05-08-1734

DKD Package
32-Lead Plastic DFN (7mm × 4mm)
(Reference LTC DWG #05-08-1734 Rev A)
0.70 ± 0.05
4.50 ± 0.05
6.43 ±0.05
2.65 ±0.05
3.10 ± 0.05
PACKAGE
OUTLINE
0.20 ± 0.05
0.40 BSC
6.00 REF
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
7.00 ±0.10
17
R = 0.115
TYP
32
R = 0.05
TYP
0.40 ± 0.10
6.43 ±0.10
4.00 ±0.10
2.65 ±0.10
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 × 45° CHAMFER
PIN 1
TOP MARK
(SEE NOTE 6)
16
0.75 ±0.05
0.40 BSC
1
6.00 REF
BOTTOM VIEW—EXPOSED PAD
0.200 REF
0.20 ± 0.05
(DKD32) QFN 0707 REV A
0.00 – 0.05
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WXXX)
IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
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