713AD

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XLLGA6 1.00x1.00, 0.35P
CASE 713AD
ISSUE O
SCALE 4:1
DATE 21 OCT 2014
PIN ONE
REFERENCE
0.05 C
2X
ÎÎÎ
ÎÎÎ
ÎÎÎ
0.05 C
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO THE PLATED TERMINALS
AND IS MEASURED BETWEEN 0.15 AND 0.25 MM
FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO ALL OF THE TERMINALS.
A B
D
E
DIM
A
A1
b
D
E
e
e2
L
L1
TOP VIEW
0.05 C
A
0.05 C
A1
SIDE VIEW
NOTE 4
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
XXM
L1
e
6X
1
e2
C
6
2
L
3
5
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.17
0.23
1.00 BSC
1.00 BSC
0.35 BSC
0.60 BSC
0.27
0.33
0.05 REF
XX = Specific Device Code
M = Date Code
4
6X
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
b
0.07
M
C A B
0.05
M
C
BOTTOM VIEW
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
0.35
PITCH
5X
0.50
PACKAGE
OUTLINE
0.55
1.25
1
6X
0.22
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON92148F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
XLLGA6 1.00X1.00, 0.35P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON92148F
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY I. MARIANO.
DATE
21 OCT 2014
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2014
October, 2014 − Rev. O
Case Outline Number:
713AD
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