Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L20.4x4
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 4, 6/15
4x 2.0 ±0.05
4.00 ±0.05
A
B
16x 0.50 ±0.05
16
6
PIN 1
INDEX AREA
6
PIN #1 INDEX AREA
20
1
15
4.00 ±0.05
2.10 ±0.15
11
5
0.15
(4x)
6
10
TOP VIEW
0.10 M C A B
4 0.25 +0.05/-0.07
20x 0.6 +0.15/-0.25
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
0.90 ±0.1
C
BASE PLANE
(3.6 TYP)
SEATING PLANE
0.08 C
(20x 0.5)
( 2.10)
SIDE VIEW
(20x 0.25)
C
0.2 REF
5
0.00 MIN.
0.05 MAX.
(20x 0.8)
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance: Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1