Data Sheet

PMBT3906
PNP switching transistor
Rev. 06 — 2 March 2010
Product data sheet
1. Product profile
1.1 General description
PNP switching transistor in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD)
plastic package.
NPN complement: PMBT3904.
1.2 Features and benefits
„ Collector-emitter voltage VCEO = −40 V
„ Collector current capability IC = −200 mA
1.3 Applications
„ General amplification and switching
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter voltage
open base
-
-
−40
V
IC
collector current
-
-
−200
mA
2. Pinning information
Table 2.
Pinning
Pin
Description
1
base
2
emitter
3
collector
Simplified outline
Graphic symbol
3
3
1
1
2
2
006aab259
PMBT3906
NXP Semiconductors
PNP switching transistor
3. Ordering information
Table 3.
Ordering information
Type number
PMBT3906
Package
Name
Description
Version
-
plastic surface-mounted package; 3 leads
SOT23
4. Marking
Table 4.
Marking codes
Type number
Marking code[1]
PMBT3906
*2A
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
collector-base voltage
open emitter
-
−40
V
VCEO
collector-emitter voltage
open base
-
−40
V
VEBO
emitter-base voltage
open collector
-
−6
V
IC
collector current
-
−200
mA
ICM
peak collector current
-
−200
mA
IBM
peak base current
-
−100
mA
-
250
mW
Ptot
total power dissipation
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
PMBT3906_6
Product data sheet
Tamb ≤ 25 °C
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB).
All information provided in this document is subject to legal disclaimers.
Rev. 06 — 2 March 2010
© NXP B.V. 2010. All rights reserved.
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PMBT3906
NXP Semiconductors
PNP switching transistor
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Rth(j-a)
[1]
Conditions
Min
Typ
Max
Unit
-
-
500
K/W
Min
Typ
Max
Unit
-
-
−50
nA
-
-
−50
nA
IC = −0.1 mA
60
-
-
IC = −1 mA
80
-
-
IC = −10 mA
100
-
300
IC = −50 mA
60
-
-
thermal resistance from
junction to ambient
in free air
[1]
Device mounted on an FR4 PCB.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
ICBO
collector-base cut-off VCB = −30 V; IE = 0 A
current
IEBO
emitter-base cut-off
current
VEB = −6 V; IC = 0 A
hFE
DC current gain
VCE = −1 V
IC = −100 mA
30
-
-
collector-emitter
saturation voltage
IC = −10 mA; IB = −1 mA
-
-
−250
mV
IC = −50 mA; IB = −5 mA
-
-
−400
mV
VBEsat
base-emitter
saturation voltage
IC = −10 mA; IB = −1 mA
-
-
−850
mV
IC = −50 mA; IB = −5 mA
-
-
−950
mV
td
delay time
-
-
35
ns
tr
rise time
-
-
35
ns
ton
turn-on time
ICon = −10 mA;
IBon = −1 mA;
IBoff = 1 mA
-
-
70
ns
ts
storage time
-
-
225
ns
tf
fall time
-
-
75
ns
toff
turn-off time
-
-
300
ns
fT
transition frequency
250
-
-
MHz
Cc
collector capacitance VCB = −5 V; IE = ie = 0 A;
f = 1 MHz
-
-
4.5
pF
Ce
emitter capacitance
VEB = −500 mV;
IC = ic = 0 A; f = 1 MHz
-
-
10
pF
NF
noise figure
IC = −100 μA;
VCE = −5 V; RS = 1 kΩ;
f = 10 Hz to 15.7 kHz
-
-
4
dB
VCEsat
PMBT3906_6
Product data sheet
VCE = −20 V;
IC = −10 mA;
f = 100 MHz
All information provided in this document is subject to legal disclaimers.
Rev. 06 — 2 March 2010
© NXP B.V. 2010. All rights reserved.
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PMBT3906
NXP Semiconductors
PNP switching transistor
mhc459
600
hFE
006aab845
−250
IC
(mA)
IB (mA) = −1.5
−200
−1.35
(1)
−1.2
400
−150
−0.9
−0.75
−0.6
−100
(2)
−1.05
−0.45
200
(3)
0
−10−1
−1
−0.3
−50
−10
−102
IC (mA)
0
−103
VCE = −1 V
−0.15
0
−2
−4
−6
−8
−10
VCE (V)
Tamb = 25 °C
(1) Tamb = 150 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Fig 1.
DC current gain as a function of collector
current; typical values
mhc461
−1200
VBE
(mV)
Fig 2.
Collector current as a function of
collector-emitter voltage; typical values
mhc462
−1200
VBEsat
(mV)
−1000
−1000
(1)
(1)
−800
(2)
−600
−800
(2)
−600
(3)
(3)
−400
−400
−200
−10−1
−1
−10
−102
IC (mA)
−103
−200
−10−1
VCE = −1 V
−1
(2) Tamb = 25 °C
(2) Tamb = 25 °C
(3) Tamb = 150 °C
Base-emitter voltage as a function of
collector current; typical values
Product data sheet
IC (mA)
−103
(1) Tamb = −55 °C
(3) Tamb = 150 °C
PMBT3906_6
−102
IC/IB = 10
(1) Tamb = −55 °C
Fig 3.
−10
Fig 4.
Base-emitter saturation voltage as a function
of collector current; typical values
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Rev. 06 — 2 March 2010
© NXP B.V. 2010. All rights reserved.
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PMBT3906
NXP Semiconductors
PNP switching transistor
mhc463
−103
VCEsat
(mV)
(1)
(2)
−102
(3)
−10
−10−1
−1
−10
−102
IC (mA)
−103
IC/IB = 10
(1) Tamb = 150 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Fig 5.
Collector-emitter saturation voltage as a function of collector current; typical values
PMBT3906_6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 06 — 2 March 2010
© NXP B.V. 2010. All rights reserved.
5 of 11
PMBT3906
NXP Semiconductors
PNP switching transistor
8. Test information
− IB
input pulse
(idealized waveform)
90 %
− I Bon (100 %)
10 %
− I Boff
output pulse
(idealized waveform)
− IC
90 %
− I C (100 %)
10 %
t
td
ts
tr
t on
Fig 6.
tf
t off
006aaa266
BISS transistor switching time definition
VBB
RB
VCC
RC
Vo
(probe)
oscilloscope
450 Ω
(probe)
450 Ω
oscilloscope
R2
VI
DUT
R1
mgd624
VI = 5 V; T = 500 μs; tp = 10 μs; tr = tf ≤ 3 ns
R1 = 56 Ω; R2 = 2.5 kΩ; RB = 3.9 kΩ; RC = 270 Ω
VBB = 1.9 V; VCC = −3 V
Oscilloscope: input impedance Zi = 50 Ω
Fig 7.
PMBT3906_6
Product data sheet
Test circuit for switching times
All information provided in this document is subject to legal disclaimers.
Rev. 06 — 2 March 2010
© NXP B.V. 2010. All rights reserved.
6 of 11
PMBT3906
NXP Semiconductors
PNP switching transistor
9. Package outline
3.0
2.8
1.1
0.9
3
0.45
0.15
2.5 1.4
2.1 1.2
1
2
1.9
0.48
0.38
Dimensions in mm
Fig 8.
0.15
0.09
04-11-04
Package outline SOT23 (TO-236AB)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
PMBT3906
[1]
PMBT3906_6
Product data sheet
Package Description
SOT23
4 mm pitch, 8 mm tape and reel
Packing quantity
3000
10000
-215
-235
For further information and the availability of packing methods, see Section 13.
All information provided in this document is subject to legal disclaimers.
Rev. 06 — 2 March 2010
© NXP B.V. 2010. All rights reserved.
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PMBT3906
NXP Semiconductors
PNP switching transistor
11. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMBT3906_6
20100302
Product data sheet
-
PMBT3906_N_5
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
•
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Section 4 “Marking”: amended
Table 7 “Characteristics”: F redefined to NF noise figure
Section 8 “Test information”: added
Figure 6: added
Figure 8: superseded by minimized package outline drawing
Section 10 “Packing information”: added
Section 12 “Legal information”: updated
PMBT3906_N_5
20071004
Product data sheet
-
PMBT3906_4
PMBT3906_4
20040121
Product specification
-
PMBT3906_3
PMBT3906_3
19990427
Product specification
-
PMBT3906_CNV_2
PMBT3906_CNV_2
19970505
Product specification
-
-
PMBT3906_6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 06 — 2 March 2010
© NXP B.V. 2010. All rights reserved.
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PMBT3906
NXP Semiconductors
PNP switching transistor
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
PMBT3906_6
Product data sheet
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
Rev. 06 — 2 March 2010
© NXP B.V. 2010. All rights reserved.
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PMBT3906
NXP Semiconductors
PNP switching transistor
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PMBT3906_6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 06 — 2 March 2010
© NXP B.V. 2010. All rights reserved.
10 of 11
PMBT3906
NXP Semiconductors
PNP switching transistor
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 2 March 2010
Document identifier: PMBT3906_6