511BE

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN8 2x2, 0.5P
CASE 511BE−01
ISSUE A
1
DATE 27 MAY 2011
SCALE 2:1
A
D
PIN ONE
REFERENCE
2X
0.10 C
2X
E
DETAIL A
TOP VIEW
ÎÎÎ
ÏÏÏ
ÎÎ
ÏÏ
ÏÏÏ
EXPOSED Cu
A
DETAIL B
A3
MOLD CMPD
A1
DETAIL B
0.08 C
ALTERNATE
CONSTRUCTIONS
A1
SIDE VIEW
C
D2
DETAIL A
1
8X
4
SEATING
PLANE
5
8
e
L
1
8X
b
0.05 C
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
XX MG
G
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
8X
1.70
PACKAGE
OUTLINE
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.50
1.70
2.00 BSC
0.80
1.00
0.50 BSC
0.25 REF
0.20
0.40
−−−
0.15
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
0.10 C A B
BOTTOM VIEW
A3
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
GENERIC
MARKING DIAGRAM*
E2
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ALTERNATE
CONSTRUCTIONS
0.10 C
NOTE 4
L
L1
ÎÎ
ÎÎ
ÎÎ
0.10 C
L
B
0.50
1.00
2.30
1
0.50
PITCH
8X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON48936E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WDFN8, 2X2, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON48936E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
21 JUL 2010
A
ADDED MISSING K LABEL TO BOTTOM VIEW. REQ. BY C. GOYON.
27 MAY 2011
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 01A
Case Outline Number:
511BE
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