20 Lead Flip-Chip, 4 x 1.6mm

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
FLIP−CHIP−20
CASE 499AS−01
ISSUE A
DATE 14 FEB 2006
A1
SCALE 4:1
4X
0.10 C
TERMINAL A1
LOCATOR
ÈÈ
ÈÈ
D
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
TOP VIEW
A1
0.10 C
A2
0.05 C
SIDE VIEW
A
SEATING
PLANE
È
D1
XXXXXXX
e
e1
XXXXXXXX = Specific Device Code
C
20X
b
0.03 C
MILLIMETERS
MIN
MAX
0.650
−−−
0.210
0.270
0.280
0.380
0.290
0.340
4.000 BSC
3.500 BSC
1.600 BSC
0.870 BSC
0.500 BSC
1.000 BSC
0.435 BSC
GENERIC
MARKING DIAGRAM*
e /2
0.05 C A B
C
DIM
A
A1
A2
b
D
D1
E
E1
e
e1
e2
E1
B
e2
A
1
2
3
4
5
6
7
8
*This information is generic. Please refer
to device data sheet for actual part
marking.
BOTTOM VIEW
DOCUMENT NUMBER:
98AON21910D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
20 PIN FLIP−CHIP, 4.0x1.6 MM,10.5 PITCH
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON21910D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY A. TAM.
06 JAN 2006
A
CHANGED DIMENSION A TO 0.650 AND A2 TO 0.280/0.380. REQ. BY A. TAM.
14 FEB 2006
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 01O
Case Outline Number:
499AS