SPA™ Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection RoHS Pb GREEN SP1010 Lead-Free/Green Series Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protection highspeed signal pins. Pinout Features • E SD, IEC61000-4-2, ±8kV contact, ±15kV air I/O (1) I/O (4) GND GND • L ightning, IEC61000-4-5, 1A (tp=8/20µs) I/O (3) • Low capacitance of 3.5pF (TYP) per I/O I/O (2) uDFN-6 (1.25x1.0x0.5mm) • EFT protection IEC61000-4-4, 40A (5/50ns) • Low leakage current of 1µA (MAX) at 5V Applications 5 4 • Notebook • Portable medical device • Netbook • MP3/PMP • Ultra mobile PC • Digital camera • Mobile phone • Portable navigation device 1 2 3 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 1 SP1010 Lead-Free/Green Series Lead-Free/Green SP1010 Functional Block Diagram 6 • Tiny uDFN package (1.25mm x 1.0mm x 0.5mm) SPA™ Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection Absolute Maximum Ratings Symbol Parameter Value Units 1.0 A Operating Temperature -40 to 85 °C Storage Temperature -60 to 150 °C IPP Peak Pulse Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C Storage Temperature Range Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units VR IR = 1mA 6.0 7.5 8.0 V Reverse Standoff Voltage VRWM IR≤1µA 6 V Reverse Leakage Current ILEAK VR = 5V 1 µA ESD Withstand Voltage1 VESD Reverse Voltage Drop Diode Capacitance1 0.1 IEC61000-4-2 (Contact Discharge) ±8 kV IEC61000-4-2 (Air Discharge) ±15 kV CD Reverse Bias = 0V 6 Reverse Bias = 2.5V 3.5 7 pF pF Notes: 1. Parameter is guaranteed by design and/or device characterization. SP1010 Lead-Free/Green Series 2 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection Capacitance vs. Reverse Bias Insertion Loss (S21) I/O to GND 5 7.0 0 -5 5.0 Attenuation (dB) Capacitance (pF) 6.0 4.0 3.0 -10 -15 2.0 -20 1.0 -25 -30 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 10 5.0 100 1000 10000 Frequency (MHz) DC Bias (V) Application Example Keyboard Controller Input SP1010-04UTG Shield Ground ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Lead-Free/Green SP1010 Outside World D1 D2 D3 D4 3 Signal Ground SP1010 Lead-Free/Green Series SPA™ Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection Soldering Parameters Pb – Free assembly Reflow Condition Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Package Dimensions - uDFN-6 (1.25x1.0x0.5mm) Bottom View Top View D 0.05 C 6 5 4 4 5 6 1 2 3 Symbol Pin 1 chamfer 0.10 x 45’ 3 2 1 B A1 A A3 Seating plane C Min Max Min Max 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 0.127 REF b 0.15 0.25 0.006 0.010 1.20 1.30 0.047 0.051 D2 - - - - E 0.95 1.05 0.037 0.041 E2 - - - - L 0.10 M C A B 0.005 REF D 0.4 REF e b Inches 0.45 A3 Side View 0.05 C Millimeters A 0.05 C L E Pin 1 Index Area uDFN-6 (1.25x1.0x0.5mm) ℮ A 0.25 0.016 REF 0.35 0.010 0.014 0.05 M C SP1010 Lead-Free/Green Series 4 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection Product Characteristics Part Numbering System SP 1010 – 04 U T G G= Green Silicon Protection Array T= Tape & Reel Series Package U: uDFN-6 Number of Channels Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. H*4 3. Dimensions are exclusive of mold flash & metal burr. Product Series H = SP1010 H*4 4. All specifications comply to JEDEC SPEC MO-223 Issue A Number of Channels 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Assembly Site (Varies) Ordering Information Part Number Package Marking Min. Order Qty. SP1010-04UTG uDFN-6 (1.25x1.0x0.5mm) H*4 3000 Embossed Carrier Tape & Reel Specification – uDFN-6 (1.25x1.0x0.5mm) t D Min Max Min Max 1.65 1.85 0.06 0.07 F 3.45 3.55 0.14 0.14 D1 0.50 0.65 0.02 0.03 P0 B0 F W 10P0 D1 P0 Inches E D E P2 Millimeters 1.50 MIN 3.90 4.10 40.0 +/- 0.20 0.06 MIN 0.15 0.16 1.57 +/- 0.01 W 7.90 8.30 0.31 0.33 P2 1.95 2.05 0.08 0.08 A0 1.09 1.19 0.04 0.05 B0 1.42 1.52 0.06 0.06 K0 0.71 0.81 0.03 0.03 t 0.25 TYP 0.01 TYP K0 A0 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 5 SP1010 Lead-Free/Green Series Lead-Free/Green SP1010 Symbol SPA™ Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection SP1010 Lead-Free/Green Series 6 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.