Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L16.5x3
16 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 4/15
2.20
3.00
A
B
1.65
6
PIN 1
INDEX AREA
16
1
0.50
3.50
5.00
4.40
6
PIN 1
INDEX AREA
0.25
8 b 4
9
(4X)
0.15
0.10 M C A B
0.40 ± 0.1
TOP VIEW
BOTTOM VIEW
(16X 0.60)
0.10 C
0.75
SEE DETAIL "X"
(16X 0.25)
C
BASE PLANE
0.05 MAX
SEATING PLANE
0.08 C
4.40
SIDE VIEW
C
0.20 REF
5
0.05 MAX
(14X 0.50)
DETAIL "X"
1.65
2.20
TYPICAL RECOMMENDED LAND PATTERN
1
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.18mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.