511BN

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN8, 2.2x2, 0.5P
CASE 511BN
ISSUE A
8
DATE 11 DEC 2012
1
SCALE 4:1
PIN ONE
REFERENCE
2X
L
A B
D
ÏÏÏ
ÏÏÏ
ÏÏÏ
L1
E
DETAIL A
OPTIONAL
CONSTRUCTIONS
0.10 C
0.10 C
2X
ÎÎ
ÏÏ
ÎÎ
EXPOSED Cu
TOP VIEW
A
DETAIL B
0.05 C
ÏÏ
ÎÎ
ÏÏ
MOLD CMPD
A1
DETAIL B
9X
0.05 C
OPTIONAL
CONSTRUCTIONS
A1
A3
SIDE VIEW
NOTE 4
SEATING
PLANE
C
b1
0.10 C A B
DETAIL C
D2
1
4X
L3
E2
L
8
NOTE 3
1
XX MG
G
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
0.54
0.30
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.15
0.25
0.25
0.35
2.20 BSC
0.34
0.54
2.00 BSC
0.60
0.80
0.50 BSC
0.75
0.95
0.05
0.15
0.30
0.50
0.15
0.25
XX = Specific Device Code
M = Date Code
G
= Pb−Free Device
DETAIL A
BOTTOM VIEW
7X
DIM
A
A1
A3
b
b1
D
D2
E
E2
e
L
L1
L2
L3
DETAIL C
5
e
e/2
A3
GENERIC
MARKING DIAGRAM*
L2
0.10 C A B
b
0.10 C A B
0.05 C
2X
4
7X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PACKAGE
OUTLINE
0.80
2.30
4X
4X
1.00
0.60
1
0.40
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON52381E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WDFN8, 2.2X2.0, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON52381E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
06 JUL 2010
A
CORRECTED DETAIL C LABEL FROM B2 TO B1. REQ. BY M. BEGONIA.
11 DEC 2012
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2012
December, 2012 − Rev. A
Case Outline Number:
511BN
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