Plastic Packages for Integrated Circuits Package Outline Drawing W4x5.20A 20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) Rev 2, 6/16 1.200 X 1.595 ±0.02 Y 0.400 5 0.400 20X 0.270 ±0.03 4 3 2.335 ±0.02 1.600 2 1 0.367 (4X) 0.10 A PIN 1 (A1 CORNER) TOP VIEW B C D 0.197 0.200 BOTTOM VIEW Z 0.05 Z PACKAGE OUTLINE 0.225 3 SEATING PLANE 0.300 ±0.025 0.400 0.275 0.270 ±0.03 0.10 0.05 ZXY Z 0.200 ±0.03 TYPICAL RECOMMENDED LAND PATTERN 0.555 MAX SIDE VIEW NOTES: 1. Dimensions and tolerance per ASME Y 14.5M - 1994. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z . 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. 5. There shall be a minimum clearance of 0.10mm between the edge of the bump and the body edge. 1