1.5SMC480A~550A, 1.5SMC130CA~550CA

MATERIAL DECLARATION SHEET
Material Number
1.5SMC480A~550A , 130CA~550CA
Product Line
Semiconductors
Compliance Date
RoHS Compliant
No.
Construction
Element(subpart)
2015/04/08
Yes
MSL
Homogeneous
Material
Material
weight [mg]
1
Dice
Silicon
7.358
2
Die attach
(Solder)
solder paste
13.250
3
Lead frame /
Leads / Disc
Copper alloy
110.667
4
Molding
Compound
Epoxy material
111.333
5
Plating
Matte-Tin
1.275
Total weight
This Document was updated on:
1
Homogeneous
Material\
Substances
Silicon
Phosphorous
Boron
Nickel
Lead glass
Silicon dioxide
Aluminum oxide
Tin
Lead
Silver
Copper
Iron
Phosphorus
Silica
Epoxy resin
Phenolic resin-A,-B
Aluminum hydroxide
Carbon black
Tin
CASRN
if applicable
Materials
Mass %
7440-21-3
7723-14-0
7440-42-8
7440-02-0
7439-92-1
7631-86-9
1344-28-1
7440-31-5
7439-92-1
7440-22-4
7440-50-8
7439-89-6
7723-14-0
14808-60-7
25928-94-3
9003-35-4
21645-51-2
1333-86-4
7440-31-5
60.1800%
0.0100%
0.0100%
14.8000%
12.5000%
10.0000%
2.5000%
5.000%
92.500%
2.500%
99.800%
0.150%
0.050%
76.000%
9.000%
8.000%
6.000%
1.000%
100.000%
Material
Mass % of
total unit wt
1.816%
0.0003%
0.0003%
0.447%
0.377%
0.302%
0.0754%
0.272%
5.025%
0.136%
45.286%
0.068%
0.023%
34.694%
4.109%
3.652%
2.739%
0.457%
0.523%
Subpart
mass of total
wt. (%)
3.017%
5.433%
45.377%
45.650%
0.523%
243.883
2015/04/08
(EU) RoHS Directive 2011/65/EU ANNEX Application of lead which are exempted from the requirement: 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys
containing 85 % by weight or more lead), and; 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g.
piezoelectronic devices, or in a glass or ceramic matrix compound.
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