200 W Game Console AC-DC Adapter GreenPoint Reference Design

TND331/D
Rev. 0, FEB - 2008
200 W Game Console
AC-DC Adapter
Reference Design Documentation Package
© Semiconductor Components Industries, LLC, 2008
February, 2008 - Rev. 0
1
Publication Order Number:
TND331/D
Disclaimer: ON Semiconductor is providing this reference design documentation package “AS IS” and the recipient assumes
all risk associated with the use and/or commercialization of this design package. No licenses to ON Semiconductor's or any
third party's Intellectual Property is conveyed by the transfer of this documentation. This reference design documentation
package is provided only to assist the customers in evaluation and feasibility assessment of the reference design. It is expected
that users may make further refinements to meet specific performance goals.
http://onsemi.com
2
TND331
TND331
200 W Game Console
AC-DC Adapter
Reference Design Documentation
Package
http://onsemi.com
TECHNICAL NOTE
OVERVIEW
This reference document describes a built-and-tested,
GreenPointt solution for a Game Console AC-DC adapter.
The reference design is targeted for the XBOXE Game
Console from Microsoft®. The block diagram of the
architecture used in this reference design is shown in
Figure1.
As seen in the figure, this reference design employs an
Active Clamp Forward topology for the main converter. A
new, highly integrated active clamp controller IC from
ONSemiconductor - NCP1562 - was used for this main
converter. This eased the implementation due to the many
features that are integrated, thereby reducing the overall
system cost and number of components while achieving the
higher efficiency targeted for this reference design.
This reference design also includes a 5 V standby rail.
This was implemented using the NCP1014 from
ONSemiconductor. The NCP1014 is a switching regulator
with an integrated high-voltage switch. This IC enabled the
reference design to achieve a standby power consumption
that easily met the Energy Star and California Energy
Commission (CEC) requirements cost effectively.
This reference design was targeted for the US model of the
XBOX Game Console. As a result, in order to keep the cost
on parity to commercially available models, this reference
design does not include a PFC section and is designed for the
110 Vac input. In order to meet the requirements in other
regions, this design can be modified to include a PFC section
as well.
Finally, though this reference design was targeted for the
XBOXE Game Console, it can be easily adapted to fit the
needs of other end applications. Since the main converter
topology used for the reference design was the Active Clamp
forward topology, the design can be modified to deliver
much higher power requirements. A good example of a
higher power design is available from ONSemiconductor's
web site - a 305 W Desktop Power Supply (ATX) reference
design using this same active clamp forward topology
(Document Reference: TND313/D). Other applications
such as game consoles with different output power
requirements and other high power adapters are good
candidates for adapting this reference design to meet
specific requirements.
Game Console AC-DC Adapter
Figure 1. Reference Design Architecture Block Diagram
http://onsemi.com
3
TND331
Introduction
Energy Star and CEC programs for external power supplies
are shown in Table 1 to Table 4. It should be noted that the
Energy Star specifications are designed with the US market
in mind. However, through its extensive partnership
programs, several other countries and regions are
implementing the Energy Star guidelines with very little
changes.
Due to the ever increasing feature sets that are being
integrated into game consoles and other consumer electronic
devices, the power requirements for these devices is also
increasing along with them. At the same time, numerous
regulatory and market forces are driving the need for higher
efficiencies from the power supplies of these devices. The
active mode and standby mode efficiency targets of the
Table 1. Energy Star Energy Efficiency targets for Active Mode
Nameplate Output Power (Pno)
Minimum Average Efficiency in Active Mode (expressed as decimal)
0 to < 1 Watt
≥ 0.49 * Pno
>1 and ≤49 Watts
≥ [0.09 * Ln(Pno)] + 0.49
> 49 Watts
≥ 0.84
Table 2. Energy Star No-load Energy Consumption Criteria
Nameplate Output Power (Pno)
Minimum Average Efficiency in Active Mode (expressed as decimal)
0 to <10 Watts
≤ 0.5 Watt
≥10 to ≤ 250 Watts
≤ 0.75 Watt
Table 3. CEC Requirements - Effective January 1, 2007
Nameplate Output
Minimum Efficiency in Active Mode
0 to < 1 Watt
0.49 * Nameplate Output
>1 and ≤49 Watts
[0.09 * Ln (Note 1) (Nameplate Output)] + 0.49
> 49 Watts
0.84
Maximum Energy Consumption in No-Load Mode
0 to <10 Watts
0.5 Watt
≥10 to ≤ 250 Watts
0.75 Watt
Where Ln (Nameplate Output) = Natural Logarithm of the nameplate output expressed in Watts
Table 4. CEC Requirements - Effective July 1, 2008
Nameplate Output
Minimum Efficiency in Active Mode
0 to < 1 Watt
0.5 * Nameplate Output
>1 and ≤51 Watts
[0.09 * Ln (Note 1) (Nameplate Output)] + 0.5
> 51 Watts
0.85
Maximum Energy Consumption in No-Load Mode
Any output
0.5 Watt
Where Ln (Nameplate Output) = Natural Logarithm of the nameplate output expressed in Watts
This reference design provides a solution to address the above challenges while meeting the aggressive specifications listed
in the following section in a cost-effective manner.
1. “Ln” refers to the natural logarithm. The algabraic order of operations requires that the natural logarithm calculation be performed first and
then multiplied by 0.09, with the resulting output added to 0.49. An efficiency of 0.84 in decimal form corresponds to the more familiar value
of 84% when expressed as a percentage.
http://onsemi.com
4
TND331
Specifications
The target specifications for the reference design for
several key parameters are outlined in this section.
Efficiency
• Active Mode Efficiency: The power supply efficiency
Input
• The Input Voltage range is 90 - 132 Vac, 47-63 Hz.
• Maximum steady state input current to be less than 5A
rms at 90 VAC for full load output.
•
Output
• The output voltages for the power supply are 12 V and
•
•
•
•
•
+5 V standby.
The accuracy of the output voltage must be ±5% or
better at the load end of the connectors under all line
and load conditions.
The output ripple voltage of the power supply must not
exceed 100 mVpp for 12 V output and 50 mVpp for
+5V STBY output.
The reference design should be capable of supplying
203W total output power under all specified
conditions.
The 12 V output should be capable of delivering 16.5 A
of current (peak) with a maximum rating of 16.5 A. The
5V STBY output should be capable of delivering a
maximum of 1 A of current with a 1.5 A of peak.
The output voltage hold-up time is 20 ms.
will exceed 88% at 90 Vac and full load (measured at
the end of PCB) for any ambient temperature within the
operating range. The efficiency at 20% load and
90/115/132 Vac shall exceed 80% (at the end of the
PCB).
Standby Mode Efficiency: During main power off
condition, the power supply unit will draw no more
than 1 W from the AC outlet at 115 VAC, 60 Hz when a
load of 0.5 W is applied to its +5V STBY rail.
Protections
•
•
•
•
Over Current
Short Circuit
Over Voltage
Over Temperature
Schematics
The schematics of the reference design are shown in this
section. Figure 2 shows the schematic for the NCP1562
active clamp converter section of the reference design,
Figure3 shows the standby section and Figure 4 shows the
control section.
http://onsemi.com
5
L
+
L8
~
C11
-
BR1
R13
N
t
J
Q6
C7
C6
K
C5
E
C2
L10
C30
D10
R2
HVDC-VE
HVDC-P
Q2
http://onsemi.com
6
T3
C
Figure 2. Main Board
C27
R7
DRV1
R11
D
R6
Q4
R12
T2
C32
C31
R10
R4
R1
D2
D1
J
C9
R9
D14
D13
D11
AUXILIARY POWER CARD
REMOTE
R8
R5
C3
BIAS
CURRENT COMP2
CURRENT COMP1
[email protected]
BIAS GND
RMTE
R15
D12
Q3
R14
F
DRV1
C10
HVDC-VE DRV2
12V AUX P-VCC
K
HVDC-P
Q5
FROM CONTROL CARD HVDC-P HVDC-VE BIAS BIASGND
DRV2
+5V
12V AUX
P-VCC
D4
R3
Q1
C8
L3
C4
+VE
C14
+5V
-VE
C13
[email protected]
TND331
CONTROL CARD
C22
R14
R15
DRAIN
NC
NC
GND
http://onsemi.com
7
R20
C23
U1
Figure 3. NCP1014 - Standby Converter Section
HVDC-VE
HVDC-P
D6
D9
C13
C24
D8
C25
R21
T1
C18
12V AUX P-VCC
D7
C12
R16
1N5822
C16
D5
R13
C19
C17
C14
R22
C20
12V AUX S-VCC
U2
R18
L11
R19
R17
R23
C21
C15
+5V
TND331
U8
FB
NC
VCC
NC
D
C28
R24
R25
HVDC-VE
HVDC-P
12V AUX P-VCC
R33
R30
R26
R27
C29
R28
R29
C32
R34
R31
C31
U3
U10
VIN VAUX
UVOV OUT1
PGND
FF
CS
OUT2
GND CSKIP
RTCT
TD
SYNC
SS
VREF VEA
C35
Q8
R32
C33
http://onsemi.com
8
Figure 4. NCP1562 - Active Clamp Forward Converter Section
R63
Q7
R50
U9
R56
D12
D11
R61
C46
C38
R35
DRV2
DRV1
R58
C39
R40
C44
U6
C34
C26
C
R59
+
D13
U7B
R39
R41
U7D
+
C43
R62
R54
R57
R52
R48
R44
R42
C36
R46
R45
R43
C41
R37
C37
U7A
+
R36
12V @ 16.6A
R60
U7C
C42
R47
U5
2.5V REF
FEEDBACK
F
12V @ 16.6A
R55
R53
OUTPUT OVER CURRENT
& SHORT CIRCUIT
PROTECTION
REMOTE ON/OFF SECTION - OUTPUT IS
ON WHEN PIN IS HIGH
REMOTE
C40
R38
12V AUX S-VCC
CURRENT COMP2
OUTPUT OVER VOLTAGE LATCH
C45
+
R51
R49
D
C
DRV2
DRV1
BIAS
REMOTE
CURRENT COMP1
12V @ 16.6A BIAS GND
HVDC-VE
12V AUX P-VCC
HVDC-P
TND331
R65
R64
TND331
Bill of Materials
The complete bill of materials for the power supply is given in this section.
Table 5. Bill of Materials - Main Board
REV:4
PRODUCT PART NO-SP001
SL.
NO
DESCRIPTION
CIRCUIT
REF
A
ASSEMBLY PCB, SS
1
BRIDGE RECTIFIER
BR1
GBV806
1
VISHAY
2
THERMISTOR, NTC
R13
2E, 15 mm
1
THINKING
ELECTRONICS
3
CAPACITOR, BOX, X2CLASS
C11
0.22 mF, 275 V
1
VISHAY
4
CAPACITOR, ELECTROLYTIC,
+80%, -20%
C2
820 mF, 250 V
1
JACKON / VISHAY
5
CAPACITOR, ELECTROLYTIC,
+80%, -20%
C3
4700 mF, 25 V
1
JACKON / VISHAY
6
CAPACITOR, ELECTROLYTIC,
+80%, -20%
C4
100 mF, 25 V
1
JACKON / VISHAY
7
CAPACITOR, CERAMIC, Y2 CLASS
C5, C6,
C7
2.2 nF, 250 V
3
EPCOS / VISHAY
8
CAPACITOR, CERAMIC, MLC
C13
0.47 mF, 100 V
1
VISHAY
9
CAPACITOR, CERAMIC, MLC
C10,
C14
0.1 mF, 50 V
2
VISHAY
10
CAPACITOR, CERAMIC, +20%, -20%
C8
103, 1 KV
1
VISHAY
11
CAPACITOR, CERAMIC, +20%, -20%
C9
101, 1 KV
1
VISHAY
12
CAPACITOR, CERAMIC, SMD2220
C27
1 mF, 100 V
1
VISHAY / AVX
13
CAPACITOR, CERAMIC, 1206
C32
10 nF, 50 V
1
VISHAY
14
CAPACITOR, CERAMIC, 1206
C30
100 nF, 50 V
1
VISHAY
15
RES, 5%, SMD, 1206
R1, R4
2E2
2
VISHAY
16
RES, 5%, SMD, 1206
R6
10E
1
VISHAY
17
RES, 5%, SMD, 1206
R3
2K2
1
VISHAY
18
RES, 5%, SMD, 1206
R7, R14,
R15
10K
3
VISHAY
19
RES, 5%, SMD, 1206
R10
47E
1
VISHAY
20
NICHROME WIRE
R5, R8
NICHROME
WIRE
2
CUSTOM
PART VALUE
QTY/
UNIT
ST200WA-V3
MANUFACTURER
PART NO
MAKE
ST200WA-V3
MAX CIRCUITS
21
RES, 5%, CFR, 0.5W
R9
10E, 0.5 W
1
VISHAY
22
RES, 5%, SMD, 2512
R12
0.05E
1
VISHAY
23
RES, 5%, SMD, 2512
R11
0.018E
1
VISHAY
24
DIODE, UFR, SOT23
D1, D2,
D4
BAS16
3
ON Semiconductor
25
DIODE, SMD MELF
R2
1N4148
1
NXP
26
DIODE, RECTIFIER
D10
1N4148
1
NXP
27
RESISTOR, SMD, 1206
C31
0E
1
28
ZENER DIODE, 400mW
D11,
D12,
D13,
D14
16 V
4
ONSEMI / NXP
29
TRANSISTOR, TO92
Q2
2SA1015
1
NXP
http://onsemi.com
9
10 mm
CATHODE
TOWARDS
GATE OF Q1
TND331
Table 5. Bill of Materials - Main Board
REV:4
PRODUCT PART NO-SP001
SL.
NO
DESCRIPTION
CIRCUIT
REF
PART VALUE
QTY/
UNIT
MANUFACTURER
PART NO
MAKE
B
HEAT SINK
HS1
SP001HS1
1
CUSTOM
REF DRAWING
1
MOSFET, TO220
Q1
STP4NK80ZP
1
ST
ALTERNATIVE
ALTERNATIVE
OR
1
MOSFET, TO220
Q1
STP3NK60ZP
1
ST
2
MOSFET, TO220
Q4
STP14NK50Z
1
ST
3
TRIAC, TO220
Q6
BT139
1
NXP
C
HEAT SINK
HS2
SP001HS2
1
CUSTOM
1
MOSFET, TO220
Q3, Q5
IRF3705N
2
IR
D
COMMON MODE CHOKE
L8
12 mH, 5 A
1
CUSTOM
E
TOROID INDUCTOR
L3
40 mH, 25 A
1
CUSTOM
F
ASSEMBLY TRANSFORMER
T2
SP001ARD2
1
CUSTOM
G
ASSEMBLY TRANSFORMER
T3
SP001DRVDR2
1
CUSTOM
I
ASSEMBLY CHOKE
L10
3.3 mH, 1.5 A
1
CUSTOM
J
3PIN POWER CONNECTOR, PCB
MOUNTABLE
J1
EMI30
1
ELCOM
http://onsemi.com
10
REF DRAWING
TND331
Table 6. Bill of Materials - Standby Converter Board
REV:4
SL.
NO
DESCRIPTION
A
ASSEMBLY PCB, SS
1
CAPACITOR, CERAMIC, +20%, -20%
PRODUCT PART NO-SP001
CIRCUIT REF
PART VALUE
QTY/
UNITS
AUXILLARY
BOARD
MAKE
CUSTOM
C12
102, 1 KV
1
EPCOS / VISHAY
2
CAPACITOR, CERAMIC, Y2 CLASS
C13
2.2 nF, 250 V
1
EPCOS / VISHAY
3
CAPACITOR, ELECTROLYTIC, +80%, -20%
C14, C24
100 mF, 25 V
2
JACKON / VISHAY
4
CAPACITOR, ELECTROLYTIC, +80%, -20%
C16, C17, C18
470 mF, 25 V
3
JACKON / VISHAY
5
CAPACITOR, ELECTROLYTIC, +80%, -20%
C22
10 mF, 50 V
1
JACKON / VISHAY
6
CAPACITOR, CERAMIC, X7R, SMD, 1206
C15, C20, C19,
C21, C25
100 nF, 50 V
5
VISHAY
7
CAPACITOR, CERAMIC, X7R, SMD, 1206
C23
1 nF
1
VISHAY
8
RES, 5%, SMD, 1206
R13
22E
1
VISHAY
9
RES, 5%, SMD, 1206
R16
120E
1
VISHAY
10
RES, 1%, SMD, 1206
R17
2K2
1
VISHAY
11
RES, 1%, SMD, 1206
R20
6K8
1
VISHAY
12
RES, 1%, SMD, 1206 (T.S.R.)
R22
100K
1
VISHAY
13
RES, 1%, SMD, 1206
R23, R19
4K7
2
VISHAY
14
RES, 5%, CFR, 1W
R15
220K
1
VISHAY
15
DIODE, UFR
D5
1N5822
1
ON Semiconductor
16
DIODE, UFR
D6, D8
UF4005
2
VISHAY
17
DIODE, SCHOTTKY
D7
1N5819
1
ON Semiconductor
18
DIODE, RECTIFIER
D9
1N4007
1
ON Semiconductor
19
IC, DIP8, PWM SWITCHER
U1
NCP1014P
1
ON Semiconductor
20
IC, REF, TO92
U2
TL431
1
ON Semiconductor
21
IC, OPTOCOUPLER, DIP4
U8
PC817
1
FAIRCHILD SEMI
22
JUMPER
J1, J2, R14
3
B
ASSEMBLY TRANSFORMER
T1
STAUXSP001RD2
1
CUSTOM
C
ASSEMBLY CHOKE
L11
3.3 mH, 1.5 A
1
CUSTOM
D
BERG STICK 90o angle
J6, J7
7PIN
2
-
http://onsemi.com
11
TND331
Table 7. Bill of Materials - Active Clamp Forward Converter Board
REV:4
SL.
DESCRIPTION
PRODUCT PART NO-SP001
CIRCUIT REF
NO
PART VALUE
QTY /
CONTROL
UNITS
BOARD
MAKE
A
ASSEMBLY PCB, DS
1
CAPACITOR, CERAMIC, X7R, SMD, 1206
C33, C34, C35, C37,
C40, C44, C46 (Note 2)
100 nF, 50 V
7
VISHAY
2
CAPACITOR, CERAMIC, X7R, SMD, 1206
C28
10 nF, 50 V
1
VISHAY
3
CAPACITOR, CERAMIC, X7R, SMD, 1206
C39
10 nF, 50 V
1
VISHAY
4
CAPACITOR, CERAMIC, X7R, SMD, 1206
C29
470 pF, 50 V
1
VISHAY
5
CAPACITOR, CERAMIC, MLC
C26
0.47 mF, 50 V
1
VISHAY
6
CAPACITOR, CERAMIC, X7R, SMD, 1206
C31
220 pF, 50 V
1
VISHAY
7
CAPACITOR, CERAMIC, X7R, SMD, 1206
C32
330 pF, 50 V
1
VISHAY
8
CAPACITOR, CERAMIC, X7R, SMD, 1206
C38
1 nF, 50 V
1
VISHAY
9
CAPACITOR, ELECTROLYTIC, +80%, -20%
C45
10 mF, 63 V
1
JACKON/VISHAY
10
CAPACITOR, ELECTROLYTIC, +80%, -20%
C43
4.7 mF, 63 V
1
JACKON/VISHAY
11
RES, 5%, SMD, 1206
R24, R26, R28
2M
3
VISHAY
12
RES, 5%, SMD, 1206
R30
160K
1
VISHAY
13
RES, 1%, SMD, 1206
R25, R27, R29, R40
100K
4
VISHAY
14
RES, 1%, SMD, 1206
R31
27K
1
VISHAY
15
RES, 1%, SMD, 1206
R32, R59
470K
2
VISHAY
16
RES, 5%, SMD, 1206
R33, R39, R53, R55
1K
4
VISHAY
17
RES, 5%, SMD, 1206
R34, R56
3.3K
2
VISHAY
18
RES, 1%, SMD, 1206
R35
820E
1
VISHAY
19
RES, 1%, SMD, 1206
R36
220E
1
VISHAY
20
RES, 1%, SMD, 1206
R37, R60
39K
2
VISHAY
21
RES, 1%, SMD, 1206 (T.S.R.)
R64
120K
1
VISHAY
22
RES, 5%, SMD, 1206
R38, R54, R61, R62
2.2K
4
VISHAY
23
RES, 5%, SMD, 1206
R50
1.5K
1
VISHAY
24
RES, 1%, SMD, 1206
R52, R58, R63, R65
10K
4
VISHAY
25
TRIMPOT, MULTITURN
R44
10K
1
BOURNS
26
RES, 1%, SMD, 1206
R43, R57
18K
1
VISHAY
27
RES, 1%, SMD, 1206
R51
220K
1
VISHAY
28
RES, 1%, SMD, 1206 (Note 3)
R66
20K
1
VISHAY
29
DIODE, UFR, SOT23
D12, D13
BAS16
2
ON Semiconductor
30
TRANSISTOR, TO92
Q7
2N2222A
1
ON Semiconductor
31
SCR, TO92
Q8
2N6565
1
NXP
32
IC, SO-16, PWM SWITCHER
U3
NCP1562A
1
ON Semiconductor
33
IC, REF, TO92
U5, U6
TL431
2
ON Semiconductor
34
IC, OP-AMP SOP14
U7
LM324
1
ON Semiconductor
35
IC, OPTOCOUPLER, DIP4
U9, U10
PC817
2
FAIRCHILD SEMI
36
NOT USED
R42, R45, R46, R47,
R48, R49, C42, D11, C36
B
BERG STICK 90o angle
J1, J2
7PIN
2
C
HEAT SINK (Note 4)
HS3
SP001HS3U
1
2. MOUNT C46 ON R58
3. PCB FOOT PRINT NOT AVAILABLE, SOLDER DIRECTLY ACROSS THE CHIP
4. OUTER HEATSINK
http://onsemi.com
12
CUSTOM
8
CUSTOM
TND331
Performance Results
Efficiency
Efficiency at Different Line and Load Conditions
Input Voltage
20% Load
50% Load
100% Load
90 Vac
88.45%
90.54%
88.48%
100 Vac
87.84%
90.40%
88.89%
110 Vac
87.26%
90.26%
89.09%
120 Vac
85.71%
90.15%
89.71%
130 Vac
85.49%
90.35%
90.04%
Standby Power
Ripple Measurements
The measured input (standby) power at 110 Vac and no
load on the outputs (with 12 V output disabled) is 488 mW.
The measured p-p ripple for the 12 V output was 80mV p-p
(max) and the ripple for the 5 V output is 30 mV p-p (max).
http://onsemi.com
13
TND331
Start-up and Shutdown Waveforms
Output turn on and off waveforms.
Ch1: 5 V Output
Ch1: 5 V Output
Ch2: 12 V Output
110 Vac Input
[email protected]
12 V @ 16.5 A
110 Vac Input
[email protected]
12 V @ 16.5 A
Figure 5. Output Turn On Waveform
Figure 6. Output Turn On Waveform
Ch1: 5 V Output
110 Vac Input
[email protected]
12 V @ 16.5 A
Ch1: 12 V Output
110 Vac Input
[email protected]
12 V @ 16.5 A
Figure 7. Output Turn On Waveform
Figure 8. Output Turn Off Waveform
Ch1: 12 V Output
Ch1: 12 V Output
110 Vac Input
[email protected]
12 V @ 16.5 A
110 Vac Input
[email protected]
12 V @ 16.5 A ~ 8.25 A
Figure 9. Output Turn Off Waveform
Figure 10. Transient Response
http://onsemi.com
14
TND331
Figure 11. Board Picture
Magnetic Component Information
1. Driver Transformer: SP001DRVDR2
1. Transformer Core: EE16
Sl No.
Winding Description
1
Primary winding W1
2. Bobbin: EE16 VERTICAL 3+3 Pins
Turns
No Of Wires
SWG
Layers
Start
Finish
18
2
30
1
3
1
30
1
6
4
2 Layers of 2 Mil Tape Insulation
2
Secondary winding W2
40
2
2. Auxiliary / Standby Power Supply Transformer: STAUXSP001RD2
1. Transformer Core: EFD20
2. Bobbin: EFD20 Horizontal 4+4 Pins
Sl No.
Winding Description
Turns
No Of Wires
SWG
Layers
Start
Finish
1
Primary winding W1
102
1
32
1
3
1
28
1
4
2
28
1
8
7
28
1
6
5
2 Layers of 2 Mil Tape Insulation
2
Bias Winding W2
3
Secondary Winding W3
12
1
2 Layers of 2 Mil tape Insulation
5
3
2 Layers of 2 Mil tape Insulation
4
Secondary Winding W4
12
1
Gap Length: 3.15 mils.
Primary Inductance: 2055 mH
Estimated Transformer Primary Leakage Inductance to be less than 5% of Primary Inductance
http://onsemi.com
15
TND331
3. Main Transformer: SP001ARD2
1. Transformer Core: PQ 32/20
2. Bobbin: PQ 32/20, 6 + 6 Pins
SN
Winding Description
Turns
No.of wires
SWG
Layers
Start
Finish
1
Split Primary Winding W1
7
8
0.4/0.5 mm
1
2,3
FL1
2
Gate drive winding W2
2
2
28
1
7
9
3
Gate drive winding W3
1
2
28
1
9
12
10 Mils foil,
16 mmWidth
1
10, 11
8
1
FL1
4, 5
2 Layers of 2 Mil Tape Insulation
2 Layers of 2 Mil Tape Insulation
4
Secondary Winding W4
3
-
Note: For winding 4 use 15SWG Wire leads to solder the foil
2 Layers of 2 Mil Tape Insulation
5
Split Primary winding W5
6
8
0.4/0.5 mm
Primary Inductance 900 mH across pins 2 & 5, + 0%, - 10%
Estimated Transformer Primary Leakage Inductance to be less than 5% of Primary.
Wind Uniformly all windings @ spread it evenly across the entire cross section of the bobbin
4. Output Inductor: T27
Toroid
T27- MicroMetal
Wire gauge
15 SWG, 2 wires, 15 Turns
Inductance
40 mH
Amps
20 A
• The thermal performance and efficiency can be further
Potential Improvements
In evaluating the results of the reference design, certain
areas of further performance improvements are identified
and listed below.
• The drive circuit for the active clamp and the main FET
can be simplified using the integrated high-side /
low-side driver like the NCP5181 instead of the gate
drive transformer.
improved by choosing more optimal FETs for the
secondary synchronous rectifiers and also by
optimizing the drive circuit for these devices. It is
estimated that there is additional power loss of 1-2% in
the current design that is attributable to the inefficient
switching of the synchronous rectifiers.
http://onsemi.com
16
TND331
APPENDIX
References:
• Draft Commission Communication on Policy Instruments to Reduce Stand-by Losses of Consumer Electronic
Equipment (19 February 1999)
- http://energyefficiency.jrc.cec.eu.int/pdf/consumer_electronics_communication.pdf
• European Information & Communications Technology Industry Association
- http://www.eicta.org/
• http://standby.lbl.gov/ACEEE/StandbyPaper.pdf
CECP (China):
• http://www.cecp.org.cn/englishhtml/index.asp
Energy Saving (Korea):
• http://weng.kemco.or.kr/efficiency/english/main.html#
Top Runner (Japan):
• http://www.eccj.or.jp/top_runner/index.html
EU Eco-label (Europe):
• http://europa.eu.int/comm/environment/ecolabel/index_en.htm
• http://europa.eu.int/comm/environment/ecolabel/product/pg_television_en.htm
EU Code of Conduct (Europe):
• http://energyefficiency.jrc.cec.eu.int/html/standby_initiative.htm
GEEA (Europe):
• http://www.efficient-appliances.org/
• http://www.efficient-appliances.org/Criteria.htm
Energy Star:
• http://www.energystar.gov/
• http://www.energystar.gov/index.cfm?c=product_specs.pt_product_specs
1 Watt Executive Order:
• http://oahu.lbl.gov/
• http://oahu.lbl.gov/level_summary.html
GreenPoint is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81-3-5773-3850
http://onsemi.com
17
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
TND331/D
Similar pages