CDDFN2 TxxC

T
PL
IA
N
M
CO
*R
oH
S
Features
This series is currently available but
not recommended for new designs.
■ Bidirectional TVS
■ Low capacitance - 12 pF
■ ESD protection >15 kV
■ Fits 0402 footprint
CDDFN2-TxxC Series - Surface Mount TVS Diode
General Information
The CDDFN2-TxxC Series provides ESD and EFT protection for external ports of electronic devices
such as cellular phones, hand held electronics and other portable electronic devices.
The device measures 1.05 mm x 0.65 mm and is available in a DFN-2 package and is intended to be
mounted directly onto an FR4 printed circuit board. The device will fit an 0402 footprint.
The device is designed to meet IEC 61000-4-2(ESD) and IEC 61000-4-4(EFT) protection requirements.
Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Peak Pulse Power @ 8/20 μs
Peak Pulse Current @ 8/20 μs
Operating Temperature
Storage Temperature
Symbol
Ppk
Ipp
TOPR
TSTG
5.0C
75
5
CDDFN212C
25
1
-40 to +125
-55 to +150
24C
47
1
Unit
W
A
ºC
ºC
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Maximum Working Peak Voltage
Minimum Breakdown Voltage @ 1 mA
Maximum Leakage Current @ Vwm
Typical Capacitance @ 0 V 1 MHz
Maximum Capacitance @ 0 V 1 MHz
Maximum Clamping Voltage @ Ipp 8/20 μs
ESD Protection per IEC 61000-4-2
Minimum Contact Discharge
Minimum Air Discharge
Symbol
Vwm
VBR
IL
CJ
CJ
Vc
ESD
ESD
5.0C
5.0
6.0
15
15
CDDFN212C
12
13
2.0
12
20
25
24C
24
25
10
47
8
15
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Unit
V
V
μA
pF
pF
V
kV
kV
CDDFN2-TxxC Series - Surface Mount TVS Diode
Product Dimensions
Recommended PCB Footprint
This is a Molded DFN-2 package with lead free 100 % Au plating on
the terminations. It weighs approximately 10 mg.
1.40
(0.055)
0.85
(0.033)
A
0.30
(0.012)
0.80
(0.031)
TOP
B
0.55
(0.022)
H
C
Typical Part Marking
CDDFN2-T5.0C ............................................................................ E5
CDDFN2-T12C ............................................................................. E2
CDDFN2-T24C ............................................................................. E4
D
BOTTOM
0.55
(0.022)
E
SIDE
How to Order
F
CD DFN2 - T 5.0 C
Common Diode
Chip Diode
G
A
B
C
D
E
F
G
H
Dimensions
0.55-0.65
(0.022-0.026)
0.95- 1.05
(0.037-.041)
0.45-0.55
(0.018-.022)
0.30
(0.012) TYP.
0.43
(0.017) TYP.
0.30
(0.012) TYP.
0.50
(0.020) TYP.
0.50
(0.020) TYP.
DIMENSIONS:
Package
DFN2 = DFN-2 Package
Model
Transient Voltage Suppressor
Working Peak Reverse Voltage
5.0 = 5.0 VRWM (Volts)
12.0 = 12.0 VRWM (Volts)
24.0 = 24.0 VRWM (Volts)
Suffix
C = Bidirectional Diode
Block Diagram
MM
(INCHES)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CDDFN2-TxxC Series - Surface Mount TVS Diode
Rating & Characteristic Curves
Pulse Waveform
Reverse Characteristics
120
Test Waveform Parameters
tt = 8 µs
td = 20 µs
tt
100
Reverse Current (A)
IPP – Peak Pulse Current (% of IPP)
10u
80
et
60
40
1u
100n
td = t|IPP/2
20
0
10n
0
5
10
15
20
25
30
0
20
40
t – Time (µs)
60
80
100
Reverse Voltage (%)
Power Derating Curve
Capacitance Between Terminals
15
Mounting on Glass Epoxy PCBs
Capacitance Between Terminals (pF)
100
Power Rating (%)
80
60
40
20
5V
12
12 V
9
24 V
6
3
0
0
0
25
50
75
100
Ambient Temperature (°C)
125
150
0
10
20
Reverse Voltage (V)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
30
40
CDDFN2-TxxC Series - Surface Mount TVS Diode
Packaging Information
The surface mount product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481 standard.
P
0
P
1
d
T
E
Index Hole
120 °
F
D2
W
B
D1 D
P
A
Trailer
.......
.......
End
C
Device
.......
.......
.......
.......
Leader
.......
.......
W1
Start
DIMENSIONS:
10 pitches (min.)
MM
(INCHES)
10 pitches (min.)
Direction of Feed
Item
Symbol
DFN-2
Carrier Width
A
0.80 ± 0.10
(0.031 ± 0.004)
Carrier Length
B
1.20 ± 0.10
(0.047 ± 0.004)
Carrier Depth
C
0.70 ± 0.10
(0.027 ± 0.004)
Sprocket Hole
d
1.55 ± 0.05
(0.061 ± 0.002)
Reel Outside Diameter
D
178
(7.008)
Reel Inner Diameter
D1
50.0
MIN.
(1.969)
Feed Hole Diameter
D2
13.0 ± 0.20
(0.512 ± 0.008)
Sprocket Hole Position
E
1.75 ± 0.10
(0.069 ± 0.004)
Punch Hole Position
F
3.50 ± 0.05
(0.138 ± 0.002)
Punch Hole Pitch
P
4.00 ± 0.10
(0.157 ± 0.004)
Sprocket Hole Pitch
P0
4.00 ± 0.10
(0.157 ± 0.004)
Embossment Center
P1
2.00 ± 0.05
(0.079 ± 0.002)
Overall Tape Thickness
T
0.20 ± 0.10
(0.008 ± 0.004)
Tape Width
W
8.00 ± 0.20
(0.315 ± 0.008)
Reel Width
W1
Quantity per Reel
--
14.4
MAX.
(0.567)
5000
REV. 12/15
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different
applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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