TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP3050 Series SP3050 Series 6V 10A Rail Clamp Array RoHS Pb GREEN The SP3050 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb surge current per IEC61000-4-5 (tP=8/20μs) without performance degradation and a minimum ±20kV ESD per IEC61000-4-2. Their very low loading capacitance also makes them ideal for protecting high speed signal pins. Features t&4%*&$ ±20kV contact, ±30kV air t&'5*&$" (5/50ns) t-JHIUOJOH*&$ 10A (8/20μs) Pinout I/O 1 I/O 4 GND VCC I/O 2 I/O 3 Applications 5 t'JSFXJSF t4FU5PQ#PYFT t'MBU1BOFM%JTQMBZT t1PSUBCMF.FEJDBM t-$%1%157T t.POJUPST t/PUFCPPLT t&UIFSOFU Functional Block Diagram 6 t-PXDBQBDJUBODFPGQ' (TYP) per I/O t-PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t4NBMM405QBDLBHJOH 4 Application Examples USB Dual Port Protection VBUS VBUS RT D+ USB Port RT D- USB Controller VBUS CT GND SP3050-04HTG CT VBUS VBUS RT 1 2 3 D+ RT USB Port DGND CT 10/100/1000 Ethernet Protection RJ45 Unused TX + Unused TX + 10/100/1000 Ethernet PHY TX - 1 6 2 5 3 4 TX RX + RX - SP3050-04HTG RX + Unused To Twisted-Pair Network CT Unused 75 75 75 75 RX VCC VCC Life Support Note: Not Intended for Use in Life Support or Life Saving Applications GND The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 129 Revision: April 14, 2011 SP3050 Series SP3050 Description TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP3050 Series Thermal Information Absolute Maximum Ratings Symbol Parameter Value 1 Parameter Units IPP Peak Current (tp=8/20μs) 10 A PPK Peak Pulse Power (tp=8/20μs) 150 W TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -50 to 150 °C Storage Temperature Range Rating Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 1 Non-repetitive pulse per waveform on page 3 Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Symbol Test Conditions VRWM IR ≤ 1μA VR IR = 1mA ILEAK VR=5V Reverse Voltage Drop Reverse Leakage Current Min Typ Clamp Voltage Dynamic Resistance RDYN ESD Withstand Voltage1 VESD Diode Capacitance1 CI/O-GND Diode Capacitance1 CI/O-I/O V V 0.1 0.5 μA 2 8.8 10.0 V 2 11.5 13.0 V 2 IPP=8A, tp=8/20μs, I/O to GND 13.2 15.0 V (VC2 - VC1) / (IPP2 - IPP1) 0.7 IPP=5A, tp=8/20μs, I/O to GND VC Units 6.0 8.0 IPP=1A, tp=8/20μs, I/O to GND 1 Max Ω IEC61000-4-2 (Contact) ±20 kV IEC61000-4-2 (Air) ±30 kV Reverse Bias=0V 2.4 3.0 pF Reverse Bias=1.65V 2.0 pF Reverse Bias=0V 1.2 pF Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 Repetitive pulse per waveform on page 3. Product Characteristics Clamping Voltage vs. IPP 20.0 Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 18.0 Clamp Voltage (VC ) 16.0 14.0 12.0 10.0 8.0 6.0 4.0 Notes : 2.0 1. All dimensions are in millimeters 0.0 2. Dimensions include solder plating. 1 2 3 4 5 6 7 8 9 10 3. Dimensions are exclusive of mold flash & metal burr. Peak Pulse Current-IPP (A) 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. SP3050 Series 130 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP3050 Series Capacitance vs. Reverse Bias Pulse Waveform 110% 3.0 100% 2.5 90% 80% VCC =3.3V VCC =5V 1.5 1.0 70% SP3050 2.0 Percent of IPP Capacitance (pF) VCC=Float 60% 50% 40% 30% 20% 0.5 10% 0% 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0.0 5.0 5.0 10.0 DC Bias (V) 15.0 20.0 25.0 30.0 Time (μs) Soldering Parameters Reflow Condition Pb – Free assembly tP Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Temperature TP TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C time to peak temperature L*4 SP 3050 – 04 H T G L*4 Silicon Protection Array (SPATM) Family of TVS Diode Arrays Number of Channels Time Part Marking System Part Numbering System Series Critical Zone TL to TP Ramp-up G= Green Product Series L = SP3050 Assembly Site (Varies) T= Tape & Reel Package H: SOT23-6 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Number of Channels Ordering Information Part Number Package Marking Min. Order Qty. SP3050-04HTG SOT23-6 L*4 3000 131 Revision: April 14, 2011 SP3050 Series TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP3050 Series Package Dimensions — SOT23-6 Package SOT23-6 Pins 6 JEDEC MO-203 Issue A Millimeters Inches Notes Min Max A 0.900 1.450 0.035 0.057 - 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 ref e1 1.9 Ref 0.0748 Ref 0.100 N 0.600 0.004 10º 0º 6 a M Max A1 L Recommended Solder Pad Layout Min - 0.023 6 0º 4,5 6 10º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - R 0.950 0.038 - Notes: 1. Dimensioning and tolerances per ANSI 14.5M-1982. 2. Package conforms to EIAJ SC-74 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlenth L measured at reference to seating plane. 5. “L” is the length of flat foot surface for soldering to substrate. 6. “N” is the number of terminal positions. 7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. P R Embossed Carrier Tape & Reel Specification — SOT23-6 8mm TAPE AND REEL 14.4mm ACCESS HOLE 13mm 180mm 60mm 4.0mm 1.5mm DIA. HOLE 2.0mm 1.75mm CL 8mm 4.0mm GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. SOT-23 (8mm POCKET PITCH) 8.4mm USER DIRECTION OF FEED SP3050 Series 132 Revision: April 14, 2011 PIN 1 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.