EMI6316FCTBG EMI Filter with ESD Protection for MicroSD Card Applications Product Description http://onsemi.com The EMI6316 is a 4 x 4, 15−bump EMI filter with ESD protection device for MicroSD card applications in a 0.4 mm pitch CSP form factor. It is fully compliant with IEC 61000−4−2. The EMI6316 is also RoHS II compliant. MARKING DIAGRAM WLCSP15 CASE 567FX A1 Corner Indicator PACKAGE / PINOUT DIAGRAMS 1 2 3 4 A B C 4 3 2 1 A 63 YW D B 63 Y W G 63 YW G = Specific Device Code = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 3 of this data sheet. C D Top View (Bumps Down View) © Semiconductor Components Industries, LLC, 2012 September, 2012 − Rev. 1 Bottom View (Bumps Up View) 1 Publication Order Number: EMI6316/D EMI6316FCTBG External (B2) (B1) Internal (B4) (C1) (C4) (A1) (A4) (A2) (A3) (D2) (D3) (D1) (D4) External (B3, C3) Figure 1. Electrical Schematic Table 1. PIN DESCRIPTIONS Pin Description Pin Description Pin Description Pin Description A1 dat0 Internal B1 clk Internal C1 cmd Internal D1 data3 Internal A2 dat1 Internal B2 VCC External D2 data2 Internal A3 SDdat1 External B3 GND C3 GND D3 SDdata2 External A4 SDdat0 External B4 SDclk External C4 SDcmd External D4 SDdata3 External http://onsemi.com 2 EMI6316FCTBG ELECTRICAL SPECIFICATIONS AND CONDITIONS Table 2. PARAMETERS AND OPERATING CONDITIONS Parameter Rating Unit Storage Temperature Range −55 to +150 °C Operating Temperature Range −40 to +85 °C Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max Unit R1 R2 R3 R4 R5 R6 Resistance 34 40 46 W R9 R10 R11 R12 Resistance 42.5 50 57.5 kW R13 Resistance 12.75 15 17.25 kW 10 100 nA 11.5 14 pF ILEAK C VB VESD Leakage Current per Channel VIN = 3.0 V Line Capacitance At 1 MHz, VIN = 0 V 9 At 1 MHz, VIN = 1.8 V (Note 2) 8 pF At 1 MHz, VIN = 2.5 V 7 pF Breakdown Voltage (Positive) IR = 1 mA ESD Protection Peak Discharge Voltage at A3, A4, B2, B4, C4, D3 and D4 pins a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Note 3) ESD Protection Peak Discharge Voltage at A1, A2, B1, C1, D1 and D2 pins a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Note 3) 6 7 9 V kV ±8 ±15 ±2 ±2 1. All parameters specified at TA = 25°C unless otherwise noted. 2. MicroSD version 3.0 SDR104 compliant. 3. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W. Table 4. CSP TAPE AND REEL SPECIFICATIONS† Part Number EMI6316FCTBG Chip Size (mm) Package Shipping† 1.56 x 1.56 x 0.50 WLCSP15 (Pb−Free) 5000 / Tape & Reel † For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. http://onsemi.com 3 EMI6316FCTBG RF CHARACTERISTICS 2.5V 0V Figure 2. S21 Attenuation Simulation http://onsemi.com 4 EMI6316FCTBG PACKAGE DIMENSIONS WLCSP15, 1.56x1.56 CASE 567FX ISSUE O D 2X A ÈÈ ÈÈ PIN A1 REFERENCE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E DIM A A1 A2 b D E e 0.10 C 2X 0.10 C TOP VIEW A2 MILLIMETERS MIN MAX 0.47 0.53 0.185 0.205 0.305 REF 0.24 0.29 1.56 BSC 1.56 BSC 0.40 BSC 0.10 C A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 A1 C SIDE VIEW SEATING PLANE 0.40 PITCH A1 15X 0.05 C A B 0.03 C e/2 b e PACKAGE OUTLINE e D e/2 15X 0.40 PITCH C B 0.23 DIMENSIONS: MILLIMETERS A 1 2 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 4 BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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