CDSOT23 SLVU2.8

Applications
■ RoHS compliant*
■ Personal Digital Assistants (PDAs)
■ Low capacitance ~ 2.5 pF
■ Mobile phones & accessories
■ ESD protection
■ Memory card protection
■ Surge protection
■ SIM card port protection
*R
oH
S
CO
M
PL
IA
N
T
Features
■ Portable electronics
CDSOT23-SLVU2.8 - Surface Mount TVS Diode
General Information
The CDSOT23-SLVU2.8 device provides ESD, EFT and Surge protection for high
speed data ports meeting IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 610004-5 (Surge) requirements. The Transient Voltage Suppressor Array offers a Working
Peak Reverse Voltage of 2.8 V and Minimum Breakdown Voltage of 3 V.
1
The SOT23 packaged device will mount directly onto the industry standard SOT23
footprint. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle with
standard pick and place equipment and the flat configuration minimizes roll away.
3
2
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Peak Pulse Power (tp= 8/20 μs)1
Symbol
Value
Unit
PPK
600
W
Peak Pulse Current (t = 8/20 μs)
p
IPPM
30
A
Storage Temperature
TSTG
-55 to +150
ºC
Operating Temperature
TOPR
-55 to +150
ºC
Minimum Breakdown Voltage @ 1 mA
VBR
3.0
V
Minimum Snap Back Voltage @ 50 mA
VBR
2.8
V
Maximum Working Peak Voltage
VWM
2.8
V
Maximum Leakage Current @ VWM
(Pin 3 to Pin 1) or (Pin 2 to Pin 1)
ID
1.0
μA
Maximum Clamping Voltage @ IP= 2 A
VC
5.5
V
Maximum Clamping Voltage @ IP= 5 A
(Pin 2 to Pin 1)
VC
7.0
8.5
V
Maximum Clamping Voltage @ IP= 30 A
VC
21.0
V
Typical Junction Capacitance @ 0 V, 1 MHz
(Pin 3 to Pin 1 & Pin 2)
(Pin 2 to Pin 1 with Pin 3 NC)
CD
20
2.5
pF
CD
3
pF
Maximum Peak Reverse Voltage @ I = 10 μA
VRRM
40
V
Maximum Reverse Leakage Current @ VWM
IDR
0.1
μA
Maximum Forward Voltage @ IF= 1 A, 120 μS
VF
2
V
Maximum Junction Capacitance @ 0 V, 1 MHz
Note:
1.See Peak Pulse Power vs. Pulse Time.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CDSOT23-SLVU2.8 - Surface Mount TVS Diode
Product Dimensions
Recommended Footprint
This is a molded JEDEC SOT-323 package with 100 % Matte Sn
plating on the lead frame. It weighs approximately 8 mg and has a
flammability rating of UL 94V-0.
A
B
A
DIMENSIONS = MILLIMETERS
(INCHES)
B
3
C
1
C
SEE
DETAIL
D
A
2
E
E
F
DETAIL
A
GAUGE
PLANE
D
L
H
G
SEATING PLANE
DIMENSIONS = MILLIMETERS
(INCHES)
I
0 ° TO 8 °
Dimensions
J
Dimensions
A
2.80 - 3.00
(0.110 - 0.118)
B
0.95
BSC
(0.037)...........
C
1.20 - 1.40
(0.047 - 0.055)
D
2.10 - 2.49
(0.083 - 0.098)
E
1.90
BSC
(0.075)...........
F
0.30 - 0.50
(0.012 - 0.019)
G
0.89 - 1.17
(0.035 - 0.046)
H
0.05 - 0.015
(0.002 - 0.006)
I
0.25
BSC
(0.010)...........
J
0.46 - 0.64
(0.018 - 0.025)
K
0.40 - 0.58
(0.016 - 0.023)
L
0.08 - 0.20
(0.003 - 0.008)
K
A
0.95
(0.037)
B
0.95
(0.037)
C
2.00
(0.079)
D
0.85
(0.033)
E
0.85
(0.033)
How to Order
CD SOT23 - SLVU 2.8
Common Code
Chip Diode
Package
• SOT23 = SOT23 Package
Model
SLVU = Special Model
Working Peak Reverse Voltage
2.8 = 2.8 VRWM (Volts)
Typical Part Marking
CDSOT23-SLVU2.8 ....................................................................SLA
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CDSOT23-SLVU2.8 - Surface Mount TVS Diode
Performance Graphs
Pulse Waveform
IPP – Peak Pulse Current (% of IPP)
Peak Pulse Power vs. Pulse Time
PPP – Peak Pulse Power (W)
10,000
600 W, 8/20 µs Waveform
1,000
100
10
0.1
1
10
100
1,000
120
Test Waveform Parameters
tt = 8 µs
td = 20 µs
tt
100
80
et
60
40
td = t|IPP/2
20
0
10,000
5
0
10
td – Pulse Duration (µs)
15
20
25
30
t – Time (µs)
Power Derating Curve
Overshoot & Clamping Voltage
35
100
Peak Pulse Power
8/20 µs
15
0.2
5
% of Rated Power
5 Volts per Division
25
80
60
40
20
2
Average Power
0
-5
-72.000 ns
28.000 ns
20.0 ns/div
128.000 ns
real time
0
25
50
75
100
TL = Lead Temperature - °C
ESD Test Pulse: 25 kilovolt, 1/30 ns (waveshape)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
125
150
CDSOT23-SLVU2.8 - Surface Mount TVS Diode
Packaging Information
The surface mount product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481 standard.
P
0
P
1
Index
Hole
d
E
T
120 °
F
D2
W
B
D1
P
A
Trailer
.......
.......
End
C
Device
.......
.......
10 pitches (min.)
.......
.......
Leader
.......
.......
Symbol
A
2.25 ± 0.10
(0.088 ± 0.004)
Carrier Length
B
2.34 ± 0.10
(0.092 ± 0.004)
Carrier Depth
C
1.22 ± 0.10
(0.048 ± 0.004)
Sprocket Hole
d
1.55 ± 0.05
(0.061 ± 0.002)
Reel Outside Diameter
D
178
(7.008)
Reel Inner Diameter
D1
50.0
MIN.
(1.969)
D2
13.0 ± 0.20
(0.512 ± 0.008)
Sprocket Hole Position
E
1.75 ± 0.10
(0.069 ± 0.004)
Punch Hole Position
F
3.50 ± 0.05
(0.138 ± 0.002)
Punch Hole Pitch
P
4.00 ± 0.10
(0.157 ± 0.004)
Sprocket Hole Pitch
P0
4.00 ± 0.10
(0.157 ± 0.004)
Embossment Center
P1
2.00 ± 0.05
(0.079 ± 0.002)
Overall Tape Thickness
T
0.20 ± 0.10
(0.008 ± 0.004)
Tape Width
W
8.00 ± 0.20
(0.315 ± 0.008)
Reel Width
W1
Quantity per Reel
DIMENSIONS:
MM
(INCHES)
--
Devices are packed in accordance with EIA standard
RS-481-A.
SOT23
Carrier Width
Feed Hole Diameter
W1
Start
10 pitches (min.)
Direction of Feed
Item
D
14.4
MAX.
(0.567)
3,000
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
EMEA:
Tel: +36 88 520 390
Fax: +36 88 520 211
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
REV. 11/13
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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