EQCO62R20.3/EQCO31R20.3 EQCO62R20.3 6.25 Gbps Asymmetric Coax Equalizer/ EQCO31R20.3 3.125 Gbps Asymmetric Coax Equalizer Features Introduction • Complies with the CoaXPress v1.1 camera standard (1) • Supports up to 68 meters of cable at 6.25 Gbps using high-quality coax • Supports up to 212 meters of cable at 1.25 Gbps using high-quality coax • Single-chip solutions for both the camera side and the frame grabber side, making a bidirectional connection over a single 75Ω coax cable • Full-Duplex, bidirectional data channel - Downlink speeds from 1.25 Gbps up to 6.25 Gbps; differential interfacing straightforward with internal termination resistors - Uplink supporting 21 Mbps, allowing nanoseconds precise triggering events driven by the frame grabber • Supports power distribution over the coax up to 900 mA, powering the camera through the same coax transporting data signals • Low power consumption (<70 mW, 1.2V supply) • 16-Pin, 0.65 mm pin pitch, 4 mm QFN package • Small PCB footprint for EQCO62R20 and off-chip components, with guaranteed RF-performance • -40°C to +85°C industrial temperature range • Pb-free and RoHS compliant The EQCO62T/R20(2) chipset is a driver/equalizer chipset that forms a bidirectional, full-duplex communication link over a single coax cable. The EQCO62T/R20 chipset is designed to transport up to 6.25 Gbps over the downlink channel and to transport 21 Mbps over the uplink channel. The EQCO62T20 is designed to transmit the downlink signal at up to 6.25 Gbps and receive the uplink signal. The EQCO62R20 is designed to receive the downlink signal at up to 6.25 Gbps and to transmit the uplink signal. Power can be transferred over the same cable via external inductors. The chipset is designed to work with several types of 75Ω coaxial cables, including legacy cables as well as thin, flexible lightweight cables. Note 1: CoaXPress V1.1 standard. Free download from the JIIA website: http://jiia.org/en/standardization/list/ 2: The EQCO31T20 and EQCO31R20 are lower-speed versions of the EQCO62T20 and EQCO62R20, with a maximum bit rate of 3.125 Gbps for the high-speed downlink and the same uplink speed. Applications • High-definition/high-bandwidth links to cameras • Machine vision for semiconductor chips and display panel inspection systems • Military, aerospace, medical applications • Broadcast and surveillance camera systems • Traffic license plate and monitoring systems • High-Speed inspection systems for food Inspection, bottling inspection, panel inspection, etc. • Any application requiring a single coax cable which carries power, video data and camera control stream. 2012-2016 Microchip Technology Inc. DS60001302B-page 1 EQCO62R20.3/EQCO31R20.3 Typical Link Performance Table 1, Table 2 and Table 3 give an overview of typical link performance at room temperature for the link containing the EQCO62T20 coax driver in conjunction with the EQCO62R20 receiver, using the downlink channel, uplink channel and power transmission simultaneously. Performance for EQCO62T/R20 and EQCO31T/R20 is equal for bit rates up to 3.125 Gbps. TABLE 1: BELDEN TYPICAL LINK PERFORMANCE Name Belden 7731A Belden 1694A Belden 1505A Belden 1505F Belden 1855A Type Long Distance Industry Standard Compromise Coax Flexible Thinnest Cable Diameter (mm) 10.3 6.99 5.94 6.15 4.03 1.25 Gbps (m) 194 130 107 80 55 2.5 Gbps (m) 162 110 94 66 55 3.125 Gbps (m) 147 100 86 60 55 5.0 Gbps (m) 87 60 52 35 38 6.25 Gbps (m) 58 40 35 23 25 TABLE 2: GEPCO TYPICAL LINK PERFORMANCE Name Gepco VHD1100 Gepco VSD2001 Gepco VPM2000 Gepco VHD2000M Gepco VDM230 Type Long Distance Industry Standard Compromise Coax Flexible Thinnest Cable Diameter (mm) 10.3 6.91 6.15 6.15 4.16 1.25 Gbps (m) 212 140 109 81 66 2.5 Gbps (m) 185 120 94 67 66 3.125 Gbps (m) 169 110 86 61 62 5.0 Gbps (m) 102 66 53 36 38 6.25 Gbps (m) 68 44 35 24 25 CANARE TYPICAL LINK PERFORMANCE(1) TABLE 3: Name Canare L-7CFB Canare L-5CFB Canare L-4CFB Canare L-3CFB Canare L-2.5CFB Type Long Distance Industry Standard Compromise Coax Thin Cable Thinnest Cable Diameter (mm) 10.2 7.7 6.1 5.5 4 1.25 Gbps (m) 165 118 94 72 43 2.5 Gbps (m) 135 98 79 66 43 3.125 Gbps (m) 122 88 71 60 43 5.0 Gbps (m) 71 52 42 36 30 6.25 Gbps (m) 46 34 28 24 20 Note 1: Specifications from Canare are only up to 2 GHz. 5 Gbps and 6.25 Gbps performance are by extrapolation. DS60001302B-page 2 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 Table of Contents 1.0 2.0 3.0 4.0 Device Overview .......................................................................................................................................................................... 4 Application Information................................................................................................................................................................. 9 Electrical Characteristics ............................................................................................................................................................ 16 Packaging................................................................................................................................................................................... 18 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2012-2016 Microchip Technology Inc. DS60001302B-page 3 EQCO62R20.3/EQCO31R20.3 1.0 DEVICE OVERVIEW The EQCO62T/R20 single-coax chipset is designed to simultaneously transmit and receive signals on a single 75Ω coax cable. In one direction, a downlink signal is transmitted. In the opposite direction, a lower-speed uplink is provided. The EQCO62T/R20 chipset consists of two chips. The EQCO62T20 is a high-speed line driver with an integrated low-speed receiver. The EQCO62R20 is a high-speed receiver with an integrated low-speed transmitter. Figure 1-1 illustrates a typical EQCO62T/R20 link setup. The downlink signal is transmitted with 600 mV transmit amplitude at the EQCO62T20 side. This signal is attenuated in the coax and recovered by an equalizer integrated in the EQCO62R20. The low-speed uplink is transmitted with a lower amplitude of 130 mV to limit the crosstalk with the downlink channel. FIGURE 1-1: In addition to the downlink channel and the low-speed uplink, the system allows power transmission over the coax by using ferrite beads and external inductors. These external inductors give the communication channel a high-pass characteristic. The uplink receiver inside the EQCO62T20 chip recovers the signal lost by this high-pass filter. Appropriate inductors need to be selected for correct operation of the link. Correct operation is only guaranteed with the inductor combination used in Figure 2-1, even though other components might be suited. The EQCO62T/R20 chipset is compatible with the CoaXPress v1.1 camera standard. TYPICAL EQCO62T/R20 LINK SETUP Up to 6.25 Gbps downlink High Definition Camera Up to 900 mA DC EQCO 62T20 21 Mbps uplink DS60001302B-page 4 The downlink channel is intended for 8B/10B NRZ coded data with bitrates from 1.25 Gbps up to 6.25 Gbps. The low-speed uplink operates at a bit rate of 21 Mbps, and has a single-ended LVTLL input and output. Up to 212 meters 75Ω Coax Up to 900 mA DC Up to 6.25 Gbps downlink Frame Store + Camera Control EQCO 62R20 21 Mbps uplink 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 1.1 Pinout and Pin Description FIGURE 1-2: TABLE 1-1: Pin Number EQCO62R20.3 PIN DIAGRAM(VIEWED FROM TOP) VCC NC NC VCC 16 15 14 13 GND 1 12 GND SDIp 2 11 SDOp SDIn 3 10 SDOn GND 4 9 GND EQCO62R20.3 GND TAB 5 6 7 8 LFI AmpR RiseR NC EQCO62R20.3 PIN DESCRIPTIONS Pin Name Signal Type (TAB) GND 13, 16 VCC Power Connect to 1.2V of power supply. 1, 4, 9, 12 GND Power Connect to ground of power supply. 2, 3 SDIp, SDIn CML Input Serial input positive/negative differential serial input. Connect SDIn to shield of cable via termination network. External 15Ω resistors required. 11, 10 SDOp/SDOn CML Output Serial output positive/negative differential serial output. Output has a swing of 2x600 mV and has 2x50Ω on-chip termination resistors. 5 LFI Input Uplink input signal. LVTTL signal with 1.2V input swing. External series resistor is required for 2.5V (3.9 kΩ) or 3.3V (6.2 kΩ) input swing. 6 AmpR Input Connected to VCC by a resistor that selects output swing of the uplink signal. Typical value is Ramp = 1.2 kΩ for rise/fall times of 11 ns. 7 RiseR Input Connected to VCC by a resistor that selects rise time of the uplink signal. Typical value is Rrise = 10 kΩ for rise/fall times of 11 ns. 8, 14, 15 NC — Do not connect. Leave these pins floating. Used for internal testing. 2012-2016 Microchip Technology Inc. Power Description Use as single-point ground. DS60001302B-page 5 EQCO62R20.3/EQCO31R20.3 1.1.1 SDIp/SDIn SDIp/SDIn together form a differential input pair. It is the differential voltage between these pins that the EQCO62R20 analyzes and adaptively equalizes for signal level and frequency response. The equalizer automatically detects and adapts to signals with different edge rates, different attenuation levels and different cable characteristics. Both SDIp and SDIn inputs are terminated by 60Ω to VCC on-chip. For each input, an external 15Ω resistor is required in series. 1.1.2 SDOp/SDOn SDOp/SDOn together form a differential pair, outputting the reconstructed far-end transmit signal. SDOp/SDOn are terminated on-chip with 2x50Ω resistors. 1.1.3 LFI LFI is the uplink input signal that will be transmitted on the SDIp/SDIn pair. LFI must be a 1.2V LVTTL signal. For 2.5V and 3.3V input swing, an external resistor is needed in series at the input of the chip. 1.1.4 AmpR AmpR is a VCC resistor that sets the transmit amplitude of the uplink output driver. The typical value for CoaXPress is Ramp = 1.2 kΩ for 130 mV transmit amplitude. 1.1.5 RISER RiseR is a VCC resistor that selects the rise/fall time of the uplink output driver. The typical value for CoaXPress is Rrise = 10 kΩ for rise/fall time of 11 ns. If no Ramp and Rrise are placed, the LF driver is disabled. DS60001302B-page 6 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 1.2 Circuit Operation FIGURE 1-3: EQCO62R20.3 BLOCK DIAGRAM SHOWING ELECTRICAL CONNECTIONS EQCO62R20.3 LF PreDriver LFI Active Signal Splitter/Combiner SDIp SDIn Equalizer Core SDOp RX Output Driver SDOn 1.2.1 LF PRE-DRIVER The uplink pre-driver converts the incoming LVTTL signal at the LFI pin to a signal with well-controlled amplitude and rise/fall times that will be transmitted onto the cable by the active splitter/combiner. 1.2.2 ACTIVE SIGNAL SPLITTER/ COMBINER The active splitter/combiner transmits the outgoing coax signal via an internal 60Ω output termination resistor. The total (60Ω + 15Ω) output resistor, when balanced with the coax characteristic impedance, also forms part of a hybrid splitter circuit which subtracts the TX output from the signal on the SDI output to give yield the far-end TX signal. 2012-2016 Microchip Technology Inc. DS60001302B-page 7 EQCO62R20.3/EQCO31R20.3 FIGURE 1-4: 1.2.3 PRINCIPLE OF EQUALIZER OPERATION EQUALIZER CORE The EQCO62R20 has an embedded equalizer in the receive path with the following characteristics: • Auto-Adaptive The equalizer controls a multiple-pole analog filter which compensates for attenuation of the cable, as illustrated in Figure 1-4. The filter frequency response needed to restore the signal is automatically determined by the device using a time-continuous feedback loop that measures the frequency components in the signal. Upon the detection of a valid signal, the control loop converges within a few microseconds. • Variable Gain The EQCO62R20 equalizer has variable gain to compensate for low-frequency attenuation through the coax and variations in transmit amplitude. • Multi-Speed The EQCO62R20 works at data rates from 1.25 Gbps to 6.25 Gbps with 8B/10B coding. Example equalizer performance measurements can be found in Figure . 1.2.4 RX OUTPUT DRIVER The output driver converts the output of the equalizer core to a LVDS-like signal and sends it onto a 100Ω differential transmission line. DS60001302B-page 8 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 2.0 APPLICATION INFORMATION Figure 2-1 illustrates a typical schematic implementation. FIGURE 2-1: TABLE 2-1: EQCO62R20.3 TYPICAL APPLICATION CIRCUIT COMPONENT RECOMMENDATION FOR THE EQCO62R20.3 BOARD LAYOUT Element Value Size Recommended Component Fb1, Fb2 1 kΩ @ 100 MHz Ferrite Bead 0603 FBMH1608HM102 from Taiyo Yuden (Critical) L1 10 µH 1812 1812PS_103 or JA4644-AL from Coilcraft (Critical) R1, R2 15Ω ±1% 0402 R3 75Ω ±1% 0402 R4 0Ω (1.2V input swing) 3.9 kΩ (2.5V input swing) 6.2 kΩ (3.3V input swing) — Ramp 1.2 kΩ ±1% — Rrise 10 kΩ ±1% — C1 100 nF, 50V, X7R 0603 C2, C3, C4, C5, C6 100 nF, X7R 0402 C7 10nF, 50V, X7R 0402 C8 1 µF, 50V, X7R 0805 BNC1 75Ω Right Angle BNC Connector 2012-2016 Microchip Technology Inc. — BNC-RA C-SX-090 from Cambridge Connectors DS60001302B-page 9 EQCO62R20.3/EQCO31R20.3 Ferrite Beads Fb1 and Fb2 (FBMH1608HM102 from Taiyo Yuden) and inductor L1 (1812PS_103 from Coilcraft [10 µH]) are recommended for CoaXPress. For other applications, the inductor value can be larger, leading to a physical larger inductor. Connector BNC1 (75Ω right angle BNC C-SX-090 from Cambridge) is recommended for CoaXPress. Other inductors/ferrite beads/BNC connectors can possibly be used, however, they must be selected carefully for their RF-performance, since performance can decrease significantly. 2.1 Guidelines for PCB Layout When using the EQCO62T/R20 chipset at its full purpose, i.e. including low-speed uplink and power supply transmission, it is important not to disturb the RF-performance of the high-speed downlink channel. Implementing the circuit illustrated in Figure 2-1 with a different PCB layout will in first instance not deliver full data sheet performance. The simplest way of meeting FIGURE 2-2: The easiest way for achieving the requirements of the CoaXPress 1.1 specification is to use the recommended circuits, components and layout illustrated in Figure 2-1. For easy implementation, Microchip will provide the Gerber file. Please ask for it by email. Note: 2.1.1 Email address: [email protected] RIGHT ANGLE BNC Figure 2-2 below shows the four layers of the recommended footprint for the EQCO62R20.3 chip and the off-chip components that are critical for the RF-performance of the system. RECOMMENDED PCB LAYOUT FOR EQCO62R20.3 In this layout, the size of the PCB area needed for the chip is minimized. Approximately two times the BNC footprint area is required for the full bidirectional system: including the necessary elements for the power transport. DS60001302B-page 10 optimal performance, including jitter and return-loss requirements, is to precisely follow the component and layout recommendations. Note that at multi-gigabit speeds, using "equivalent" components or small PCB layout changes (even moving a via) can have significant detrimental effects. The differential output of the chip must be a 100Ω differential transmission line. To minimize the parasitic capacitance of the input pins, a cut-out of the ground 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 and power plane underneath the input pins is recommended. For best performance, no vias should be used in this high-speed signal path. A large cut-out underneath the right angle BNC connector, the AC coupling capacitors, ferrite beads and inductor is needed for minimal parasitics. FIGURE 2-3: This proposed layout is designed to be largely independent of the used PCB-layer stack. This will work as well for four, six or even higher numbers of layers. Possible extra layers should have cut-outs as large as the full proposed footprint. PCB LAYOUT OF MULTILANE COAXPRESS 0V1 DEMO BOARD PAIR Camera Side CD_1 CD_2 CD_3 CD_4 EQ_5 5x6.25Gb/s + 5x21Mb/s CD_5 EQ_4 EQ_3 EQ_2 EQ_1 Host Side 2012-2016 Microchip Technology Inc. DS60001302B-page 11 EQCO62R20.3/EQCO31R20.3 2.1.2 MULTILANE COAXPRESS 4+1 LAYOUT WITH DIN1.0/2.3 CONNECTORS Figure 2-3 shows an example of a Multilane CoaXPress 4+1 setup. The recommended Din1.0/2.3 connector is the NPF 4076 from Cambridge Connectors. The cable example shows the pitches in millimeters. Figure 2-4 shows the four layers of the recommended footprints and off-chip components that are critical for RF-performance of the cable drivers CD_1 to CD_4 at the camera side, which have Power over CoaXPress (PoCXP). Figure 2-5 shows the variant without PoCXP used for CD_5 at the host side. The exact dimensions in millimeters are given in Section 4.1 “Package Marking Information”. It is recommended to copy these dimensions, especially the connection between the DIN1.0/2.3 connector and the chip, as this is a complex entity with coupled currents and compensated parasitic capacitances. Despite the critical layout, this proposed layout is designed to be largely independent of the used PCBlayer stack, as the critical parts are mainly the top-layer only. This will work as well for four, six or even higher numbers of layers. Possible extra layers should have cut-outs as large as the full proposed footprint. In these layouts, the size of the PCB area needed for the chip is minimized. This allows multiple lanes close together. Only two of four connector GND pins are connected to the GND plane to reduce the capacitance. The differential CD inputs must be a 100Ω differential transmission line. A cut-out of the ground and power plane underneath the input pins is recommended to minimize the parasitic capacitance. For best performance, no vias should be used in this high-speed signal path. The Components Express 4+1 connector in Figure 2-3 is only shown as an example. Other connector configurations are available with DIN1.0/2.3 connectors such as 6+1, 2+1, 1+1, dual- or single-lane configurations. DS60001302B-page 12 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 FIGURE 2-4: RECOMMENDED PCB LAYOUT FOR EQCO62R20.3 WITH DIN1.0/2.3 CONNECTOR WITH PoCXP top Ground C I B J V3 D V5 V1 V2 H V4 G F E L M V7 A V6 K V8 Power Bottom Q P O N R S T U 2012-2016 Microchip Technology Inc. DS60001302B-page 13 EQCO62R20.3/EQCO31R20.3 FIGURE 2-5: RECOMMENDED PCB LAYOUT FOR EQCO62R20.3 WITH DIN1.0/2.3 CONNECTOR WITHOUT PoCXP Ground top a b h c i d V1 g V3 V2 e f V4 V5 V6 V7 k l j Power Bottom m p q o n s t DS60001302B-page 14 r 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 2.2 Guidelines for Power Transmit Unit At the Power-IN connection, a voltage supply is expected for powering a device (e.g. a camera) at the other end of the cable. This voltage supply should have low ripple. Highfrequency ripple will be rejected by C8/L1/FB1/FB2 filtering in the reference circuit. However, mid-frequency ripple is to be avoided by the power supply itself. In a typical application, one could want to step-up from a 12V supply (e.g. in a PC) to a 24V power supply for CoaXPress. It is in this case preferred to use a DC-toDC converter that has a high switching frequency (e.g. 2 MHz) above one that has lower switching frequency (200 kHz). The latter typically induces larger voltage spikes at the Power-IN connection. These will be only partially filtered out by said filter; the remainder will become crosstalk for the uplink channel. When too much crosstalk remains on the uplink channel, additional power-supply filtering is required. This may be achieved by placing an extra filter network (not shown) in series with the Power-IN node. 2.3 Power Over CoaXPress The EQCO62R20.3 is compatible with the Power over CoaXPress system (PoCXP) using the circuit from Figure 2-2. Hence, power can be switched on and off by the host (e.g. frame grabber) through the 10 µH inductor specified by the CXP standard. This switching is supported through a relay and through an electronic switch. Powering through a wide-band bias-T is also supported. The EQCO62R20.3 is also protected against the following events: • Hot plugging by frame grabber: in case the frame grabber has already applied its 24V on the coax when connecting the cable, no damage will occur to the EQCO62R20.3 when connecting the powered coax cable. • Fast turn-on and turn-off of power supply by frame grabber. 2012-2016 Microchip Technology Inc. DS60001302B-page 15 EQCO62R20.3/EQCO31R20.3 3.0 ELECTRICAL CHARACTERISTICS 3.1 Absolute Maximum Ratings Stresses beyond those listed under this section may cause permanent damage to the device. These are stress ratings only and are not tested. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TABLE 3-1: ABSOLUTE MAXIMUM RATINGS Parameter Conditions Min. Typ. Max. Units -65 — +150 °C Power Applied -55 — +125 °C Normal Operation (VCC = 1.2V ±5%) -40 — +85 °C Supply Voltage to Ground -0.5 — +1.4 V DC Input Voltage -0.5 — +1.6 V DC Voltage to Outputs -0.5 — +1.6 V — — 90 mA Storage Temperature Ambient Temperature Operating Temperature Current into Outputs TABLE 3-2: Outputs Low ELECTRICAL CHARACTERISTICS (OVER THE OPERATING VCC AND -40 TO +85°C RANGE) Parameter Description Min. Typ. Max. Unit 1.15 1.2 1.25 V Power Supply VCC Supply Voltage IS Supply Current, both Transmitting and Receiving — 60 — mA Isr Supply Current when only Receiving — 50 — mA ⌂Vih Input High Voltage — 1.2 1.6 V Vil Input Low Voltage -0.5 GND — V Rinput Resistance to GND — 3.6 — kΩ LFI Input (LVTTL-Like) SDIp Connection to Coax Zcoax Coax Cable Characteristic Impedance — 75 — Ω RSDIP Input Impedance between SDOp and VCC/GND — 75 — Ω VLF Coax Return Loss as Seen on SDOp pin Frequency Range = 5 MHz-1 GHz — — -15 dB trise_lf Coax Return Loss as Seen on SDOp pin Frequency Range = 1 GHz-1.5 GHz — — -10 dB RLloss Coax Return-Loss as Seen on SDIp pin Frequency Range = 5 MHz-1 GHz — — -15 dB RLloss Coax Return-Loss as Seen on SDIp pin Frequency Range = 1 GHz-1.5 GHz — — -10 dB RLloss Coax Return-Loss as Seen on SDIp pin Frequency Range = 1.5 GHz-3.2 GHz — — -7 dB ⌂VTX Transmit Amplitude for Downlink Signal 500 600 700 mV DS60001302B-page 16 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 TABLE 3-2: ELECTRICAL CHARACTERISTICS (OVER THE OPERATING VCC AND -40 TO +85°C RANGE) (CONTINUED) SDOp/SDOn Outputs ⌂Vo Output Amplitude VSDOp,n (into 2x50Ω) — 2x600 — mV Routput Termination Between SDOp/SDOn and GND/VCC — 2x50 — Ω trise_o Rise/Fall Time 20% to 80% of VSDOp,n — 40 — ps Min. Typ. Max. Units 8B/10B Coded Signal at 21 Mbps Over Full VCC and Temperature Range — — 1 ns 8B/10B Coded Signal at 21 Mbps Over Full VCC and Temperature Range — — 3 ns At 1.25 Gbps from 0 to 135m Belden 1694A = -22 dB Attenuation at 0.625 GHz(1) — — 0.3 UI At 1.25 Gbps from 0 to 115m Belden 1694A = -27.2 dB Attenuation at 1.25 GHz(1) — — 0.3 UI At 1.25 Gbps from 0 to 105m Belden 1694A = -28.1 dB Attenuation at 1.5625 GHz(1) — — 0.3 UI At 1.25 Gbps from 0 to 65m Belden 1694A = -22.6 dB Attenuation at 2.5 GHz(1) — — 0.3 UI TABLE 3-3: JITTER NUMBERS Parameter Additive Jitter on LF Output DCD in LF Output Jitter in Equalizer Output Jitter in Equalizer Output Jitter in Equalizer Output Jitter in Equalizer Output Conditions Jitter in Equalizer Output 1: At 1.25 Gbps from 0 to 45m Belden 1694A = -17.8 dB — — 0.35 Attenuation at 3.125 GHz(1) Jitter in Equalizer Output measured as 8B/10B coded signal over full transmit amplitude, VCC and temperature range, including uplink and power supply transmission. 2012-2016 Microchip Technology Inc. UI DS60001302B-page 17 EQCO62R20.3/EQCO31R20.3 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 16-Lead Plastic Quad Flat, No Lead Package – 4x4x0.9 mm Body [QFN] 16-Lead QFN (4x4x0.9 mm) PIN 1 Example PIN 1 EQCO YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: DS60001302B-page 18 62R20.3 YYWWNNN Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.20 C 2X TOP VIEW 0.20 C 0.10 C C A1 A SEATING PLANE 16X SIDE VIEW (A3) 0.10 0.08 C C A B D2 (16X K) 0.10 C A B E2 e 2 2 1 16X L N e BOTTOM VIEW 16X b 0.10 0.05 C A B C Microchip Technology Drawing C04-259B Sheet 1 of 2 2012-2016 Microchip Technology Inc. DS60001302B-page 19 EQCO62R20.3/EQCO31R20.3 16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch A Overall Height Standoff A1 A3 Terminal Thickness Overall Width E E2 Exposed Pad Width D Overall Length D2 Exposed Pad Length b Terminal Width Terminal Length L K Terminal-to-Exposed-Pad MIN 0.80 0.00 1.95 1.95 0.25 0.45 MILLIMETERS NOM 16 0.65 BSC 0.87 0.02 0.20 REF 4.00 BSC 2.05 4.00 BSC 2.05 0.30 0.55 0.425 REF MAX 0.95 0.05 2.15 2.15 0.35 0.65 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-259B Sheet 2 of 2 DS60001302B-page 20 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging C1 X2 16 G1 1 X1 2 C2 Y2 Y1 E SILK SCREEN RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C1 Contact Pad Spacing C2 Contact Pad Width (X16) X1 Contact Pad Length (X16) Y1 Contact Pad to Center Pad (X16) G1 MIN MILLIMETERS NOM 0.65 BSC MAX 2.15 2.15 3.625 3.625 0.30 0.725 0.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2259A 2012-2016 Microchip Technology Inc. DS60001302B-page 21 EQCO62R20.3/EQCO31R20.3 APPENDIX A: REVISION HISTORY Revision B (March 2016) • Updated Section 4.0, Packaging Information. • Removed electrostatic discharge ratings from Table 3-1. • Minor typographical changes. Revision A (August 2014) • This is the initial release of the document in the Microchip format. This replaces EqcoLogic document version 1v2. TABLE A-1: REVISION HISTORY Version Date 1v2 1/27/14 Added references 1v1 4/10/12 Added Multilane CoaXPress 4+1 layout with DIN1.0/2.3 connectors 1v0 2/9/12 Initial release of this document DS60001302B-page 22 Comments 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 APPENDIX B: TYPICAL LINE EQUALIZER CHARACTERISTICS All measurements at VCC = 1.2V, Temp = +25ºC, data pattern = 8B/10B test pattern, 600 mV transmit amplitude using Belden 1694A coaxial cable, and include uplink and power supply transmission over the cable with differential measurement into 2x50Ω. FIGURE B-1: 1.25 GBPS, 135M BELDEN 1694A FIGURE B-4: 2.5 GBPS, 115M BELDEN 1694A FIGURE B-2: 3.125 GBPS, 105M BELDEN 1694A FIGURE B-5: 5 GBPS, 65M BELDEN 1694A (EQCO62R20 ONLY) FIGURE B-3: 6.25 GBPS, 45M BELDEN 1694A (EQCO62R20 ONLY) 2012-2016 Microchip Technology Inc. DS60001302B-page 23 EQCO62R20.3/EQCO31R20.3 APPENDIX C: TYPICAL UPLINK CHARACTERISTICS All measurements at VCC = 1.2V, Temp = +25ºC, data pattern = 8B/10B test pattern at 21 Mbps, typical Ramp and Rrise, measured into 75Ω. FIGURE C-1: 1: SIGNAL TRANSMITTED BY LOW-SPEED DRIVER SHOWING BASLINE WANDER DUE TO EXTERNAL 10 µH INDUCTOR AND FERRITE BEADS(1) Inductor and ferrite beads at the camera side of the link will double the baseline wandering. This is resolved by the LF-Receiver in the EQCO62T20 chip. FIGURE C-2: OUTPUT EYE OF LF DRIVER WITH AND WITHOUT EXTERNAL 10 ΜH INDUCTOR With external 10 μH inductor DS60001302B-page 24 Without external 10 μH inductor 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 APPENDIX D: TYPICAL RETURN-LOSS Figure D-1 shows the return-loss at the BNC connector of the EQCO62R20.3 evaluation board as shown in Section 2.0 “Application Information” with supply current of 0 mA and 703 mA (maximum supply current for CoaXPress) through the inductor (L1) and the ferrite beads (Fb1 & Fb2) and compares it with the CoaXPress (Full-Speed) return-loss specification. FIGURE D-1: RETURN-LOSS OF THE EQCO62R20.3 BNC EVALUATION BOARD WITH AND WITHOUT SUPPLY CURRENT 2012-2016 Microchip Technology Inc. DS60001302B-page 25 EQCO62R20.3/EQCO31R20.3 APPENDIX E: FIGURE E-1: FOOTPRINTS USED FOR THE MULTILANE COAXPRESS LAYOUT 0402, 0603 AND VIA WITH THERMAL ISOLATION FOOTPRINTS 0.90 0.35 drill 0.60 0.52 0.40 0.71 copper 1.20 FIGURE E-2: 0.30 0.75 0.52 DIN1.0/2.3 AND L1 INDUCTOR 1812 FOOTPRINTS 0.80 drill 2.28 3.00 1.50 copper 2.54 2.60 copper 1.60 drill 2.54 1.60 TABLE E-1: COMPONENT POSITIONS OF Figure 2-4 Component Footprint X Y Angle DIN1.0/2.3 0 0 — EQCO62R20.3 QFN -0.075 -8 — C1 (50V) 0603 0.075 -2.55 90° C2 0402 2.4 -4.9 90° R1 (16Ω) 0402 0.25 -4.575 90° R2 (91Ω) 0402 -1.2 -5 — FB1 0603 -2.05 0.6 — NPF 4076 FB2 0603 -2.05 -0.6 — R6 0402 4.075 0.35 — C7 (50V) 0402 4.475 1.850 90° C9 0402 1.675 -11.025 — C10 0402 2.05 -4.9 — DS60001302B-page 26 Bottom 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 Footprint X Y Angle L1 Component 1812 4.5 -7.6 90° Bottom C8 (50V) 0603 -0.725 -8.425 — Bottom C5 0402 -0.125 -7.175 — Bottom TABLE E-2: VIA POSITIONS OF Figure 2-4 VIA 1 Thermal X Y Connected To — 4.1 -4.1 Top-Bottom 2 — 4.825 -4.1 Top-Bottom 3 Not Isolated -1.725 -5.975 Top-GND-Bottom 4 Not Isolated 1.7 -6.425 Top-Power-Bottom 5 — -2.9 -7.025 Top-Bottom 6 Isolated 1.65 -9.9 Top-GND-Bottom 7 Isolated 1.575 -9.7 Top-GND 8 Not Isolated 2.375 -10.175 Top-Power TABLE E-3: GROUND AND VCC PLANE POSITION OF Figure 2-4 GND Plane Coordinates X Y X Y A -2.475 -9.1 N -2.475 -9.125 B -2.475 C -1.25 -3.1 O -2.475 -6.875 -3.1 P 0.75 -6.875 D -1.25 -6.125 Q 0.75 -6.05 E -0.475 -6.9 R 2.475 -6.05 S 2.475 -9.125 F 0.85 -6.9 G 0.85 -5.975 H 1.05 -5.775 I 1.05 -3.1 J -2.475 -3.1 K 2.475 -9.1 VCC Plane Coordinates L -0.9 -9.075 T -0.9 -9.075 M 0.75 -10.725 U 0.75 -10.725 FIGURE E-3: TRACK DIMENSIONS OF Figure 2-4 Track Width 1 0.3 QFN.1 to Tab (GND) 2 0.4 QFN.1 to C10 (GND) 3 0.3 QFN.2 (SDIp) 4 0.2 QFN.3 (SDIn) 5 0.3 QFN.4 (GND) 6 0.2 QFN.5 (LFin) 7 0.2 QFN.6 (ampR) 8 0.2 QFN.7 (riseR) 9 0.3 10 11 Note 1: QFN.9 (GND) (1) 100Ω Diff. 0.3 QFN.10-11 (SDIp-SDIn) QFN.12 to V8/Tab (GND) Width and spaces between lines needs to be calculated based on PCB layer stack. Impedance should be 100Ω differential. 2012-2016 Microchip Technology Inc. DS60001302B-page 27 EQCO62R20.3/EQCO31R20.3 FIGURE E-3: Note 1: TRACK DIMENSIONS OF Figure 2-4 Track Width 12 0.4 QFN.12 to C9 (GND) 13 0.4 QFN.13 (VCC) 14 0.5 C9 to V9 (VCC) 15 0.5 QFN.16 16 0.4 C2 to DIN1.0/2.3 17 0.7 C10 to DIN1.0/2.3 18 0.3 R1 19 0.4 C1 to DIN1.0/2.3 20 0.4/0.7 FB 21 0.2 C7 22 0.5 Bottom Tracks Width and spaces between lines needs to be calculated based on PCB layer stack. Impedance should be 100Ω differential. TABLE E-4: COMPONENT POSITIONS OF Figure 2-5 Component Footprint X Y Angle DIN1.0/2.3 0 0 — EQCO62R20.3 QFN -0.075 -7.725 — C1 (50V) 0603 0.5 -2 90° C2 0402 -0.75 -2.4 90° R1 (16Ω) 0402 0.5 -4.05 90° NPF 4076 R2 (91Ω) 0402 -0.8 -4.05 90° C5 0402 -2.4 -4.925 — C9 0402 2.925 -9.1 90° C10 0402 2.225 -4.925 — TABLE E-5: Bottom Bottom VIA POSITIONS OF Figure 2-5 VIA Thermal X Y Connected To 1 Isolated -2.8 -5.625 Top-Power 2 Not Isolated -1.675 -5.65 Top-GND 3 Not Isolated 1.6 -5.65 Top-GND 4 Not Isolated 2.325 -6.225 Top-Power 5 Isolated 2.675 -8 Top-Power 6 Isolated -1.65 -9.5 Top-GND 7 Isolated 1.55 -9.5 Top-GND DS60001302B-page 28 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 TABLE E-6: GROUND PLANE POSITION OF Figure 2-5 GND Plane Coordinates X Y a -1.725 3.75 b -1.725 -3 c -2.25 -3 d -2.25 -5.2 p 1.75 -5.575 e -0.425 -7 q 2.85 -5.575 f 0.225 -7 r 2.85 -10.075 g 1.65 -5.575 h 1.65 -3 i 2.85 -3 j 2.85 -10.075 k -0.9 -8.8 s -0.9 -8.8 l 0.75 -10.45 t 0.75 -10.45 FIGURE E-4: VCC Plane Coordinates X Y -2.3 -3.475 n -2.3 -6.65 o 1.75 -6.65 m TRACK WIDTHS OF Figure 2-5 Track Width 1 0.3 QFN.1; QFN.4 (GND) 2 0.3 QFN.2 (SDIp) 3 0.3 QFN.3 (SDIn) 4 0.2 QFN.5 (LFin) 5 0.2 QFN.6 (ampR) 6 0.2 QFN.7 (riseR) 7 0.3 QFN.9; QFN.12 (GND) 8 100Ω Diff.(1) QFN.10-11 (SDIp-SDIn) 9 0.5 QFN.13; QFN.16 (VCC) 10 0.5 C9; C10; C5 0.4 C1; C2 11 Note 1: Width and spaces between lines need to be calculated based on PCB layer stack. Impedance should be 100Ω differential. FIGURE E-5: USED LAYER STACK 2012-2016 Microchip Technology Inc. DS60001302B-page 29 EQCO62R20.3/EQCO31R20.3 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. DS60001302B-page 30 2012-2016 Microchip Technology Inc. EQCO62R20.3/EQCO31R20.3 PRODUCT IDENTIFICATION SYSTEM To order parts, including industrial, or obtain information, for e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. I RM Device Temp. Range Radio Module XXX Firmware F Revision Number Examples: a) b) Device: EQCO62R20.3 Temperature Range: I Package: EQCO62R20.3 = Industrial temperature, 16-Lead QFN Tube packaging EQCO62R20.3-TRAY = Industrial temperature, 16-Lead QFN Tray packaging = -40C to +85C (Industrial temperature) TRAY = Tray (Blank) = Tube 2012-2016 Microchip Technology Inc. DS60001302B-page 31 EQCO62R20.3/EQCO31R20.3 NOTES: DS60001302B-page 32 2012-2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2012-2016 Microchip Technology Inc. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2012-2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 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