BHxxMA3W

Datasheet
CMOS LDO Regulators for Portable Equipments
1ch 300mA
CMOS LDO Regulators
BHxxMA3 series
●General Description
BHxxMA3 series are high-performance CMOS LDO
regulators with output current ability of up to 300mA. These
devices have excellent noise characteristics despite of
their low circuit current consumption of 65µA. They are
most appropriate for various applications such as power
supplies for logic IC, RF, and camera modules.
●Key Specifications
„ Input Power Supply Voltage Range:
„ Output Current Range:
„ Operating Temperature Range:
„ Output Voltage Lineup:
„ Output Voltage Accuracy:
„ Circuit Current:
„ Standby Current:
●Package
HVSOF6
●Features
„ High Output Voltage Accuracy: ±1 %
(±25mV on VOUT<2.5V products)
„ Dropout voltage: 60mV (IOUT=100mA)
„ Compatible with small ceramic capacitor
„ Output Voltage ON/OFF Control
„ Built-in Over Current Protection Circuit (OCP)
„ Built-in Thermal Shutdown Circuit (TSD)
„ Ultra-small power package:HVSOF6
2.5V to 5.5V
0 to 300mA
-40 to 85℃
1.5V to 3.3V
±1%
65μA (Typ.)
0μA (Typ.)
W(Typ.) x D(Typ.) x H(Max.)
1.60mm x 3.00mm x 0.75mm
●Applications
„ Battery-driven portable devices
„ Other electronic devices using microcontrollers or
logic circuits
●Typical Application Circuit
Vin
VIN
Vout
VOUT
Cout
Cin
VOUT
BHxxMA3
On
Off
NOISE
STBY
GND
Cn
Figure 1. Typical Application Circuit
○Product structure:Silicon monolithic integrated circuit
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Datasheet
BHxxMA3 series
●Pin Configuration
STBY GND
VIN
NOISE
VOUT VOUT
●Pin Description
Pin No.
Symbol
Function
1
VIN
2
VOUT
OUTPUT Pin
3
VOUT
OUTPUT Pin
4
NOISE
NOISE reducing capacitor ground terminal
5
GND
GROUND Pin
6
STBY
OUTPUT CONTROL Pin (High:ON,Low:OFF)
reverse
FIN
INPUT Pin
OPEN
●Block Diagram
VIN
1
VOLTAGE
REFERENCE
+
GND
5
THERMAL
PROTECTION
VOUT
2
3
VOUT
OVER CURRENT
PROTECTION
STBY
6
CONTROL
BLOCK
NOISE
4
Figure 2. Block diagram
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Datasheet
BHxxMA3 series
●Absolute Maximum Ratings
Parameter
Symbol
Ratings
Unit
VMAX
-0.3 to +6.5
V
Pd
680(*1)
mW
Tjmax
+125
℃
Operating Temperature Range
Topr
-40 to +85
℃
Storage Temperature Range
Tstg
-55 to +125
℃
Maximum Power Supply Voltage Range
Power Dissipation
Maximum Junction Temperature
(*1) Derate by 6.8mW/℃ when operating above Ta=25℃. (When mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer.)
●Recommended Operating Ratings
Parameter
Symbol
Input Power Supply Voltage Range
Maximum Output Current Range
Limit
Unit
VIN
2.5 to 5.5
V
IMAX
0 to 300
mA
●Recommended Operating Conditions
(*2)
Parameter
Symbol
Input Capacitor
Ratings
Unit
Conditions
-
µF
A ceramic capacitor is recommended.
-
-
µF
A ceramic capacitor is recommended.
0.01
0.22
µF
A ceramic capacitor is recommended.
Min.
Typ.
Max.
Cin
1.0(*2)
-
Output Capacitor
Cout
1.0(*2)
Noise Decrease Capacitor
Cn
-
Set the value of the capacitor so that it does not fall below the minimum value. Take into considerations the temperature characteristics,
DC device characteristics, and degradation with time.
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Datasheet
BHxxMA3 series
●Electrical characteristics
(*3)
(Unless otherwise noted, Ta=25℃,VIN=VOUT+1.0V ,STBY=1.5V, Cin=1μF, Co=1μF, Cn=0.01μF.)
Limit
PARAMETER
Symbol
UNIT
Conditions
MIN.
TYP.
MAX.
【REG】
VOUT
VOUT
IOUT=1mA, VOUT≧2.5V
VOUT
×1.01
×0.99
V
Output Voltage
VOUT
VOUT
VOUT
IOUT=1mA, VOUT<2.5V
VOUT
+25mV
-25mV
Circuit Current
IGND
65
95
μA
IOUT=1mA
Circuit Current (STBY)
ISTBY
1.0
μA
STBY=0V
Ripple Rejection Ratio
R.R.
60
dB
VRR=-20dBv,fRR=1kHz,IOUT=10mA
VIN=0.98×VOUT,IOUT=100mA
Dropout Voltage
VSAT1
60
90
mV
VOUT≧2.5V
IOUT=1mA
Line Regulation
VDL1
2
20
mV
VIN=VOUT+0.5V to 5.5V(*4)
Load Regulation 1
VDLO1
6
30
mV
IOUT=1mA to 100mA
Load Regulation 2
VDLO2
18
90
mV
IOUT=1mA to 300mA
Output Voltage
⊿VOUT/⊿Ta
±100
ppm/℃ IOUT=1mA,Ta=-40 to +85℃
Temperature
【OCP】
Limit Current
Short Current
ILMAX
ISHORT
310
-
600
100
1300
-
mA
mA
【STBY】
STBY Pull-down Resistor
ON
STBY Control
OFF
Voltage
RSTB
VSTBH
VSTBL
550
1.5
-0.3
1100
-
2200
VCC
0.3
kΩ
V
V
Vo=VOUT×0.85
Vo=0V
(*3) VIN=3.5V for VOUT<2.5V.
(*4) VIN=3.0V to 5.5V for VOUT<2.5V.
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Datasheet
BHxxMA3 series
●Reference data BH30MA3WHFV (Unless otherwise specified, Ta=25℃.)
Figure 3. Output Voltage vs. Input Voltage
Figure 4. GND Current vs. Input Voltage
Figure 5. Output Voltage vs. Output Current
(OCP Threshold)
Figure 6. Dropout Voltage vs. Output Current
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Datasheet
BHxxMA3 series
●Reference data BH30MA3WHFV (Ta=25℃, unless otherwise specified.)
Figure 7. Output Voltage vs. Temperature
Figure 8. Ripple Rejection vs. Frequency
Figure 9. Load response
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Figure 10. Startup time
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Datasheet
BHxxMA3 series
●About input/output capacitor
Capacity value of ceramic capacitor - DC bias characteristics
(Example)
10-V withstand voltage
B1characteristics
GRM188B11A105KA61D
10
0
-10
Capacitance Change [%]
It is recommended that an input capacitor is placed near pins
between the VCC pin and GND as well as an output capacitor
between the output pin and GND. The input is valid when the
power supply impedance is high or when the PCB trace has
significant length. For the output capacitor, the greater the
capacitance, the more stable the output will be depending on
the load and line voltage variations. However, please check the
actual functionality of this capacitor by mounting it on a board
for the actual application. Ceramic capacitors usually have
different, thermal and equivalent series resistance
characteristics, and may degrade gradually over continued
use.
For additional details, please check with the manufacturer,
and select the best ceramic capacitor for your application
10-V withstand voltage
B characteristics
-20
6.3-V withstand voltage
B characteristics
-30
10-V withstand voltage
F characteristics
-40
-50
-60
4-V withstand voltage
X6S characteristics
10-V withstand voltage
F characteristics
-70
-80
-90
-100
0
0.5
1
1.5
2
2.5
3
3.5
4
DC Bias Voltage [V]
Figure 11. Capacity-bias characteristics
Cout=1.0μF,Cin=1.0μF,Temp=+25℃
●Equivalent Series Resistance (ESR) of a Ceramic Capacitor
100
10
ESR [Ω]
Capacitors generally have ESR (equivalent series resistance) and it
operates stably in the ESR-IOUT area shown on the right. Since
ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc.
generally have different ESR, please check the ESR of the capacitor to
be used and use it within the stability area range shown in the right
graph for evaluation of the actual application.
1
Stable region
0.1
0.01
0
50
100
150
200
250
300
Output Current IOUT [mA]
Figure 12. Stable region (example)
●Power Dissipation (Pd)
As for power dissipation, an estimate of heat reduction characteristics and internal power consumption of IC are shown, so
please use these for reference. Since power dissipation changes substantially depending on the implementation conditions
(board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd
on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as
causing the operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare
sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
Where : VIN=Input voltage
VOUT= Output voltage IOMAX: Maximum output current
PMAX=(VIN-VOUT)×IOMAX
0.8
0.68W
0.7
Pd (W)
0.6
Standard ROHM
board
0.5
* Please design the margin so that
PMAX becomes is than Pd (PMAX<Pd)
within the usage temperature range
0.4
0.3
0.2
0.1
0
0
25
75 85
50
100
125
Ta (℃)
Figure 13.HVSOF6 Power dissipation heat reduction characteristics (Reference)
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Datasheet
BHxxMA3 series
●Operational Notes
1) Absolute maximum ratings
This product is produced with strict quality control, however it may be destroyed if operated beyond its absolute
maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open
circuit modes, etc. T h e r e f o r e , i t i s i m p o r t a n t t o c o n s i d e r c i r c u i t p r o t e c t i o n m e a s u r e s , l i k e a d d i n g a
fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings.
2) GND Potential
GND potential must be the lowest potential of all pins of the IC at all operating conditions. Ensure that no pins are at a
voltage below the ground pin at any time, even during transient condition.
3) Setting of Heat
Carry out the heat design that have adequate margin considering Pd of actual working states.
4) Pin Short and Mistake Fitting
When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is mistake in the placement, the IC
may be burned up.
5) Actions in Strong Magnetic Field
Using the IC within a strong magnetic field may cause the IC to malfunction.
6) Mutual impedance
Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as
possible. Use a capacitor to keep ripple to a minimum.
7) STBY Pin Voltage
For standby mode, set STBY voltage below 0.3V. For normal operation, set the pin voltage beyond 1.5V. It is not
recommended to set STBY voltage between 0.3V and 1.5V, as it may cause malfunctions.
8) Over Current Protection Circuit
Over current and short circuit protection is built-in at the output, and IC destruction is prevented at the time of load
short circuit. These protection circuits are effective in the destructive prevention by the sudden accident. Please
avoid applications where the over current protection circuit operates continuously.
9) Thermal shutdown
This IC also features a thermal shutdown circuit that is designed to turn off the output when the junction temperature of
the IC exceeds about 170℃. This feature is intended to protect the IC only in the event of thermal overload and is not
designed to guarantee operation or act as an active security device for applications. Therefore, it is not recommended
that you design application where TSD will work in normal condition.
TSD ON TEMPURATURE(℃) (typ.)
HYSTERESIS TEMPURATURE(℃) (typ.)
170
15
BHxxMA3 series
10) Noise Pin
NOISE pin can drive small current, since it is directly connected to reference voltage circuit. The output voltage may
drop when the load of NOISE pin is more than 100nA. If the pin is connected to a capacitor, please use ceramic
capacitor for small leak current. Please take note that the output noise is smaller as NOISE pin capacitor is larger,
but startup time is longer.
11)Output capacitor
To prevent oscillation at output, it is recommended that the IC be operated at the stable region shown in Figure 12.
It operates at the capacitance value of more than 1.0μF. As capacitance is larger, stability becomes more stable and
characteristic of output load fluctuation is also improved.
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Datasheet
BHxxMA3 series
●Ordering Information
B
H
ROHM
Part No.
x
x
M
A
3 W
Series name
MA3:300mA
Output voltage
xx=15:1.5V
xx=18:1.8V
xx=25:2.5V
xx=28:2.8V
xx=29:2.9V
xx=30:3.0V
xx=31:3.1V
xx=33:3.3V
H
F
V
-
Package
HFV:HVSOF6
Shutdown
switch
W:With
switch
T
R
Packaging and forming specifications
TR:Embossed tape and reel
●Physical Dimension Tape and Reel Information
HVSOF6
<Tape and Reel information>
(1.5)
(0.45)
(1.4)
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
(1.2)
1 2 3
Tape
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
(0.15)
2.6±0.1
(MAX 2.8 include BURR)
6 5 4
)
1pin
0.145±0.05
0.75Max.
3.0±0.1
1.6±0.1
(MAX 1.8 include BURR)
S
0.1 S
0.22±0.05
Direction of feed
0.5
(Unit : mm)
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram(s)
xx
15
18
25
28
29
30
31
33
Output Voltage
1.5V typ.
1.8V typ.
2.5V typ.
2.8V typ.
2.9V typ.
3.0V typ.
3.1V typ.
3.3V typ.
Marking
CB
CC
CD
CE
CF
CG
CH
CJ
HVSOF6(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
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Datasheet
BHxxMA3 series
●Revision History
Date
Revision
25.Sep.2013
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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