511BH

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN8 3x3, 0.65P
CASE 511BH−01
ISSUE O
1
DATE 21 JUL 2010
SCALE 2:1
A
D
B
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L1
PIN ONE
REFERENCE
2X
ÎÎÎ
ÎÎÎ
ÎÎÎ
DETAIL A
E
ALTERNATE
CONSTRUCTIONS
0.10 C
2X
0.10 C
ÎÎÎ
ÎÎ
ÏÏ
ÏÏÏ ÎÎ
EXPOSED Cu
TOP VIEW
A
DETAIL B
0.10 C
MOLD CMPD
A1
A3
DETAIL B
ALTERNATE
CONSTRUCTIONS
0.08 C
A1
NOTE 4
C
SIDE VIEW
D2
DETAIL A
1
8X
4
A3
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.25
0.35
3.00 BSC
2.20
2.40
3.00 BSC
1.40
1.60
0.65 BSC
0.45 REF
0.20
0.40
−−−
0.15
SEATING
PLANE
L
E2
5
8
e
8X
b
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
8X
2.46
PACKAGE
OUTLINE
0.53
1.66
3.30
1
0.65
PITCH
8X
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON49350E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WDFN8, 3X3, 0.65P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON49350E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
DATE
21 JUL 2010
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2010
July, 2010 − Rev. 01O
Case Outline Number:
511BH