711AT

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN6 1.20x1.20, 0.40P
CASE 711AT
ISSUE C
SCALE 4:1
DATE 04 DEC 2015
D
PIN ONE
REFERENCE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO THE PLATED
TERMINALS.
4. COPLANARITY APPLIES TO THE PAD AS
WELL AS THE TERMINALS.
A
B
ÍÍÍ
ÍÍÍ
E
DIM
A
A1
b
D
D2
E
E2
e
L
L1
L
TOP VIEW
DETAIL A
OPTIONAL
CONSTRUCTION
A
0.05 C
A1
GENERIC
MARKING DIAGRAM*
0.05 C
NOTE 4
C
SIDE VIEW
MILLIMETERS
TYP
MAX
0.37
0.45
0.03
0.05
0.18
0.23
1.20
1.25
1.04
0.94
1.20
1.25
0.30
0.40
0.40 BSC
0.15
0.20
0.25
0.05
0.00
0.10
MIN
0.30
0.00
0.13
1.15
0.84
1.15
0.20
SEATING
PLANE
XX M
D2
6X
1
3
L1
XX = Specific Device Code
M = Date Code
E2
6X
*This information is generic. Please refer
to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “
G”, may or may not be present.
L
6
DETAIL A
4
6X
e
RECOMMENDED
MOUNTING FOOTPRINT*
b
0.10
BOTTOM VIEW
M
C A B
1.08
NOTE 3
PACKAGE
OUTLINE
6X
0.37
1.40
0.40
1
0.40
PITCH
6X
0.24
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON76141F
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
http://onsemi.com
XDFN6, 1.20 X 1.20, 0.40P
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON76141F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY I. MARIANO.
03 SEP 2013
A
CORRECTED DIMENSION L LABEL IN BOTTOM VIEW. CORRECTED MARKING
DIAGRAM INFORMATION TO ADD CHARACTER. REQ. BY I. HYLAND.
16 JUN 2015
B
ADDED TYPICAL VALUES PER CUSTOMER’S REQUEST. REQ. BY J. SUPINA.
20 OCT 2015
C
MODIFIED DIMENSION L1 VALUES. REQ. BY J. SUPINA.
04 DEC 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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© Semiconductor Components Industries, LLC, 2015
December, 2015 − Rev. C
Case Outline Number:
711AT
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