05-08-1735

LU Package
32-Lead Plastic TQFP (5mm × 5mm)
(Reference LTC DWG # 05-08-1735 Rev Ø)
5.15 – 5.25
7.00 BSC
3.50 REF
5.00 BSC
32
0.50 BSC
1
2
3
32
SEE NOTE: 4
1
2
3
3.50 REF
7.00 BSC
5.00 BSC
5.15 – 5.25
A
A
0.22 – 0.30
PACKAGE OUTLINE
SEE NOTE: 5
1.30 MIN
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.20
0.95 – 1.05 MAX
11° – 13°
R0.08 – 0.20
GAUGE PLANE
0.25
0° – 7°
11° – 13°
0.09 – 0.22
1.00 REF
0.50
BSC
0.05 – 0.15
0.17 – 0.27
0.45 – 0.75
SECTION A – A
NOTE:
1. DRAWING CONFORMS TO JEDEC #MS-026 PACKAGE OUTLINE
2. DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT
4. PIN-1 INDENTIFIER IS A MOLDED INDENTATION
5. EXACT SHAPE OF EACH CORNER IS OPTIONAL
6. DRAWING IS NOT TO SCALE
LU32 TQFP 0906 REVØ
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