BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold (BGA-256P-M02) 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004) Note: The actual shape of corners may differ from the dimension. 2.30±0.20 (.091±.008) 0.60±0.10 (.024±.004) 24.13±0.20(.95±.008) 1.27±0.20 (.05±.008) 0.15(.006) INDEX C 1995 FUJITSU LIMITED BGA256004SC-2-1 Ø0.75±0.15(Ø.03±.006) 1 PIN Dimensions in mm (inches). The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 9711