LITTELFUSE V18MLA1210H

Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
RoHS
ML Varistor Series
The ML Series family of Transient Voltage Surge Suppression devices is
based on the Littelfuse Multilayer fabrication technology. These components are designed to suppress a variety of transient events, including
those specified in IEC 61000-4-2 or other standards used for Electromagnetic
Compliance (EMC). The ML Series is typically applied to protect integrated
circuits and other components at the circuit board level.
The wide operating voltage and energy range make the ML Series suitable for numerous applications on power supply, control and signal lines.
The ML Series is manufactured from semiconducting ceramics, and is
supplied in a leadless, surface mount package. The ML Series is compatible with modern reflow and wave soldering procedures.
It can operate over a wider temperature range than zener diodes, and
has a much smaller footprint than plastic-housed components.
Littelfuse Inc. manufactures other Multilayer Series products. See the
MLE Series data sheet for ESD applications, MHS Series data sheet for
high-speed ESD applications, the MLN for multiline protection and the
AUML Series for automotive applications.
Features
• RoHS Compliant
Size
• Leadless 0402, 0603, 0805, 1206 and 1210 Chip Sizes
• Multilayer Ceramic Construction Technology
•-55oC to +125oC Operating Temperature Range
• Operating Voltage Range VM(DC) = 5.5V to 120V
• Rated for Surge Current (8 x 20µs)
• Rated for Energy (10 x 1000µs)
• Inherent Bi-directional Clamping
• No Plastic or Epoxy Packaging Assures Better than 94V-0
Flammability Rating
• Standard Low Capacitance Types Available
Applications
• Suppression of Inductive Switching or Other Transient Events Such
as EFT and Surge Voltage at the Circuit Board Level
• ESD Protection for Components Sensitive to IEC 61000-4-2,
MIL-STD-883C Method 3015.7, and Other Industry Specifications
(See Also the MLE or MLN Series)
• Provides On-Board Transient Voltage Protection for ICs and Transistors
• Used to Help Achieve Electromagnetic Compliance of End Products
• Replace Larger Surface Mount TVS Zeners in
Many Applications
168
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Metric
EIA
1005
1608
2012
3216
3225
4532
5650
0402
0603
0805
1206
1210
1812
2220
Multilayer Transient Voltage Surge Suppressors
RoHS
ML Varistor Series
Absolute Maximum Ratings For ratings of individual members of a series, see Device Ratings and Specifications table.
Continuous:
ML SERIES
Steady State Applied Voltage:
DC Voltage Range (VM(DC)) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 to 120
AC Voltage Range (VM(AC)RMS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 to 107
Transient:
Non-Repetitive Surge Current, 8/20µs Waveform, (ITM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 to 500
Non-Repetitive Surge Energy, 10/1000µs Waveform, (WTM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.02 to 1.2
Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 125
Storage Temperature Range (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 150
Temperature Coefficient ( V) of Clamping Voltage (VC) at Specified Test Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <0.01
Device Ratings and Specifications
MAXIMUM RATINGS (125 oC)
170
SPECIFICATIONS (25 oC)
MAXIMUM
CONTINUOUS
WORKING
VOLTAGE
MAXIMUM
NONREPETITIVE
SURGE
CURRENT
(8/20 s)
MAXIMUM
NONREPETITIVE
SURGE
ENERGY
(10/1000 s)
MAXIMUM
CLAMPING
VOLTAGE AT
1A
(OR AS NOTED)
(8/20 s)
VN(DC)
VN(DC)
VM(DC) VM(AC)
ITM
WTM
VC
MIN
MAX
C
NOMINAL VOLTAGE
AT 1mA DC TEST
CURRENT
TYPICAL
CAPACITANCE
AT f = 1MHz
PART
NUMBER
(V)
(V)
(A)
(J)
(V)
(V)
(V)
(pF)
V3.5MLA0603
3.5
2.5
30
0.1
13
3.7
7.0
1270
V3.5MLA0805
3.5
2.5
120
0.3
13
3.7
7.0
2530
V3.5MLA0805L
3.5
2.5
40
0.1
13
3.7
7.0
1380
V3.5MLA1206
3.5
2.5
100
0.3
13
3.7
7.0
6000
V5.5MLA0402
5.5
4.0
20
0.050
19
7.1
10.8
220
V5.5MLA0402L
5.5
4.0
20
0.050
38
15.9
21.5
70
V5.5MLA0603
5.5
4.0
30
0.1
17.5
7.1
9.3
760
V5.5MLA0805
5.5
4.0
120
0.3
17.5
7.1
9.3
1840
V5.5MLA0805L
5.5
4.0
40
0.1
17.5
7.1
9.3
990
V5.5MLA1206
5.5
4.0
150
0.4
17.5
7.1
9.3
3500
V9MLA0402
9
6.5
20
0.050
30
11
16
120
V9MLA0402L
9
6.5
4
0.020
35
11
16
33
V9MLA0603
9.0
6.5
30
0.1
25.5
11
16
490
V9MLA0805L
9.0
6.5
40
0.1
25.5
11
16
520
V12MLA0805L
12
9.0
40
0.1
29
14
18.5
410
V14MLA0402
14
10
20
0.050
38
15.9
21.5
70
V14MLA0603
14
10
30
0.1
34.5
15.9
21.5
180
V14MLA0805
14
10
120
0.3
32
15.9
20.3
560
V14MLA0805L
14
10
40
0.1
32
15.9
20.3
320
V14MLA1206
14
10
150
0.4
32
15.9
20.3
1400
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UNITS
V
V
A
J
O
C
O
C
%/OC
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Device Ratings and Specifications
(Continued)
MAXIMUM RATINGS (125 oC)
PART
NUMBER
SPECIFICATIONS (25 oC)
MAXIMUM
CONTINUOUS
WORKING
VOLTAGE
MAXIMUM
NONREPETITIVE
SURGE
CURRENT
(8/20 s)
MAXIMUM
NONREPETITIVE
SURGE
ENERGY
(10/1000 s)
MAXIMUM
CLAMPING
VOLTAGE AT
1A
(OR AS NOTED)
(8/20 s)
VN(DC)
VN(DC)
VM(DC) VM(AC)
ITM
WTM
VC
MIN
MAX
C
NOMINAL VOLTAGE
AT 1mA DC TEST
CURRENT
TYPICAL
CAPACITANCE
AT f = 1MHz
(V)
(V)
(A)
(J)
(V)
(V)
(V)
(pF)
V18MLA0402
18
14
20
0.050
50
22
28.0
40
V18MLA0603
18
14
30
0.1
50
22
28.0
120
V18MLA0805
18
14
120
0.3
44
22
28.0
520
V18MLA0805L
18
14
40
0.1
44
22
28.0
290
V18MLA1206
18
14
150
0.4
44
22
28.0
1270
V18MLA1210
18
14
500
2.5
22
28.0
1440
V26MLA0603
26
20
30
0.1
60
31
38
110
V26MLA0805
26
20
100
0.3
60
29.5
38.5
220
V26MLA0805L
26
20
40
0.1
60
29.5
38.5
140
V26MLA1206
26
20
150
0.6
60
29.5
38.5
600
V26MLA1210
26
20
300
1.2
29.5
38.5
1040
V30MLA0603
30
25
30
0.1
74
37
46
90
V30MLA0805L
30
25
30
0.1
72
37
46
90
V30MLA1210
30
25
280
1.2
68 at 2.5A
35
43
1820
V30MLA1210L
30
25
220
0.9
68 at 2.5A
35
43
1760
V33MLA1206
33
26
180
0.8
75
38
49
500
V42MLA1206
42
30
180
0.8
92
46
60
425
V48MLA1210
48
40
250
1.2
105 at 2.5A
54.5
66.5
520
V48MLA1210L
48
40
220
0.9
105 at 2.5A
54.5
66.5
500
V56MLA1206
56
40
180
1.0
61
77
180
V60MLA1210
60
50
250
1.5
67
83
440
V68MLA1206
68
50
180
1.0
76
90
100
V85MLA1210
85
67
250
2.5
180 at 2.5A
95
115
260
V120MLA1210
120
107
125
2.0
260 at 2.5A
135
165
80
44 at 2.5A
60 at 2.5A
120
130 at 2.5A
140
3
SURFACE MOUNT
VARISTORS
RoHS
NOTES:
1. L suffix is a low capacitance and energy version; Contact your Littelfuse Sales Representative for custom capacitance requirements.
o
2. Typical leakage at 25 C<25µA, maximum leakage 100µA at VM(DC) ; for 0402 size, typical leakage <5µA, maximum leakage <20µA at VM(DC).
3. Average power dissipation of transients for 0402, 0603, 0805, 1206 and 1210 sizes not to exceed 0.03W, 0.05W, 0.1W, 0.1W and 0.15W respectively.
w w w. l i t t e l f u s e . c o m
171
Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Temperature De-rating
PERCENT OF PEAK VALUE
100
50
0
t
O1
100
TIME
t1
80
t2
60
FIGURE 2. PEAK PULSE CURRENT TEST WAVEFORM
FOR CLAMPING VOLTAGE
40
20
0
-55
50
60
70
80
90
100
110 120
O1 = VIRTUAL ORIGIN OF WAVE
t = TIME FROM 10% TO 90% OF PEAK
t1 = VIRTUAL FRONT TIME = 1.25 x t
t2 = VIRTUAL TIME TO HALF VALUE
(IMPULSE DURATION)
130 140 150
AMBIENT TEMPERATURE ( oC)
FIGURE 1. PEAK CURRENT AND ENERGY
DERATING CURVE
EXAMPLE:
FOR AN 8/20µs CURRENT WAVEFORM
8µs = t1 = VIRTUAL FRONT TIME
3
20µs = t2 = VIRTUAL TIME TO
HALF VALUE
MLA0402 Limit VI Curves
100
Varistor Voltage (V)
PERCENT OF RATED VALUE
When transients occur in rapid succession, the average power dissipation is the energy (watt-seconds) per pulse times the number of pulses
per second. The power so developed must be within the specifications
shown on the Device Ratings and Specifications table for the specific
device. For applications exceeding 125oC ambient temperature, the peak
surge current and energy ratings must be derated as shown in Figure 1.
SURFACE MOUNT
VARISTORS
RoHS
10
V18MLA0402
V14MLA0402
V9MLA0402
V5.5MLA0402
1
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
Current (A)
FIGURE 3. LIMIT V-I CHARACTERISTIC FOR V5.5MLA0402 TO V18MLA0402
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171
Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
RoHS
ML Varistor Series
Maximum Transient V-I Characteristic Curves
MLA0402L Limit VI Curves
Varistor Voltage (V)
100
10
V9MLA0402L
V5.5MLA0402L
1
0.000001 0.00001
0.0001
0.001
0.01
0.1
1
10
100
Current (A)
FIGURE 4. LIMIT V-I CHARACTERISTIC FOR V9MLA0402L
1000
V30MLA0603
V26MLA0603
Varistor Voltage (V)
V18MLA0603
100
V14MLA0603
10
V9MLA0603
V5.5MLA0603
V3.5MLA0603
1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
Current (A)
FIGURE 5. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0603 TO V30MLA0603
1000
V30MLA0805L
V26MLA0805L
Varistor Voltage (V)
V18MLA0805L
100
V14MLA0805L
10
V12MLA0805L
V9MLA0805L
V5.5MLA0805L
V3.5MLA0805L
1
0.00001
0.0001
0.001
0.01
0.1
1
10
Current (A)
FIGURE 6. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0805L TO V30MLA0805L
172
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100
Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Maximum Transient V-I Characteristic Curves
(Continued)
Varistor Voltage (V)
1000
100
V26MLA0805
10
V18MLA0805
V14MLA0805
V5.5MLA0805
3
V3.5MLA0805
1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
SURFACE MOUNT
VARISTORS
RoHS
1000
Current (A)
FIGURE 7. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0805 TO V26MLA0805
1000
Varistor Voltage (V)
100
V68MLA1206
V56MLA1206
V42MLA1206
V33MLA1206
V26MLA1206
V18MLA1206
V14MLA1206
V5.5MLA1206
V3.5MLA1206
10
1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Current (A)
FIGURE 6. LIMIT V-1 CHARACTERISTIC FOR V3.5MLA1206 TO V68MLA1206
1000
MAXIMUM CLAMPING VOLTAGE
MAXIMUM LEAKAGE
100
Varistor Voltage (V)
V120MLA1210
10
V85MLA1210
V60MLA1210
V48MLA1210, V48MLA1210L
V30MLA1210, V30MLA1210L
V26MLA1210
V18MLA1210
1
1 µA
10µA
100µA
1mA
10mA
100mA
1A
10A
100A
1000A
CURRENT (A)
FIGURE 9. LIMIT V-I CHARACTERISTIC FOR V18MLA1210 TO V120MLA1210
w w w. l i t t e l f u s e . c o m
173
Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
RoHS
ML Varistor Series
Device Characteristics
100
CLAMPING VOLTAGE (V)
At low current levels, the V-I curve of the multilayer transient voltage
suppressor approaches a linear (ohmic) relationship and shows a
temperature dependent effect (Figure 10). At or below the maximum
working voltage, the suppressor is in a high resistance mode (approaching 106Ω at its maximum rated working voltage). Leakage currents at
maximum rated voltage are below 50µA, typically 25µA; for 0402 size
below 10µA, typically 5µA.
V5.5MLA1206
VNOM VALUE AT 25 oC (%)
SUPPRESSOR VOLTAGE IN PERCENT OF
100%
V26MLA1206
10
-60
-40
-20
0
40
60
80
20
TEMPERATURE ( oC)
100
120
140
FIGURE 12. CLAMPING VOLTAGE OVER TEMPERATURE
(VC AT 10A)
25
10%
1E -9
o
50o 75o
1E -8
1E -7
Energy Absorption/Peak Current Capability
100o 125oC
1E -6
1E -5
1E -4
1E -3
1E -2
SUPPRESSOR CURRENT (ADC)
FIGURE 10. TYPICAL TEMPERATURE DEPENDANCE OF THE CHARACTERISTIC
CURVE IN THE LEAKAGE REGION
Speed of Response
The Multilayer Suppressor is a leadless device. Its response time is not
limited by the parasitic lead inductances found in other surface mount
packages. The response time of the Zinc Oxide dielectric material is less
than 1 nanosecond and the ML can clamp very fast dV/dT events such
as ESD. Additionally, in “real world” applications, the associated circuit
wiring is often the greatest factor effecting speed of response. Therefore,
transient suppressor placement within a circuit can be considered
important in certain instances.
Energy dissipated within the ML is calculated by multiplying the clamping
voltage, transient current and transient duration. An important advantage
of the multilayer is its interdigitated electrode construction within the mass
of dielectric material. This results in excellent current distribution and the
peak temperature per energy absorbed is very low. The matrix of semiconducting grains combine to absorb and distribute transient energy (heat)
(Figure 11). This dramatically reduces peak temperature; thermal stresses
and enhances device reliability.
As a measure of the device capability in energy and peak current
handling, the V26MLA1206A part was tested with multiple pulses at its
peak current rating (150A, 8/20µs). At the end of the test, 10,000 pulses
later, the device voltage characteristics are still well within specification
(Figure 13).
100
PEAK CURRENT = 150A
8/20µs DURATION, 30s BETWEEN PULSES
FIRED CERAMIC
DIELECTRIC
VOLTAGE
V26MLA1206
METAL
ELECTRODES
10
METAL END
TERMINATION
0
2000
4000
6000
8000
NUMBER OF PULSES
FIGURE 13. REPETITIVE PULSE CAPABILITY
DEPLETION
REGION
DEPLETION
REGION
GRAINS
FIGURE 11. MULTILAYER INTERNAL CONSTRUCTION
174
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10000
12000
Multilayer Transient Voltage Surge Suppressors
RoHS
ML Varistor Series
Soldering Recommendations
230
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of components in surface
mount technology are IR Re-flow & Wave soldering. Typical profiles are
shown in Figures 14 & 15
The termination options available for each solder technique are:
Reflow
1. Nickel Barrier (preferred)
2. Silver/Platinum
Wave
1. Nickel Barrier (preferred)
2. Silver/Palladium
The recommended solder for the ML suppressor is a 62/36/2 (Sn/Pb/Ag),
60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA
solder flux.
FIGURE 14. REFLOW SOLDER PROFILE
Wave soldering is the most strenuous of the processes. To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in
the soldering process is recommended, and the peak temperature of the
solder process should be rigidly controlled.
Once the soldering process has been completed, it is still necessary to
ensure that any further thermal shocks are avoided. One possible cause
of thermal shock is hot printed circuit boards being removed from the
solder process and subjected to cleaning solvents at room temperature.
The boards must be allowed to cool gradually to less than 50˚C before
cleaning.
MAXIMUM WAVE 260 oC
250
TEMPERATURE ( oC)
When using a reflow process, care should be taken to ensure that the
ML chip is not subjected to a thermal gradient steeper than 4 degrees
per second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating to within 100 degrees of the solderís peak
temperature is essential to minimize thermal shock.
300
200
150
SECOND PREHEAT
100
FIRST PREHEAT
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
TIME (MINUTES)
3.5
4.0
4.5
FIGURE 15. WAVE SOLDER PROFILE
Lead-Free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel-Barrier termination finish for the optimum Pbfree solder performance.
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
RAMP RATE
<3˚C/s
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA flux, but
there is a wide selection of pastes & fluxes available with which the nickel barrier parts should be compatible.
The reflow profile must be constrained by maximums shown in Figure16.
For Pb-free Wave soldering, Figure 15 still applies.
Note: the Pb-free paste, flux & profile were used for evaluation purposes
by Littelfuse, based upon industry standards & practices. There are
multiple choices of all three available, it is advised that the customer
explores the optimum combination for their process as processes vary
considerably from site to site.
176
w w w. l i t t e l f u s e . c o m
60 - 150 SEC
> 217˚C
PREHEAT ZONE
5.0
6.0
7.0
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
RoHS
ML Varistor Series
Recommended Pad Outline
C
B
NOTE
A
NOTE: Avoid metal runs in this area.
TABLE 1: PAD LAYOUT DIMENSIONS
PAD SIZE
1210
SIZE DEVICE
1206
SIZE DEVICE
0805
SIZE DEVICE
0603
SIZE DEVICE
MM
IN
MM
0.100
2.54
0.067
1.70
0.030
0.76
0.020
0.51
0.89
0.024
0.61
DIMENSION
IN
MM
IN
MM
IN
MM
A
0.160
4.06
0.160
4.06
0.120
3.05
B
0.100
2.54
0.065
1.65
0.050
1.27
C
0.040
1.02
0.040
1.02
0.040
1.02
0.035
176
w w w. l i t t e l f u s e . c o m
0402
SIZE DEVICE
IN
Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
RoHS
ML Varistor Series
Mechanical Dimensions
3
D
SURFACE MOUNT
VARISTORS
E
L
W
CHIP SIZE
1210
1206
0805
0603
0402
DIMENSION
IN
MM
IN
MM
IN
MM
IN
MM
IN
D Max.
0.113
2.87
0.071
1.80
0.043
1.10
0.035
0.90
0.024
0.90
E
0.02 ±0.01
0.50 ±0.25
0.02 ±0.01
0.50 ±0.25
0.02 ± 0.01
0.50 ± 0.25
0.015 ±0.008
0.4 ±0.2
0.010 ±0.006
0.25 ±0.15
L
0.125 ±0.012
3.20 ±0.30
0.125 ±0.012
3.20 ±0.30
0.079 ±0.008
2.01 ±0.20
0.063 ±0.006
1.6 ±0.15
0.039 ±0.004
1.0 ±0.1
W
0.10 ±0.012
2.54 ±0.30
0.06 ±0.011
1.60 ±0.28
0.049 ±0.008
1.25 ±0.20
0.032 ±0.06
0.8 ±0.15
0.020 ±0.004
0.5 ±0.1
MM
Ordering Information
VXXML TYPES
V
18
MLA
1206
X
X
X
DEVICE FAMILY
Littelfuse TVSS Device
PACKING OPTIONS
T: 13in (330mm) Diameter Reel
H: 7in (178mm) Diameter Reel (0603-1210 sizes)
R: 7in (178mm) Diameter Reel (0402 size only)
A: Bulk Pack
MAXIMUM DC
WORKING VOLTAGE
END TERMINATION OPTION
No Letter: Ag/Pt
W: Ag/Pd
N: Nickel Barrier (0402 -1210 only).
MULTILAYER SERIES
DESIGNATOR
DEVICE SIZE:
i.e 120 mil x 60 mil
(3MM X 1.5MM)
CAPACITANCE OPTION
No Letter: Standard
L: Low Capacitance Version
Standard Shipping Quantities
DEVICE SIZE
“13” INCH REEL (“T”OPTION)
“7”INCH REEL (“H”OPTION)
1210
8,000
2,000
2500
1206
10,000
2,500
2500
0805
10,000
2,500
2500
0603
10,000
2,500
2500
0402
N/A
10,000
N/A
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BULK PACK (“A”OPTION)
177
Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
RoHS
ML Varistor Series
Tape and Reel Specifications
• Conforms to EIA - 481-1, Revision A
• Can be supplied to IEC Publication 286 - 3
SYMBOL
DIMENSIONS IN MILLIMETERS
DESCRIPTION
0402 Size
0603, 0805, 1206 & 1210 Sizes
A0
Width of Cavity
Dependent on Chip Size to Minimize Rotation.
B0
Length of Cavity
Dependent on Chip Size to Minimize Rotation.
K0
Depth of Cavity
Dependent on Chip Size to Minimize Rotation.
W
Width of Tape
F
Distance Between Drive Hole Centers and Cavity Centers
3.5 ±0.05
E
Distance Between Drive Hole Centers and Tape Edge
1.75 ±0.1
P1
Distance Between Cavity Centers
P2
Axial Drive Distance Between Drive Hole Centers & Cavity Centers
2 ±0.1
P0
Axial Drive Distance Between Drive Hole Centers
4 ±0.1
D0
Drive Hole Diameter
D1
Diameter of Cavity Piercing
T1
Top Tape Thickness
8 ±0.2
4 ±0.1
2±0.05
1.55 ±0.05
1.05 ±0.05
N/A
0.1 Max
D0
P0
P2
E
F
K0
W
B0
t1
P1
D1
A0
PRODUCT
IDENTIFYING
LABEL
PLASTIC CARRIER TAPE
EMBOSSED PAPER (0402 SIZE ONLY)
EMBOSSMENT
TOP TAPE
178
8mm
NOMINAL
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178mm
OR 330mm
DIA. REEL