Plastic Packages for Integrated Circuits Package Outline Drawing L20.4x4I 20 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 1, 3/15 (0.711) 4.00 A 1.678 (0.461) B 6 PIN 1 INDEX AREA 20 0.10 6 PIN #1 INDEX AREA 1 20x 0.40 1.25 4.00 4.00 3.40 4 20x 0.20 2.15 (4X) 10 11 0.10 0.10 TOP VIEW 0.10 M C A B 20X 0.45 2.60 4.00 SEE DETAIL "X" 0.10 C C BASE PLANE SEATING PLANE 0.08 C BOTTOM VIEW 0.711 0.461 (1.678) PACKAGE OUTLINE C 0.65 0 . 203 REF 0 . 00 MIN. 0 . 05 MAX. (16x 0.40) 0.10 (1.25) 5 DETAIL "X" 0.60 0.20 (4.00) (3.40) (2.15) 0.20 0.40 0.40 0.10 2.60 0.25 (20x 0.65) 0.70 0.90 TYPICAL RECOMMENDED LAND PATTERN 0.035 0.203 SIDE VIEW NOTES: 1 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. JEDEC reference drawing: MO-229.