EMI7403 D

EMI7403
EMI Filter with ESD
Protection for MicroSD Card
Applications
Product Description
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The EMI7403 is a combination EMI filter with integrated TVS
diodes for use on Multimedia Card interfaces. This state−of−the−art
device utilizes solid−state, silicon− avalanche technology for superior
clamping performance and DC electrical characteristics. The
EMI7403 has been optimized for protection of MicroSD interfaces in
smart phones and other portable electronics.
MARKING
DIAGRAM
WLCSP15
CASE 567FX
Features
• Provides ESD Protection to IEC61000−4−2:
•
•
±15 kV Contact Discharge
Protection and Termination for 6 Lines + VCC
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• MicroSD Interfaces
• MMC Interfaces
• Feature Phones, Smart Phones
A1 Corner
Indicator
2
3
4
A
4
3
2
= Specific Device Code
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping†
EMI7403FCTBG
WLCSP15
(Pb−Free)
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
PACKAGE / PINOUT DIAGRAMS
1
74
Y
W
G
74
YW
G
1
A
B
74
YW
C
D
B
C
D
Top View
(Bumps Down View)
© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. 0
Bottom View
(Bumps Up View)
1
Publication Order Number:
EMI5106/D
EMI7403
Figure 1. Electrical Schematic
Table 1. PIN DESCRIPTIONS
Pin
Description
Pin
Description
Pin
Description
Pin
Description
A1
data0 Internal
B1
clk Internal
C1
cmd Internal
D1
data3 Internal
A2
data1 Internal
B2
VCC External
D2
data2 Internal
A3
SDdata1 External
B3
GND
C3
GND
D3
SDdata2 External
A4
SDdata0 External
B4
SDclk External
C4
SDcmd External
D4
SDdata3 External
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2
EMI7403
ELECTRICAL SPECIFICATIONS AND CONDITIONS
Table 2. PARAMETERS AND OPERATING CONDITIONS
Parameter
Rating
Unit
Storage Temperature Range
−55 to +150
°C
Operating Temperature Range
−40 to +85
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
VRWM
Parameter
Test Conditions
Reverse Working Voltage
VBR
Breakdown Voltage
ILEAK
Channel Leakage Current
RCH
Channel Resistance (R1 to R6)
f3dB
Cut-off Frequency
Min
(Note 3)
IT = 1 mA; (Note 4)
Stop Band Attenuation
VESD
In-system ESD Withstand Voltage
a) Contact discharge per IEC 61000-4-2 standard, Level 4
(External Pins)
b) Contact discharge per IEC 61000-4-2 standard, Level 1
(Internal Pins)
Max
3.3
6.0
VIN = 3.3 V
Fatten
Typ
0.1
Unit
V
9.0
V
0.5
mA
40
W
50 W Source and Load
Termination
300
MHz
@ 700 MHz
@ 900 MHz
20
35
dB
(Notes 1 and 2)
±15
kV
±2
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Standard IEC61000−4−2 with CDischarge = 150 pF, RDischarge = 330, GND grounded.
2. These measurements performed with no external capacitor.
3. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC
or continuous peak operating voltage level.
4. VBR is measured at pulse test current IT.
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EMI7403
RF CHARACTERISTICS
m1
0
INSERTION LOSS (dB)
−5
−10
−15
−20
−25
−30
−35
−40
−45
−50
1E+06
1E+07
1E+08
1E+09
1E+10
FREQUENCY (Hz)
Figure 2. S21 Attenuation Simulation
Interface
Data Rate
(Mbyte/s)
Fundamental Frequency (MHz)
EMI7403 Insertion Loss (dB)
DDR50/SDR50
50
100 (m1)
m1 = 3.27
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4
EMI7403
PACKAGE DIMENSIONS
WLCSP15, 1.56x1.56
CASE 567FX
ISSUE O
ÈÈ
ÈÈ
D
PIN A1
REFERENCE
2X
A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
E
DIM
A
A1
A2
b
D
E
e
0.10 C
2X
0.10 C
TOP VIEW
A2
MILLIMETERS
MIN
MAX
0.53
0.47
0.185
0.205
0.305 REF
0.24
0.29
1.56 BSC
1.56 BSC
0.40 BSC
0.10 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
NOTE 3
A1
C
SIDE VIEW
SEATING
PLANE
0.40
PITCH
A1
15X
0.05 C A B
0.03 C
e/2
b
e
PACKAGE
OUTLINE
e
D
e/2
15X
0.40
PITCH
C
B
0.23
DIMENSIONS: MILLIMETERS
A
1
2
3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
4
BOTTOM VIEW
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
EMI7403/D
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