BHxxPB1W

CMOS LDO Regulators for Portable Equipments
1ch 150mA
CMOS LDO Regulators
BH□□PB1WHFV Series
No.11020EBT05
●Description
The BH□□PB1WHFV regulator series can respond to changes in output current by switching to a state in which regulator
characteristics are ideal. The regulators cut power consumption by lowering their own current consumption to approximately
2 A when the application is operating in the standby state. During normal-current operation it will automatically switch to
high-speed operating mode. The IC's soft start function reduce the rush current that flows to the output capacitors during
startup. The HVSOF5 package, which features excellent heat dissipation, contributes to space-saving application designs.
●Features
1) Automatic switching between low-consumption and high-speed modes
2) Built-in rush current prevention circuit
3) Low-voltage 1.7 V operation
4) High accuracy output voltage: ± 1%
5) Circuit current during low-consumption operation: 2 A
6) Stable with a ceramic capacitor (0.47 µF)
7) Built-in temperature and overcurrent protection circuits
8) Built-in output discharge during standby operation function
9) Ultra-small HVSOF5 power package
●Applications
Battery-driven portable devices, etc.
●Product lineup
150 mA BH□□PB1WHFV Series
Product name
BH□□PB1WHFV
1.2
1.5
1.8
2.5
2.8
2.9
3.0
3.1
3.3
Package
√
√
√
√
√
√
√
√
√
HVSOF5
Model name: BH□□PB1W□
a
b
Symbol
Description
Output voltage specification
a
b
□□
Output voltage (V)
□□
Output voltage (V)
12
1.2 V (Typ.)
29
2.9 V (Typ.)
15
1.5 V (Typ.)
30
3.0 V (Typ.)
18
1.8 V (Typ.)
31
3.1 V (Typ.)
25
2.5 V (Typ.)
33
3.3 V (Typ.)
28
2.8 V (Typ.)
Package HFV: HVSOF5
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© 2011 ROHM Co., Ltd. All rights reserved.
1/10
2011.01 - Rev.B
Technical Note
BH□□PB1WHFV Series
●Absolute maximum ratings (Ta = 25°C)
Parameter
Symbol
Ratings
Unit
Power supply voltage
VMAX
−0.3 to +6.5
V
Pd
410 *1
mW
Operating temperature range
Topr
−40 to +85
°C
Storage temperature range
Tslg
−55 to +125
°C
Tjmax
125
°C
Power dissipation
Junction temperature
*1: Reduced by 4.1 mW/°C over 25°C, when mounted on a glass epoxy board (70 mm  70 mm  1.6 mm)
●Recommended operating ranges (not to exceed Pd)
Parameter
Power supply voltage
Output MAX current
Symbol
Ratings
Unit
VIN
1.7 to 5.5
V
IMAX
0 to 150
mA
●Recommended operating conditions
Parameter
Symbol
Ratings
Min.
Typ.
Max.
Unit
Input capacitor
CIN
0.33 *2
0.47
−
µF
Output capacitor
CO
0.33 *2
0.47
−
µF
Conditions
The use of ceramic capacitors is
recommended.
The use of ceramic capacitors is
recommended.
*2: Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias characteristic.
And also make sure that the capacitor value can not change as time progresses.
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2/10
2011.01 - Rev.B
Technical Note
BH□□PB1WHFV Series
●Electrical characteristics
(Unless otherwise specified, Ta = 25°C, VIN = VOUT + 1.0 V, STBY = 1.5 V, SEL = 0 V, CIN = 0.47 µF, CO = 0.47 µF)
Limits
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max..
【Regulator】
Output voltage
(high-speed mode)
VOUT1
Output voltage
(low-consumption mode)
VOUT2
Circuit current
(high-speed mode)
Circuit current
(low-consumption mode)
VOUT1
×0.99
VOUT1
-0.025
VOUT2
×0.97
VOUT2
×0.967
VOUT1
×1.01
VOUT1
+0.025
VOUT2
×1.038
VOUT2
×1.043
-
V
VOUT≧2.5V,IOUT=0.1mA,SEL=1.5V
V
VOUT≦1.8V,IOUT=0.1mA,SEL=1.5V
V
VOUT≧2.5V,IOUT=0.1mA,SEL=0V
V
VOUT≦1.8V,IOUT=0.1mA,SEL=0V
ICC1
-
20
40
μA
IOUT=0mA, VIN pin
monitor,SEL=1.5V
ICC2
-
2
4
μA
IOUT=0mA, VIN pin monitor, SEL=0V
ISTBY
-
-
1.0
μA
STBY=0V
Ripple rejection ratio
(high-speed mode)
RR1
42
60
-
dB
VRR=-20dBv, fRR=1kHz,
IOUT=10mA, SEL=1.5V
Dropout voltage 1 *1
VSAT1
-
100
200
mV
VIN=VOUT×0.98,IOUT=50mA
Dropout voltage 2 *1
VSAT2
-
210
400
mV
VIN=VOUT×0.98,IOUT=100mA
Dropout voltage 3 *1
VSAT3
-
315
600
mV
VIN=VOUT×0.98,IOUT=150mA
VDL1
-
2
20
mV
VIN=VOUT+1V to 5.5V,IOUT=10mA
VDL2
-
2
20
mV
VIN=VOUT+1V to 5.5V,IOUT=100μA
VDLO
-
10
40
mV
IOUT=10mA to 100mA
ITH1
0.09
0.3
-
mA
SEL=0V IOUT=3mA⇒0mA sweep
ITH2
-
1.2
2.2
mA
SEL=0V IOUT=0mA⇒3mA sweep
Limit Current
ILMAX
160
300
500
mA
Vo=VOUT×0.90
Short current
ISHORT
20
50
100
mA
Vo=0V
ISTB
-
2
4
μA
STBY=1.5V
VSTBH
VSTBL
1.5
-0.3
-
VIN
0.3
V
V
Discharge resistance at standby RDCG
1.5
2.2
3.0
kΩ
RSEL
0.5
1.0
2.0
MΩ
VSELH
VSELL
1.5
-0.3
-
VIN
0.3
V
V
Circuit current (STBY)
Line regulation 1
(high-speed mode)
Line regulation 2
(low-consumption mode)
Load regulation
【Mode switch】
Current threshold
(low-consumption mode)
Current threshold
(high-speed mode)
【Over Current Protection 1】
【Stand-by block】
STBY pin sink current
STBY control voltage
ON
OFF
STBY=0V
【SEL PIN】
Pull-down resistance of SEL pin
SEL control voltage
ON
OFF
* Note: This IC is not designed to be radiation-resistant.
*3: Except at VOUT ≤ 1.5 V.
●Electrical characteristics of each output voltage
Output Voltage
Parameter
Min.
70
1.2 V
1.5 V
Max. output
current
1.8 V ≤ VOUT
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Fixed high speed mode
Automatic switch mode
Typ.
Max.
120
−
Unit
Conditions
VCC = 1.7 V
150
−
−
VCC = 2.0 V
50
100
−
VCC = 1.8 V
150
−
−
75
143
−
VCC = VOUT + 0.3 V
150
−
−
VCC = VOUT + 0.6 V
3/10
mA
VCC = 2.2 V
2011.01 - Rev.B
Technical Note
BH□□PB1WHFV Series
4.0
4.0
3.5
3.5
3.5
3.0
2.5
2.0
1.5
1.0
3.0
2.5
2.0
1.5
1.0
IO = 10 mA
0.5
3.0
2.5
2.0
1.5
1.0
IO = 10 mA
0.5
0.0
0.5
1
2
3
4
Input Voltage VIN [V]
5
0
Fig.1 Output Voltage vs Input Voltage
(BH12PB1WHFV)
1
2
3
4
Input Voltage VIN [V]
0
5
Fig.2 Output Voltage vs Input Voltage
(BH30PB1WHFV)
Output Voltage VOUT [V]
40
30
SEL = 1.5 V
20
10
IO = no load
3.0
50
SEL = 0 V
2.5
2.0
1
2
3
4
Input Voltage VIN [ V]
IO = no load
200
1.5
SEL = 1.5 V
1.0
SEL = 1.5 V
100
SEL = 0 V
0.0
0
5
300
0.5
0
2
3
4
Input Voltage VIN [ V]
400
I nput Output Voltage difference VSAT
[mV]
IO = no load
60
1
Fig.3 Output Voltage vs Input Voltage
(BH33PB1WHFV)
3.5
70
IO = 10 mA
0.0
0.0
0
GND Current IGND [μA]
Out put Volt age VOUT [V]
4.0
Output Voltage VOUT [V]
Output Voltage VOUT [V]
●Typical characteristics
0
0
5
SEL = 0 V
100
200
300
Output Current I OUT [mA]
400
(BH33PB1WHFV)
(BH30PB1WHFV)
(BH12PB1WHFV)
0
50
100
Output Current IOUT [mA]
150
Fig.6 GND Current vs-Input Voltage
(BH33PB1WHFV)
(BH30PB1WHFV)
3.5
3.0
3.0
3.0
O ut put Volt age VOUT [V]
2.5
2.0
1.5
1.0
0.5
2.5
2.0
1.5
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.5
0.0
0
100
200
300
Output Current IOUT [mA]
400
0.0
0
100
200
300
Output Current I OUT [mA]
400
Fig.8 Output Voltage vs Output Current
(BH30PB1WHFV)
(BH30PB1WHFV)
(BH12PB1WHFV)
400
300
2.5
2.0
1.0
0.0
100
0
0
0
100
200
300
O utput Current IO UT [ mA]
400
Fig.10 Dropout voltage vs Output Current
(BH18PB1WHFV)
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Fig.9 Output Voltage vs Output Current
(BH33PB1WHFV)
200
100
0.5
400
300
200
1.5
100
200
300
Output Current I OUT [mA]
I nput Output Voltage difference VSAT
[mV]
3.0
0
400
Input Output Voltage difference VOUT
[mV]
3.5
Out put Volt age VO UT [V]
Output Voltage VOUT [V]
3.5
Output Voltage VOUT [V]
3.5
0
50
100
Output Current IO UT [ mA]
150
0
50
100
Output Current IOUT [mA]
150
Fig.11 Dropout voltage vs Output Current Fig.12 Dropout voltage vs Output Current
(BH33PB1WHFV)
(BH30PB1WHFV)
4/10
2011.01 - Rev.B
Technical Note
BH□□PB1WHFV Series
4
3.1
3.0
2.9
6
Standby Pin Sink Current ISTBY[µA]
Out put Volt age VOUT[V]
O ut put Volt age VOUT[V]
3.2
3
2
1
-50
-25
0
25
50
Temp[℃ ]
75
0.0
100
80
70
70
Ripple Rejection R.R.[dB]
Ripple Rejection R.R.[dB]
80
50
40
30
Co = 0.47 µF
IO = 10 mA
20
0.5
1.0
VSTBY[V]
1.5
3
2
1
0.0
2. 0
Fig.14 Standby Pin Threshold
(BH30PB1WHFV)
Fig.13 Output Voltage vs Temperature
(BH30PB1WHFV)
60
4
0
0
2.8
5
1.0
2.0
3.0
VSTBY[V]
4.0
5.0
Fig.15 Standby Pin Sink Current
(BH30PB1WHFV)
SEL
1 V / div
SEL = 0 V  1.5
60
50
40
VOUT
30
Co = 0.47 µF
IO = 10 mA
20
50 mV / div
IO = no load
10 ms / div
10
10
100
1k
10 k
100
Frequency f[Hz]
1M
Fig.16 Ripple Rejection
(BH12PB1WHFV)
IOUT = 0 mA  10 mA
100
1k
10 k
100
Frequency f[Hz]
1M
Fig.17 Ripple Rejection
(BH30PB1WHFV)
Fig.18 Output Voltage Waveform
During SEL Switching
(BH30PB1WHFV)
IOUT = 1 mA  30 mA
50 mV / div
IOUT = 1 mA  100
50 mV / div
100 mV / div
VOUT
VOUT
VOUT
SEL = 0 V
100 s / div
(power-saving operation)
Fig.19 Load Response (Co = 1.0 µF)
(BH30PB1WHFV)
200 s / div
SEL = 1.5 V
200 s / div
Fig.20 Load Response (Co=1.0 µF)
(BH30PB1WHFV)
Fig.21 Load Response (Co=1.0 µF)
(BH30PB1WHFV)
100 m
Rss = 10 k,
IO = no load
STBY
STBY
1 V / div
Co = 0.47 µF
1 V / div
VOUT
Co = 2.2 µF
Co = 1 µF
Co = 0.47 µF
VOUT
Co = 10 µF
Startup time Trise [sec]
1 V / div
10 m
1.0µ
1 V / div
200 s / div
10 ms / div
100 µ
0.01µ
0.1 µ
1.0µ
Slow start capacitance Css (F)
Fig.22 Output Voltage Rise Time
(BH30PB1WHFV)
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Fig.23 Output Voltage Fall Time
(BH30PB1WHFV)
5/10
Fig.24 Soft Start Rise Time
(BH30PB1WHFV)
2011.01 - Rev.B
Technical Note
BH□□PB1WHFV Series
●Block diagram, recommended circuit diagram, and pin assignment table
BH□□PB1WHFV
VIN
PIN No.
Symbol
Function
1
STBY
Output voltage on/off control(High: ON, Low: OFF)
2
GND
Ground
3
VIN
4
VOUT
5
SEL
Power supply input
Voltage output
Mode switching
(High: Fix in high-speed mode
Low: Automatic low-consumption mode switching)
3
CH1
+
Cin
THERMAL &
OVER CURRENT
PROTECTION
VOLTAGE
REFERENCE
GND
VOUT
4
2
+
Co
CH2
DISCHARGE
SOFFT
START
Cin … 0.47 µF
Co … 0.47 µF
CURRENT
STBY
MONITOR
Rss
(
)
(
Css
1
)
CONTROL
5
BLOCK
SEL
Fig.25
The IC incorporates a built-in auto power-saving function that
continuously monitors the output current and switches
automatically between a low current consumption regulator
and a high-speed operation regulator. This function reduces
the regulator's own current consumption to approximately 1/10
or lower of normal levels when the output current falls below
approximately 300 A.
To operate only the high-speed operation regulator without
using the auto power-saving function, fix the SEL pin to high.

GND current IGND [μ A]
●Auto Power-saving Function
30
Measurement conditions
High-speed mode
BH12PB1WHFV
20
VCC = 2.2 V
10
VSEL = open,
VSTBY = 1.5 V
Low-consumption mode
0
0
0.5
1
1.5
2
2.5
3
Out put current IOUT [ mA]
Fig.26 Auto Power-Saving Function (Example)
Calculating the maximum internal IC power consumption (PMAX)
2. Power Dissipation/Heat Reduction (Pd)
HVSOF5
0.6
*Circuit design
should allow a
sufficient
margin for the
temperature
range so that
PMAX < Pd.
410 mW
0.4
Pd[W]
●Power Dissipation (Pd)
1. Power Dissipation (Pd)
Power dissipation calculations include estimates of power
dissipation characteristics and internal IC power consumption, and
should be treated as guidelines. In the event that the IC is used in
an environment where this power dissipation is exceeded, the
attendant rise in the junction temperature will trigger the thermal
shutdown circuit, reducing the current capacity and otherwise
degrading the IC's design performance. Allow for sufficient margins
so that this power dissipation is not exceeded during IC operation.
0.2
0
0
25
50
75
100
125
Ta[℃]
PMAX = (VIN - VOUT)  IOUT (MAX.)
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VIN : Input voltage
VOUT : Output voltage
IOUT (MAX) : Max. output current
6/10
Fig.27 HVSOF5 Power Dissipation
vs Heat Reduction (Example)
2011.01 - Rev.B
Technical Note
BH□□PB1WHFV Series
●Input Output capacitors
It is recommended to insert bypass capacitors between input and GND pins, positioning them as close to the pins as
possible. These capacitors will be used when the power supply impedance increases or when long wiring paths are used, so
they should be checked once the IC has been mounted. Ceramic capacitors generally have temperature and DC bias
characteristics. When selecting ceramic capacitors, use X5R or X7R, or better models that offer good temperature and DC
bias characteristics and high tolerant voltages.
Typical ceramic capacitor characteristics
120
100
120
50 V rated voltage
80
60
10V
rated voltage
40
16 V rated voltage
20
0
100
95
Capacitance rate of change (%)
Capacitance rate of change (%)
100
Capacitance rate of change (%)
50 V rated voltage
90
16 V rated voltage
85
10 V
rated voltage
80
75
70
0
1
2
3
4
0
DC bias Vdc (V)
1
2
3
80
40
20
0
-25
4
X7R
X5R
Y5V
60
DC bias Vdc (V)
0
25
Temp[℃]
50
75
Fig.28 Capacitance vs Bias
Fig.29 Capacitance vs Bias
Fig.30 Capacitance vs Temperature
(X5R, X7R, Y5V)
(Y5V)
(X5R, X7R)
●Output capacitors
Mounting input capacitor between input pin and GND(as close to pin as possible), and also output capacitor between output
pin and GND(as close to pin as possible) is recommended. The input capacitor reduces the output impedance of the voltage
supply source connected to the VCC. The higher value the output capacitor goes the more stable the whole operation
becomes. This leads to high load transient response. Please confirm the whole operation on actual application board.
Generally, ceramic capacitor has wide range of tolerance, temperature coefficient, and DC bias characteristic. And also its value goes
lower as time progresses. Please choose ceramic capacitors after obtaining more detailed data by asking capacitor makers.
BH□□PB1WHFV
100
ESR (Ω)
10
Stable region
1
COUT = 0.47 µF
Ta = +25°C
0.1
0.01
0
50
100
150
Output Current Io (mA)
Fig.31 Stable Operation Region (Example)
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7/10
2011.01 - Rev.B
Technical Note
BH□□PB1WHFV Series
●Notes for use
1. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break
down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated
values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
3. Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
4. Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit is designed only to shut
the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not
continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is
assumed.
5. Ground wiring patterns
The power supply and ground lines must be as short and thick as possible to reduce line impedance. Fluctuating voltage
on the power ground line may damage the device.
6. Overcurrent protection circuit
The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This
circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current
flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other
component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.
However, the IC should not be used in applications characterized by the continuous operation or transitioning of the
protection circuits. At the time of thermal designing, keep in mind that the current capability has negative characteristics to
temperatures.
7. Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8. Back current
In applications where the IC may be exposed to back current flow, it is recommended to create a path to dissipate this
current by inserting a bypass diode between the VIN and VOUT pins.
Back current
VIN
STBY
OUT
GND
Fig.32 Example Bypass Diode Connection
9. I/O voltage difference
Using the IC in automatic switching mode when the I/O voltage differential becomes saturated (VIN - VOUT < 150 mV)
may result in a large output noise level. If the noise level becomes problematic, use the IC with the SEL pin in the high
state when the voltage differential is saturated.
10. GND Voltage
The potential of GND pin must be minimum potential in all operating conditions.
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8/10
2011.01 - Rev.B
Technical Note
BH□□PB1WHFV Series
11. Preventing Rush Current
By attaching the Rss and Css time constants to the STBY pin, sudden rises in the regulator output voltage can be
prevented, dampening the flow of rush current to the output capacitors. The larger the time constant used, the greater the
resulting reduction. However, large time constants also result in longer startup times, so the constant should be selected
after considering the conditions in which the IC is to be used.
100
Rss = 10 k
Startup
time Trise [sec]
起動時間
IO = no load
10
1.0 m
100 
0.01 
0.1 
1.0 
Slow start
capacitance
Frequency
f[Hz] Css (F)
Fig.33 VOUT Startup Time vs CSS Capacitance (Reference)
12. Regarding input Pin of the IC (Fig.34)
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin B
B
E
Pin A
N
N
N
P
+
P+
P
N
P+
Parasitic
element
P substrate
Parasitic element
GND
B
N
P+
P
N
C
E
Parasitic
element
P substrate
Parasitic element
GND
GND
GND
Other adjacent elements
Fig.34
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9/10
2011.01 - Rev.B
Technical Note
BH□□PB1WHFV Series
●Ordering part number
B
H
3
Part No.
0
P
Output voltage
12: 1.2 V
15: 1.5 V
18: 1.8 V
25: 2.5 V
28: 2.8 V
29: 2.9 V
30: 3.0 V
31: 3.1 V
33: 3.3 V
B
1
W
Series
PB1:Auto powersaving type
H
Shutdown
switch
W : Includes
switch
F
V
-
Package
HFV : HVSOF5
T
R
Packaging and forming specification
TR: Embossed tape and reel
HVSOF5
Embossed carrier tape
(0.3)
Quantity
3000pcs
4
(0.91)
4
5
(0.41)
5
0.2MAX
Tape
1.0±0.05
(0.05)
(0.8)
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
3 2 1
1 2 3
1pin
0.13±0.05
S
+0.03
0.02 –0.02
1.6±0.05
0.6MAX
1.2±0.05
(MAX 1.28 include BURR)
<Tape and Reel information>
1.6±0.05
0.1
S
0.5
0.22±0.05
0.08
Direction of feed
M
(Unit : mm)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
Reel
10/10
∗ Order quantity needs to be multiple of the minimum quantity.
2011.01 - Rev.B
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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