFG
BootROM
ERRCFG
BootRom
Reserved
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
Only the CPU core can access 0000_0000 ~ 01FF_FFFF. Bus masters other than the CPU core
cannot access the region.
Internal area of CR5 complex (0000_0000 ~ 01FF_FFFF) is mapped to AXI_SLAVE_CORE0. All bus
masters can access to internal area of CR5 complex via AXI_SLAVE_CORE0.
In each of the following memory area combinations, the areas are physically the same memory area.
1. TCM FLASH (0x00A0_0000 -) and AXI FLASH MEMORY (0x01A0_0000 -)
2. TCM FLASH Small Sector (0x009F_0000 -) and AXI FLASH MEMORY Small Sector
(0x019F_0000 -)
3. WORKFLASH (0x0E00_0000 -), WORKFLASH (0x0E20_0000 -), and WORKFLASH
(0x0E30_0000 -)
− The differences between the TCM FLASH and AXI FLASH include the following.
Function
High-speed Access Using Dedicated Bus
Write and Erase
TCM FLASH
AXI FLASH
Applicable
Not applicable
Not applicable
Applicable
(Read-only)
Read
Applicable
Applicable
− The differences between WORKFLASH areas include the following.
Area
Function
WORKFLASH Area 1
Used in write operation (with ECC)
WORKFLASH Area 3
Used in write operation (without ECC)
WORKFLASH Area 4
Used in read operation
− Terms are as follows.
Term
Description
TCM RAM
Main RAM
TCM FLASH
Program FLASH (TCM area)
AXI FLASH
Program FLASH (AXI area)
This is physically the same as the TCM FLASH.
SYSTEM RAM
System RAM
AXI SLAVE CORE
AXI CPU control area
WORKFLASH
FLASH for work
BACKUP RAM
Backup RAM
Peri area
Entire area for peripheral functions
APPS#5
Part of area for peripheral functions
ERRCFG
Error configuration area
BootROM
ROM for reset boot
June 25, 2014, S6J311E_DS708-00002-0v01-E
CONFIDENTIAL
39
D a t a S h e e t ( P r e l i m i n a r y )
S6J311EJAA Peripheral Map
START
Address
B000_0000
B010_8000
B010_8100
B030_0000
B030_8000
B040_0000
B040_8000
B041_0000
B041_1000
B041_2000
B041_2100
B050_0000
B060_0000
B060_0080
B060_0100
B060_0180
B060_0200
B060_0280
B060_0300
B060_0380
B060_0400
B060_0480
B060_0500
B060_0600
B060_0680
B060_0700
B060_0800
B060_C000
B061_0000
B061_8000
B062_0000
B064_0000
B066_0000
B068_0000
B068_8000
B068_8400
B068_8800
B068_8C00
B069_0000
B070_0000
B080_0000
B100_0000
B110_0000
B120_0000
B200_0000
B210_0000
B470_0000
B470_4000
B471_0000
B471_1000
B471_4000
B471_5000
B471_8000
B471_8400
B471_8800
B471_8C00
B471_9000
B473_8000
B474_0000
B474_8000
B475_0000
B475_8000
B478_FC00
B479_0000
40
CONFIDENTIAL
END
Address
B010_7FFF
B010_80FF
B02F_FFFF
B030_7FFF
B03F_FFFF
B040_7FFF
B040_FFFF
B041_0FFF
B041_1FFF
B041_20FF
B04F_FFFF
B05F_FFFF
B060_007F
B060_00FF
B060_017F
B060_01FF
B060_027F
B060_02FF
B060_037F
B060_03FF
B060_047F
B060_04FF
B060_05FF
B060_067F
B060_06FF
B060_07FF
B060_BFFF
B060_FFFF
B061_7FFF
B061_FFFF
B063_FFFF
B065_FFFF
B067_FFFF
B068_7FFF
B068_83FF
B068_87FF
B068_8BFF
B068_FFFF
B06F_FFFF
B07F_FFFF
B0FF_FFFF
B10F_FFFF
B11F_FFFF
B1FF_FFFF
B20F_FFFF
B46F_FFFF
B470_3FFF
B470_FFFF
B471_0FFF
B471_3FFF
B471_4FFF
B471_7FFF
B471_83FF
B471_87FF
B471_8BFF
B471_8FFF
B473_7FFF
B473_FFFF
B474_7FFF
B474_FFFF
B475_7FFF
B478_FBFF
B478_FFFF
B47F_FFFF
Group
SystemSRAM
SYSC1
SYSC1
MEMORY_CONFIG_GROUP
MEMORY_CONFIG_GROUP
MEMORY_CONFIG_GROUP
MEMORY_CONFIG_GROUP
MEMORY_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
MCU_CONFIG_GROUP
Bit RMW alias
Bit RMW alias
Bit RMW alias
SHE
CommonPERI #2
CommonPERI #2
CommonPERI #2
CommonPERI #2
CommonPERI #2
CommonPERI #2
CommonPERI #2
CommonPERI #2
CommonPERI #2
CommonPERI #2
CommonPERI #2
Function
Reserved
SystemSRAM registers
Reserved
System Controller #1
SWDT
IRC0
TPU0
TCRAM Control Status Register
TCFlash Control Status Register
WFlash Control Status Register
Reserved
Reserved
Protection register area
RUN profile register area
PSS profile register area
APP profile register area
STS profile register area
System register area
CSV
RESET
SCT(Fast CR)
SCT(Slow CR)
SCT(Main clock)
Clock System
Special register area
Debug register area
Mode
HWDT
Reserved
RTC
EIC
Reserved
Reserved
BURAMIF
EICU
CR_Calibration
IRQ ALL
CAN Prescaler
Reserved
Reserved
Bit RMW alias for MCU config Gr (Covers B060_0000 -- B06F_FFFF)
Bit RMW alias for SYSC1 (Covers B030_0000 -- B031_FFFF)
Bit RMW alias for MEMC (Covers B040_0000 -- B041_FFFF)
Reserved
SHE configuration registers
Reserved
DMAC #0 registers
Reserved
MPU for DMAC#0
Reserved
DMA Complex #0 registers (Additional registers, RLTs)
Reserved
CRC#0
CRC#1
CRC#2
CRC#3
Reserved
GPIO
PPC
RIC
PPU
Reserved
Reserved
Reserved
PPU No
21
19
16
17
18
34
33
35
32
37
38
42
43
63
64
66
68
70
71
72
73
74
75
76
-
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
START
Address
B480_0000
B480_0400
B480_0800
B480_0C00
B480_1000
B480_1400
B480_1800
B480_1C00
B480_2000
B480_8000
B480_8400
B480_8800
B480_8C00
B480_9000
B480_9400
B480_9800
B480_9C00
B480_A000
B480_A400
B480_A800
B480_AC00
B480_B000
B482_0000
B482_0400
B482_0800
B482_0C00
B482_1000
B482_1400
B482_1800
B482_8000
B482_8400
B482_8800
B482_8C00
B482_9000
B482_9400
B482_9800
B483_0000
B483_0400
B483_0800
B483_0C00
B483_1000
B483_1400
B483_1800
B483_FC00
B484_0000
B485_0000
B48A_0000
B48B_1000
B48B_FC00
B48C_0000
B490_0000
B491_0000
B492_0000
B4C0_0000
B500_0000
B600_0000
B700_0000
B780_0000
B7C0_0000
B800_0000
FFFE_E000
FFFE_FC00
END
Address
B480_03FF
B480_07FF
B480_0BFF
B480_0FFF
B480_13FF
B480_17FF
B480_1BFF
B480_1FFF
B480_7FFF
B480_83FF
B480_87FF
B480_8BFF
B480_8FFF
B480_93FF
B480_97FF
B480_9BFF
B480_9FFF
B480_A3FF
B480_A7FF
B480_ABFF
B480_AFFF
B481_FFFF
B482_03FF
B482_07FF
B482_0BFF
B482_0FFF
B482_13FF
B482_17FF
B482_7FFF
B482_83FF
B482_87FF
B482_8BFF
B482_8FFF
B482_93FF
B482_97FF
B482_FFFF
B483_03FF
B483_07FF
B483_0BFF
B483_0FFF
B483_13FF
B483_17FF
B483_FBFF
B483_FFFF
B484_FFFF
B489_FFFF
B48B_0FFF
B48B_FBFF
B48B_FFFF
B48F_FFFF
B490_FFFF
B491_FFFF
B4BF_FFFF
B4FF_FFFF
B5FF_FFFF
B6FF_FFFF
B77F_FFFF
B7BF_FFFF
B7FF_FFFF
FFFE_DFFF
FFFE_FBFC
FFFE_FFFF
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
CommonPERI #0
APPS #5
CommonPERI #0
CommonPERI #0
Bit RMW alias
Bit RMW alias
Bit RMW alias
Error Config
Error Config
June 25, 2014, S6J311E_DS708-00002-0v01-E
CONFIDENTIAL
Function
M.F.Serial ch.0
M.F.Serial ch.1
M.F.Serial ch.2
M.F.Serial ch.3
M.F.Serial ch.4
M.F.Serial ch.5
M.F.Serial ch.6
M.F.Serial ch.7
Reserved
BaseTimer ch.0
BaseTimer ch.1
BaseTimer ch.2
BaseTimer ch.3
BaseTimer ch.4
BaseTimer ch.5
BaseTimer ch.6
BaseTimer ch.7
BaseTimer ch.8
BaseTimer ch.9
BaseTimer ch.10
BaseTimer ch.11
Reserved
FRT ch.0
FRT ch.1
FRT ch.2
FRT ch.3
FRT ch.4
FRT ch.5
Reserved
ICU ch.0 / ch1
ICU ch.2 / ch3
ICU ch.4 / ch5
ICU ch.6 / ch7
ICU ch.8 / ch9
ICU ch.10 / ch11
Reserved
OCU ch.0 / ch1
OCU ch.2 / ch3
OCU ch.4 / ch5
OCU ch.6 / ch7
OCU ch.8 / ch9
OCU ch.10 / ch11
Reserved
Reserved
APPS#5 area
Reserved
Reserved
Reserved
Reserved
Reserved
CAN_FD ch0
CAN_FD ch1
Reserved
Bit RMW alias for CPERI#0(Covers B490_0000 -- B497_FFFF)
Reserved
Reserved
Bit RMW alias for CPERI#2 (Covers B470_0000 -- B47F_FFFF)
Bit RMW alias for CPERI#0 (Covers B480_0000 -- B487_FFFF)
Reserved
Reserved
IRC
BootROM I/F
PPU No
176
177
178
179
180
181
182
183
88
89
90
91
92
93
94
95
96
97
98
99
208
209
210
211
212
213
224
225
226
227
228
229
240
241
242
243
244
245
256
257
20
41
D a t a S h e e t ( P r e l i m i n a r y )
- APPS#5 area
START
Address
B484_0000
B484_0400
B484_0800
B484_0C00
B484_1000
B484_1400
B484_1800
B484_1C00
B484_2000
B484_2400
B484_2800
B484_2C00
B484_3000
B484_3400
B484_3800
B484_3C00
B484_4000
B484_4400
B484_4800
B484_4C00
B484_5000
B484_5400
B484_5800
B484_5C00
B484_6000
B484_6400
B484_6800
B484_6C00
B484_7000
B484_7400
B484_7800
B484_7C00
B484_8000
B484_8400
B484_8800
B484_8C00
42
CONFIDENTIAL
END
Address
B484_03FF
B484_07FF
B484_0BFF
B484_0FFF
B484_13FF
B484_17FF
B484_1BFF
B484_1FFF
B484_23FF
B484_27FF
B484_2BFF
B484_2FFF
B484_33FF
B484_37FF
B484_3BFF
B484_3FFF
B484_43FF
B484_47FF
B484_4BFF
B484_4FFF
B484_53FF
B484_57FF
B484_5BFF
B484_5FFF
B484_63FF
B484_67FF
B484_6BFF
B484_6FFF
B484_73FF
B484_77FF
B484_7BFF
B484_7FFF
B484_83FF
B484_87FF
B484_8BFF
B484_FFFF
Group
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
APPS #5
Function
M.F.Serial ch.8
M.F.Serial ch.9
M.F.Serial ch.10
M.F.Serial ch.11
M.F.Serial ch.12
M.F.Serial ch.13
M.F.Serial ch.14
M.F.Serial ch.15
M.F.Serial ch.16
M.F.Serial ch.17
M.F.Serial ch.18
M.F.Serial ch.19
M.F.Serial ch.20
M.F.Serial ch.21
BaseTimer ch.12
BaseTimer ch.13
BaseTimer ch.14
BaseTimer ch.15
BaseTimer ch.16
BaseTimer ch.17
BaseTimer ch.18
BaseTimer ch.19
BaseTimer ch.20
BaseTimer ch.21
BaseTimer ch.22
BaseTimer ch.23
BaseTimer ch.24
BaseTimer ch.25
BaseTimer ch.26
BaseTimer ch.27
BaseTimer ch.28
BaseTimer ch.29
A/D unit0
A/D unit1 , Partial Wake Up
A/D analog input control
Reserved
PPU No
264
265
266
267
268
269
270
271
272
273
274
275
276
277
278
279
280
281
282
283
284
285
286
287
288
289
290
291
292
293
294
295
296
297
298
-
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
11. PIN STATUSES IN CPU STATUS
Table 11-1 Pin state table (1/2)
2
3
4
5
6
7
8
2
3
4
5
6
7
8
9
10
9
11 P009/IN10_0/SIN8_0/TIOA1_0/INT0_1
13
14
15
16
17
12
13
14
15
16
17
18
19
20
21
18
22 P020/SOT0_0/TIOB1_0/TEXT1_0
19
23 P021/SCK4_1/SCK0_0/TIOB2_0
20
24 P022/SIN0_0/TIOB3_0/INT3_0
21
22
52
53
54
55
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
47
48
49
50
51
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
56
70 P130/IN7_1/SIN6_0/AN23/INT5_0
57
71 P131/IN8_1/SOT6_0/AN24
72 P200/SCS202_0/AN25/TIOA17_0
73 P201/SIN20_0/AN26/TIOA18_0
58
74 P202/IN9_1/SCK6_0/INT6_1
59
60
61
62
75
76
77
78
63
79 P207/SCK4_0/AN30/INT7_1/TEXT5_1
64
65
80 P208/SCS42_0/AN31/TIOA19_0
81 P209/SOT4_0/AN32/TIOA20_0
23
24
25
26
27
28
29
30
31
32
33
34
35
39
40
41
45
46
47
48
49
50
51
P010/IN11_0/SOT8_0/TIOA2_0
P011/SIN18_1/TIOA2_1
P012/OUT5_0/SCK8_0/TIOA3_0
P013/OUT6_0/SCS80_0/TIOA4_0
P014/SOT18_1/TIOA3_1
P015/OUT7_0/SCS81_0/TIOA5_0
P016/OUT8_0/SCS82_0/TIOA6_0
P017/OUT9_0/SCS83_0/TIOA7_0
P018/OUT10_0/TIOA8_0
P019/OUT11_0/TIOB0_0/TEXT0_0
P023/SIN4_1/SCS0_0/TIOB4_0
P024/SOT4_1/TIOB5_0
P025/SCS40_1
P026/SCS41_1
P027/SCS42_1/TIOA4_1/TIOB6_0/INT1_1/TEXT0_1
P028/OUT0_1/SIN1_0/TIOB7_0/INT4_0
P029/OUT1_1/SOT1_0/AN0
P030/OUT2_1/SCS43_1
P031/OUT3_1/SCS1_0/AN1
P100/OUT4_1/SCK1_0/AN2
P101/OUT5_1/AN3
P102/AN4
P103/OUT6_1/SIN17_0/AN5
P104/SOT17_0
P105/OUT7_1/SCK17_0/TIOA9_0
P106/OUT8_1/TX1_2/SCS170_0
P107/OUT9_1/RX1_2/SIN19_0/TIOA10_0/INT2_1
P108/OUT10_1/SOT19_0/AN6/TIOA11_0/INT3_1
P109/OUT11_1/SIN19_1/SCK19_0/TIOA12_0
P110/SCS190_0/AN7
P111/SIN18_0/AN8
P112/SOT18_0/AN9/TIOA13_0
P113/SOT19_1/SCK18_0/TIOA5_1
P114/SCS180_0/AN10/TIOA6_1
P115
P116/AN11
P117/AN12/INT4_1
P118/AN13/INT5_1
P119/SCS60_0/AN14
P120/SCS61_0/AN15
P121/SCS160_0/AN16/TIOA14_0
P122/SCS62_0/AN17/TIOA11_1
P123/SCS63_0/AN18/TIOA12_1
P124/SIN16_0/TIOA15_0
P125/SOT16_0/TIOA16_0
P126/SCK16_0/AN19
P127/SCS203_0/AN20/TEXT1_1
P128/SCS200_0/AN21/TEXT2_1
P129/IN6_1/SCS201_0/AN22
Controlled
Hiz/Input turned off
P203/IN10_1
P204/IN11_1/SOT20_0/AN27
P205/SCK20_0/AN28/TEXT3_1
P206/SCS43_0/AN29/TEXT4_1
66
82 P210/IN0_2/SIN4_0/AN33/TIOA21_0/INT6_0
67
68
83 P211/IN1_2/SCS40_0/AN34/TIOA22_0
84 P212/IN2_2/SCS50_1/SCS41_0/AN35/TIOA13_1
69
85 P213/IN3_2/SIN5_1/TIOA14_1/INT8_1
70
86 P214/IN4_2/SOT5_1/TIOA15_1
71
87 P215/IN5_2/SCK5_1/TIOA16_1/INT9_1
June 25, 2014, S6J311E_DS708-00002-0v01-E
CONFIDENTIAL
Hiz/
Previous Hiz/Input
turned off
value
retained
Hiz/Input
turned off
Hiz/Input
turned off
Status
Last state
immediately
retained
before the
shutdown retaine
When High Impedance
Enabled
(SYSC_SSPECFGR.
PSSPADCTRL=1)
Watch *4
When High Impedance
Disabled
(SYSC_SSPECFGR.
PSSPADCTRL=0)
When High Impedance
Enabled
(SYSC_SSPECFGR.
PSSPADCTRL=1)
Stop *4
When High Impedance
Disabled
(SYSC_SSPECFGR.
PSSPADCTRL=0)
Sleep
CPU Sleep
Internal Reset Factor
*2
After Issuing Internal
Reset (Before Setting
GPORT)
External Reset
Factor 3
While Issuing
Internal Reset
After Issuing Internal
Reset (Before Setting
GPORT)
After Releasing
External Factor
While Issuing
Internal Reset
While Issuing
Internal Reset
Before Issuing
Internal Reset
After Issuing Internal
Reset (Before Setting
GPORT)
External Reset Factor 2
While Generating
External Factor
P000/SOT2_1
P001/SCS20_1
P002/SCS21_1/TIOA0_1
P003/SCS22_1
P004/SCS23_1/TIOA1_1
P005/IN6_0/SIN3_0
P006/IN7_0/SOT3_0
P007/IN8_0/SCK18_1/SCK3_0
P008/IN9_0/SCS180_1/SCS30_0/TIOA0_0
10
11
12
GPORTEN
Control
After Releasing
External Factor
While Issuing
Internal Reset
Pin Name
While Issuing
Internal Reset
Pin No.
端子番号 (144Pin)
External Reset Factor 1
While
Generating
External
Factor
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Last state
retained
(*3)
Hiz/Input turned
off (*1)
Last state
retained
(*3)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
43
D a t a S h e e t ( P r e l i m i n a r y )
Table 11-2Pin state table (2/2)
When High Impedance
Enabled
(SYSC_SSPECFGR.
PSSPADCTRL=1)
Watch *4
When High Impedance
Disabled
(SYSC_SSPECFGR.
PSSPADCTRL=0)
When High Impedance
Enabled
(SYSC_SSPECFGR.
PSSPADCTRL=1)
Stop *4
When High Impedance
Disabled
(SYSC_SSPECFGR.
PSSPADCTRL=0)
Sleep
CPU Sleep
After Issuing Internal
Reset (Before Setting
GPORT)
External Reset
Factor 3
While Issuing
Internal Reset
After Issuing Internal
Reset (Before Setting
GPORT)
While Issuing
Internal Reset
While Issuing
Internal Reset
After Releasing
External Factor
Internal Reset Factor
*2
External Reset Factor 2
While Generating
External Factor
Before Issuing
Internal Reset
After Issuing Internal
Reset (Before Setting
GPORT)
While Issuing
Internal Reset
GPORTEN
Control
After Releasing
External Factor
P216/SIN15_0
P217/SOT15_0
P218/SCK15_0/AN36/TEXT2_0
P219/SCS150_0/AN37/TEXT3_0
P220/IN6_2/SCS53_0/AN38
P221/SCS52_0
Hiz/Input
turned off
Hiz/Input
turned off
77
96 P222/IN7_2/SIN5_0/AN39/INT7_0
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
78
79
97 P223/IN8_2/PWU_AN0/SCS51_0/AN40
98 P224/IN9_2/PWU_AN1/TX0_2/SCS50_0/AN41
80
99 P225/IN10_2/PWU_AN2/RX0_2/SOT5_0/AN42/INT0_0
81
85
86
100 P226/IN11_2/PWU_AN3/SCK5_0/AN43/TIOA17_1
104 P227/PWU_AN4/SCK10_0/AN44/TIOA23_0
105 P228/PWU_AN5/TX0_1/SOT10_0/AN45/TIOA24_0
74
75
76
90
91
92
93
94
95
Pin Name
While Issuing
Internal Reset
While
Generating
External
Factor
Pin No.
端子番号 (144Pin)
External Reset Factor 1
87
106 P229/OUT0_0/PWU_AN6/RX0_1/SIN10_0/AN46/TIOA25_0/INT8_0
88
89
90
91
92
93
94
95
107
108
109
110
111
112
113
114
115
96
116 P306/TX0_0/SCS73_0/AN54
97
117 P307/RX0_0/SCS72_0/AN55/INT1_0
98
99
118 P308/IN0_1/SCK13_0/AN56/TIOA28_1
119 P309/IN1_1/SCS130_0/AN57/TIOA29_1
P230/OUT1_0/PWU_AN7/SCS103_0/AN47/TIOA26_0
P231/OUT2_0/SCS102_0/AN48/TIOA27_0
P300/OUT3_0/SCS101_0/AN49/TIOA28_0
P301/OUT4_0/SCS100_0/AN50/TIOA18_1
P302/SIN14_0/AN51/TIOA19_1
P303/SOT14_0
P304/SCK14_0/AN52/TIOA20_1/TEXT4_0
P305/SCS140_0/AN53/TIOA29_0/TEXT5_0
NMIX
Controlled
-
Hiz/Input turned off
Input enabled
Hiz
/Previous Hiz/Input
value
turned off
retained
Input enabled
Hiz/Input
turned off
Input enabled
Hiz/Input
turned off
Input enabled
Status
immediately
Last state
before the
retained
shutdown retaine
Input enabled
Input enabled
Last state
retained
(*3)
Controlled
Hiz/Input turned off
Hiz
/Previous Hiz/Input
value
turned off
retained
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input
turned off
Input enabled
Hiz/Input
turned off
Input enabled
Hiz/Input
turned off
Status
Last state
immediately
before the
retained
shutdown retaine
Input enabled
Input enabled
Input enabled
Input enabled
123 151 RSTX
-
-
Input enabled
Input enabled
Hiz/Input turned off
Hiz
/Previous Hiz/Input
value
turned off
retained
Hiz/Input
turned off
Hiz/Input
turned off
Controlled
-
Input enabled
Input enabled
Input enabled
Input enabled
Input enabled
Input enabled
Input enabled
-
-
-
-
-
-
-
Controlled
Hiz/Input turned off
-
Input enabled
Hiz
/Previous
value
retained
Hiz/Input
turned off
Input enabled
Hiz/Input
turned off
Hiz/Input
turned off
Input enabled
Input enabled
Status
immediately
Last state
before the
retained
shutdown retaine
Input enabled
Input enabled
Last state
retained
(*3)
Last state
retained
(*3)
135 163 P409/SOT2_0/TIOA24_1/TRACEDATA6
164 P410/SCS70_1
140 171 P417/SOT7_1/SCS110_0/TIOA23_1/INT15_1
141 172 P418/SCS22_0/SIN12_0/INT14_0
173 P419/SCS23_0/SOT12_0/TIOA27_1
142 174 P420/SCK2_1/SCK12_0/TRACECLK
143 175 P421/SIN2_1/SCS120_0/TRACECTL
44
CONFIDENTIAL
Hiz/Input turned
off (*1)
Last state
retained
(*3)
Controlled
Hiz/Input turned off
Hiz
/Previous Hiz/Input
turned off
value
retained
Hiz/Input
turned off
Hiz/Input
turned off
Status
immediately
Last state
before the
retained
shutdown retaine
-
Hiz/Input
turned off
Last state
retained
(*3)
Hiz/Input
turned off
Input enabled
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Last state
retained
(*3)
Hiz/Input
turned off
Input enabled
Hiz/Input turned
off (*1)
134 162 P408/SIN2_0/INT12_0/TRACEDATA5
139 170 P416/IN5_0/SIN7_1/SCK11_0/TIOA22_1
Hiz/Input
turned off
Input enabled
Hiz/Input
turned off
132 160 P406/SOT9_0/TRACEDATA3
133 161 P407/SCK7_1/SCK9_0/TRACEDATA4
169 P415/SOT11_0/TIOA26_1/INT13_0
Hiz/Input
turned off
(*1)
Hiz/Input turned
off (*1)
Status
immediately
Last state
before the
retained
shutdown retaine
131 159 P405/IN4_0/SIN9_0/INT11_0/TRACEDATA2
138 168 P414/SCS21_0/SIN11_0
Hiz/Input
turned off
-
129 157 P403/IN2_0/TRACEDATA0
130 158 P404/IN3_0/TRACEDATA1
137 167 P413/SCS73_1/SCS20_0/INT14_1
Hiz/Input
turned off
Input enabled
128 156 P402/IN1_0/RX1_0/SCS63_1/SCS90_0/INT2_0
166 P412/SCS72_1/TIOA25_1
Hiz/Input
turned off
Hiz/Input turned
off (*1)
-
127 155 P401/IN0_0/TX1_0/SCS62_1
136 165 P411/SCS71_1/SCK2_0/INT13_1/TRACEDATA7
Last state
retained
(*3)
Hiz/Input turned
off (*1)
Hiz/Input
Hiz/Input
turned off
turned off
Input enabled
Input
(Status
Input enabled Input enabled Input enabled Input enabled
enabled
(Last state
(Hiz/Input
(Last state
(Hiz/Input
immediately
(Last state
retained (*3)) turned off) retained (*3)) turned off)
before the
retained)
(*6)
*6
(*6)
*6
shutdown retaine)
*6
*6
Input
Input enabled
Input enabled
Input enabled
enabled
139 P325/SIN21_0/INT10_0
122 150 P400/SCS61_1
Hiz/Input turned
off (*1)
Input enabled
-
113 137 TMS
114 138 TCK
116
117
118
119
121
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Last state
retained
(*3)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Last state
retained (*3)
(*5)
130 P320/PWUTRG/WOT
115
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input
turned off
(*1)
107 131 P321
110 134 TRST/P322
111 135 TDO/P323
P326/SOT21_0
P327/SCK6_1/SCK21_0
P328/SOT6_1/SCS210_0
P329/SIN6_1
P330
MD
X0
X1
P331/SCS60_1
Last state
retained
(*3)
Hiz/Input turned
off (*1)
102 124 P314/IN4_1/SCK7_0/AN60/TIOA7_1
103 125 P315/IN5_1/SCS70_0/AN61/TIOA8_1
126 P316/TIOA21_1
104 127 P317/TX1_1/AN62/TIOA9_1/INT11_1
105 128 P318/RX1_1/TIOA10_1/INT9_0
106 129 P319/SIN7_0/AN63/INT12_1
140
141
142
143
144
145
146
147
149
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
101 123 P313/IN3_1/SOT7_0/AN59/INT10_1
112 136 TDI/P324
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input
turned off
120 P310/SIN13_0/INT15_0
121 P311/SOT13_0
100 122 P312/IN2_1/SCS71_0/AN58
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Last state
retained
(*3)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
Hiz/Input turned
off (*1)
Hiz/Input turned
off (*1)
Hiz/Input
turned off
Hiz/Input
turned off
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
*1: Input disable is not valid when external interrupts are enabled.
*2: Recovery from standby (power off) becomes a factor.
*3: The pin state from the time that HOLDIO_PD2 was set (SYSC_SSPECFGR.HOLDIO_PD2=1) is retained. If
power-off has not occurred and HOLDIO_PD2 has not been set (SYSC_SSPECFGR.HOLDIO_PD2=0), the last
state is retained.
*4: To power off power domains 2 and 3, be sure to set HOLDIO_PD2 (SYSC_SSPECFGR.HOLDIO_PD2=1).
*5: When the PWU function is enabled, a change to output occurs.
*6: The pin state when the PORT function is enabled is shown.
-External Reset Factor 1
Power-on reset (PONR)
RAM retention low-voltage detection reset (RVD)
Internal power supply low-voltage detection reset (LVDL1R)
RSTX pin + MD pin simultaneous assert reset (INITX)
-External Reset Factor 2
RSTX pin input reset (RSTX)
-External Reset Factor 3
Hardware watchdog reset (HWDR)
Software watchdog reset (SWDR)
PLL clock supervisor reset (CSVPRn)
SSCG clock supervisor reset (CSVSRn)
Profile error reset (PRFERR)
Software trigger hard reset (SHRST)
Software reset (SRST)
-Internal Reset Factor 4
Standby transition reset/ Power domain reset
June 25, 2014, S6J311E_DS708-00002-0v01-E
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12. ELECTRICAL CHARACTERISTICS
12.1 Absolute Maximum Ratings
Parameter
Symbol
Power supply voltage*1, *2
*1 *2
Analog supply voltage ,
*1
Analog reference voltage
*1
Rating
Unit
Max
VCC
VSS-0.3
VSS+6.0
V
AVCC
VSS-0.3
VSS+6.0
V
Avcc≤Vcc
AVRH
VSS-0.3
VSS+6.0
V
AVRH≤AVCC
Input voltage
VI
VSS-0.3
VCC+0.3
V
Analog pin input voltage*1
VIA
VSS-0.3
VCC+0.3
V
VO
VSS-0.3
VCC+0.3
V
ICLAMP
-
4
mA
*1
Output voltage
Maximum clamp current
Total maximum clamp current
"L"-level maximum output current*3
"L"-level average output current*4
Remarks
Min
*7
Σ|ICLAMP |
-
20
mA
*7
IOL1
-
3.5
mA
When setting is 1 mA*6
IOL2
-
7
mA
When setting is 2 mA
IOLAV1
-
1
mA
When setting is 1 mA*6
IOLAV2
-
2
mA
When setting is 2 mA
ΣIOL
-
40
mA
*6
IOH1
-
-3.5
mA
When setting is 1 mA*6
IOH2
-
-7
mA
When setting is 2 mA
IOHAV1
-
-1
mA
When setting is 1 mA*6
IOHAV2
-
-2
mA
When setting is 2 mA
ΣIOH
-
-40
mA
*6
Power consumption
PD
-
2000
mW
Operating temperature
TA
-40
+105
℃
Tstg
-55
+150
℃
"L"-level total output current*5
"H"-level maximum output current*3
"H"-level average output current*4
"H"-level total output current*5
Storage temperature
S6J311EJAA
*1: VSS=AVSS=0.0 V is used as a reference.
*2: Take care that AVCC does not exceed VCC at, for example, the power-on time.
*3: The definition of maximum output current is the peak current value of the relevant pin.
*4: The definition of average output current is the average value of current flowing into the relevant pin for
10 ms. The average value means operating current x operating rate.
*5: The definition of total output current is the maximum value of the current flowing into all the relevant
pins.
*6: Relevant pins: All general-purpose ports
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D a t a S h e e t ( P r e l i m i n a r y )
*7: Relevant pins: All general-purpose ports and analog input pins
−
Use the device within the recommended operating conditions.
−
Use the device with direct voltage (current).
−
Be sure to connect a limiting resistor between a +B signal and microcontroller to apply the +B
signal.
−
Set the limiting resistor value such that the current input into a microcontroller pin at the +B
input time is equal to or less than the standard value regardless of whether it is instantaneous
or stationary.
−
Note that +B input potential increases the potential of a Vcc pin through a diode under
operating conditions where there is less drive current for the microcontroller (such as in
low-power consumption mode). This characteristic may affect other devices.
−
If the microcontroller power is off (not fixed at 0 V) and there is +B input, power is supplied from
pins. Note that faulty operation may occur in this case.
−
If there is +B input at the power-on time, power is supplied from pins. Note that the supply
voltage may be insufficient for the operation of a power-on reset in this case.
−
Make sure that +B input pins are not open.
Example of a recommended circuit
WARNING:
−
Semiconductor devices may be permanently damaged by application of stress (including, without
limitation, voltage, current or temperature) in excess of absolute maximum ratings.Do not exceed
any of these ratings.
June 25, 2014, S6J311E_DS708-00002-0v01-E
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D a t a S h e e t ( P r e l i m i n a r y )
12.2 Recommended operating conditions
(VSS=AVSS=0.0 V)
Parameter
Supply voltage
Rating
Symbol
Min
Max
Unit
VCC
4.5
5.25
V
AVCC
4.5
5.25
V
VCC
3.5
5.25
V
AVCC
3.5
5.25
V
Smoothing capacitor*
CS
Operating temperature
TA
4.7
-40
+105
Remarks
Recommended operation assurance range
Operation assurance range
µF
Tolerance of up to ±40%
°C
S6J311EJAA
*: For the connections of smoothing capacitor CS, see the following diagram.
・C pin connection diagram
C
CS
VSS
VSS
AVSS
WARNING:
1. The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is
operated under these conditions.
2. Any use of semiconductor devices will be under their recommended operating condition.
3. Operation under any conditions other than these conditions may adversely affect reliability of device
and could result in device failure.
4. No warranty is made with respect to any use, operating conditions or combinations not represented on
this data sheet. If you are considering application under any conditions other than listed herein, please
contact sales representatives beforehand.
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12.3 DC characteristics
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Symbol
Pin Name
Conditions
Value
Unit
Min
Typ
Max
0.7×VCC
-
VCC+0.3
V
0.8×VCC
-
VCC+0.3
V
Remarks
P000 to P031,
VIH1
P100 to P131,
CMOS
P200 to P231,
Schmitt
P300 to P320,
input level
P325 to P331,
selected
P400 to P421
"H" level
input voltage
Automotive
VIH2
P401 to P421
input level
selected
VIH4
RSTX, NMIX
-
0.7×VCC
-
VCC+0.3
V
VIH5
MD
-
0.7×VCC
-
VCC+0.3
V
TTL
2.0
-
VCC+0.3
V
Vss-0.3
-
0.3×VCC
V
Vss-0.3
-
0.5×VCC
V
VIH6
TRST, TCK, TDI,
TMS
P000 to P031,
VIL1
P100 to P131,
CMOS
P200 to P231,
Schmitt
P300 to P320,
input level
P325 to P331,
selected
P400 to P421
"L" level
input voltage
Automotive
VIL2
P401 to P421
input level
selected
VIL4
RSTX, NMIX
-
Vss-0.3
-
0.3×VCC
V
VIL5
MD
-
Vss-0.3
-
0.3×VCC
V
TTL
Vss-0.3
-
0.8
V
VIL6
TRST, TCK, TDI,
TMS
June 25, 2014, S6J311E_DS708-00002-0v01-E
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(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Symbol
Pin Name
Conditions
Value
Unit
Min
Typ
Max
Vcc-0.5
-
Vcc
V
Vcc-0.5
-
Vcc
V
0
-
0.4
V
0
-
0.4
V
Remarks
P000 to P031,
P100 to P131,
"H" level
output voltage
P200 to P231,
VOH1
P300 to P320,
P321 to P324
Vcc=4.5 V
IOH=-2.0 mA
P325 to P331,
P400 to P421
P000 to P031,
P100 to P131,
"H" level
output voltage
VOH2
P200 to P231,
Vcc=4.5 V
P300 to P320,
IOH=-1.0 mA
P325 to P331,
P400 to P421
P000 to P031,
P100 to P131,
"L" level
output voltage
P200 to P231,
VOL1
P300 to P320,
P321 to P324
Vcc=4.5 V
IOL=2.0 mA
P325 to P331,
P400 to P421
P000 to P031,
P100 to P131,
"L" level
output voltage
VOL2
P200 to P231,
Vcc=4.5 V
P300 to P320,
IOL=1.0 mA
P325 to P331,
P400 to P421
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D a t a S h e e t ( P r e l i m i n a r y )
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Input leakage
current
Symbol
Pin Name
IIL
All input pins
RUP1
RSTX, NMIX
Conditions
Value
Unit
Min
Typ
Max
-5
-
+5
µA
25
-
100
kΩ
25
-
100
kΩ
25
-
100
kΩ
25
-
100
kΩ
-
25
-
100
kΩ
-
-
5
15
pF
Vcc=AVCC=5.25 V
VSS < VI < VCC
-
Remarks
P000 to P031,
P100 to P131,
Pull-up
RUP2
resistor
P200 to P231,
Pull-up resistor
P300 to P320,
selected
P325 to P331,
P400 to P421
RUP3
TDI(P324),TMS,
TCK
-
P000 to P031,
P100 to P131,
Pull-down
Rdown1
resistor
P200 to P231,
Pull-down resistor
P300 to P320,
selected
P325 to P331,
P400 to P421
Rdown2
TRST(P322)
Pins other than
Input
capacitance
CIN
VCC, VSS,
AVCC0,AVCC1,
AVSS0,AVSS1
June 25, 2014, S6J311E_DS708-00002-0v01-E
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D a t a S h e e t ( P r e l i m i n a r y )
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Symbol
Pin
Name
Conditions
Normal operation
ICC5
Flash
write/erase
Power
Value
Unit
Typ
Max
-
140
320
mA
Operating at 144 MHz
-
160
343
mA
Operating at 144 MHz
Operating at 144 MHz
ICCS5
CPU Sleep
-
82
265
mA
ICCT5
Timer mode
-
946.0
2967.9
µA
Stop mode
-
945.1
2966.2
µA
-
53.4
130.6
µA
-
47.1
116.4
µA
-
40.9
102.3
µA
-
40.1
101.4
µA
supply
current
S6J311EJ
AA
ICCH5
ICCP
ICCT52
ICCH52
VCC
PWU mode
(Shutdown)
Timer mode
(Shutdown)
Stop mode
(Shutdown)
Remarks
Min
TA=25°C
Slow-CR source Oscillation
TA=25°C
TA=25°C
(PWU operation cycle 16ms)
TA=25°C
(PWU operation cycle 32ms)
TA=25°C
Slow-CR source Oscillation
TA=25°C
Refer to Hardware manual “APPENDIX State transition” for Internal clock frequency setting / Setting of the power domain /
Regulator setting.
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12.4 AC characteristics
12.4.1
Source clock timing
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Source oscillation clock
frequency
Source oscillation clock
cycle time
CAN PLL jitter
(when locked)
Internal Slow CR
oscillation frequency
Internal Fast CR
oscillation frequency
Value
Pin
Cond
Name
itions
Min
Typ
Max
FC
X0, X1
-
-
4
-
MHz
tCYL
X0, X1
-
-
250
-
ns
tPJ
-
-
-10
-
+10
ns
FCRS
-
-
50
100
150
kHz
FCRF
-
-
2.4
4
6.0
MHz
Symbol
Unit
Remarks
*
*: The maximum/minimum values have been standardized with the main clock and PLL clock in use.
−
X0 and X1 clock timing
tCYL
X0
−
CAN PLL jitter
A time difference from the ideal clock is guaranteed for each cycle period within 20,000 cycles.
t1
t2
t3
tn-1
tn
Ideal clock
Slow
PLL output
t1
t2
t3
tn-1
tn
Fast
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12.4.2
Parameter
Internal clock timing
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Symbol
Pin
Name
Conditions
S6J311EJAA Value
Min
Typ
Max
Unit
Remarks
FCD0_CLK
-
-
-
-
144
MHz
CD0_CLK
FCLK_CPU
-
-
-
-
144
MHz
CLK_CPU
FCLK_FCLK
-
-
-
-
72
MHz
CLK_FCLK
FCLK_ATB
-
-
-
-
72
MHz
CLK_ATB
FCLK_DBG
-
-
-
-
72
MHz
CLK_DBG
FCLK_HPM
-
-
-
-
36
MHz
CLK_HPM
FCLK_HPM2
-
-
-
-
18
MHz
CLK_HPM2
FCLK_DMA
-
-
-
-
36
MHz
CLK_DMA
FCLK_MEMC
-
-
-
-
36
MHz
CLK_MEMC
FCLK_SYSC1
-
-
-
-
36
MHz
CLK_SYSC1
FCLK_HAPP0A0
-
-
-
-
36
MHz
CLK_HAPP0A0
FCLK_HAPP0A1
-
-
-
-
36
MHz
CLK_HAPP0A1
FCLK_HAPP1B0
-
-
-
-
36
MHz
CLK_HAPP1B0
FCLK_HAPP1B1
-
-
-
-
36
MHz
CLK_HAPP1B1
Internal clock
FCLK_LLPBM
-
-
-
-
144
MHz
CLK_LLPBM
frequency
FCLK_LLPBM2
-
-
-
-
72
MHz
CLK_LLPBM2
FCLK_LCP
-
-
-
-
72
MHz
CLK_LCP
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CONFIDENTIAL
FCLK_LCP0
-
-
-
-
36
MHz
CLK_LCP0
FCLK_LCP0A
-
-
-
-
36
MHz
CLK_LCP0A
FCLK_LAPPA0
-
-
-
-
36
MHz
CLK_LAPP0
FCLK_LAPPA0A
-
-
-
-
36
MHz
CLK_LAPP0A
FCLK_LAPP1
-
-
-
-
36
MHz
CLK_LAPP1
FCLK_LAPP1A
-
-
-
-
36
MHz
CLK_LAPP1A
FCLK_TRC
-
-
-
-
36
MHz
CLK_TRC
FCLK_SYSC0H
-
-
-
-
36
MHz
CLK_SYSC0H
FCLK_COMH
-
-
-
-
36
MHz
CLK_COMH
FCLK_RAM0H
-
-
-
-
36
MHz
CLK_RAM0H
FCLK_RAM1H
-
-
-
-
36
MHz
CLK_RAM1H
FCLK_SYSC0P
-
-
-
-
36
MHz
CLK_SYSCP0
FCLK_COMP
-
-
-
-
36
MHz
CLK_COMP
S6J311E_DS708-00002-0v01-E, June 25, 2014
D a t a S h e e t ( P r e l i m i n a r y )
Parameter
Symbol
Pin
Name
Conditions
S6J311EJAA Value
Min
Typ
Max
Unit
Remarks
tCD0_CLK
-
-
6.9
-
-
ns
CD0_CLK
tCLK_CPU
-
-
6.9
-
-
ns
CLK_CPU
tCLK_FCLK
-
-
13.8
-
-
ns
CLK_FCLK
tCLK_ATB
-
-
13.8
-
-
ns
CLK_ATB
tCLK_DBG
-
-
13.8
-
-
ns
CLK_DBG
tCLK_HPM
-
-
27.7
-
-
ns
CLK_HPM
tCLK_HPM2
-
-
55.5
-
-
ns
CLK_HPM2
tCLK_FMA
-
-
27.7
-
-
ns
CLK_DMA
tCLK_MEMC
-
-
27.7
-
-
ns
CLK_MEMC
tCLK_SYSC1
-
-
27.7
-
-
ns
CLK_SYSC1
tCLK_HAPP0A0
-
-
27.7
-
-
ns
CLK_HAPP0A0
tCLK_HAPP0A1
-
-
27.7
-
-
ns
CLK_HAPP0A1
tCLK_HAPP1B0
-
-
27.7
-
-
ns
CLK_HAPP1B0
tCLK_HAPP1B1
-
-
27.7
-
-
ns
CLK_HAPP1B1
Internal clock
tCLK_LLPBM
-
-
6.9
-
-
ns
CLK_LLPBM
cycle time
tCLK_LLPBM2
-
-
13.8
-
-
ns
CLK_LLPBM2
tCLK_LCP
-
-
13.8
-
-
ns
CLK_LCP
tCLK_LCP0
-
-
27.7
-
-
ns
CLK_LCP0
tCLK_LCP0A
-
-
27.7
-
-
ns
CLK_LCP0A
tCLK_LAPP0
-
-
27.7
-
-
ns
CLK_LAPP0
tCLK_LAPP0A
-
-
27.7
-
-
ns
CLK_LAPP0A
tCLK_LAPP1
-
-
41.6
-
-
ns
CLK_LAPP1
tCLK_LAPP1A
-
-
41.6
-
-
ns
CLK_LAPP1A
tCLK_TRC
-
-
27.7
-
-
ns
CLK_TRC
tCLK_SYSC0H
-
-
27.7
-
-
ns
CLK_SYSC0H
tCLK_COMH
-
-
27.7
-
-
ns
CLK_COMH
tCLK_RAM0H
-
-
27.7
-
-
ns
CLK_RAM0H
tCLK_RAM1H
-
-
27.7
-
-
ns
CLK_RAM1H
tCLK_SYSC0P
-
-
27.7
-
-
ns
CLK_SYSCP0
tCLK_COMP
-
-
27.7
-
-
ns
CLK_COMP
June 25, 2014, S6J311E_DS708-00002-0v01-E
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−
Operation assurance range
Relationship between the internal clock frequency and supply voltage
3.5
2
4
144
Internal clock frequency FCDO_CLK(MHz)
Note: A supply voltage that is equal to or less than the set voltage for low-voltage detection causes a reset.
Relationship between the oscillation clock frequency and internal clock frequency
Oscillation Clock
Frequency
−
Main Clock
PLL Multiplier
PLL Output Division
Setting
Setting
PLL Clock
4 MHz
4 MHz
144
4
144 MHz
4 MHz
4 MHz
144
6
96 MHz
Oscillation circuit example
X0
X1
R
C1
C2
Note:
For the configuration of an oscillation circuit, request the oscillator manufacturer to perform a circuit matching evaluation
before starting design.
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The following measurement reference voltage values define the alternate current standard
Input signal waveform
−
−
Output signal waveform
Output pin
Hysteresis input pin (Automotive)
0.8Vcc
2.4V
0.5Vcc
0.8V
Hysteresis input pin (CMOS Schmitt)
0.7Vcc
0.3Vcc
Hysteresis input pin (TTL)
2.0V
0.8V
12.4.3
Reset input
Parameter
Symbol
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Pin Name
Conditions
Reset
input time
tRSTL
Reset
RSTX
Value
Unit
Min
Max
10
-
µs
1
-
µs
Remarks
-
input reduction
width
tRSTL
RSTX
0.2Vcc
June 25, 2014, S6J311E_DS708-00002-0v01-E
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0.2Vcc
57
D a t a S h e e t ( P r e l i m i n a r y )
12.4.4
Power-on and power-on conditions
(TA: Recommended operating conditions, VSS=0.0 V)
Parameter
Symbol
Level detection
voltage
Level detection
hysteresis width
Level detection time
Pin
Name
Conditions
Value
Min
Typ
Max
Unit
Remarks
-
VCC
-
2.25
2.45
2.65
V
-
VCC
-
-
100
-
mV
-
-
-
-
-
30
μs
*1
-
-
4
mV/µs
*2
50
-
-
ms
*3
VCC = at
level
Slope detection
undetected standard
-
VCC
detection
release level
time
Power off time
-
VCC
-
*1: If a power fluctuation precedes the low-voltage detection time, the detection may occur or be
canceled after the supply voltage passes the detection voltage range.
*2: This time is a period that begins when the power supply is turned off and ends when an internal
charge is released and tilt detection becomes possible for the next power-on.
*3: This time is to start the slope detection at next power on after power down and internal charge loss.
58
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D a t a S h e e t ( P r e l i m i n a r y )
12.4.5 Multi-function serial
12.4.5.1 CSIO timing (SMR:MD2-0=0b010)
(5-1-1) Normal synchronous transfer (SCR:SPI=0) and mark level "H" of serial clock
output (SMR:SCINV=0)
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Serial clock
cycle time
SCK falling -> SOT
delay time
Valid SIN -> SCK rising
setup time
SCK rising -> Valid SIN
hold time
Serial clock
Symbol
Pin Name
tSCYC
SCK0 to SCK21
tSLOVI
tIVSHI
tSHIXI
Conditions
Master
mode
SCK0 to SCK21
(CL=50pF,
SOT0 to SOT21
IOL=-2mA,
SCK0 to SCK21,
(CL=20pF,
SIN0 to SIN21
IOL=-1mA,
IOH=2mA),
IOH=1mA)
tSHSL
"H" pulse width
Value
Unit
Min
Max
4tCLK_LCP0A
-
ns
-30
+30
ns
30
-
ns
0
-
ns
tCLK_LCP0A +10
-
ns
2tCLK_LCP0A -10
-
ns
-
45
ns
10
-
ns
20
-
ns
-
5
ns
-
5
ns
Remarks
SCK0 to SCK21
Serial clock
tSLSH
"L" pulse width
SCK falling -> SOT
delay time
Valid SIN -> SCK rising
setup time
SCK rising -> Valid SIN
hold time
tSLOVE
tIVSHE
tSHIXE
Slave
SCK0 to SCK21,
mode
SOT0 to SOT21
(CL=50pF,
SCK0 to SCK21,
IOH=2mA),
SIN0 to SIN21
(CL=20pF,
IOL=-2mA,
IOL=-1mA,
SCK falling time
tF
SCK0 to SCK21
SCK rising time
tR
SCK0 to SCK21
IOH=1mA)
Notes:
−
−
−
This table provides the alternate current standard for CLK synchronous mode.
CL is the load capability value connected to the pin at the test time.
The maximum baud rate is limited by the internal operating clock used and other parameters.
For details, see the hardware manual.
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D a t a S h e e t ( P r e l i m i n a r y )
tSCYC
SCK
VOH
VOL
tSLOVI
VOH
VOL
SOT
tIVSHI
tSHIXI
VIH
VIL
SIN
VIH
VIL
Master mode
tSLSH
SCK
VIH
tF
SOT
SIN
VIL
tSHSL
VIL
VIH
tR
VIH
tIVSHE
tSHIXE
tSLOVE
VOH
VOL
VIH
VIL
VIH
VIL
Slave mode
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D a t a S h e e t ( P r e l i m i n a r y )
(5-1-2) Normal synchronous transfer (SCR:SPI=0) and mark level "L" of serial clock
output (SMR:SCINV=1)
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Serial clock
cycle time
SCK rising -> SOT
Symbol
Pin Name
tSCYC
SCK0 to SCK21
tSHOVI
delay time
Valid SIN -> SCK falling
setup time
SCK falling -> Valid SIN
hold time
Serial clock
tIVSLI
tSLIXI
Conditions
Master
mode
SCK0 to SCK21,
(CL=50pF,
SOT0 to SOT21
IOL=-2mA,
SCK0 to SCK21,
(CL=20pF,
SIN0 to SIN21
IOL=-1mA,
IOH=2mA),
IOH=1mA)
tSHSL
"H" pulse width
Value
Unit
Min
Max
4tCLK_LCP0A
-
ns
-30
+30
ns
30
-
ns
0
-
ns
tCLK_LCP0A +10
-
ns
2tCLK_LCP0A -10
-
ns
-
45
ns
10
-
ns
20
-
ns
-
5
ns
-
5
ns
Remarks
SCK0 to SCK21
Serial clock
tSLSH
"L" pulse width
SCK rising -> SOT
tSHOVE
delay time
Valid SIN -> SCK falling
setup time
SCK falling -> Valid SIN
hold time
tIVSLE
tSLIXE
Slave
SCK0 to SCK21,
mode
SOT0 to SOT21
(CL=50pF,
IOL=-2mA,
SCK0 to SCK21,
IOH=2mA),
SIN0 to SIN21
(CL=20pF,
IOL=-1mA,
SCK falling time
tF
SCK0 to SCK21
SCK rising time
tR
SCK0 to SCK21
IOH=1mA)
Notes:
−
−
−
This table provides the alternate current standard for CLK synchronous mode.
CL is the load capability value connected to the pin at the test time.
The maximum baud rate is limited by the internal operating clock used and other parameters.
For details, see the hardware manual.
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tSCYC
VOH
SCK
VOL
tSHOVI
VO
VOL
SOT
tIVSLI
tSLIXI
VIH
VIL
SIN
VIH
VIL
Master mode
tSHSL
SCK
VIL
tR
SOT
VIH
tSLSH
VIH
tF
tSHOVE
VIL
VOH
VOL
tIVSLE
SIN
VIL
VIH
VIL
tSLIXE
VIH
VIL
Slave mode
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D a t a S h e e t ( P r e l i m i n a r y )
(5-1-3) SPI supported (SCR:SPI=1), and mark level "H" of serial clock output (SMR:SCINV=0)
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Serial clock
cycle time
SCK rising -> SOT
delay time
Valid SIN -> SCK falling
setup time
SCK falling -> Valid SIN
hold time
SOT -> SCK falling
delay time
Serial clock
Symbol
Pin Name
tSCYC
SCK0 to SCK21
tSHOVI
tIVSLI
tSLIXI
tSOVLI
Conditions
Master
SCK0 to SCK21,
mode
SOT0 to SOT21
(CL=50pF,
IOL=-2mA,
SCK0 to SCK21,
IOH=2mA),
SIN0 to SIN21
(CL=20pF,
IOL=-1mA,
SCK0 to SCK21,
IOH=1mA)
SOT0 to SOT21
tSHSL
"H" pulse width
Value
Unit
Min
Max
4tCLK_LCP0A
-
ns
-30
+30
ns
30
-
ns
0
-
ns
2tCLK_LCP0A -30
-
ns
tCLK_LCP0A +10
-
ns
2tCLK_LCP0A -10
-
ns
-
45
ns
10
-
ns
20
-
ns
-
5
ns
-
5
ns
Remarks
SCK0 to SCK21
Serial clock
tSLSH
"L" pulse width
SCK rising -> SOT
delay time
Valid SIN -> SCK falling
setup time
SCK falling -> Valid SIN
hold time
tSHOVE
tIVSLE
tSLIXE
Slave
SCK0 to SCK21,
mode
SOT0 to SOT21
(CL=50pF,
IOL=-2mA,
SCK0 to SCK21,
IOH=2mA),
SIN0 to SIN21
(CL=20pF,
IOL=-1mA,
SCK falling time
tF
SCK0 to SCK21
SCK rising time
tR
SCK0 to SCK21
IOH=1mA)
Notes:
−
−
−
This table provides the alternate current standard for CLK synchronous mode.
CL is the load capability value connected to the pin at the test time.
The maximum baud rate is limited by the internal operating clock used and other parameters.
For details, see the hardware manual.
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tSCYC
SCK
VOH
VOL
tSOVLI
VOL
tSHO
VOH
VOL
SOT
VOH
VOL
tIVSLI
VIH
VIL
SIN
tSLIXI
VIH
VIL
Master mode
tSHSL
tSLSH
VIH
SCK
SIN
VIL
tF
*
SOT
VIL
tR
VIH
VIH
tSHOV
VOH
VOL
VIL
VO
VOL
tIVSLE
VIH
VIL
tSLIXE
VIH
VIL
* Changes when writing to the TDR
Slave mode
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D a t a S h e e t ( P r e l i m i n a r y )
(5-1-4) SPI supported (SCR:SPI=1), and mark level "L" of serial clock output (SMR:SCINV=1)
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Serial clock
cycle time
SCK falling -> SOT
Symbol
Pin Name
tSCYC
SCK0 to SCK21
tSLOVI
delay time
Valid SIN -> SCK rising
tIVSHI
setup time
SCK rising -> Valid SIN
tSHIXI
hold time
SOT -> SCK rising
tSOVHI
delay time
Serial clock
tSHSL
"H" pulse width
Serial clock
tSLSH
"L" pulse width
SCK falling -> SOT
tSLOVE
delay time
Valid SIN -> SCK rising
tIVSHE
setup time
SCK rising -> Valid SIN
tSHIXE
hold time
SCK falling time
tF
SCK rising time
tR
Conditions
Master
SCK0 to SCK21,
mode
SOT0 to SOT21
(CL=50pF,
IOL=-2mA,
SCK0 to SCK21,
IOH=2mA),
SIN0 to SIN21
(CL=20pF,
IOL=-1mA,
SCK0 to SCK21,
IOH=1mA)
SOT0 to SOT21
SCK0 to SCK21,
SOT0 to SOT21
Slave
SCK0 to SCK21,
mode
SOT0 to SOT21
(CL=50pF,
IOL=-2mA,
SCK0 to SCK21,
IOH=2mA),
SSIN0 to SIN21
(CL=20pF,
IOL=-1mA,
IOH=1mA)
SCK0 to SCK21,
SCK0 to SCK21
Value
Unit
Min
Max
4tCLK_LCP0A
-
ns
-30
+30
ns
30
-
ns
0
-
ns
2tCLK_LCP0A -30
-
ns
tCLK_LCP0A +10
-
ns
2tCLK_LCP0A -10
-
ns
-
45
ns
10
-
ns
20
-
ns
-
5
ns
-
5
ns
Remarks
Notes:
−
−
−
This table provides the alternate current standard for CLK synchronous mode.
CL is the load capability value connected to the pin at the test time.
The maximum baud rate is limited by the internal operating clock used and other parameters.
For details, see the hardware manual.
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tSCYC
VOH
VOH
SCK
VOL
tSOVH
tSLOVI
VOH
VOL
SOT
VOH
VOL
tIVSHI
tSHIXI
VIH
VIL
SIN
VIH
VIL
Master mode
tSLSH
tSHSL
SCK
VIL
tR
*
SOT
VIH
tF
VOH
VOL
VIL
VIL
VIH
tSLO
VOH
VOL
tSHIXE
tIVSHE
SIN
VIH
VIH
VIL
VIH
VIL
* Changes when writing to the TDR
Slave mode
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D a t a S h e e t ( P r e l i m i n a r y )
(5-1-5) Serial chip select used (SCSCR:CSEN=1)
 Mark level "H" of serial clock output (SMR, SCSFR:SCINV=0)
 Inactive level "H" of serial chip select (SCSCR, SCSFR:CSLVL=1)
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
SCS falling -> SCK falling
setup time
Symbol
Pin Name
tCSSI
SCK0 to SCK21
SCS0x to
SCK rising -> SCS rising
SCS21x
tCSHI
hold time
Conditions
Master
mode
(CL=50pF,
IOL=-2mA,
Value
Unit
Min
Max
tCSSU*1-50
-
ns
tCSHD*2+0
-
ns
-
ns
3tCLK_LCP0A +30
-
ns
0
-
ns
3tCLK_LCP0A +30
-
ns
-
50
ns
0
-
ns
3tCLK_LCP0A +0
3tCLK_LCP0A +50
ns
Remarks
IOH=2mA),
SCS
tCSDI
deselect time
SCS0x to
(CL=20pF,
tCSDS*3-50
SCS21x
IOL=-1mA,
+5tCLK_LCP0A
IOH=1mA)
SCS falling -> SCK falling
setup time
tCSSE
SCK0 to SCK21
SCS0x to
SCK rising -> SCS rising
SCS21x
tCSHE
hold time
SCS
tCSDE
deselect time
SCS falling -> SOT
delay time
delay time
mode
(CL=50pF,
SCS0x to
IOL=-2mA,
SCS21x
IOH=2mA),
tDSE
SCS0x to
tDEE
SOT0 to SOT21
SCS21x
SCS rising -> SOT
Slave
(CL=20pF,
IOL=-1mA,
IOH=1mA)
Master
mode
round
SCK falling -> SCS falling
clock switching
SCK0 to SCK21
tSCC
SCS0x to
SCS21x
time
operation
(CL=50pF,
IOL=-2mA,
IOH=2mA),
(CL=20pF,
IOL=-1mA,
IOH=1mA)
*1: tCSSU=SCSTR:CSSU7 to 0 x serial chip select timing operating clock
*2: tCSHD=SCSTR:CSHD7 to 0 x serial chip select timing operating clock
*3: tCSDS=SCSTR:CSDS15 to 0 x serial chip select timing operating clock
For details on *1, *2, and *3 above, see the hardware manual.
Notes:
−
−
−
This table provides the alternate current standard for CLK synchronous mode.
CL is the load capability value connected to the pin at the test time.
The maximum baud rate is limited by the internal operating clock used and other parameters.
For details, see the hardware manual.
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D a t a S h e e t ( P r e l i m i n a r y )
SCS
VOH
VOL
tCSSI
SCK
VOL
tCSHI
VOH
tCSDI
VOH
VOL
SOT
(Normal
synchronous
transfer)
SOT
(SPI support)
Master mode
SCS input
VIH
VIL
tCSDE
tCSHE
VIL
tCSSE
SCK input
VIH t
DEE
VIL
SOT
(Normal
synchronous
transfer)
SOT
(SPI support)
VIH
VOL
tDSE
VOH
VOL
Slave mode
SCSx
tSCC
SCSy output
SCK output
VOL
VOL
Example of clock switching by a round operation in master mode
(x,y=0,1,2,3: The x and y values differ from each other.)
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D a t a S h e e t ( P r e l i m i n a r y )
(5-1-6) Serial chip select used (SCSCR:CSEN=1)
 Mark level "L" of serial clock output (SMR, SCSFR:SCINV=1)
 Inactive level "H" of serial chip select (SCSCR, SCSFR:CSLVL=1)
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Symbol
SCS falling -> SCK rising
tCSSI
setup time
SCK falling -> SCS rising
tCSHI
hold time
Pin Name
Conditions
Master
SCK0 to SCK21
mode
SCS0x to SCS21x
(CL=50pF,
IOL=-2mA,
Value
Unit
Min
Max
tCSSU*1-50
-
ns
tCSHD*2+0
-
ns
-
ns
3tCLK_LCP0A +30
-
ns
0
-
ns
3tCLK_LCP0A +30
-
ns
-
50
ns
0
-
ns
3tCLK_LCP0A +0
3tCLK_LCP0A +50
ns
Remarks
IOH=2mA),
SCS deselect time
tCSDI
SCK0 to SCK21
(CL=20pF,
tCSDS*3-50+5
SCS0x to SCS21x
IOL=-1mA,
tCLK_LCP0A
IOH=1mA)
SCS falling -> SCK rising
tCSSE
setup time
SCK falling -> SCS rising
tCSHE
hold time
SCS
tCSDE
deselect time
SCS falling -> SOT
tDSE
delay time
SCS rising -> SOT
tDEE
delay time
SCK0 to SCK21
Slave
SCS0x to SCS21x
mode
(CL=50pF,
SCS0x to SCS21x
IOL=-2mA,
IOH=2mA),
(CL=20pF,
SCS0x to SCS21x
IOL=-1mA,
SOT0 to SOT21
IOH=1mA)
Master
mode
round
operation
SCK rising -> SCS falling
clock switching
tSCC
time
SCK0 to SCK21
(CL=50pF,
SCS0x to SCS21x
IOL=-2mA,
IOH=2mA),
(CL=20pF,
IOL=-1mA,
IOH=1mA)
*1: tCSSU=SCSTR:CSSU7 to 0 x serial chip select timing operating clock
*2: tCSHD=SCSTR:CSHD7 to 0 x serial chip select timing operating clock
*3: tCSDS=SCSTR:CSDS15 to 0 x serial chip select timing operating clock
For details on *1, *2, and *3 above, see the hardware manual.
Notes:
−
−
−
This table provides the alternate current standard for CLK synchronous mode.
CL is the load capability value connected to the pin at the test time.
The maximum baud rate is limited by the internal operating clock used and other parameters.
For details, see the hardware manual.
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D a t a S h e e t ( P r e l i m i n a r y )
SCS output
VOH
VOL
tCSH
VOL
tCSSI
VOH
SCK output
VOH
tCSD
I
VOL
SOT
(Normal
synchronous
transfer)
SOT
(SPI support)
Master mode
SCS input
VIH
SCK input
SOT
(Normal
synchronous
transfer)
SOT
(SPI support)
VIH
VIL
tCSDE
tCSHE
VIL
tCSSE
VIL
VIH
tDEE
VOL
tDSE
VOH
VOL
Slave mode
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D a t a S h e e t ( P r e l i m i n a r y )
SCSx output
tSCC
SCSy output
SCK output
VOL
VOH
Example of clock switching by a round operation in master mode
(x,y=0,1,2,3: The x and y values differ from each other.)
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(5-1-7) Serial chip select used (SCSCR:CSEN=1)
 Mark level "H" of serial clock output (SMR, SCSFR:SCINV=0)
 Inactive level "L" of serial chip select (SCSCR, SCSFR:CSLVL=0
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Symbol
Pin Name
SCS rising -> SCK
tCSSI
setup time
rising
->
SCK0 to SCK21
SCS0x to
SCS
falling
tCSHI
SCS21x
hold time
tCSDI
deselect time
rising
Unit
Min
Max
tCSSU*1-50
-
ns
tCSHD*2+0
-
ns
-
ns
3tCLK_LCP0A +30
-
ns
0
-
ns
3tCLK_LCP0A +30
-
ns
-
50
ns
0
-
ns
3tCLK_LCP0A +0
3tCLK_LCP0A +50
ns
Remarks
mode
(CL=50pF,
IOL=-2mA,
IOH=2mA),
(CL=20pF,
SCS
SCS
Value
Master
falling
SCK
Conditions
->
falling
IOL=-1mA,
tCSDS*3-50+5
SCS21x
IOH=1mA)
tCLK_LCP0A
SCK
tCSSE
setup time
SCK0 to SCK21
SCS0x to
SCK rising -> SCS
falling
SCS0x to
tCSHE
SCS21x
hold time
SCS
deselect time
SCS rising -> SOT
delay time
SCS falling -> SOT
delay time
Slave
mode
(CL=50pF,
IOL=-2mA,
tCSDE
tDSE
SCS0x to
IOH=2mA),
SCS21x
(CL=20pF,
SCS0x to
SCS21x
tDEE
IOL=-1mA,
IOH=1mA)
SOT0 to SOT21
Master
mode
round
SCK falling -> SCS
rising
clock switching
time
SCK0 to SCK21
tSCC
SCS0x to
SCS21x
operation
(CL=50pF,
IOL=-2mA,
IOH=2mA),
(CL=20pF,
IOL=-1mA,
IOH=1mA)
*1: tCSSU=SCSTR:CSSU7 to 0 x serial chip select timing operating clock
*2: tCSHD=SCSTR:CSHD7 to 0 x serial chip select timing operating clock
*3: tCSDS=SCSTR:CSDS15 to 0 x serial chip select timing operating clock
For details on *1, *2, and *3 above, see the hardware manual.
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Notes:
−
−
−
This table provides the alternate current standard for CLK synchronous mode.
CL is the load capability value connected to the pin at the test time.
The maximum baud rate is limited by the internal operating clock used and other parameters.
For details, see the hardware manual
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D a t a S h e e t ( P r e l i m i n a r y )
(5-1-8) Serial chip select used (SCSCR:CSEN=1)
 Mark level "L" of serial clock output (SMR, SCSFR:SCINV=1)
 Inactive level "L" of serial chip select (SCSCR, SCSFR:CSLVL=0)
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
SCS rising -> SCK rising
setup time
SCK falling -> SCS falling
hold time
Symbol
Pin Name
tCSSI
SCK0 to SCK21
SCS0x to
tCSHI
SCS21x
Conditions
Master
mode
(CL=50pF,
IOL=-2mA,
Value
Unit
Min
Max
tCSSU*1-50
-
ns
tCSHD*2+0
-
ns
-
ns
3tCLK_LCP0A+30
-
ns
0
-
ns
3tCLK_LCP0A+30
-
ns
-
50
ns
0
-
ns
3tCLK_LCP0A+0
3tCLK_LCP0A+50
ns
Remarks
IOH=2mA),
SCS
tCSDI
deselect time
SCS0x to
(CL=20pF,
tCSDS*3-50+5
SCS21x
IOL=-1mA,
tCLK_LCP0A
IOH=1mA)
SCS rising -> SCK rising
setup time
SCK falling -> SCS falling
hold time
SCS
tCSSE
SCS0x to
tCSHE
tCSDE
deselect time
SCS rising -> SOT
delay time
SCK0 to SCK21
SCS21x
delay time
mode
(CL=50pF,
SCS0x to
IOL=-2mA,
SCS21x
IOH=2mA),
tDSE
SCS0x to
tDEE
SOT0 to SOT21
SCS21x
SCS falling -> SOT
Slave
(CL=20pF,
IOL=-1mA,
IOH=1mA)
Master
mode
round
SCK0 to SCK21
SCK rising -> SCS rising
clock switching
time
tSCC
SCS0x to
SCS21x
operation
(CL=50pF,
IOL=-2mA,
IOH=2mA),
(CL=20pF,
IOL=-1mA,
IOH=1mA)
*1: tCSSU=SCSTR:CSSU7 to 0 x serial chip select timing operating clock
*2: tCSHD=SCSTR:CSHD7 to 0 x serial chip select timing operating clock
*3: tCSDS=SCSTR:CSDS15 to 0 x serial chip select timing operating clock
For details on *1, *2, and *3 above, see the hardware manual.
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Notes:
−
−
−
CL is the load capability value connected to the pin at the test time.
This table provides the alternate current standard for CLK synchronous mode.
The maximum baud rate is limited by the internal operating clock used and other parameters.
For details, see the hardware manual.
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SCS output
tCSDI
VOH
VOH
VOH
SCK output
VOL
tCSHI
tCSSI
VOL
SOT
(Normal synchronous transfer)
SOT
(SPI support)
Master mode
tCSDE
SCS input
VIH
VIH
SCK input
VIL
SOT
(Normal
synchronous
transfer)
SOT
(SPI support)
VIL
tCSHE
tCSSE
tDEE
VOL
tDSE
VOH
VOL
Slave mode
tSCC
SCSx
VOH
SCSy output
SCK output
VOH
Example of clock switching by a round operation in master mode
(x,y=0,1,2,3: The x and y values differ from each other.)
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12.4.5.2
UART (asynchronous serial interface) timing
(SMR:MD2-0=0b000, 0b001)
(5-2-1) External clock selected (BGR:EXT=1)
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Symbol
Serial clock
Pin Name
tSLSH
"L" pulse width
Serial clock
(CL=50pF,
IOL=-2mA,
tSHSL
"H" pulse width
SCK falling time
tF
SCK rising time
tR
SCK0 to
VIL
IOH=2mA),
Value
Ma
tCLK_LCP0A +10
-
ns
tCLK_LCP0A +10
-
ns
-
5
ns
-
5
ns
IOL=-1mA,
IOH=1mA)
tF
tSHSL
VIH
VIH
Unit
Min
(CL=20pF,
SCK21
tR
SCK
Conditions
Remarks
tSLSH
VIL
VIL
VIH
External clock selected
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12.4.5.3 LIN interface (v2.1) (LIN communication control interface (v2.1))
timing (SMR:MD2-0=0b011)
(5-3-1) External clock selected (BGR:EXT=1)
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Serial clock
"L" pulse width
Serial clock
"H" pulse width
Symbol
Pin Name
Conditions
tSLSH
tSHSL
SCK falling time
tF
SCK rising time
tR
(CL=50pF,
IOL=-2mA,
IOH=2mA),
SCK0 to
(CL=20pF,
SCK21
IOL=-1mA,
IOH=1mA)
tR
SCK
VIL
VIH
Unit
Min
Max
tCLK_LCP0A+10
-
ns
tCLK_LCP0A+10
-
ns
-
5
ns
-
5
ns
tF
tSHSL
VIH
Value
VIL
Remarks
tSLSH
VIL
VIH
External clock selected
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12.5 Timer input timing
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Symbol
Input pulse width
tTWH
tTWL
Pin Name
Conditions
IN0 to IN11
-
TEXT0 to 5
-
TIOA0 to TIOA29
−
Min
4tCLK_LCP0A
100
4tCLK_LCP0A
100
4tCLK_LCP0A
-
TIOB0 to TIOB7
Value
100
Max
Unit
-
ns
-
ns
-
ns
Remarks
4tCLK_LCP0A ≥100 ns
4tCLK_LCP0A <100 ns
4tCLK_LCP0A ≥100 ns
4tCLK_LCP0A <100 ns
4tCLK_LCP0A ≥100 ns
4tCLK_LCP0A <100 ns
Timer input timing
INx
TEXTx
TIOAx,TIOBx
tTIWH
VIH
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tTIWL
VIH
VIL
VIL
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12.6 Trigger input timing
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Input pulse width
Symbol
tTRGH,
tTRGL
Pin Name
Conditions
INT0 to INT15
RX0 to RX1
INT0 to INT15
RX0 to RX1
−
Value
Unit
Min
Max
-
100
-
ns
-
5tCLK_LLPBM2
-
ns
-
1
-
µs
Remarks
Stop mode
Trigger input timing
tTRGH
INTx
RXx
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VIH
tTRGL
VIH
VIL
VIL
S6J311E_DS708-00002-0v01-E, June 25, 2014
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12.7 NMI input timing
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Input pulse width
−
Symbol
tNMIL
Pin Name
Conditions
NMIX
-
Value
Min
Max
300
-
Unit
Remarks
ns
NMIX input timing
tNMIL
NMIX
VIH
VIH
VIL
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12.8 Low-voltage detection (external low-voltage detection)
(TA: Recommended operating conditions, VSS=AVSS=0.0 V)
Parameter
Supply voltage range
Symbol
Pin Name
Conditions
VDP5
VCC
-
Value
Min
Typ
Max
3.5
-
5.25
Unit
Remarks
V
When
power-supply
Detection voltage
VDL
VCC
*1
4.0
4.2
4.4
V
voltage falls
and detection
level is set
initially
When
Hysteresis width
VHYS
VCC
-
-
100
-
mV
power-supply
voltage rises
Low-voltage detection
time
Power supply voltage
regulation
Td
-
-
-
-
30
μs
-
VCC
-
-2
-
2
V/ms
*2
*1: If the fluctuation of the power supply is faster than the low-voltage detection time, there is a possibility
to generate or release after the power supply voltage has exceeded the detection voltage range.
*2: Please suppress the change of the power supply within the range of the power-supply voltage
regulation to do a low-voltage detection by detecting voltage (VDL)
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12.9 Low-voltage detection (internal low-voltage detection)
(TA: Recommended operating conditions, VSS=AVSS=0.0 V)
Parameter
Supply voltage range
Symbol
Pin Name
Conditions
VRDP5
-
VRDL
-
Value
Unit
Min
Typ
Max
-
0.6
-
1.4
V
*1
0.9
0.95
1.0
V
Remarks
When
Detection voltage
power-supply
voltage falls
When
Hysteresis width
VRHYS
-
-
-
75
-
mV
power-supply
voltage rises
Low-voltage detection
time
Supply voltage range
TRd
-
-
-
-
30
μs
VRDP5
-
-
0.6
-
1.4
V
*1: If the power fluctuation time is less than the low-voltage detection time (TRd) and has passed the
detection voltage range, the detection may occur or be canceled after the supply voltage has passed
the detection voltage range.
12.10 Low-voltage detection (1.2 V power supply low-voltage detection)
(TA: Recommended operating conditions, VSS=AVSS=0.0 V)
Parameter
Supply voltage range
Symbol
Pin Name
Conditions
VRDP5
-
-
Value
Min
Typ
Max
0.6
-
1.4
Unit
Remarks
V
When
Detection voltage
VRDL
-
*1
0.92
0.97
1.02
V
power-supply
voltage falls
When
Hysteresis width
VRHYS
-
-
-
75
-
mV
power-supply
voltage rises
Low-voltage detection
time
TRd
-
-
-
-
30
μs
*1: If the power fluctuation time is less than the low-voltage detection time (TRd) and has passed the
detection voltage range, the detection may occur or be canceled after the supply voltage has passed
the detection voltage range.
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12.11 A/D converter
12.11.1 Electrical characteristics
(TA: Recommended operating conditions, Vcc=5.0 V +5%/-10%, VSS=AVSS=0.0 V)
Parameter
Symbol
Pin Name
Resolution
-
Total Error
Conditions
Value
Unit
Min
Typ
Max
-
-
-
12
bit
-
-
-
-
±12
LSB
*3
Integral Non linearity
-
-
-
-
±4.0
LSB
*4
Differential Non linearity
-
-
-
-
±1.9
LSB
*4
VZT
AN0 to AN63
Zero transition voltage
AVRL
-11.5LSB
AVRH
-
+12.5LSB
AVRH
V
*5
Full-scale transition voltage
VFST
AN0 to AN63
Sampling time
tSMP
-
0.3
-
12
µs
*1
Compare time
tCMP
-
0.7
-
28
µs
*1
A/D conversion time
tCNV
-
1.0
-
40
µs
*1
Analog port input current
IAIN
AN0 to AN63
-1.0
-
1.0
µA
Analog input voltage
VAIN
AN0 to AN63
AVSS
-
AVRH
V
AVRH
AVRH0,AVRH1
4.5
-
5.25
V
-
0.0
-
V
-
500
900
µA
per one unit
-
1.0
100
µA
*2
-
1
2
mA
per one unit
-
-
5.0
µA
*2
AN0 to AN31
-
-
4
LSB
AN32 to AN63
-
-
4
LSB
Reference voltage
AVRL
IA
Power supply current
IAH
IR
IRH
Variation between channels
-
AVRL0/AVSS0,
AVRL1/AVSS1
AVCC
AVRH
-13.5LSB
-
AVRL
+10.5LSB
V
VAVSS≤
VAIN≤VAVCC
AVcc≥AVRH
*1: Time per channel
*2: Definition of the power supply current (when Vcc=AVcc=5.0 V) while the A/D converter is not
operating and in stop mode
*3: Total Error is a comprehensive static error that includes the linearity. 1LSB=(AVRH-AVRL)/4096
*4: 1LSB=(VFST-VZT)/4094
*5: 1LSB=(AVRH-AVRL)/4096
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12.11.2 Notes on A/D converters
About the output impedance of an external circuit for analog input
When the external impedance is too high, the analog voltage sampling time may become insufficient. In
this case, we recommend attaching a capacitor (about 0.1 µF) to an analog input pin.
Analog input circuit model
Comparator
R
C
Analog input
Sampling ON
R
12-bit A/D
3.9 kiloohms (max)
C
11.0 pF (max)
(4.5 V≤Avcc≤5.25 V)
Note: Use the numerical values provided here simply as a guide.
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12.11.3 Glossary
Resolution: Analog change that can be identified by an A/D converter
Integral linearity error: Deviation of the straight line connecting the zero transition point ("0000 0000
0000" <--> "0000 0000 0001") and full-scale transition point ("1111 1111 1110" <--> "1111 1111 1111") from
actual conversion characteristics
includes zero transition error, full-scale transition error, and non-linearity error.
Differential linearity error: Deviation from the ideal value of the input voltage required for changing the
output code by 1 LSB
Total error : Difference between the actual value and the theoretical value. The total error
Total error
FFF
FFE
Actual conversion
characteristics
1.5LSB
{1 LSB (N - 1) + 0.5LSB}
Digital output
FFD
V NT
(Actually-measured
value)
004
003
Actual conversion
characteristics
002
001
AVRL
(AVSS)
Ideal characteristics
0.5LSB
Analog input
AVRH
Total error of digital output N =
1LSB(Ideal value) =
VNT- {1 LSB × (N-1) + 0.5LSB}
1LSB
AVRH - AVRL
4096
[LSB]
[V]
N: A/D converter digital output value.
VZT(Ideal value) = AVRL + 0.5LSB[V]
VFST(Ideal value) = AVRH - 1.5LSB[V]
VNT: Voltage at which the digital output changes from "(N – 1)" to "N".
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Integral linearity error
Differential linearity error
Ideal characteristics
FFE
Actual conversion
characteristics
FFD
{1 LSB (N - 1) + VZT}
004
003
002
N+1
V FST
Digital output
Digital output
FFF
V NT
(measured value)
Actual conversion
characteristics
Ideal characteristics
Actual conversion
characteristics
N
N-1
V (N+1)T
(measured
V NT
value)
(measured value)
Actual conversion
characteristics
N-2
001
VZT (measured value)
AVSS
(AVRL)
Analog input
AVSS
(AVRL)
AVRH
Integral linearity error of digital output N =
Differential linearity error of digital output N =
1LSB =
Analog input
VNT- {1 LSB × (N-1) + VZT}
1LSB
V(N+1) T- VNT
1LSB
VFST - VZT
4094
AVRH
[LSB]
-1 LSB [LSB]
[V]
VZT: Voltage for which digital output changes from "0x000" to "0x001"
VFST: Voltage for which digital output changes from "0xFFE" to "0xFFF".
June 25, 2014, S6J311E_DS708-00002-0v01-E
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12.12 Flash memory
Rating
Parameter
Unit
Min
Typ *3
Max
-
540
TBD
ms
-
610
TBD
ms
Sector erase time
Remarks
8-KB sector*1
Internal preprogramming time excluded
8-KB sector*1
Internal preprogramming time included
64-KB sector*1
-
540
TBD
ms
-
1100
TBD
ms
8-bit write time
-
15
TBD
µs
System-level overhead time excluded*1
16-bit write time
-
20
TBD
µs
System-level overhead time excluded*1
32-bit write time
-
30
TBD
µs
System-level overhead time excluded*1
64-bit write time
-
50
TBD
µs
System-level overhead time excluded*1
ECC write time
-
5
TBD
µs
System-level overhead time excluded*1
1,000/20 years,
Erase count*2/
10,000/10 years,
Data retention time
Internal preprogramming time excluded
64-KB sector*1
Internal preprogramming time included
Temperature at write/erase time
-
-
100,000/5 years
-
Average temperature TA=+85 degrees
Celsius
*1: Guaranteed value for up to 100,000 erases
*2: Number of erases for each sector
*3: Target value
Note:
−
Turning off an external power supply (VCC) during writing or erasing of Flash memory is prohibited.
For an application that may lose VCC during a write operation, use an external low-voltage detector
and simultaneous input reset of the MD and RSTX pins so that power-off is safe. Specifically, take
the following action.
1. After simultaneous input from the MD and RSTX pins while VCC is within the recommended
operating range, power off VCC in observance of the standard regarding the supply voltage
fluctuation rate of the external low-voltage detector.
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13. ORDERING INFORMATION
Part Number
Package
S6J311xJAASEy0000
Plastic, LEP176
S6J311xJAAEEy0000
Plastic, LEP176
Note:
−
"x"/”y” is an part number option. For the part number option, see the following table.
For details on each package, see "PACKAGE DIMENSIONS."
14. PART NUMBER OPTION
Part Number Option “x”
FLASH
E
4MByte
Part Number Option “y”
1
Sn-Bi & Halogen Free
2
PureSn & Halogen Free
June 25, 2014, S6J311E_DS708-00002-0v01-E
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15. PACKAGE DIMENSIONS
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16. MAJOR CHANGES IN THIS EDITION
Page
Section
Change Results
Revision 0.1
-
-
June 25, 2014, S6J311E_DS708-00002-0v01-E
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Initial release
91
D a t a S h e e t ( P r e l i m i n a r y )
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury,
severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control,
mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where
chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such
failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating conditions. If any products described in this document
represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law
of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the
respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion
product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without
notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy,
completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other
warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of
the information in this document.
Copyright © 2014 Spansion
TM
ORNAND
®
®
®
TM
All rights reserved. Spansion , the Spansion logo, MirrorBit , MirrorBit Eclipse ,
and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and
other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.
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