bga-256p-m02.pdf

BALL GRID ARRAY PACKAGE
FUJITSU SEMICONDUCTOR
DATA SHEET
256 PIN PLASTIC
BGA-256P-M02
256-pin plastic BGA
Lead pitch
50 mil
Pin matrix
20
Sealing method
Plastic mold
(BGA-256P-M02)
256-pin plastic BGA
(BGA-256P-M02)
27.00±0.20(1.06±.008)SQ
24.00±0.10(.94±.004)
Note: The actual shape of corners may differ from the dimension.
2.30±0.20
(.091±.008)
0.60±0.10
(.024±.004)
24.13±0.20(.95±.008)
1.27±0.20
(.05±.008)
0.15(.006)
INDEX
C
1995 FUJITSU LIMITED BGA256004SC-2-1
Ø0.75±0.15(Ø.03±.006)
1 PIN
Dimensions in mm (inches).
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
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