Plastic Packages for Integrated Circuits Package Outline Drawing L14.3.5x3.5 14 LEAD QUAD DUAL FLAT NO-LEAD PLASTIC PACKAGE (QFN) Rev 0, 2/08 3.50 2x 2.0 A PIN 1 6 INDEX AREA 8x 0.50 6 B PIN #1 INDEX AREA 2 6 1 3.50 7 2.05 ± 0 . 15 2x 1.50 8 14 0.15 (4X) 13 9 TOP VIEW 0.10 M C A B 0.07 4 16X 0.23 +- 0.05 VIEW “A-A” 14x 0.40 ± 0.10 BOTTOM VIEW ( 2.00 ) (8x 0.50) SEE DETAIL "X" 0.10 C C 0 . 90 ± 0.1 BASE PLANE SEATING PLANE 0.08 C ( 3.30 TYP ) ( ( 2x 1.5 ) 2.05) SIDE VIEW ( 14x 0.23 ) C ( 14 x 0.60) TYPICAL RECOMMENDED LAND PATTERN 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. DETAIL “X” NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Lead width dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 1