Plastic Packages for Integrated Circuits Package Outline Drawing W4x5.20G 20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH) Rev 0, 11/13 1.200 X Y 0.400 1.67±0.030 E D 20x 0.265±0.035 C 2.07±0.030 1.600 B 0.235 A (4X) 0.10 1 0.200 TOP VIEW 2 3 4 0.235 PIN 1 (A1 CORNER) BOTTOM VIEW Z PACKAGE OUTLINE 0.05 Z SEATING PLANE 3 0.240 0.040 BSC (BACK SIDE COATING) 0.400 0.290 0.265±0.035 x20 0.10 0.05 ZXY Z 0.200±0.030 RECOMMENDED LAND PATTERN 0.540±0.050 SIDE VIEW NOTES: 1. Dimensions and tolerance per ASME Y 14.5M - 1994. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z . 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. 5. There shall be a minimum clearance of 0.10mm between the edge of the bump and the body edge. 1