B132 I0011 V1 7600 EU EC P lo

RF & Protection Devices
Selection Guide
www.infineon.com/rfandprotectiondevices
2
Content
RF MMIC LNAs
4
RF Pin Diode
10
LTE LNAs
4
Band Switching and RF Attenuation
10
GNSS LNAs
5
Antenna Switch
11
General Purpose LNAs
5
RF Varactor Diode
13
RF Modules
5
VCO and Low Voltage Tuner
13
Navigation Rx Front-End
5
FM Tuner
13
SAT Tuner
13
UHF and VHF Tuner
13
RF Mixer + Detector Schottky Diode
14
RF mmW-MMIC
15
RF Switches
6
Antenna Switch Module
6
Diversity Switches
6
General Purpose Switches
6
Antenna Tuning
6
24GHz Industrial
15
Antenna Aperture Tuning RF Switches
6
Backhaul
15
RF Transistors
7
ESD & EMI Protection and Filters
16
Low Noise Si Transistors up to 2.5GHz
7
Multi-Purpose ESD Devices
16
Low Noise Si Transistors up to 5GHz
7
Low Capacitance ESD Devices
18
Ultra Low Noise SiGe:C Transistors for use
up to 12GHz
7
Surge Protection Devices
18
High Linearity Si- and SiGe:C-Transistors for use
up to 6GHz
8
Alphanumerical List of the Symbols used
20
Biased Low Noise RF Transistor
8
Package Information
22
RF MOSFET
9
Single Full Biased
9
Single Non Biased
9
Single Semi Biased
9
Dual Semi Biased
9
3
RF MMIC LNAs
LTE LNAs
Product Type
f
[MHz]
Gain (typ)
[dB]
F (typ)
P1dB (in)
[dBm]
BGA622L7
2100
16.00
1.10
-16
5.8
–
TSLP-7-1
BGA711N7
2100
17.00
1.10
-8
3.6
–
TSNP-7-1
BGA713N7
700
15.50
1.10
-7
4.8
–
TSNP-7-1
BGA728L7
170–1675
15.75
1.30
-10
0.5
5.8
TSLP-7-1
BGA734L16
800
1900
2100
15.20
16.50
1.20
1.00
1.10
-12
-10
-11
3.5
3.4
–
–
TSLP-16-1
BGA735N16
900/1900/2100
16.00
1.10
-5
3.4
–
TSNP-16-1
BGA748L16
2140
1960
940
880
17.40
16.50
16.20
1.10
1.20
-10
-8
-7
-6
4.4
4.0
3.8
–
–
–
TSLP-16-1
BGA751N7
800
15.80
1.05
-5
3.3
–
TSNP-7-1
BGA777N7
2300–2700
15.70
1.20
-10
4.2
–
TSNP-7-1
BGA7H1N6
2300–2690
12.50
–
-1
4.7
–
TSNP-6-2
BGA 7L1N6
728–960
13.30
–
-2
4.4
–
TSNP-6-2
BGA7M1N6
1805–2200
13.00
–
0
4.4
–
TSNP-6-2
BGM7MLLM4L12
700–2100
13.00
0.70
0
4.5
–
TSLP-12-4
BGM7LLHM4L12
700–2700
13.00
0.70
0
4.5
–
TSLP-12-4
BGM7LMHM4L12
700–2700
13.00
0.70
0
4.5
–
TSLP-12-4
www.infineon.com/rfmmics
4
I (typ)
[mA]
Package
GNSS LNAs
Product Type
Gain (typ)
[dB]
F (typ)
[dB]
P1dB (in)
[dBm]
I (typ)
[mA]
f
[MHz]
Package
BGA231L7
16.0
0.75
-5.0
4.4
1550–1615
TSLP-7-1
BGA231N7
16.0
0.75
-5.0
4.4
1550–1615
TSNP-7-1
BGA524N6
19.6
0.55
-12.0
2.5
–
TSNP-6-2
BGA715N7
20.0
0.75
-15.5
3.3
1550–1615
TSNP-7-1
BGA725L6
20.0
0.65
-16.0
3.6
1550–1615
TSLP-6-2
BGA824N6
17.0
0.55
-6.0
3.9
–
TSNP-6-2
BGA825L6S
17.0
0.60
-7.0
4.8
1550–1615
TSLP-6-3
BGA915N7
15.5
0.70
-5.0
4.4
1550–1615
TSNP-7-6
BGA924N6
16.2
0.55
-5.0
4.9
–
TSNP-6-2
BGA925L6
15.8
0.65
-5.0
4.9
1550–1615
TSLP-6-2
General Purpose LNAs
Product Type
Gain (typ)
[dB]
F (typ)
[dB]
P1dB (out)
[dBm]
I (typ)
[mA]
f
[MHz]
Package
BGA728L7
15.75
1.3
–
0.5
BGB707L7ESD
–
0.4
10
2.1
5.8
170–1675
TSLP-7-1
25.0
50–10000
BGB717L7ESD
12.00
1.0
4
TSLP-7-1
3.0
–
50–1000
BGB741L7ESD
19.00
1.0
TSLP-7-1
10
5.5
30.0
30–5000
BGB719N7ESD
13.50
1.2
TSLP-7-1
6
2.8
–
10–1000
TSNP-7-6
Application notes, Data sheets, Simulation data: www.infineon.com/rfmmic.documents
RF Modules
Navigation Rx Front-End
Product Type
I (typ)
[mA]
Gain (typ)
[dB]
NFmin (typ)
[dB]
P1dB (in)
[dBm]
f
[MHz]
VCC (typ)
[V]
Package
BGM1143N9
3.9
15.5
1.45
-6
1550–1615
BGM1032N7
4.0
14.8
1.65
-6
1570–1615
1.5
3.3
TSNP-9-1
2.7
–
BGM1033N7
4.0
14.8
1.65
-6
TSNP-7-10
1570–1615
2.7
–
BGM1034N7
3.9
17.0
1.70
TSNP-7-10
-15
1570–1615
1.8
–
BGM1043N7
3.9
17.0
1.50
TSNP-7-10
-6
1570–1615
–
–
TSNP-7-10
Product information: www.infineon.com/rfmodule
www.infineon.com/rfmodule
5
RF Switches
Antenna Switch Module
Product Type
Switch Type
Control Interface
f
[GHz]
Pmax
[dBm]
Insertion Loss @ 1GHz
[dB]
Isolation @ 1GHz
[dB]
Supply Voltage
[V]
Package
BGSF110GN26
SP10T
GPIO
0.1–3.8
36
0.5
37
2.4–3.3
TSNP-26-2
BGSF1717MN26
DP14T
MIPI RFFE
0.1–2.7
36
0.5
47
2.4–5.5
TSNP-26-3
Diversity Switches
Product Type
Switch Type
Control Interface
f
[GHz]
Pmax
[dBm]
Insertion Loss @ 1GHz
[dB]
Isolation @ 1GHz
[dB]
Supply Voltage
[V]
Package
BGS14AN16
SP4T
GPIO
0.1–3.0
30
0.34
40
2.85–4.7
TSNP-16-6
BGS15AN16
SP5T
GPIO
0.1–3.0
32
0.34
35
2.85–4.7
TSNP-16-6
BGS16MN14
SP6T
MIPI RFFE
0.1–2.7
32
0.30
–
2.50–5.5
TSNP-14-3
BGS18MN14
SP8T
MIPI RFFE
0.1–2.7
32
0.35
–
2.50–5.5
TSNP-14-3
General Purpose Switches
Product Type
Switch Type
Control Interface
f
[GHz]
Pmax
[dBm]
Insertion Loss @ 1GHz
[dB]
Isolation @ 1GHz
[dB]
Supply Voltage
[V]
Package
BGS12AL7-4
SPDT
GPIO
0.1–3
24.0
0.40
32
2.4–3.6
TSLP-7-4
BGS12AL7-6
SPDT
GPIO
0.1–3
24.0
0.40
32
2.4–3.6
TSLP-7-6
BGS12PL6
SPDT
GPIO
0.1–4
35.0
0.40
37
2.4–3.6
TSLP-6-4
BGS12SL6
SPDT
GPIO
0.1–6
27.5
0.25
36
2.4–3.6
TSLP-6-4
BGS12SN6
SPDT
GPIO
0.1–6
30.0
0.25
40
1.8–3.3
TSNP-6-2
BGS13SL9
SP3T
GPIO
0.1–3
30.0
0.35
37
2.4–3.6
TSLP-9-3
BGS22WL10
DPDT
GPIO
0.1–3
30.0
0.33
38
2.4–3.6
TSLP-10-1
BGS22W2L10
DPDT
GPIO
0.1–3
30.0
0.33
35
2.4–3.6
TSLP-10-1
Application notes, Data sheets, Simulation data: www.infineon.com/rfswitches.documents
Antenna Tuning
Antenna Aperture Tuning RF Switches
Product Type
VRF (max) 1000h
[V]
VRF (max)
[V]
ESD @ ANT
kV
RON
[Ω]
COFF
[fF]
RON x COFF
[fs]
H2 @ 25dBm
[dBc]
H3 @ 25dBm
[dBc]
Package
BGSA12GN10
40
36
8
1.6
120
< 200
-105
-115
TSNP-10-1
BGSA13GN10
40
36
8
0.8 = RF1
1.3 = RF2
1.6 = RF2
240 = RF1
145 = RF2
120 = RF3
< 200
-105
-115
TSNP-10-1
BGSA14GN10
40
36
8
1.6
120
< 200
-105
-115
TSNP-10-1
Product information: www.infineon.com/rfswitches
www.infineon.com/rfswitches
6
RF Transistors
Low Noise Si Transistors up to 2.5GHz
Product Type
VCEO (max)
[V]
IC (max)
[mA]
NFmin (typ)
[dB]
Gmax (typ)
[dB]
OIP3
[dBm]
OP1dB
[dBm]
f T (typ)
[GHz]
Ptot (max)
[mW]
Package
For Low Frequencies e.g. VHF/UHF
BFP181
12
20
0.9
21.0
16.5
-2.0
8.0
175
SOT143
BFR181
12
20
0.9
18.5
18.0
-1.0
8.0
175
SOT23
BFR181W
12
20
0.9
19.0
18.0
-1.0
8.0
175
SOT323
BFP182R
12
35
0.9
22.0
24.0
5.0
8.0
250
SOT143
BFP182W
12
35
0.9
22.0
24.0
5.0
8.0
250
SOT343
BFR182
12
35
0.9
18.0
24.5
5.0
8.0
250
SOT23
BFR182W
12
35
0.9
19.0
25.0
5.0
8.0
250
SOT323
BFP183W
12
65
0.9
22.0
26.5
8.5
8.0
450
SOT343
BFR183
12
65
0.9
17.5
27.0
9.0
8.0
450
SOT23
BFR183W1)
12
65
0.9
18.5
27.0
9.0
8.0
450
SOT323
BFR35AP1)
15
45
1.4
16.0
24.0
9.0
5.0
280
SOT23
BFR92P
15
45
1.4
16.0
24.0
9.0
5.0
280
SOT23
BFR92W1)
15
45
1.4
17.0
24.0
9.0
5.0
280
SOT323
BFS17P
15
25
3.5
–
21.5
10.0
1.4
280
SOT23
BFS17S
15
25
3.0
12.7
22.5
11.0
1.4
280
SOT363
BFS17W
15
25
3.5
12.7
22.5
11.0
1.4
280
SOT323
BFS481
12
20
0.9
20.0
18.0
-1.0
8.0
175
SOT363
BFS4831)
12
65
0.9
19.0
26.5
9.0
8.0
450
SOT363
TSFP-3-1
High Gain up to 2.5GHz, Flatlead TSFP Package Respectively TSLP Package for Modules
BFR340F
6
10
1.15
16.5
13.0
-1.0
14.0
60
BFR340L3
6
10
1.15
17.5
12.5
-1.0
14.0
60
TSLP-3-7
BFR360F
6
35
1.00
15.5
24.0
9.0
14.0
210
TSFP-3-1
BFR360L3
6
35
1.00
16.0
24.0
9.0
14.0
210
TSLP-3-1
1) Not for new design
Low Noise Si Transistors up to 5GHz
Product Type
VCEO (max)
[V]
IC (max)
[mA]
NFmin (typ)
[dB]
Gmax (typ)
[dB]
OIP3
[dBm]
OP1dB
[dBm]
f T (typ)
[GHz]
Ptot (max)
[mW]
Package
BFP405
4.5
12
1.25
23.0
15.0
5.0
25
55
SOT343
BFP405F
4.5
12
1.25
22.5
14.0
0.0
25
55
TSFP-4-1
BFP410
4.5
40
1.20
21.5
23.5
10.5
25
150
SOT343
BFP420
4.5
35
1.10
21.0
22.0
12.0
25
160
SOT343
BFP420F
4.5
35
1.10
19.5
24.0
10.5
25
160
TSFP-4-1
BFP460
4.5
50
1.10
17.5
27.5
11.5
22
200
SOT343
BFP520
2.5
40
0.95
23.5
25.0
12.0
45
100
SOT343
BFP520F
2.5
40
0.95
22.5
23.5
10.5
45
100
TSFP-4-1
BFP540
4.5
80
0.90
21.5
24.5
11.0
30
250
SOT343
BFP540ESD
4.5
80
0.90
21.5
24.5
11.0
30
250
SOT343
BFP540FESD
4.5
80
0.90
20.0
24.5
11.0
30
250
TSFP-4-1
50
1.10
16.0
27.0
11.5
22
200
TSLP-3-1
For Modules in TSLP Package
BFR460L3
4.5
Ultra Low Noise SiGe:C Transistors for use up to 12GHz
Product Type
VCEO (max)
[V]
IC (max)
[mA]
NFmin (typ)
[dB]
Gmax (typ)
[dB]
OIP3
[dBm]
Package
Robust Low Noise Broadband Pre-Matched SiGe:C Transistors
BFP843F
2.25
55
0.90
23.5
23.5
TSFP-4-1
BFR843EL3
2.25
55
0.95
24.0
21.0
TSLP-3-9
www.infineon.com/rftransistors
7
RF Transistors
Ultra Low Noise SiGe:C Transistors for use up to 12GHz
Product Type
VCEO (max)
IC (max)
[V]
[mA]
Robust Ultra Low Noise SiGe:C Transistors
BFP640ESD
4.10
50
BFP640FESD
4.10
50
BFP720ESD
4.20
25
4.20
25
BFP720FESD1)
BFP740ESD
4.20
35
BFP740FESD
4.20
35
BFP840ESD
2.25
35
BFP840FESD
2.25
35
BFP842ESD
3.25
40
BFR840L3RHESD 2.25
35
Ultra Low Noise SiGe:C Transistors
BFP620
2.30
80
BFP620F
2.30
80
BFP640
4.00
50
BFP640F
4.00
50
BFP720
4.00
20
BFP720F
4.00
20
BFP740
4.00
45
BFP740F
4.00
45
4.00
20
BFR720L3RH1)
BFR740L3RH
4.00
30
NFmin (typ)
[dB]
Gmax (typ)
[dB]
OIP3
[dBm]
OP1dB
[dBm]
f T (typ)
[GHz]
Ptot (max)
[mW]
Package
0.65
0.55
0.60
0.60
0.60
0.60
0.60
0.55
0.40
0.50
25.0
26.5
27.0
27.0
27.0
27.0
27.0
27.5
23.5
26.5
27.0
26.0
22.0
22.0
25.0
24.5
21.0
21.0
24.5
17.0
12.0
11.5
6.5
7.0
10.0
10.0
4.5
4.5
8.0
4.0
46
46
45
45
47
47
80
85
57
75
200
200
100
100
160
160
75
75
120
75
SOT343
TSFP-4-1
SOT343
TSFP-4-1
SOT343
TSFP-4-1
SOT343
TSFP-4-1
SOT343
TSLP-3-9
0.70
0.70
0.65
0.65
0.50
0.50
0.50
0.50
0.50
0.50
21.5
21.0
24.0
23.0
26.0
26.0
27.0
27.5
24.0
24.5
25.5
25.0
26.5
27.5
20.5
20.5
25.0
25.0
20.5
25.0
14.5
14.0
13.0
13.5
6.0
6.0
11.0
11.0
6.0
11.0
65
65
40
40
45
45
42
42
45
42
185
185
200
200
80
80
160
160
80
160
SOT343
TSFP-4-1
SOT343
TSFP-4-1
SOT343
TSFP-4-1
SOT343
TSFP-4-1
TSLP-3-9
TSLP-3-9
1) Not for new design
High Linearity Si- and SiGe:C-Transistors for use up to 6GHz
Product Type
VCEO (max)
IC (max)
[V]
[mA]
For Low Frequencies, e.g. VHF/UHF
NFmin (typ)
[dB]
Gmax (typ)
[dB]
OIP3
[dBm]
OP1dB
[dBm]
f T (typ)
[GHz]
Ptot (max)
[mW]
Package
BF799
20.0
35
BF799W
20.0
35
BFQ19S
15.0
210
BFR93A
12.0
90
BFR93AW
12.0
90
BFR106
15.0
210
BFP193
12.0
80
BFP193W
12.0
80
BFR193
12.0
80
BFR193F
12.0
80
BFR193W
12.0
80
BFR193L3
12.0
80
BFP196(R)
12.0
150
BFP196W
12.0
150
Si Transistors with High Gain up to 2.5GHz
BFR380F
6.0
80
BFR380L3
6.0
80
BFP450
4.5
100
SiGe:C Transistors with High Gain up to 6GHz
BFP650
4.0
150
BFP650F
4.0
150
4.0
90
BFP7501)
4.0
90
BFR750L3RH1)
BFP760
4.0
70
3.00
3.00
1.80
1.50
1.50
1.80
1.00
1.00
1.00
1.00
1.30
1.00
1.30
1.30
–
–
11.5
14.5
15.5
13.0
18.0
20.5
15.0
19.0
16.0
19.0
16.5
19.0
–
–
32.0
30.0
30.0
32.0
29.5
29.5
30.0
29.0
30.0
29.0
32.0
32.0
–
–
22.0
15.0
15.0
22.0
15.0
15.0
15.0
14.8
15.0
15.0
19.0
19.0
0.8
0.8
5.5
6.0
6.0
5.0
8.0
8.0
8.0
8.0
8.0
8.0
7.5
7.5
280
280
1000
300
300
700
580
580
580
580
580
580
700
700
SOT23
SOT323
SOT89
SOT23
SOT323
SOT23
SOT143
SOT343
SOT23
TSFP-3-1
SOT323
TSLP-3-1
SOT143
SOT343
1.10
1.10
1.25
13.5
13.5
15.5
29.0
29.5
29.0
17.0
16.0
19.0
14.0
14.0
24.0
380
380
450
TSFP-3-1
TSLP-3-1
SOT343
0.80
0.80
0.90
0.60
0.50
21.5
21.5
22.5
21.0
25.0
29.5
31.0
30.0
29.5
31.5
18.0
17.5
16.0
16.5
14.5
37.0
42.0
41.0
37.0
45.0
500
500
360
360
240
SOT343
TSFP-4-1
SOT343
TSLP-3-9
SOT343
1) Not for new design
Biased Low Noise RF Transistor
Product Type
VCEO (max)
[V]
IC (max)
[mA]
NFmin (typ)
[dB]
Gmax (typ)
[dB]
OIP3
[dBm]
OP1dB
[dBm]
f T (typ)
[GHz]
Ptot (max)
[mW]
Package
BGR405
BGR420
4.5
4.5
12
25
1.6
1.7
7.0
15.5
14.5
23.0
-0.5
7.4
25
25
50
120
SOT343
SOT343
Application notes, Data sheets, Simulation data: www.infineon.com/rftransistors.documents
8
RF MOSFET
Single Full Biased
Product Type
ID (max)
[mA]
Ptot (max)
[mW]
gfs (typ)
[ms]
Gp (typ)
[dB]
F (typ)
[dB]
Cg1ss (typ)
[pF]
Cdss (typ)
[pF]
Package
BF1005SR
25
200
30
22
1.6
2.4
1.3
SOT143
BF1005R
25
200
24
19
1.6
2.1
1.3
SOT143
Single Non Biased
Product Type
ID (max)
[mA]
Ptot (max)
[mW]
gfs (typ)
[ms]
Gp (typ)
[dB]
F (typ)
[dB]
Cg1ss (typ)
[pF]
Cdss (typ)
[pF]
Package
BF998
30
200
24
20
1.8
2.1
1.1
SOT143
Single Semi Biased
Product Type
ID (max)
[mA]
Ptot (max)
[mW]
gfs (typ)
[mS]
Gp (typ)
[dB]
F (typ)
[dB]
Cg1ss (typ)
[pF]
Cdss (typ)
[pF]
Package
BF2030R
40
200
31
23
1.5
2.4
1.3
SOT143
BF2040
40
200
42
23
1.6
2.9
1.6
SOT143
BF2040W
40
200
42
23
1.6
2.9
1.6
SOT343
BF5020
25
200
34
26
1.2
2.4
1.0
SOT143
BF5020R
25
200
34
26
1.2
2.4
1.0
SOT143
BF5030
25
200
41
24
1.3
2.7
1.6
SOT143
BF5030R
25
200
41
24
1.3
2.7
1.6
SOT143
Ptot (max)
[mW]
gfs (typ)
[mS]
Gp (typ)
[dB]
F (typ)
[dB]
Cg1ss (typ)
[pF]
Cdss (typ)
[pF]
Package
Dual Semi Biased
Product Type
ID (max)
[mA]
BG3130
25
200
33
24
1.3
1.9
1.1
SOT363
BG3130R
25
200
33
24
1.3
1.9
1.1
SOT363
Application notes, Data sheets, Simulation data: www.infineon.com/rfmosfet.documents
www.infineon.com/rfmosfet
9
RF Pin Diode
Band Switching and RF Attenuation
Product Type
IF (max)
[mA]
CT (max)
[pF]
trr (typ)
[ns]
Configuration
Mounting
Package
BA592
100
1.4
0.36
120
Single
SMT
SOD323
BA595
50
0.6
4.50
1600
Single
SMT
SOD323
BA885
50
0.6
4.50
1600
Single
SMT
SOT23
BA892-02V
100
1.4
0.36
120
Single
SMT
SC79
BA895-02V
50
0.6
4.50
1600
Single
SMT
SC79
BAT18-04
100
1.0
0.40
120
Dual
SMT
SOT23
BAT18-051)
100
1.0
0.40
120
Dual
SMT
SOT23
BAR14-1
140
0.5
7.00
1000
Dual
SMT
SOT23
BAR15-1
140
0.5
7.00
1000
Dual
SMT
SOT23
BAR16-11)
140
0.5
7.00
1000
Dual
SMT
SOT23
BAR611)
140
0.5
7.00
1000
Single
SMT
SOT143
1) Not for new design
www.infineon.com/pindiodes
10
rF (typ)
[Ω]
Antenna Switch
Product Type
IF (max)
[mA]
CT (max)
[pF]
rF (typ)
[Ω]
trr (typ)
[ns]
Configuration
Mounting
Package
BAR50-02L1)
100
0.50
3.00
1100
Single
SMT
TSLP-2-1
BAR50-02V
100
0.50
3.00
1100
Single
SMT
SC79
BAR50-03W1)
100
0.50
3.00
1100
single
–
SOD323
BAR63-02L1)
100
0.30
1.00
75
Single
SMT
TSLP-2-1
BAR63-02V
100
0.30
1.00
75
Single
SMT
SC79
BAR63-03W
100
0.30
1.00
75
Single
SMT
SOD323
BAR63-04
100
0.30
1.00
75
Dual
SMT
SOT23
BAR63-04W
100
0.30
1.00
75
Dual
SMT
SOT323
BAR63-05
100
0.30
1.00
75
Dual
SMT
SOT23
BAR63-05W
100
0.30
1.00
75
Dual
SMT
SOT323
BAR63-06
100
0.30
1.00
75
Dual
SMT
SOT23
BAR63-06W
100
0.30
1.00
75
Dual
SMT
SOT323
BAR64-02EL
100
0.35
2.10
1550
Single
SMT
TSLP-2-19
BAR64-02V
100
0.35
2.10
1550
Single
SMT
SC79
BAR64-04W
100
0.35
2.10
1550
Dual
SMT
SOT323
BAR64-05W
100
0.35
2.10
1550
Dual
SMT
SOT323
BAR64-03W
100
0.35
2.10
1550
Single
SMT
SOD323
BAR64-04
100
0.35
2.10
1550
Dual
SMT
SOT23
BAR64-05
100
0.35
2.10
1550
Dual
SMT
SOT23
BAR64-06
100
0.35
2.10
1550
Dual
SMT
SOT23
BAR64-06W
100
0.35
2.10
1550
Dual
SMT
SOT323
BAR65-02V
100
0.90
0.56
80
Single
SMT
SC79
BAR65-03W
100
0.90
0.56
80
Single
SMT
SOD323
BAR67-02V
200
0.55
1.00
700
Single
SMT
SC79
BAR67-04
200
0.90
1.50
700
Dual
–
SOT23
BAR81W
100
1.00
0.70
80
Single
SMT
SOT343
2)
BAR86-02EL
100
0.15
3.70
3
Single
SMT
TSLP-2
BAR86-02ELS
100
0.152)
3.702)
32)
Single
SMT
TSSLP-2
BAR88-02LRH1)
100
0.40
0.60
500
Single
SMT
TSLP-2-7, -17, -21
BAR88-02V
100
0.40
0.60
500
Single
SMT
SC79
BAR89-02LRH1)
100
0.35
0.80
800
Single
SMT
TSLP-2-7, -17, -21
BAR90-02EL
100
0.35
0.80
750
Single
SMT
TSLP-2-19
BAR90-02ELS
100
0.35
0.80
750
Single
SMT
TSSLP-2-3, -4
BAR90-098LRH3)
100
0.35
0.80
750
Dual
SMT
TSLP-4-7
2)
2)
1) Not for new design
2) Typical value
3) On request
Application notes, Data sheets, Simulation data: www.infineon.com/pindiodes.documents
11
12
RF Varactor Diode
VCO and Low Voltage Tuner
Product Type
Configuration
IF (max)
[mA]
CT1 (typ)
[pF]
CT2 (typ)
[pF]
CT/CT
rS (typ)
[Ω]
Mounting
Package
BBY51-03W
Single
20
5.40
4.20
1.75 (1/4V)
0.37
SMT
SOD323
BBY52-02L1)
Single
20
1.85
1.50
1.60 (1/4V)
0.90
SMT
TSLP-2-1
BBY53-02L1)
Single
20
5.30
2.40
2.20 (1/3V)
0.47
SMT
TSLP-2-1
BBY53-02V
Single
20
5.30
2.40
2.20 (1/3V)
0.47
SMT
SC79
BBY53-03LRH
Single
20
5.30
2.40
2.20 (1/3V)
0.47
SMT
TSLP-3-7
BBY53-03W
Single
20
5.30
2.40
2.20 (1/3V)
0.47
SMT
SOD323
BBY53-05W
Dual
20
5.30
2.40
2.20 (1/3V)
0.47
SMT
SOT323
BBY55-02V
Single
20
18.60
15.00
2.50 (2/10V)
0.15
SMT
SC79
BBY55-03W
Single
20
18.60
15.00
2.50 (2/10V)
0.15
SMT
SOD323
BBY56-03W1)
Single
20
5.30
2.40
2.20 (1/3V)
0.47
–
SOD323
BBY57-02V
Single
20
17.50
8.00
2.45 (1/3V)
0.30
SMT
SC79
BBY57-05W
Dual
20
17.50
10.00
2.45 (1/3V)
0.30
SMT
SOT323
BBY58-02V
Single
20
18.30
12.35
2.15 (1/3V)
0.25
SMT
SC79
BBY58-03W
Single
20
18.30
12.35
2.15 (1/3V)
0.25
SMT
SOD323
BBY58-05W
Dual
20
18.30
12.35
2.15 (1/3V)
0.25
SMT
SOT323
BBY58-06W
Dual
20
18.30
12.35
2.15 (1/3V)
0.25
SMT
SOT323
BBY65-02V
Single
50
20.25
9.80
4.55 (1/3V)
0.60
SMT
SC79
BBY66-02V
Single
50
68.70
35.40
5.41 (1/4.5V)
0.25
–
SC79
BBY66-05W
Dual
50
68.70
35.40
5.41 (1/4.5V)
0.25
SMT
SOT323
Product Type
Configuration
IF (max)
[mA]
CT1 (typ)
[pF]
CT2 (typ)
[pF]
CT/CT
rS (typ)
[Ω]
Mounting
Package
BB804
Dual
50
47.50
27.9
1.71 (2/8V)
0.18
SMT
SOT23
BB814
Dual
50
44.75
20.8
2.15 (2/8V)
0.18
SMT
SOT23
BB844
Single
50
43.75
11.7
3.80 (2/8V)
0.28
SMT
SOT23
BB914
Dual
50
43.75
18.7
2.34 (2/8V)
0.28
SMT
SOT23
1) Not for new design
FM Tuner
SAT Tuner
Product Type
Configuration
IF (max)
[mA]
CT1 (typ)
[pF]
CT/CT
rS (typ)
[Ω]
Mounting
Package
BB833
Single
20
9.3
12.4 (1/28V)
1.8
SMT
SOD323
BB837
Single
20
6.6
12.7 (1/28V)
1.5
SMT
SOD323
BB857-02V
Single
20
6.6
12.7 (1/28V)
1.5
SMT
SC79
UHF and VHF Tuner
Product Type
Configuration
IF (max)
[mA]
CT1 (typ)
[pF]
CT2 (typ)
[pF]
CT/CT
rS (typ)
[Ω]
Mounting
Package
BB439
Single
20
43.0
34.50
6.9 (2/25V)
0.35
SMT
SOD323
BB545
Single
20
20.0
14.80
7.2 (2/25V)
0.60
SMT
SOD323
BB640
Single
20
69.0
54.50
16.6 (2/25V)
1.15
SMT
SOD323
Application notes, Data sheets, Simulation data: www.infineon.com/varactordiodes.documents
www.infineon.com/varactordiodes
13
RF Mixer + Detector Schottky Diode
Product Type
VR (max)
[V]
IF (max)
[mA]
CT (typ)
[pF]
VF (typ)
[V]
Configuration
RO @ VR = 0V
[kΩ]
Package
BAT15-02EL
4
110
0.26
0.230
Single
–
TSLP-2
BAT15-02ELS
4
110
0.26
0.230
Single
–
TSSLP-2
BAT15-03W
4
110
0.26
0.230
Single
–
SOD323
BAT15-04R
4
110
0.26
0.230
Single
–
SOT23
BAT15-04W
4
110
0.26
0.230
Dual
–
SOT323
BAT15-05W
4
110
0.26
0.230
Dual
–
SOT323
BAT15-099
4
110
0.26
0.230
Single
–
SOT143
BAT17
4
130
0.55
0.340
Single
–
SOT23
BAT17-04
4
130
0.55
0.340
Dual
–
SOT23
BAT17-04W
4
130
0.55
0.340
Dual
–
SOT323
BAT17-05
4
130
0.55
0.340
Dual
–
SOT23
BAT17-05W
4
130
0.55
0.340
Dual
–
SOT323
BAT17-06W
4
130
0.55
0.340
Dual
–
SOT323
BAT17-07
4
130
0.75
0.340
Dual
–
SOT143
BAT24-02ELS
4
110
0.21
0.230
Single
–
TSSLP-2-1
RF Mixer
RF Signal Detection + Power Leveling
BAT62
40
20
0.35
0.580
Dual
225
SOT143
BAT62-02LS
40
20
0.35
0.580
Single
225
TSSLP-2-1
BAT62-02V
40
20
0.35
0.580
Single
225
SC79
BAT62-03W
40
20
0.35
0.580
Single
225
SOD323
BAT62-07W
40
20
0.35
0.580
Dual
225
SOT343
BAT63-02V
3
100
0.65
0.190
Single
30
SC79
BAT63-07W
3
100
0.65
0.190
Dual
30
SOT343
BAT68
8
130
0.75
0.318
Single
–
SOT23
BAT68-04
8
130
0.75
0.318
Dual
–
SOT23
BAT68-04W
8
130
0.75
0.318
Dual
–
SOT323
BAT68-06
8
130
0.75
0.318
Dual
–
SOT23
BAT68-06W
8
130
0.75
0.318
Dual
–
SOT323
Application notes, Data sheets, Simulation data: www.infineon.com/schottkydiodes.documents
www.infineon.com/schottkydiodes
14
RF mmW-MMIC
24GHz Industrial
Product Type
f
[GHz]
ICC (typ)
[mA]
PTX (typ)
[dBm]
Gain (typ)
[dB]
NFmin (typ)
[dB]
Compression Point
P1dB (typ)
Frequency Divider
Temperatur Sensor
Package
BGT24MR2
24–24.25
90
–
26
12
-12
no
yes
VQFN-32-9
BGT24MTR11
24–26.00
150
11
26
12
-12
yes
yes
VQFN-32-9
BGT24MTR12
24–24.25
210
11
26
12
-12
yes
yes
VQFN-32-9
Backhaul
Product Type
f
[GHz]
Psat (typ)
[dBm]
Rx Gain (typ) NFDSB (typ)
[dB]
[dB]
ICCRx/Tx
PN @ 100kHz (typ)
[dBc/Hz]
Power Detector
Temperatur
Sensor
Package
BGT60
57–64
14
22
7
350/480mA @ 3.3V
-81
Integrated
Integrated
WFWLB-119-1
BGT70
71–76
14
20
8
350/480mA @3.3V
-80
Integrated
Integrated
WFWLB-119-1
BGT80
81–86
10
20
9
350/480mA @ 3.3V
-80
Integrated
Integrated
WFWLB-119-1
Application notes, Data sheets, Simulation data: www.infineon.com/mmWave.documents
www.infineon.com/mmWave
15
ESD & EMI Protection and Filters
Multi-Purpose ESD Devices
Product Type
Applications
VRWM
CL (typ,max)
ESD200-B1-CSP0201
keypad, touchscreen, buttons, convenience keys, audio
-5.5
5.5
6.5
–
-16
16
ESD201-B2-03LRH
keypad, touchscreen, buttons, Audio
-5.5
5.5
5.0
7.0
-20
20
ESD202-B1-CSP01005
keypad, touchscreen, buttons, Audio
-5.5
5.5
5.5
7.0
-12
12
ESD203-B1-02ELS
Audio Line, Speaker, Headset, Microphone Protection,
Human Interface Devices
-12.0
12.0
6.0
–
-30
30
ESD203-B1-02EL
Audio Line, Speaker, Headset, Microphone Protection,
Human Interface Devices
-12.0
12.0
6.0
–
-30
30
ESD204-B1-02ELS
keypad, touchscreen, buttons, convenience keys
-8.0
14.0
4.0
7.0
-15
15
ESD204-B1-02EL
keypad, touchscreen, buttons, convenience keys
-8.0
14.0
4.0
7.0
-15
15
ESD205-B1-02ELS
keypad, touchpad, buttons, convenience keys
-5.5
5.5
4.0
7.0
-20
20
ESD205-B1-02EL
keypad, touchpad, buttons, convenience keys
-5.5
5.5
4.0
7.0
-20
20
ESD206-B1-02ELS
Audio Line, Speaker, Headset, Microphone Protection,
Human Interface Devices
-5.5
5.5
13.0
–
-30
30
ESD206-B1-02EL
Audio Line, Speaker, Headset, Microphone Protection,
Human Interface Devices
-5.5
5.5
13.0
–
-30
30
ESD206-B1-02V
Aaudio line, speaker, microphone, human interfaces
-5.5
5.5
13.0
–
-30
30
ESD207-B1-02ELS
keypad, touchpad, buttons, convenience keys
-3.3
3.3
14.0
20.0
-30
30
ESD207-B1-02EL
keypad, touchpad, buttons, convenience keys
-3.3
3.3
14.0
20.0
-30
30
ESD208-B1-02ELS
keypad, touchpad, buttons, convenience keys
-3.3
3.3
6.0
9.0
-25
25
ESD208-B1-02EL
keypad, touchpad, buttons, convenience keys
-3.0
3.0
6.0
9.0
-25
25
ESD217-U1-02EL
keypad, touchpad, buttons, convenience keys
-8.0
14.0
8.5
13.0
-25
25
ESD218-B1-02ELS
keypad, touchpad, buttons, convenience keys, USB Vbus
-24.0
24.0
2.5
3.5
-18
18
ESD218-B1-02EL
keypad, touchpad, buttons, convenience keys, USB Vbus
-24.0
24.0
2.5
3.5
-18
18
ESD221-U1-02EL
keypad, touchpad, buttons, convenience keys
5.3
–
35.0
40.0
25
–
ESD5V0L1B-02V
keypad, touchscreen, buttons, Power Lines
-5.0
5.0
8.5
13.0
25
–
ESD5V0S1U-02V
keypad, touchscreen, buttons, Power Lines
5.0
–
35.0
40.0
20
–
ESD24VS2U
keypad, touchscreen, buttons, 24V Appls.
24.0
–
48.0
52.0
30
–
[pF]
[V]
Application notes, Data sheets, Simulation data: www.infineon.com/esd.documents
www.infineon.com/esdprotection
16
VESDmax
[kV]
RDYN,typ reverse
RDYN,typ forward
Vcl typ. forward
TLP 16A
[V]
Vcl typ. reverse
TLP 30A
[V]
Vcl typ. forward
TLP 30A
[V]
IR (max)
[Ω]
Vcl typ. reverse
TLP 16A
[V]
[Ω]
0.2
IEFT
Isurge
[nA]
[A]
[A]
0.2
13.0
13.0
–
–
100
–
0.37
0.22
12.1
10.2
–
–
100
0.20
0.20
13.0
13.0
17.0
17.0
100
0.29
0.29
17.0
18.0
23.0
23.5
0.29
0.29
17.0
18.0
23.0
0.6
0.5
28.0
28.0
0.6
0.5
28.0
28.0
0.22
0.37
10.2
0.22
0.37
0.15
0.15
0.15
Protected
Lines
Package
3.0
1
WLL-2-1
40
2.5
2
TSLP-3-9
–
3.0
1
WLL-2-2
50
50
5.0
1
TSSLP-2-4
23.5
50
50
5.0
1
TSLP-2-20
35.0
35.0
50
40
1.0
1
TSSLP-2-3
35.0
35.0
50
40
1.0
1
TSLP-2-19
12.1
13.2
17.2
100
40
2.5
1
TSSLP-2-3
10.3
12.2
13.3
17.3
100
40
2.5
1
TSLP-2-19
9.0
9.0
11.0
11.0
100
50
6.0
1
TSSLP-2-3
0.15
9.0
9.0
11.0
11.0
100
50
6.0
1
TSLP-2-19
0.15
0.15
9.0
9.0
11.0
11.0
100
50
6.0
1
SC79
0.13
0.13
7.0
7.0
9.0
9.0
50
40
8.0
1
TSSLP-2-3
0.13
0.13
7.0
7.0
9.0
9.0
50
40
8.0
1
TSLP-2-19
0.2
0.2
8.0
8.0
11.0
11.0
50
80
4.0
1
TSSLP-2-3
0.2
0.2
8.0
8.0
11.0
11.0
50
80
4.0
1
TSLP-2-19
0.3
0.2
28.0
26.0
30.0
27.0
50
40
2.5
1
TSLP-2-19
1.0
1.0
55.0
55.0
–
–
50
40
1.0
1
TSSLP-2-4
1.0
1.0
55.0
55.0
–
–
50
40
1.0
1
TSLP-2-20
0.27
0.27
7.0
1.2
9.0
2.5
100
50
5.5
1
TSLP-2-20
0.4
0.2
22.0
25.0
26.0
27.0
50
40
2.5
1
SC79
0.2
0.3
10.5
4.3
14.5
7.3
100
50
5.5
1
SC79
0.22
0.11
37.0
2.6
40.0
4.2
10µA
80
5.0
2
SOT23
17
ESD & EMI Protection and Filters
Low Capacitance ESD Devices
Product Type
Applications
VRWM
CL (typ,max)
VESDmax
ESD101-B1-02ELS
Super high-speed interfaces, RF antennas
-5.5
5.5
0.1
0.2
-10
10
ESD101-B1-02EL
RF antenna, Super high-speed interfaces such as USB 3.0, HDMI 1.4a, MHL
-5.5
5.5
0.1
0.2
-12
12
ESD102-U1-02ELS
USB 3.0, 10/100/1000 Ethernet, Firewire, DVI, HDMI, S-ATA, DisplayPort
3.3
–
0.4
0.65
-20
20
ESD102-U2-099EL
USB 3.0, 10/100/1000 Ethernet, firewire, DVI, HDMI, S-ATA, display port
3.3
–
0.4
0.65
-20
20
ESD102-U4-05L
Protection of high-speed digital interfaces
3.3
–
0.4
0.65
-20
20
ESD103-B1-02ELS
Super high-speed interfaces, RF antenna
-15.0
15.0
0.1
0.2
-10
10
ESD103-B1-02EL
RF antenna, Super high-speed interfaces such as USB 3.0, HDMI 1.4a, MHL
-15.0
15.0
0.09
0.2
-10
10
ESD105-B1-02ELS
RF antenna, Super high-speed interfaces such as USB 3.0, HDMI 1.4a, MHL
-5.5
5.5
0.3
0.45
-25
25
ESD105-B1-02EL
RF antenna, Super high-speed interfaces such as USB 3.0, HDMI 1.4a, MHL
-5.5
5.5
0.3
0.45
-25
25
ESD108-B1-CSP0201
RF antenna, small signal, NFC
-5.5
5.5
0.28
0.38
-25
25
ESD110-B1-02ELS
RF antenna, small signal, NFC
-18.5
18.5
0.3
0.6
-15
15
ESD110-B1-02EL
RF antenna, small signal, NFC
-18.5
18.5
0.3
0.6
-15
15
ESD112-B1-02ELS
RF antenna, small signal, NFC
-5.3
5.3
0.23
0.4
-20
20
ESD112-B1-02EL
RF antenna, small signal, NFC
-5.3
5.3
0.23
0.4
-20
20
ESD113-B1-02ELS
HDMI, USB 2.0, USB 3.0, DisplayPort, DVI
-3.6
3.6
0.22
–
-20
20
ESD113-B1-02ELS
HDMI, USB 2.0, USB 3.0, DisplayPort, DVI
-3.6
3.6
0.22
–
-20
20
ESD114-U1-02ELS
RF antenna, Super high-speed interfaces such as USB 3.0, HDMI 1.4a, MHL
5.3
–
0.4
0.6
20
–
ESD114-U1-02EL
RF antenna, Super high-speed interfaces such as USB 3.0, HDMI 1.4a, MHL
5.3
–
0.4
0.6
20
–
ESD3V3U4ULC
USB3.0
3.3
–
0.4
0.65
20
–
ESD5V3U2U-03F
USB2.0, HDMI, DisplayPort
5.3
–
0.4
0.6
20
–
ESD5V3U4U-HDMI
USB2.0, HDMI, DisplayPort
5.3
–
0.4
0.6
20
–
ESD5V3U4RRS
USB2.0
5.3
–
0.4
0.6
15
–
ESD5V5U5ULC
USB2.0 x 2 (4 I/O + Vcc)
5.5
–
0.45
1.0
25
–
ESD0P8RFL
RF antenna, small signal, NFC
-50.0
50.0
0.8
–
20
–
[pF]
[V]
[kV]
Surge Protection Devices
Product Type
Applications
VRWM
CL (typ,max)
ESD300-B1-02LRH
Keypad, touchscreen, buttons, power lines
-3.3
3.3
1.2
–
-30
30
ESD307-U1-02N
VBUS
10.0
–
270.0
350
-30
30
ESD311-U1-02N
VBUS
15.0
–
–
–
-30
30
DSL70
DSL
50.0
–
2.5
5
-15
15
TVS3V3L4U
Gigabit Ethernet
3.3
–
2.0
3
-30
30
[pF]
[V]
Application notes, Data sheets, Simulation data: www.infineon.com/esd.documents
18
VESDmax
[kV]
RDYN,typ reverse
RDYN,typ forward
Vcl typ. forward
TLP 16A
[V]
Vcl typ. reverse
TLP 30A
[V]
Vcl typ. forward
TLP 30A
[V]
IR (max)
[Ω]
Vcl typ. reverse
TLP 16A
[V]
[Ω]
1.3
IEFT
Isurge
Protected
Lines
Package
[nA]
[A]
[A]
1.3
29
29
–
–
50
–
–
1.5
1.5
30
30
–
–
50
1
TSSLP-2-3
–
–
1
0.19
0.23
8
6
11
9
TSLP-2-20
50
50
3
1
TSSLP-2-3
0.19
0.23
8
6
11
0.19
0.23
8
6
11
9
50
50
3
2
TSLP-4-10
9
50
50
3
4
1.8
1.8
48
48
TSLP-5-2
–
–
50
–
–
1
1.8
1.8
48
TSSLP-2-4
48
–
–
50
–
–
1
0.38
0.38
TSLP-2-20
13
13
19
19
50
50
5
1
0.38
TSSLP-2-4
0.38
13
13
19
19
50
50
5
1
TSLP-2-20
0.75
0.75
20
20
30
30
100
40
2.5
1
WLL-2-1
0.6
0.6
26
26
35
35
30
–
2
1
TSSLP-2-4
0.6
0.6
26
26
35
35
30
–
2
1
TSLP-2-20
1.0
1.0
29
29
38
38
50
40
3
1
TSSLP-2-4
1.0
1.0
29
29
38
38
50
40
3
1
TSLP-2-20
0.45
0.45
14
12
20
18
50
50
3
1
TSSLP-2-4
0.45
0.45
14
12
20
18
50
50
3
1
TSLP-2-20
0.6
0.5
19
10
28
17
50
50
3
1
TSSLP-2-3
0.6
0.5
19
10
28
17
50
50
3
1
TSLP-2-19
0.19
0.23
8
6
11
9
50
50
3
4
TSLP-9-1
0.6
0.5
19
10
28
17
50
40
3
2
TSFP-3-1
0.6
0.5
19
10
28
17
50
50
3
4
TSLP-9-1
0.62
0.44
20
12
28
17
100
50
3
5
SOT363
0.2
0.3
8.9
5.4
11.5
9.2
100
50
6
5
SC74
–
–
–
–
–
–
100
40
10
1
TSLP-4-7
RDYN,typ reverse
RDYN,typ forward
Vcl typ. reverse
TLP 30A
[V]
Vcl typ. forward
TLP 30A
[V]
IEFT
Isurge
[nA]
[A]
[A]
Protected
Lines
Package
[Ω]
Vcl typ. forward
TLP 16A
[V]
IR (max)
[Ω]
Vcl typ. reverse
TLP 16A
[V]
0.23
0.23
9.5
9.5
12.5
12.5
100
–
18
1
TSLP-2-21
0.05
–
17.0
–
18.0
–
100
80
34
1
TSNP-2-2
0.07
–
22.0
–
23.0
–
100
80
28
1
TSNP-2-2
0.1
–
2.6 + Vcc
–
4.0 + Vcc
–
5
80
27
2
SOT143
0.09
0.12
5.8
3.1
7.3
4.4
50
80
20
4
SC74
19
Alphanumerical List of the Symbols used
20
Symbols
Terms
Symbols
Terms
ANT
Antenna
OIP3
Output 3rd-order intercept point
Cdss
Output capacitance
OP1dB
Output -1dB compression
Cg1ss
Gate-1 input capacitance
P1dB
Power output at -1dB compression point
CL
Line capacitance
Pmax
Maximum power
COFF
Off capacitance
Psat
Saturation power
CT
Total diode capacitance
Ptot
Total power dissipation
ESD
Electrostatic discharge
PTX
Transmitter power
F
Noise factor
RDYN,typ forward
Forward dynamic resistance
f
Frequency
RDYN,typ reverse
Reverse dynamic resistance
fT
Transition frequency
rF
Forward resistance of diodes
gfs
Forward transconductance
RO
Differential resistance
Gmax
Max. available gain
RON
On resistance
Gp
Power gain
rS
Series resistance
I
Current
Rx Gain
Receiver gain
IC
Collector current (DC or average value)
trr
Charge carrier life time
ICCTx
Transmitter current consumption
VCC
Collector supply voltage
ICCRx
Receiver current consumption
VCEO
Collector-emitter breakdown voltage
with open base
ID
Drain current
Vcl typ. forward
Forward clamping voltage
IEFT
Burst current (acc. to IEC61000-4-4)
Vcl typ. reverse
Reverse clamping voltage
IF
Forward current
VESDmax
Voltage of ESD pulse
Isurge
Surge current (acc. to IEC61000-4-5)
VF
Forward voltage
NFDSB
Double-side band noise figure
VR
Reverse voltage
NFmin
Mimimum noise figure
VRF
Maximum RF voltage
H2
2nd Harmonic
VRWM
Reverse working voltage
H3
3rd Harmonic
21
Package Information
SC74
6
SC79 (SC-79)
2.9 x 2.5 x 1.1
2
1.6 x 0.8 x 0.55
6:1
SOT143 (SC61)
4
2.9 x 2.4 x 1.0
3
2.0 x 2.1 x 0.9
8:1
4
6
8:1
6
8:1
All products are available in green (RoHS compliant).
Footprints are recommendations only.
For detailed information please refer to our datasheets or www.infineon.com/packages.
22
22
8:1
TSLP-3-1 (SC-101)
3
4
TSLP-5-2
0.75 x 0.75 x 0.31
5
1.3 x 0.8 x 0.39
8:1
8:1
TSLP-7-1
7
8:1
1.0 x 0.6 x 0.4
8:1
TSLP-4-10
1.1 x 0.7 x 0.31
1.2 x 1.2 x 0.55
8:1
TSLP-6-4
1.1 x 0.9 x 0.39
3
1.0 x 0.6 x 0.31
8:1
TSLP-6-3
1.1 x 0.7 x 0.39
2.0 x 2.1 x 0.9
TSFP-3-1, -2
6:1
2
1.2 x 0.8 x 0.39
4.5 x 4.0 x 1.5
4:1
TSLP-2-19, -20
1.0 x 0.6 x 0.39
8:1
TSLP-6-2
6
TSLP-4-7
1.0 x 0.6 x 0.31
4
6:1
8:1
TSLP-3-9
3
2.9 x 2.4 x 1
6:1
2
SOT89 (SC62, SOT-89)
SOT363 (SC88, SOT-363)
2.0 x 2.1 x 0.9
8:1
TSLP-3-7
3
TSLP-2-7, -17, -21
1.0 x 0.6 x 0.4
8:1
6
4
6:1
2
1.0 x 0.6 x 0.39
2.5 x 1.25 x 0.9
SOT343 (SC82)
TSLP-2-1
1.4 x 1.2 x 0.55
SOT23 (SOT-23)
6:1
SOT323 (SC70, SOT-323)
TSFP-4-1, -2
3
2
6:1
6:1
4
SOD323 (SC76)
TSLP-7-4
2.0 x 1.3 x 0.4
7
6:1
2.3 x 1.5 x 0.4
6:1
TSLP-7-6
7
TSLP-9-1
1.4 x 1.26 x 0.39
9
2.3 x 1 x 0.31
6:1
2.3 x 2.3 x 0.39
2
9
1.6 x 0.8 x 0.4
26
5:1
32
5.5 x 4.5 x 0.9
119
14
2
1.4 x 1.26 x 0.375
6:1
TSNP-16-1
2.0 x 2.0 x 0.77
16
5:1
TSSLP-2-1, -2
3.2 x 2.8 x 0.77
2
TSSLP-2-3, -4
0.62 x 0.32 x 0.31
2
0.62 x 0.32 x 0.31
20:1
20:1
WLL-2-2
0.58 x 0.21 x 0.15
2.3 x 2.3 x 0.375
5:1
WLL-2-1
6.0 x 6.0 x 0.8
7
6:1
4:1
WFWLB-119-1
TSNP-7-6
2.0 x 1.3 x 0.375
6:1
26
1.9 x 1.1 x 0.39
6:1
TSNP-14-3
1.5 x 1.1 x 0.4
4:1
VQFN-32-9, -15
7
TSNP-26-3
3.4 x 2.6 x 0.73
12
6:1
TSNP-10-1
TSNP-26-2
2.3 x 2.3 x 0.73
1.55 x 1.15 x 0.39
8:1
10
TSLP-12-4
TSNP-7-1
1.1 x 0.7 x 0.375
6:1
TSNP-16-6
16
6
1.5 x 1.1 x 0.77
5:1
10
TSNP-6-2
TSNP-9-1
2.3 x 1.7 x 0.73
1.15 x 1.15 x 0.31
8:1
TSNP-7-10
TSLP-10-1
6:1
TSNP-2-2
5:1
7
9
6:1
TSLP-16-1
16
TSLP-9-3
2
Package (JEITA-code)
0.43 x 0.23 x 0.15
X
LxWxH
PIN-Count
Scale 1:1
3:1
3:1
20:1
20:1
All Dimensions in mm
23
23
SC74
Package Outline
2.9 ±0.2
(2.25)
B
1.1 MAX.
4
1
2
3
Pin 1
marking
0.35 +0.1
-0.05
0.2
0.95
M
1.6 ±0.1
5
2.5 ±0.1
6
0.25 ±0.1
0.15 +0.1
-0.06
(0.35)
B 6x
0.1 MAX.
0.2
1.9
M
A
A
Foot Print (Reflow)
2.9
1.9
0.5
0.95
SC79 (SC-79)
Package Outline
0.2 M A
0.13 +0.05
-0.03
0.8 ±0.1
1.6 ±0.1
Cathode
marking
1.2 ±0.1
A
2
0.3 ±0.05
0.55 ±0.04
0.2 ±0.05
1
0.35
1.35
Foot Print
0.35
All dimensions in mm
24
SOD323 (SC76)
Package Outline
0.9 +0.2
-0.1
1.25 +0.2
-0.1
0 ±0.05
0.45 ±0.15
2.5 ±0.2
Cathode
marking
1
0.3 +0.1
-0.05
1.7 +0.2
-0.1
A
2
+0.05
0.3 -0.2
0.15 +0.1
-0.06
0.25 M A
0.8
1.7
0.8
Foot Print (Reflow)
0.6
All dimensions in mm
25
SOT23 (SOT-23)
2.9 ±0.1
0.15 MIN.
Package Outline
B
1)
0.25
M
BC
0.4 +0.1
-0.05
2
0.2
C
0.95
M
1.3 ±0.1
1
0.1 MAX.
2.4 ±0.15
3
1 ±0.1
0.08...0.1
A
5
A
0...8°
1.9
1) Lead width can be 0.6 max. in dambar area
Foot Print (Reflow)
0.8
0.9
1.3
0.9
0.8
1.2
SOT89 (SC62, SOT-89)
Package Outline
4.5 ±0.1
45°
B
1.5 ±0.1
0.2 MAX.
2
1.6 ±0.2
2.75 +0.1
-0.15
1)
1±0.2
1
0.15
4 ±0.25
1±0.1
1)
2.5±0.1
0.25 ±0.05
3
1.5
0.35 ±0.1
0.45 +0.2
-0.1
3
0.15
M
B x3
0.2 B
1) Ejector pin markings possible
Foot Print
1.2
1.0
2.5
2.0
0.8
0.8
0.7
All dimensions in mm
26
SOT143 (SC61)
2.9 ±0.1
1.9
B
3
0.1 MAX.
2
1.3 ±0.1
1
1 ±0.1
2.4 ±0.15
4
0.15 MIN.
Package Outline
0.2
0.08...0.1
5
0.8 +0.1
-0.05
0.4 +0.1
-0.05
1.7
A
0...8°
0.2
0.25 M B
M
A
Note: Mold flash, protrusions or gate burrs of 0,2 mm max. per side are not included
Foot Print (Reflow)
1.2
0.8
0.9
1.1
0.9
0.8 1.2 0.8
0.8
SOT323 (SC70, SOT-323)
Package Outline
0.9 ±0.1
2 ±0.2
0.3 +0.1
-0.05
0.1 MAX.
3x
0.1 M
0.1
A
1
2
1.25 ±0.1
0.1 MIN.
2.1 ±0.1
3
0.15 +0.1
-0.05
0.65 0.65
0.2
M
A
Foot Print (Reflow)
0.8
1.6
0.6
0.65
All dimensions in mm
27
SOT343 (SC82)
Package Outline
0.9 ±0.1
2 ±0.2
1.3
0.1 MAX.
0.1
A
1
0.1 MIN.
0.15
1.25 ±0.1
3
2.1 ±0.1
4
2
0.3 +0.1
-0.05
0.15 +0.1
-0.05
0.6 +0.1
-0.05
4x
0.1 M
0.2
M
A
Foot Print
1.6
0.8
0.6
1.15
0.9
SOT363 (SC88, SOT-363)
Package Outline
0.9 ±0.1
5
4
1
2
3
0.1 MAX.
0.1
2.1 ±0.1
6
0.1 M
Pin 1
marking
0.65
A
1.25 ±0.1
6x
0.1 MIN.
2 ±0.2
0.2 +0.1
-0.05
0.15 +0.1
-0.05
0.65
0.2
M
A
Foot Print
1.6
0.9
0.7
0.3
0.65
All dimensions in mm
28
TSFP-3-1, -2
Package Outline
0.2 ±0.05
0.55 ±0.04
1
1.2 ±0.05
0.2 ±0.05
3
2
0.2 ±0.05
0.8 ±0.05
1.2 ±0.05
0.15 ±0.05
0.4 ±0.05
0.4 ±0.05
Foot Print
1.05
0.45
0.4
0.4
0.4
TSFP-4-1, -2
Package Outline
1
3
1.2 ±0.05
0.2 ±0.05
4
0.55 ±0.04
2
0.2 ±0.05
10° MAX.
0.2 ±0.05
0.8 ±0.05
1.4 ±0.05
0.15 ±0.05
0.5 ±0.05
0.5 ±0.05
Foot Print
0.9
0.45
0.35
0.5
0.5
All dimensions in mm
29
TSLP-2-1
Package Outline
Top view
Bottom view
0.4 +0.01
0.6 ±0.05
2
1±0.05
0.65 ±0.05
0.05 MAX.
1
0.25 ±0.035 1)
0.5 ±0.035 1)
Cathode
marking
1) Dimension applies to plated terminals
0.45
0.275
0.35
Copper
0.375
0.925
1
0.3
0.35
0.6
0.275
Foot Print
Solder mask
Stencil apertures
TSLP-2-7, -17, -21
Package Outline
Bottom view
0.39 +0.01
-0.03
0.6 ±0.05
0.65 ±0.05
0.05 MAX.
2
1±0.05
Top view
1
0.25 ±0.035
1)
0.5 ±0.035 1)
Cathode
marking
1) Dimension applies to plated terminals
0.45
Copper
Solder mask
0.375
0.925
0.275
0.35
1
0.3
0.35
0.6
0.275
Foot Print
Stencil apertures
All dimensions in mm
30
TSLP-2-19, -20
Package Outline
Bottom view
0.31 +0.01
-0.02
0.6 ±0.05
0.05 MAX.
0.65 ±0.05
2
1±0.05
Top view
1
0.25 ±0.035 1)
0.5 ±0.035 1)
Pin 1
marking
1) Dimension applies to plated terminals
Foot Print
0.35
0.28
0.38
0.93
0.3
1
Copper
0.28
0.45
0.35
0.6
Solder mask
Stencil apertures
TSLP-3-1 (SC-101)
Package Outline
Bottom view
0.4 +0.1
3
2
1
2 x 0.25 ±0.035
2 x 0.15 ±0.035
1 ±0.05
0.65 ±0.05
1)
0.35 ±0.05
Pin 1
marking
0.25 ±0.035
0.6 ±0.05
0.5 ±0.035
1)
0.05 MAX.
1)
Top view
1)
1) Dimension applies to plated terminal
0.2
0.225
0.15
Copper
0.225
Solder mask
R0.1
0.2
0.17
0.315
0.945
0.35
1
0.3
0.35
0.45
0.275
0.6
0.355
Foot Print
Stencil apertures
All dimensions in mm
31
TSLP-3-7
Package Outline
Bottom view
0.39 +0.01
-0.03
1)
Top view
1)
3
2
1
2 x 0.25 ±0.035
2 x 0.15 ±0.035
1)
0.35 ±0.05
Pin 1
marking
1 ±0.05
0.65 ±0.05
0.5 ±0.035
0.25 ±0.035
0.6 ±0.05
0.05 MAX.
1)
1) Dimension applies to plated terminal
R0.1
0.2
0.225
0.2
0.225
0.17
0.15
Copper
0.315
0.35
1
0.3
0.945
0.35
0.45
0.275
0.6
0.355
Foot Print
Solder mask
Stencil apertures
TSLP-3-9
Package Outline
Top view
Bottom view
2
1±0.05
3
1
2 x 0.15 ±0.035 1)
1) Dimension applies to plated terminal
2 x 0.25 ±0.035 1)
0.575 ±0.05
0.5 ±0.035 1)
0.35 ±0.05
Pin 1
marking
0.4 ±0.035 1)
0.6 ±0.05
0.31+0.01
-0.02
0.225
0.225
0.15
Copper
Solder mask
0.2
0.2
0.17
0.315
0.5
0.95
0.2
0.35
1
0.45
R0.19
0.38
0.6
0.255
Foot Print
R0.1
Stencil apertures
All dimensions in mm
32
TSLP-4-7
Package Outline
Bottom view
0.8 ±0.05
4 x 0.25 ±0.035 1)
2
0.75 ±0.05
0.05 MAX.
3
1
1.2 ±0.05
0.39 +0.01
-0.03
4 x 0.35 ±0.035
1)
Top view
4
0.45 ±0.05
Pin 1 marking
1) Dimension applies to plated terminal
Foot Print
0.8
0.4
0.38
0.42
1.18
0.4
1.2
0.4
0.38
0.78
0.28
0.3
0.3
0.2
Copper
0.28
0.22
Stencil apertures
Solder mask
TSLP-4-10
Package Outline
0.75 ±0.035
0.25 ±0.035 1)
0.05 MAX.
0.4
2
1
3
4
0.75 ±0.035
Bottom view
+0.1
0.31-0.2
0.25 ±0.035 1)
Top view
0.4
Pin 1 marking
1) Dimension applies to plated terminals
Foot Print
0.4
0.4
0.25
All dimensions in mm
33
TSLP-5-2
Package Outline
Bottom view
+0.01
0.39 -0.03
0.2 ±0.035 1)
0.8 ±0.05
0.26 ±0.035 1)
3
0.5 ±0.05
0.05 MAX.
0.5 ±0.05
1.3 ±0.05
Top view
4
2
5
0.03
1
0.46 ±0.05
Pin 1 marking
1) Dimension applies to plated terminals
Foot Print
0.5
0.5
0.46
0.46
0.26
0.2
0.26
0.2
0.5
0.5
Copper
Stencil apertures
Solder mask
TSLP-6-2
Package Outline
Top view
Bottom view
3
4
2
5
1
6
0.2 ±0.05
Pin 1 marking
1.1 ±0.05
(0.05)
(0.05)
0.2 ±0.05
0.05 MAX.
0.2 ±0.035 1)
0.2 ±0.035 1)
(0.05)
(0.05)
0.7 ±0.05
+0.01
0.39 -0.03
1) Dimension applies to plated terminals
Foot Print
NSMD
0.4
0.4
0.25
0.25
0.4
0.4
0.25
0.25
(stencil thickness 100 µm)
Copper
Solder mask
Stencil apertures
All dimensions in mm
34
TSLP-6-3
Package Outline
0.2 ±0.035 1)
Bottom view
+0.01
0.39 -0.03
0.9 ±0.05
0.25 ±0.035 1)
0.05 MAX.
0.8 ±0.05
3
5
6
1
0.4 ±0.05
Pin 1 marking
4
2
1.1 ±0.05
Top view
0.45 ±0.05
1) Dimension applies to plated terminals
Foot Print
NSMD
0.4
0.4
0.3
0.3
0.45
0.25
0.45
0.25
(stencil thickness 100 µm)
Copper
Stencil apertures
Solder mask
TSLP-6-4
Package Outline
Top view
Bottom view
(0.05)
3
1.1 ±0.05
4
2
5
1
6
(0.05)
0.2 ±0.035 1)
0.05 MAX.
0.4
0.2 ±0.035 1)
(0.05)
0.4
Pin 1 marking
(0.05)
0.7 ±0.05
+0.01
0.31 -0.02
1) Dimension applies to plated terminals
Foot Print
NSMD
0.4
0.4
0.25
0.25
0.4
0.4
0.25
0.25
(stencil thickness 100 µm)
Copper
Solder mask
Stencil apertures
All dimensions in mm
35
TSLP-7-1
Package Outline
Top view
Bottom view
0.4 +0.1
1.3 ±0.05
0.05 MAX.
1 ±0.05
6
1.1 ±0.035 1)
1.7 ±0.05
1.2 ±0.035 1)
7
3
Pin 1 marking
2 ±0.05
5
6 x 0.2 ±0.035 1)
4
2
1
6 x 0.2 ±0.035 1)
1) Dimension applies to plated terminal
Foot Print
S MD
1.4
0.3
Copper
0.3
Solder mask
1.4
0.2
0.25
0.2
0.25
Stencil apertures
R0.1
0.3
0.3
Copper
0.3
Solder mask
0.2
0.2
0.25
1.9
0.2
1.9
0.25
0.2
0.25
0.2
0.3
0.2
0.2
1.9
1.9
0.2
0.25
0.2
0.2
0.2
1.4
0.2
N SMD
1.4
0.25
0.25
R0.1
Stencil apertures
All dimensions in mm
36
TSLP-7-4
Package Outline
Top view
Bottom view
0.4
+0.1
1.5 ±0.05
0.05 MAX.
1.1±0.05
1.9 ±0.05
1.4 ±0.035 1)
7
3
Pin 1 marking
2
2.3 ±0.05
6
6 x 0.3 ±0.035 1)
5
1.1±0.035 1)
4
1
6 x 0.3 ±0.035 1)
1) Dimension applies to plated terminal
0.25
0.175
0.175
0.3
0.3
Copper Solder mask
0.25
0.25
0.25
0.3
0.3
0.25
Stencil apertures
1.4
2.2
0.25
2.2
0.175
0.25
0.25
0.25
0.3
0.3
0.3
Copper Solder mask
S MD
0.3
0.175
2.2
0.25
2.2
0.3
1.4
0.25
1.4
0.25
NS MD
0.25
1.4
0.3
Foot Print
0.25
Stencil apertures
All dimensions in mm
37
TSLP-7-6
Package Outline
Bottom view
1.26 ±0.05
0.03 A
4
5
6
0.05 B
B
0.2 MIN.
0.5 ±0.0351)
1.1
A
(0.05) 2)
0.05 MAX.
1.16 ±0.035 1)
0.96
7
3
2
Pin 1 marking
1
0.48
0.03 B
(0.05) 2)
1) Dimension applies to plated terminals
2) Dimension of 0.02 MIN. is guaranteed
0.03 B
0.05 A
6 x 0.2 ±0.035 1)
0.39 +0.01
-0.03
1.4 ±0.05
Top view
6 x 0.2 ±0.035 1)
Foot Print
S MD
1.21
0.51
0.25
Copper
0.45
0.2
0.2
0.25
0.23
0.25
0.25
0.25
1.35
0.45
0.2
0.25
0.2
1.35
0.25
0.25
1.21
0.51
0.25
0.23
0.25
0.23
Solder mask
Vias
0.23
Stencil apertures
All dimensions in mm
38
TSLP-9-1
Package Outline
Bottom view
1±0.035
A
(0.03)
0.59
0.5
6
B
7
4
0.94 ±0.025 1)
2
0.05 A B
0.4 ±0.025 1)
5
3
0.05 A B
4 x 0.5 = 2
(0.05)
0.05 MAX.
0.05 A B
8
1
2.3 ±0.035
0.31+0.01
-0.02
8 x 0.2 ±0.025 1)
Top view
9
Pin 1 marking
8 x 0.35 ±0.025 1)
0.05 A B
1) Dimension applies to plated terminals
Foot Print
1
0.38
Copper
Solder mask
0.2
0.3
0.2
0.3
0.2
0.3
0.2
2.3
0.3
0.2
0.2
0.3
0.24
0.38
0.38
0.3
0.38
0.3
0.3
0.2
2.3
0.3
0.3
0.2
1
0.24
Stencil apertures
All dimensions in mm
39
TSLP-9-3
Package Outline
Top view
Bottom view
0.31 +0.01
-0.02
1.15 ±0.05
6
5
7
9
4
8
3
1
0.2 ±0.0351)
2
0.2 ±0.0351)
Pin 1 marking
1.15 ±0.05
2 x 0.4 = 0.8
0.4
0.05 MAX.
0.4
2 x 0.4 = 0.8
1) Dimension applies to plated terminals
Foot Print
0.25
0.4
0.4
0.25
0.25
0.4
0.4
(stencil thickness 100 µm)
Copper
Stencil apertures
Solder mask
TSLP-10-1
Package Outline
Top view
Bottom view
0.39 +0.01
-0.03
1.15 ±0.05
0.2 ±0.05
0.05 MAX.
7
2
8
9
1
0.2 ±0.0351)
Pin 1 marking
1.55 ±0.05
6
3
0.2 ±0.0351)
0.2 ±0.05
5
4
10
1) Dimension applies to plated terminals
Foot Print
N SMD
0.25
0.4
0.4
0.25
0.25
0.4
0.4
Copper
Solder mask
(stencil thickness 100 µm)
Stencil apertures
All dimensions in mm
40
TSLP-12-4
Package Outline
Bottom view
1.1±0.05
A
0.2 ±0.035
8
9
10
5
11
4
12
3
2
1
0.4
Pin 1 marking
0.1 A
0.1 B
1.9 ±0.05
7
0.1 A
0.2 ±0.035
12x
6
0.75 ±0.035
4 x 0.4 = 1.6
0.4
0.05 MAX.
0.1 B
0.39 +0.01
-0.03
0.2 ±0.035
12x
Top view
B
2 x 0.4 = 0.8
Foot Print
0.4
0.4
0.25
0.8
0.25
0.25
Copper
0.4
0.4
0.8
0.25
0.25
Solder mask
Stencil apertures
All dimensions in mm
41
TSLP-16-1
Package Outline
Top view
Bottom view
2.3 ±0.05
0.39 +0.01
-0.03
2 ±0.05
0.05 MAX.
1±0.05
9
10
11
12
14
1.4 ±0.035 1)
8
7
15
6
16
5
Pin 1 marking
4
3
1 6 x 0.2 ±0.035
2
0 . 0 5 x 45°
1 6 x 0.2 ±0.035
2.3 ±0.05
2 ±0.05
1.4 ±0.035
1±0.05
13
1
1) Dimension applies to plated terminals
Foot Print
NSMD
0.55
1.25
0.3
0.2
0.3
0.2
0.3
0.2
0.3
Stencil apertures
Solder mask
SMD - V1
SMD - V2 (e.g. BGA734L16)
0.15
2.3
0.55
1.25
0.35
0.225
2.3
0.55
1.25
0.35
0.225
0.2
0.3
0.3
0.2
0.3
Copper
0.2
0.3
0.2
0.2
0.3
0.3
0.3
Copper
0.2
0.3
0.2
Solder mask
0.2
0.3
0.3
0.2
0.15
0.3
2.3
2.3
0.2
0.3
0.075
0.275
0.225
1.25
0.225
0.3
0.3
0.2
0.3
0.2
0.3
0.2
Vias top to first inner layer
All dimensions in mm
42
TSNP-2-2
0.02 MAX.
B
0.35 ±0.05
0.8 ±0.05
0.7 ±0.05
0.1 A
0.95
1.6 ±0.05
A
0.1 B
Bottom view
0.4 MAX.
0.75 ±0.05
Top view
0.1 B
Package Outline
0.15 x 45°
Pin 1 marking
Foot Print
0.7
0.4
0.35
0.75
0.75
0.4
0.35
0.7
0.7
0.7
Copper
Stencil apertures
Solder mask
TSNP-6-2
Package Outline
Bottom view
0.7 ±0.05
0.2 ±0.05 1)
0.02 MAX.
0.8 ±0.05
3
4
2
5
1
6
1.1 ±0.05
+0.025
0.375 -0.015
0.2 ±0.05 1)
Top view
0.4 ±0.05
Pin 1 marking
1) Dimension applies to plated terminals
Foot Print
N SMD
0.4
0.4
0.25
0.25
0.4
0.4
0.25
0.25
(stencil thickness 100 µm)
Copper
Solder mask
Stencil apertures
All dimensions in mm
43
TSNP-7-1
Package Outline
Top view
Bottom view
1.3 ±0.05
0.375 +0.025
-0.015
1.15 ±0.05 1)
0.02 MAX.
1 ±0.05
6
7
3
Pin 1 marking
2
2 ±0.05
6 x 0.25 ±0.05 1)
5
1.1 ±0.05 1)
1.75 ±0.05
4
1
6 x 0.2 ±0.05 1)
1) Dimension applies to plated terminals
Foot Print
S MD
1.4
Copper
1.4
0.2
0.25
0.2
0.3
0.3
Copper
0.2
0.2
Stencil apertures
Solder mask
0.25
1.9
0.2
1.9
0.25
0.3
R0.1
0.25
0.25
0.2
0.3
0.3
0.25
0.2
0.3
0.2
0.2
1.9
1.9
0.2
0.25
0.2
0.2
0.2
1.4
0.2
NSM D
1.4
0.25
R0.1
Stencil apertures
Solder mask
TSNP-7-6
Package Outline
Top view
Bottom view
1.26 ±0.05
0.375 +0.025
-0.015
1.16 ±0.05 1)
0.02 MAX.
6
1.4 ±0.05
0.5 ±0.05 1)
1.175 ±0.05
5
7
3
Pin 1 marking
2
6 x 0.225 ±0.05 1)
0.96 ±0.05
4
1
6 x 0.2 ±0.05 1)
1) Dimension applies to plated terminals
Foot Print
Copper
0.35
0.2
0.2
0.25
0.35
0.25
0.23
0.25
1.55
0.2
0.45
0.35
0.25
0.35
0.2
1.55
0.25
1.21
0.51
0.45
SMD
1.21
0.51
0.23
0.25
0.23
Solder mask
Vias
0.23
Stencil apertures
All dimensions in mm
44
TSNP-7-10
Package Outline
Top view
Bottom view
1.7 ±0.05
1.47 ±0.05
0.73 +0.04
-0.03
0.05 MAX.
1.08 ±0.05
6
7
3
Pin 1 marking
2
6 x 0.31 ±0.05
5
2.3 ±0.05
1.28 ±0.05
1.99 ±0.05
4
1
6 x 0.275 ±0.05
1) Dimension applies to plated terminals
Foot Print
NS MD
0.3
1.28
1.09
0.5
0.28
1.09
0.5
0.28
0.19
1.5
0.54
0.57
S MD
0.8
0.28
0.5
1.09
0.3
0.49
0.2
0.465
0.58
0.35
1.09
0.5
0.28
0.19
0.54
0.575
Copper
Solder mask
0.35
Vias top to first inner layer
0.54
0.57
Stencil apertures
All dimensions in mm
45
TSNP-9-1
Package Outline
Top view
Bottom view
0.4
B
7
8
9
0.6 ±0.05
0.1 A
2x
Pin 1 marking
6
0.4
0.2 ±0.05
8x
0.8
1.1 ±0.05
5
0.1 B
0.02 MAX.
1.5 ±0.05
4
3
2
1
Index
marking
0.1 x 45°
0.2 ±0.05
A
3 x 0.4 = 1.2
0.1 B
0.77 MAX.
0.8
0.2 ±0.05
8x
0.1 A
Foot Print
0.4
0.2
0.25
0.25
0.25
0.65
0.25
0.4
0.4
0.25
0.4
0.25
0.4
0.25
0.075
0.4
0.55
0.125
Copper
Solder mask
Stencil apertures
All dimensions in mm
46
TSNP-10-1
Package Outline
Top view
Bottom view
0.4 MAX.
B
7
3
8
2
9
1
10
0.2 ±0.05
10x
Pin 1 marking
0.2 ±0.05
10x
6
4
0.4
1.5 ±0.05
3 x 0.4 = 1.2
5
0.1 B
0.4
0.02 MAX.
1.1 ±0.05
A
0.8
0.1 A
Foot Print
Optional solder mask dam
0.4
0.4
0.4
0.2
0.475
10x 0.25
0.4
0.475
10x 0.25
0.4
10x 0.25
Copper
Solder mask
0.4
Stencil apertures
All dimensions in mm
47
TSNP-14-3
0.1 B
Package Outline
Top view
Bottom view
3 x 0.5 = 1.5
10
11
1.7
12
13
6
14
5
4
B
9
0.45
8
3
2
1
0.2 x 45°
Pin 1 marking
1.1 ±0.05
14 x 0.17 ±0.05
0.45
0.1 B
1.1 ±0.05
2 x 0.4 = 0.8
2 ±0.05
0.5
7
0.4
0.05 MAX.
2 ±0.05
A
0.2 ±0.05
14x
0.77 MAX.
0.1 A
0.1 A
Foot Print
14x 0.22
0.22
0.4 0.4
0.25
0.5
Copper
0.85
Solder mask
0.85
1.1
0.85
1.1
0.4 0.4
0.25
14x 0.25
1.1
0.25
0.5
0.85
(stencil thickness 80 µm)
Stencil apertures
All dimensions in mm
48
TSNP-16-1
Package Outline
Top view
Bottom view
2.3 ±0.05 1)
0.375 +0.025
-0.015
2 ±0.05
0.02 MAX.
(0.08)
2.3 ±0.05
0.2 x 45°
16
16 x 0.2 ±0.035
1.4 ±0.035
1±0.05
1.4 ±0.035
2 ±0.05
1±0.05
1
16 x 0.2 ±0.035
1) Dimension applies to plated terminals
Foot Print
NS MD
0.2
0.3
0.3
0.55
1.25
0.2
0.3
0.3
0.3
0.2
0.3
Copper
0.2
0.3
0.2
0.2
0.3
0.2
0.3
0.2
0.3
Stencil apertures
Solder mask
S MD–V 1
S MD– V 2
0.2
0.3
0.3
0.3
Copper
0.2
0.3
0.2
Solder mask
0.2
0.3
0.3
0.2
0.15
0.15
2.3
0.55
1.25
0.35
0.225
2.3
0.55
1.25
0.35
0.225
0.075
0.275
0.225
2.3
2.3
1.25
0.225
0.3
0.3
0.2
0.3
0.2
0.3
0.2
Vias top to first inner layer
All dimensions in mm
49
TSNP-16-6
Package Outline
Top view
Bottom view
2.3 ±0.05 1)
0.73 +0.04
-0.03
2 ±0.035
0.02 MAX.
16
16 x 0.2 ±0.035
2.3 ±0.05
16 x 0.2 ±0.035
0.2 x 45°
1.4 ±0.035
1±0.05
2 ±0.035
1.4 ±0.005
1±0.05
1
1) Dimension applies to plated terminals
Foot Print
NS MD
0.2
0.3
0.3
0.55
1.25
0.2
0.3
0.3
0.3
0.2
0.3
Copper
0.2
0.3
0.2
0.2
0.3
0.2
0.3
0.2
0.3
Stencil apertures
Solder mask
S MD–V 1
S MD– V 2
0.2
0.3
0.3
0.3
Copper
0.2
0.3
0.2
Solder mask
0.2
0.3
0.3
0.2
0.15
0.15
2.3
0.55
1.25
0.35
0.225
2.3
0.55
1.25
0.35
0.225
0.075
0.275
0.225
2.3
2.3
1.25
0.225
0.3
0.3
0.2
0.3
0.2
0.3
0.2
Vias top to first inner layer
All dimensions in mm
50
TSNP-26-2
Package Outline
Top view
Bottom vew
3.4 ±0.05
0.4 ±0.05
0.02 MAX.
0.4 ±0.05
1.7 ±0.05
2.5 ±0.05
2.6 ±0.05
2 ±0.05
1.6 ±0.05
26x0.2 ±0.05
2.85 ±0.05
0.73 +0.04
-0.03
26
4x0.25 ±0.05
1
22x0.2 ±0.05
0.43 ±0.05
1) Dimension applies to plated terminals
Foot Print
NS MD
0.25
2.45
0.3
0.25 0.25
0.25
0.25
0.25
0.25
0.15
1.65
0.6
0.25
0.25
0.35
0.25
0.15
0.16
Copper
Solder mask
0.3
1
0.25
0.35
(stencil thickness 100 µm)
Stencil apertures
All dimensions in mm
51
TSNP-26-3
Package Outline
0.1 B
1.7 ±0.05
6 x 0.4 = 2.4
2.8 ±0.05
B
0.4
0.4
0.05 MAX.
3.2 ±0.05
7 x 0.4 = 2.8
0.2 ±0.05
0.77 MAX.
A
Bottom view
0.1 B
Top view
2.1 ±0.05
Pin 1 marking
0.2 ±0.05
0.1 A
0.1 A
Foot Print
26x 0.25
2.1
0.9
0.25
26x 0.25
0.25
1.2
1.7
2.65
0.7
1.2
0.4
26x 0.25
Optional solder mask dam
1.4
0.4
1.4
(stencil thickness 100 µm)
3.05
Copper
Solder mask
Stencil apertures
All dimensions in mm
52
TSSLP-2-1, -2
Package Outline
Top view
Bottom view
0.31 +0.01
-0.02
2
0.62 ±0.035
0.355 ±0.025
0.32 ±0.035
1
0.2 ±0.025 1)
0.26 ±0.025 1)
Cathode
marking
1) Dimension applies to plated terminal
Foot Print
0.24
0.19
0.19
0.57
0.14
0.62
Copper
0.19
0.27
0.24
0.32
Solder mask
Stencil apertures
TSSLP-2-3, -4
Package Outline
Top view
Bottom view
0.31 +0.01
-0.02
0.32 ±0.05
0.355
0.62 ±0.05
2
1
0.05 MAX.
0.26 ±0.035
0.2 ±0.035 1)
Pin 1 marking
1)
1) Dimension applies to plated terminals
Foot Print
Solder mask
0.19
0.19
0.57
0.14
0.24
0.62
Copper
0.19
0.27
0.24
0.32
Stencil apertures
All dimensions in mm
53
VQFN-32-9, -15
Package Outline
0.9 MAX.
(0.65)
Index Marking
C
0.55 ±0.07
26
27
32
11
1
10
0.1±0.05
(0.2)
(3.9)
0.05 MAX.
4.4
(2.9)
0.5
5 x 0.5 = 2.5
32x
0.08
17
16
3.4
0.5
1)
+0.03
SEATING PLANE
B
4.3
5.3
9 x 0.5 = 4.5
0.1±0.03
A
4.5 ±0.1
5.5 ±0.1
Index Marking
0.25±0.05
32x
0.05 M A B C
1) Vertical burr 0.03 max. all sides
Foot Print
4.3
3.9
Solder resist covering vias and
segmenting thermal pad (optional)
0.5
0.25
3.3
2.9
0.85
Package outline 5.5 x 4.5
Space for via hole (optional)
All dimensions in mm
54
WFWLB-119-1
Package Outline
11 x 0.5 = 5.5
0.5
0.8 MAX.
A
12
11
10
9
8
7
6
5
4
3
6 ±0.1
SEATING PLANE
0.1 C
C
119x
0.08
COPLANARITY
Index Marking
M L K J H G F E D C B A
11 x 0.5 = 5.5
6 ±0.1
0.5
B
2
1
Index Marking
119x
ø0.15 M C A B
ø0.05 M C
0.3 ±0.05
0.15 MIN.
STANDOFF
Foot Print
0.25
0.25
0.25
0.25
0.5
0.5
0.5
0.5
0.275
0.275
Copper
Solder mask
Stencil apertures
All dimensions in mm
55
WLL-2-1
Package Outline
Top view
Bottom view
0.28 ±0.03
0.2 ±0.02
(0.16)
0.36
2
1
0.58 ±0.03
0.15 ±0.01
0.26 ±0.02
Foot Print
0.24
0.19
0.19
0.57
0.14
0.62
Copper
0.19
0.27
0.24
0.32
Solder mask
Stencil apertures
WLL-2-2
Package Outline
Top view
Bottom view
0.15 ±0.01
0.13 ±0.02
0.43 ±0.03
0.23 ±0.03
(0.15)
0.28
2
1
0.2 ±0.02
Foot Print
Copper
Solder mask
0.3
0.15
0.23
0.3
0.15
0.23
Stencil apertures
All dimensions in mm
56
Packing Information (Tape and Reel)
Tape and Reel
(DIN IEC 286-3)
Please consult your nearest Infineon sales offices (see list of addresses) if you have any queries relating to additional dimensions,
dimensional tolerances or variations.
Tape and Reel made of Plastic
ø Reel 180mm and 330mm
Carrier tape width: 8, 12mm
ø330
12
11
10
Direction of unreeling
9
8
7
6
5
4
ø180
3
Upper side
2
Sd
1
Removable transparency foil
93
07
I n fi
neo
8
Optional:
additional customer label
n
I n fi
neo
n
Barcode label
(readable in this position and removable)
Tape and Reel made of Paper (only for TSLP Packages)
ø Reel 180mm
Carrier tape width: 8mm
Direction of unreeling
Upper side
Upper side
Bottom side
Sd
Infi
neo
Optional:
additional customer label
n
Barcode label
(readable in this position and removable)
All dimensions in mm
57
Packing Information (Tape and Reel)
Fixing on the Tape
13 ±0.2
30 ±10
Carrier tape width: ≤ 12mm
on
Direction of unreeling
1.5 +0.1
4 ±0.1
Trailer (empty)
Leader (empty)
(1 x Circumference / Hub)
min. 160mm
(1 x Circumference / Reel)
min. 400mm
There shall be a leader of 400mm minimum of cover tape, which includes at least 100mm of carrier tape with
empty compartments. All the leader may consist of the carrier tape with empty compartments, sealed by cover tape.
For 1 Tape (resembling a pizza box)
S
d
ine
on
O
V RIG
E
PA R IN
C PA AL
K C
IN K
G T
Inf
Infineon packing label
Up to 10 Tapes
S
d
ine
on
O
V RIG
E
PA R IN
C PA AL
K C
IN K
G T
Inf
Infineon packing label
Inf
ine
Inf
on
ine
on
Barcode label
All dimensions in mm
58
Support Material
More detailed Information on RF & Protection Devices
Data Sheets/Application Notes/Technical Reports
www.infineon.com/esdprotection
www.infineon.com/rf
Please see also the product pages of this
brochure for direct links.
Brochures:
„„
Application Guide for Mobile Communication
„„
Application Guide for Protection
„„
Application Guide for Industrial
„„
Application Guide for Consumer
Evaluation Boards
Visit our ESD Protection Forum: www.infineon.com/esdforum
www.infineon.com/rpd_appguide_mobile
www.infineon.com/rpd_appguide_protection
www.infineon.com/rpd_appguide_industrial
www.infineon.com/rpd_appguide_consumer
For more information please contact your
sales counterpart.
Ask Infineon. Get connected with the answers.
Infineon offers its toll-free 0800/4001 service hotline as one central number,
available 24/7 in English, Mandarin and German.
Our global connection service goes way beyond standard switchboard
services by offering qualified support on the phone. Call us!
„„ Germany ................... 0800 951 951 951 (German/English)
„„ China, mainland ....... 4001 200 951 (Mandarin/English)
„„ India .......................... 000 800 4402 951 (English)
„„ USA ............................ 1-866 951 9519 (English/German)
„„ Other countries ......... 00* 800 951 951 951 (English/German)
„„ Direct access ............. +49 89 234-0 (interconnection fee, German/English)
* Please note: Some countries may require you to dial a code other than “00” to access this international number,
please visit www.infineon.com/service for your country!
Where to Buy
Infineon Distribution Partners and
Sales Offices:
www.infineon.com/WhereToBuy
Stay connected
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Visit us:
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Attention please!
The information given in this document shall in no event
be regarded as a guarantee of conditions or characteristics
(“Beschaffenheitsgarantie”). With respect to any examples or
hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon
Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Order Number: B132-I0011-V1-7600-EU-EC-P
Date: 09 / 2014
Information
For further information on technology, delivery terms and
conditions and prices please contact your nearest Infineon
Technologies Office (www.infineon.com).
Published by
Infineon Technologies AG
85579 Neubiberg, Germany
© 2014 Infineon Technologies AG.
All Rights Reserved.
Warnings
Due to technical requirements components may contain
dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies
Office. Infineon Technologies Components may only be
used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or
effectiveness of that device or system. Life support devices
or systems are intended to be implanted in the human body, or
to support and/or maintain andsustain and/or protect human
life. If they fail, it is reasonable to assume that the health of the
user or other persons may be endangered.
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