Data Sheet

Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPXHZ6116A
Rev. 2.1, 06/2015
MPXHZ6116A, 20 to 115 kPa,
Absolute, Integrated Pressure Sensor
MPXHZ6116A
The MPXHZ6116A series pressure sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The sensor’s packaging has been designed to
provide resistance to high humidity conditions as well as common automotive
media. The small form factor and high reliability of on-chip integration make this
sensor a logical and economical choice for the system designer.
Super small outline package
The MPXHZ6116A series pressure sensor is a state-of-the-art, monolithic, signal
conditioned sensor designed for a wide range of applications, but particularly
those employing a microcontroller or microprocessor with A/D inputs. This
piezoresistive transducer combines advanced micromachining techniques, thinfilm metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
MPXHZ6116A6U/6T1
Case 98ARH99066A
Features
Top view
•
Resistant to high humidity and common automotive media
•
1.5% maximum error over 0 °C to 85 °C
•
Temperature compensated from -40 °C to +125 °C
•
Durable thermoplastic (PPS) surface mount package (SSOP)
•
Ideally suited for microprocessor or microcontroller-based systems
DNC
5
4
VOUT
DNC
6
3
GND
DNC
7
2
VS
DNC
8
1
DNC
Pin 1 identification,
chamfered corner
Pinout
Ordering information
# of Ports
Part number
Shipping
Pressure type
Absolute
Device
marking
Package
None
Single
Dual
Gauge
Differential
Small Outline Package (MPXHZ6116A series)
MPXHZ6116A6U
MPXHZ6116A6T1
Rail
98ARH99066A
•
•
MPHZ6116A
Tape and Reel
98ARH99066A
•
•
MPHZ6116A
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© 2009. 2010, 2015 Freescale Semiconductor, Inc. All rights reserved.
Contents
1
2
3
4
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Minimum recommended footprint for super small packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Related Documentation
The MPXHZ6116A device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1.
Go to the Freescale homepage at:
http://www.freescale.com/
2.
3.
In the Keyword search box at the top of the page, enter the device number MPXHZ6116A.
In the Refine Your Result pane on the left, click on the Documentation link.
MPXHZ6116A
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General Description
1.1
Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
Gain Stage #2
and
Ground
Reference
Shift Circuitry
VOUT
Pins 1, 5, 6, 7, and 8 are internal device connections.
Do
. not connect to external circuitry or ground.
GND
Figure 1. Fully integrated pressure sensor schematic
1.2
Pinout
DNC
5
4
VOUT
DNC
6
3
GND
DNC
7
2
VS
DNC
8
1
DNC
Pin 1 identification, chamfered corner
Figure 2. Device pinout (top view)
Table 1. Pin functions
Pin
Name
1
DNC
Function
Do not connect to external circuitry or ground. Pin 1 is denoted by chamfered corner.
2
VS
3
GND
4
VOUT
Output voltage
5
DNC
Do not connect to external circuitry or ground.
6
DNC
Do not connect to external circuitry or ground.
7
DNC
Do not connect to external circuitry or ground.
8
DNC
Do not connect to external circuitry or ground.
Voltage supply
Ground
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2
Mechanical and Electrical Specifications
2.1
Maximum ratings
Table 2. Maximum ratings(1)
Rating
Symbol
Value
Units
Maximum pressure
Pmax
400
kPa
Storage temperature
Tstg
-40 to +125
°C
Operating temperature
TA
-40 to +125
°C
Output source current @ full-scale output(2)
Io +
+0.5
mAdc
Output sink current @ minimum pressure offset(2)
Io -
-0.5
mAdc
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit.
2.2
Operating characteristics
Table 3. Operating characteristics (VS = 5.0 Vdc, TA = 25 °C unless otherwise noted, decoupling circuit shown in Figure 4
required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
20
—
115
kPa
Supply voltage(1)
VS
4.75
5.0
5.25
Vdc
Supply current
IS
—
6.0
10
mAdc
Pressure range
Full-scale span(2)
(0 °C to 85 °C)
VFSS
—
4.2
—
Vdc
Offset(3)
(0 °C to 85 °C)
Voff
0.335
0.399
0.463
Vdc
V/P
—
44.2
—
mV/kPa
—
-1.5
—
+1.5
%VFSS
POP
20
—
115
kPa
Sensitivity
Accuracy(4)
(0 °C to 85 °C)
Pressure range
1.Device is ratiometric within this specified excitation range.
2.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3.Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4.Accuracy (error budget) is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent
of VSS span at 25 °C due to all sources of error including the following:
Linearity:
Temperature Hysteresis:
Pressure Hysteresis:
Offset Stability:
TcSpan:
TcOffset:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25 °C.
Output deviation, after 1000 temperature cycles, -40 °C to 125 °C, and 1.5 million pressure cycles, with minimum
rated pressure applied.
Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C.
Output deviation with minimum pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C.
MPXHZ6116A
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On-chip Temperature Compensation and Calibration
The performance over temperature is achieved by integrating the shear–stress strain gauge, temperature compensation,
calibration, and signal conditioning circuitry onto a single monolithic chip.
Figure 3 illustrates the configuration in the basic chip carrier (case 98ARH99066A) prior to porting. A gel die coat isolates the die
surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The
gel die coat and durable thermoplastic package provide a media resistant barrier that allows the sensor to operate reliably in high
humidity conditions as well as common automotive media.
NOTE
The MPXHZ6116A pressure sensor operating characteristics, internal reliability and
qualification tests are based on use of air as the pressure media. Media, other than air, may
have adverse effects on sensor performance and long–term reliability. Contact the factory
for information regarding media compatibility in your application.
Figure 4 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or
microcontroller. Proper decoupling of the power supply is recommended.
Die
Fluorosilicone
Gel Die Coat
Stainless
Steel Cap
P1
Thermoplastic Case
Wire Bond
Lead Frame
Absolute Element
Sealed Vacuum Reference
Die Bond
Figure 3. Cross-sectional diagram SSOP (not to scale)
+5 V
VS
MPXHZ6116A
to ADC
VOUT
100 nF
GND
47 pF
51 K
Figure 4. Recommended power supply decoupling and output filtering
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5.0
VOUT = VS (0.008938 x P (kPa) - 0.09895)
4.5
± (1.5 x TM x V x 0.008938)
S
3.0
2.5
2.0
NOM
1.5
MIN
1.0
120
140
80
40
20
0
0
60
MAX
0.5
100
OUTPUT (V)
4.0 TEMP = 0 °C to 85 °C
VS = 5.0 V ± 0.25
3.5
100
120
PRESSURE (kPa)
Temperature Error Factor (TM)
Figure 5. Output vs. absolute pressure
4.0
Break Points
3.0
2.0
Temp
Multiplier
- 40
0 to 85
125
2.85
0.96
1.66
1.0
0.0
-40
-20
0
20
40
60
80
Temperature in Cº
140
NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC
Figure 6. Temperature error band
Error Limits for Pressure
3.0
Pressure Error (kPa)
2.0
1.0
0.0
Pressure (in kPa)
20
40
60
80
100
120
-1.0
Pressure
20 to 115 (kPa)
-2.0
Error (Max)
±1.5 (kPa)
-3.0
Figure 7. Pressure error band
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Package Information
4.1
Minimum recommended footprint for super small packages
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry,
the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder
mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.050
1.27
TYP
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 8. SSOP footprint
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4.2
Package dimensions
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf.
Case 98ARH99066A, 8-lead super small outline package
MPXHZ6116A
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Case 98ARH99066A, 8-lead super small outline package
MPXHZ6116A
Sensors
Freescale Semiconductor, Inc.
9
Case 98ARH99066A, 8-lead super small outline package
MPXHZ6116A
10
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Freescale Semiconductor, Inc.
5
Revision History
Table 4. Revision history
Revision
number
Revision
date
2.1
05/2015
Description
• Updated format.
• Corrected accuracy bullet on page 1, was 1.43% to 1.52%. Corrected device marking column on page 1.
• Updated package drawing with current version.
MPXHZ6116A
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© 2009. 2010, 2015 Freescale Semiconductor, Inc.
Document Number: MPXHZ6116A
Rev. 2.1
06/2015
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