Plastic Packages for Integrated Circuits Package Outline Drawing W4x5.20N 20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch) (With BSC) Rev 0, 2/15 X 0.400 1.74 ±0.030 Y E 20x 0.265 ±0.035 D C 2.15 ±0.030 B A (4X) 0.10 TOP VIEW 0.275 1 PIN 1 (A1 CORNER) 2 3 4 0.200 0.270 BOTTOM VIEW Z 0.05 Z 0.240 PACKAGE OUTLINE SEATING PLANE 3 0.040 (BSC) (BACKSIDE COATING) 0.400 0.290 2 0.265 ±0.035 x20 0.10 0.05 Z X Y Z 4 0.200 ±0.030 6 NSMD RECOMMENDED LAND PATTERN 0.540 ±0.050 SIDE VIEW NOTES: 1. Dimensions and tolerance per ASMEY 14.5 - 1994. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z . 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. 5. All dimensions are in millimeters. 6. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. 1