Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L32.5x5J
32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 12/13
4X 3.5
5.00
28X 0.50
A
B
25
6
PIN 1
INDEX AREA
6
PIN #1
INDEX AREA
32
1
5.00
24
3.30 ± 0.15
17
(4X)
8
0.15
16
TOP VIEW
9
32X 0.40 ± 0.10
4 32X 0.23
0.10 M C A B
BOTTOM VIEW
SEE DETAIL “X”
0.10 C
C
SEATING PLANE
0.08 C
0.75 ± 0.05
(4.80 TYP)
(28X 0.5)
(
SIDE VIEW
3.30)
C
(32X 0.23)
0.2 REF
5
0.00 MIN
0.05 MAX
(32X 0.60)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASMEY 14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.