1.5SMC6.8A~440A, 1.5SMC6.8CA~120CA

MATERIAL DECLARATION SHEET
Material Number
1.5SMC6.8A ~ 440A, 6.8CA ~ 120CA
Product Line
Semiconductors
Compliance Date
2015/04/08
RoHS Compliant
No.
Yes
Construction
Element(subpart)
MSL
1
Homogeneous
Material
Material
weight [mg]
1
Dice
Silicon
4.829
2
Die attach (Solder)
solder paste
9.170
3
Lead frame / Leads /
Disc
Copper alloy
110.667
Epoxy material
112.150
Matte-Tin
Total weight
1.275
238.091
4
5
Molding Compound
Plating
This Document was updated on:
Homogeneous
CASRN
Material\
if applicable
Substances
Silicon
7440-21-3
Phosphorous
7723-14-0
Boron
7440-42-8
Nickel
7440-02-0
Lead glass
7439-92-1
Silicon dioxide
7631-86-9
Aluminum oxide
1344-28-1
Tin
7440-31-5
Lead
7439-92-1
Silver
7440-22-4
Copper
7440-50-8
Iron
7439-89-6
Phosphorus
7723-14-0
Silica
14808-60-7
Epoxy resin
25928-94-3
Phenolic resin-A,-B 9003-35-4
Aluminum hydroxide 21645-51-2
Carbon black
1333-86-4
Tin
7440-31-5
Materials
Mass %
60.1800%
0.0100%
0.0100%
14.8000%
12.5000%
10.0000%
2.5000%
5.000%
92.500%
2.500%
99.800%
0.150%
0.050%
76.000%
9.000%
8.000%
6.000%
1.000%
100.000%
Material
Mass % of
total unit wt
1.221%
0.0002%
0.0002%
0.300%
0.254%
0.203%
0.0507%
0.193%
3.563%
0.096%
46.388%
0.070%
0.023%
35.799%
4.239%
3.768%
2.826%
0.471%
0.536%
Subpart
mass of total
wt. (%)
2.028%
3.851%
46.481%
47.104%
0.536%
2015/04/08
(EU) RoHS Directive 2011/65/EU ANNEX - Application of lead which are exempted from the requirements : 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys
containing 85 % by weight or more lead), and; 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g.
piezoelectronic devices, or in a glass or ceramic matrix compound.
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