Plastic Packages for Integrated Circuits Package Outline Drawing L14.4x3 14 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 1, 4/15 3.00 SEE DETAIL "X" A PIN #1 INDEX AREA B 6 PIN 1 INDEX AREA 14 4.00 (4X) 1 3.2 ±0.05 2X 3.00 7 8 0.10 TOP VIEW 6 12X 0.50 14X 0.25 ±0.05 0.80 MAX 0.10 M C A B C 1.70 ±0.05 14X 0.40 ± 0.05 4 SIDE VIEW BOTTOM VIEW (14X 0.60) ( 14 X 0.25) 0.10 C C ( 3.20 ) 0 . 2 REF ( 3.00) SEATING PLANE 0 . 00 MIN. 0 . 05 MAX. 0.08 C DETAIL "X" (12x 0.50) (1.70) ( 2.80 ) TYPICAL RECOMMENDED LAND PATTERN 1 NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Reference document JEDEC MO-229.