Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
W4x5.20E
20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (BSC)
Rev 1, 1/13
1.200
X
Y
1.82±0.030
0.400
E
20x 0.265±0.035
2.15±0.030
D
C
1.600
B
0.275
A
(4X)
0.10
1
2
4
3
0.310
TOP VIEW
0.200
PIN 1
(A1 CORNER)
BOTTOM VIEW
Z
0.05 Z
PACKAGE
OUTLINE
0.240
SEATING PLANE
3
0.040 BSC
(BACK SIDE COATING)
0.290
0.400
0.265±0.035
0.10
0.05
ZXY
Z
0.200±0.030
RECOMMENDED LAND PATTERN
0.540±0.050
SIDE VIEW
NOTES:
1. Dimensions and tolerance per ASME Y 14.5M - 1994.
2. Dimension is measured at the maximum bump diameter
parallel to primary datum Z .
3. Primary datum Z and seating plane are defined by the spherical
crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
5. There shall be a minimum clearance of 0.10mm between
the edge of the bump and the body edge.
1