Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L12.3x3C
12 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (0.4mm PITCH)
Rev 1, 4/15
3.00
6
PIN #1
INDEX AREA
A
B
6
PIN 1
INDEX AREA
3.00
0.40
(4X)
2.45±0.1
0.15
12x 0.20
0.10 M C A B
4 0.20 ±0.05
1.70±0.1
TOP VIEW
12x 0.40
BOTTOM VIEW
PACKAGE
OUTLINE
SEE DETAIL "X"
0.10 C C
BASE PLANE
SEATING PLANE
0.08 C
0 . 75
(12 x0.20)
SIDE VIEW
2.45
(10 x0.40)
C
1.70
(12 x0.20)
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
(12 x0.40)
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.25mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.