Plastic Packages for Integrated Circuits Package Outline Drawing L10.3x3B 10 LEAD THIN DUAL FLAT PACKAGE (TDFN) WITH E-PAD Rev 4, 4/15 3.00 5 PIN #1 INDEX AREA A B 1 2 0.50 3.00 2.38 +0.1/ - 0.15 10 5 PIN 1 INDEX AREA 0.25 +0.05/ - 0.07 6 (4X) 0.15 1.64 +0.1/ -0.15 TOP VIEW BOTTOM VIEW 10x 0.40 +/- 0.1 SEE DETAIL "X" (10x0.60) (10X0.25) 0.75 0.10 C SEATING PLANE 0.08 C 2.38 0.05 C SIDE VIEW (8x 0.50) 1.64 2.80 TYP TYPICAL RECOMMENDED LAND PATTERN C 0.20 REF 4 0.05 DETAIL "X" NOTES: 1 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 5. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.