Data Sheet

TFA9890
9.5 V boosted audio system with adaptive sound maximizer
and speaker protection
Rev. 01 — 17 May 2013
Preliminary short data sheet
1. General description
The TFA9890 is a high efficiency class-D audio amplifier with a sophisticated speaker
boost and protection algorithm. It can deliver 7.2 W peak output power into an 8 
speaker at a supply voltage of 3.6 V. The internal boost converter raises the supply
voltage to 9.5 V, providing ample headroom for major improvements in sound quality.
A safe working environment is provided for the speaker under all operating conditions.
The TFA9890 maximizes acoustic output while ensuring diaphragm displacement and
voice coil temperature do not exceed their rated limits. This function is based on a
speaker box model that operates in all loudspeaker environments (e.g. free air, closed box
or vented box). Furthermore, advanced signal processing ensures the quality of the audio
signal is never degraded by unwanted clipping or distortion in the amplifier or speaker.
Unlike competing solutions, the adaptive sound maximizer algorithm uses feedback to
accurately calculate both the temperature and the excursion, allowing the TFA9890 to
adapt to changes in the acoustic environment.
Internal intelligent DC-to-DC conversion boosts the supply rail to provide additional
headroom and power output. The supply voltage is only raised when necessary. This
maximizes the output power of the class-D audio amplifier while limiting quiescent power
consumption.
The TFA9890 also incorporates advanced battery protection. By limiting the supply
current when the battery voltage is low, it prevents the audio system from drawing
excessive load currents from the battery, which could cause a system undervoltage. The
advanced processor minimizes the impact of a falling battery voltage on the audio quality
by preventing distortion as the battery discharges.
The device features low RF susceptibility because it has a digital input interface that is
insensitive to clock jitter. The second order closed loop architecture used in a class-D
audio amplifier provides excellent audio performance and high supply voltage ripple
rejection. The audio input interface is I2S and the control settings are communicated via
an I2C-bus interface.
The device also provides the speaker with robust protection against ESD damage. In a
typical application, no additional components are needed to withstand a 15 kV discharge
on the speaker.
The TFA9890 is available in a 49-bump WLCSP (Wafer Level Chip-Size Package) with a
400 m pitch.
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
2. Features and benefits
 Sophisticated speaker-boost and protection algorithm that maximizes speaker
performance while protecting the speaker:
 Fully embedded software, no additional license fee or porting required
 Total integrated solution that includes DSP, amplifier, DC-to-DC, sensing and more
 Adaptive excursion control - guarantees that the speaker membrane excursion never
exceeds its rated limit
 Real-time temperature protection - direct measurement ensures that voice coil
temperature never exceeds its rated limit
 Environmentally aware - automatically adapts speaker parameters to acoustic and
thermal changes including compensation for speaker-box leakage
 Output power: 3.6 W (RMS) into 8  at 3.6 V supply voltage (THD = 1 %)
 Clip avoidance - DSP algorithm prevents clipping even with sagging supply voltage
 Bandwidth extension option to increase low frequency response
 Compatible with standard Acoustic Echo Cancellers (AECs)
 High efficiency and low power dissipation
 Wide supply voltage range (fully operational from 3 V to 5.5 V)
 Two I2S inputs to support two audio sources
 I2C-bus control interface (400 kHz)
 Dedicated speech mode with speech activity detector
 Speaker current and voltage monitoring (via the I2S-bus) for Acoustic Echo
Cancellation (AEC) at the host
 Fully short-circuit proof across the load and to the supply lines
 Sample frequencies from 8 kHz to 48 kHz supported
 3 bit clock/word select ratios supported (32x, 48x, 64x)
 Option to route I2S input direct to I2S output to allow a second I2S output slave device
to be used in combination with the TFA9890
 TDM interface supported (with limited functionality)
 Volume control
 Low RF susceptibility
 Input clock jitter insensitive interface
 Thermally protected
 15 kV system-level ESD protection without external components
 ‘Pop noise' free at all mode transitions
3. Applications






TFA9890_SDS
Preliminary short data sheet
Mobile phones
Tablets
Portable Navigation Devices (PND)
Notebooks/Netbooks
MP3 players and portable media players
Small audio systems
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
2 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBAT
battery supply voltage
on pin VBAT
3
-
5.5
V
VDDD
digital supply voltage
on pin VDDD
1.65
1.8
1.95
V
IBAT
battery supply current
on pin VBAT and in DC-to-DC converter coil;
Operating modes with load; DC-to-DC
converter in Adaptive Boost mode (no output
signal, VBAT = 3.6 V, VDDD = 1.8 V)
-
4
-
mA
Power-down mode
-
1
-
A
IDDD
digital supply current
on pin VDDD; Operating modes;
SpeakerBoost Protection activated
-
20
-
mA
on pin VDDD; Operating modes; CoolFlux
DSP bypassed
-
6
-
mA
on pin VDDD; Power-down mode;
BCK1 = WS1 = DATAI1 = BCK2 = WS2 =
DATAI2 = DATAI3 = 0 V
-
10
-
A
RL = 8 ; fs = 48 kHz
-
3.6
-
W
RL = 8 ; fs = 32 kHz
-
3.7
-
W
RMS output power
Po(RMS)
THD+N = 1 %; CLIP = 0
5. Ordering information
Table 2.
Ordering information
Type number
TFA9890UK
Package
Name
Description
Version
WLCSP49
wafer level chip-size package; 49 bumps
TFA9890UK
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
3 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
6. Block diagram
VDDD
ADS1
ADS2
VBAT
INB
G3
F2
F3
G2
E6, F6, G6
TFA9890
SCL G1
SDA F1
ADAPTIVE
DC-to-DC
CONVERTER
RAM/ROM
MEMORY
I2C
INTERFACE
DATAI3 B3
E7, F7, G7
BST
E5, F5, G5
GNDB
A7, B7, C7
VDDP
C6
OUTA
A6
OUTB
B5, B6
GNDP
A5, B2, C2,
C5, D2, D5,
E2, F4, G4
GNDD
REGISTERS
DATAI1 A2
WS1 A1
I2S
INPUT
INTERFACE
(x2)
BCK1 B1
DATAI2 C1
M
U
X
SPEAKER PROTECTION
ALGORITHM AND
VOLUME CONTOL
(CoolFlux DSP)
PWM
CLASS-D
AUDIO
AMPLIFIER
WS2 D1
BCK2 E1
ISEL
DATAO A3
I2S
OUTPUT
INTERFACE
M
U
X
current sensing
CURRENTSENSING
PROCESSOR
ADC
I2SDOC
TEMP SENSE
RST B4
PROTECTION:
OTP
OVP
UVP
OCP
IDP
PLL
VBAT SENSE
Fig 1.
A4
E3
D3
C3
C4
D4
E4
INT
TEST2
TEST3
TEST4
TEST5
TEST6
TEST7
010aaa816
Block diagram
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
4 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
7. Pinning information
7.1 Pinning
1
2
3
4
5
6
bump A1
index area
7
G
2
3
4
5
6
7
A
F
B
E
C
D
D
C
E
B
F
A
G
bump A1
index area
010aaa782
010aaa783
a. Bottom view
Fig 2.
1
b. Transparent top view
Bump configuration
1
2
3
4
5
6
7
A
WS1
DATAI1
DATAO
INT
GNDD
OUTB
VDDP
B
BCK1
GNDD
DATAI3
RST
GNDP
GNDP
VDDP
C
DATAI2
GNDD
TEST4
TEST5
GNDD
OUTA
VDDP
D
WS2
GNDD
TEST3
TEST6
GNDD
n.c.
n.c.
E
BCK2
GNDD
TEST2
TEST7
GNDB
INB
BST
F
SDA
ADS1
ADS2
GNDD
GNDB
INB
BST
G
SCL
VBAT
VDDD
GNDD
GNDB
INB
BST
010aaa807
Transparent top view
Fig 3.
TFA9890_SDS
Preliminary short data sheet
Bump mapping
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
5 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
Table 3.
Pinning
Symbol
Pin
Type
Description
WS1
A1
I
digital audio word select input 1
DATAI1
A2
I
digital audio data input 1
DATAO
A3
O
digital audio data output
INT
A4
O
interrupt output
GNDD
A5
P
digital ground
OUTB
A6
O
inverting output
VDDP
A7
P
power supply voltage
BCK1
B1
I
digital audio bit clock input 1
GNDD
B2
P
digital ground
DATAI3
B3
I
digital audio data input 3
RST
B4
I
reset input
GNDP
B5
P
power ground
GNDP
B6
P
power ground
VDDP
B7
P
power supply voltage
DATAI2
C1
I
digital audio data input 2
GNDD
C2
P
digital ground
TEST4
C3
O
test signal input 4; for test purposes only, connect to PCB ground
TEST5
C4
O
test signal input 5; for test purposes only, connect to PCB ground
GNDD
C5
P
digital ground
OUTA
C6
O
non-inverting output
VDDP
C7
P
power supply voltage
WS2
D1
I
digital audio word select input 2
GNDD
D2
P
digital ground
TEST3
D3
O
test signal input 3; for test purposes only, connect to PCB ground
TEST6
D4
O
test signal input 6; for test purposes only, connect to PCB ground
GNDD
D5
P
digital ground
n.c.
D6
-
not connected[1]
n.c.
D7
-
not connected[1]
BCK2
E1
I
digital audio bit clock input 2
GNDD
E2
P
digital ground
TEST2
E3
O
test signal input 2; for test purposes only, connect to PCB ground
TEST7
E4
O
test signal input 7; for test purposes only, connect to PCB ground
GNDB
E5
P
boosted ground
INB
E6
P
DC-to-DC boost converter input
BST
E7
O
boosted supply voltage output
SDA
F1
I/O
I2C-bus data input/output
ADS1
F2
I
address select input 1
ADS2
F3
I
address select input 2
GNDD
F4
P
digital ground
GNDB
F5
P
boosted ground
INB
F6
P
DC-to-DC boost converter input
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
6 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
Table 3.
Pinning …continued
Symbol
Pin
Type
Description
BST
F7
O
boosted supply voltage output
SCL
G1
I
I2C-bus clock input
VBAT
G2
P
battery supply voltage sense input
VDDD
G3
P
digital supply voltage
GNDD
G4
P
digital ground
GNDB
G5
P
boosted ground
INB
G6
P
DC-to-DC boost converter input
BST
G7
O
boosted supply voltage output
[1]
TFA9890_SDS
Preliminary short data sheet
Can be used to simplify routing to OUTA (see Figure 3).
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
7 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
8. Functional description
The TFA9890 is a highly efficient mono Bridge Tied Load (BTL) class-D audio amplifier
with a sophisticated SpeakerBoost protection algorithm. Figure 1 is a block diagram of the
TFA9890.
It contains three I2S input interfaces and one I2S output interface. One of I2S inputs
DATAI1 and DATAI2 can be selected as the audio input stream. The third I2S input,
DATAI3, is provided to support stereo applications. A ‘pass-through’ option allows one of
the I2S input interfaces to be connected directly to the I2S output. The pass-through option
is provided to allow an I2S output slave device (e.g. a CODEC), connected in parallel with
the TFA9890, to be routed directly to the audio host via the I2S output.
The I2S output signal on DATAO can be configured to transmit the DSP output signal,
amplifier output current information, DATAI3 Left or Right signal information or amplifier
gain information. The gain information can be used to facilitate communication between
two devices in stereo applications.
A SpeakerBoost protection algorithm, running on a CoolFlux Digital Signal Processor
(DSP) core, maximizes the acoustical output of the speaker while limiting membrane
excursion and voice coil temperature to a safe level. The mechanical protection
implemented guarantees that speaker membrane excursion never exceeds its rated limit,
to an accuracy of 10 %. Thermal protection guarantees that the voice coil temperature
never exceeds its rated limit, to an accuracy of 10 C. Furthermore, advanced signal
processing ensures the audio quality remains acceptable at all times.
The protection algorithm implements an adaptive loudspeaker model that is used to
predict the extent of membrane excursion. The model is continuously updated to ensure
that the protection scheme remains effective even when speaker parameter values
change or the acoustic enclosure is modified.
Output sound pressure levels are boosted within given mechanical, thermal and quality
limits. An optional Bandwidth extension mode extends the low frequency response up to a
predefined limit before maximizing the output level. This mode is suitable for listening to
high quality music in quiet environments.
The frequency response of the TFA9890 can be modified via ten fully programmable
cascaded second-order biquad filters. The first two biquads are processed with 48-bit
double precision; biquads 3 to 8 are processed with 24-bit single precision.
At low battery voltage levels, the gain is automatically reduced to limit battery current. The
output volume can be controlled by the SpeakerBoost protection algorithm or by the host
application (external). In the latter case, the boost features of the SpeakerBoost protection
algorithm must be disabled to avoid neutralizing external volume control.
The SpeakerBoost protection algorithm output is converted into two pulse width
modulated (PWM) signals which are then injected into the class-D audio amplifier. The
3-level PWM scheme supports filterless speaker drive.
An adaptive DC-to-DC converter boosts the battery supply voltage in line with the output
of the SpeakerBoost protection algorithm. It switches to Follower mode (VBST = VBAT; no
boost) when the audio output voltage is lower than the battery voltage.
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
8 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
9. Internal circuitry
Table 4.
Pin
Internal circuitry
Symbol
Equivalent circuit
C1, C4, D1, DATAI2, TEST5, WS2,
D3, E1, F2, TEST3, BCK2, ADS1,
F3
ADS2
C1, C4, D1,
D3, E1, F2,
F3
ESD
GNDD (E4)
010aaa788
A1, A2, A4,
B1, B3, E3,
G1
WS1, DATAI1, INT,
BCK1, DATAI3,
TEST2, SCL,
VDDP (B6)
ESD
A1, A2, A4,
B1, B3, E3,
G1
ESD
ESD
GNDP (B7)
GNDD (E4)
010aaa789
C3
TEST4
VDDD (E3)
ESD
C3
ESD
GNDD (E4)
010aaa790
F1
SDA
F1
ESD
GNDD (E4)
010aaa791
A3
DATAO
VDDD (E3)
A3
ESD
GNDD (E4)
GNDP (B7)
010aaa792
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
9 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
Table 4.
Internal circuitry
Pin
Symbol
A6, C6
OUTB, OUTA
Equivalent circuit
VDDP (B6)
A6, C6
GNDP (B7)
010aaa787
E6, F6, G6
i.c.
SENSE (E6)
E6, F6, G6
GNDB (D7)
010aaa793
A5, B2, B5,
B6, C2, C5,
D2, D5, E2,
E5, F4, F5,
G4, G5
GNDP, GNDB, GNDD
GNDD (A5, B2, C2, D2, D5, E2, F4, G4)
GNDP (B5, B6, C5)
GNDB (E5, F5, G5)
010aaa794
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
10 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
10. I2C-bus interface and register settings
The TFA9890 supports the 400 kHz I2C-bus microcontroller interface mode standard. The
I2C-bus is used to control the TFA9890 and to transmit and receive data. The TFA9890
can only operate in I2C slave mode, as a slave receiver or as a slave transmitter.
10.1 TFA9890 addressing
The TFA9890 is accessed via an 8-bit code (see Table 5). Bits 1 to 7 contain the device
address. Bit 0 (R/W) indicates whether a read (1) or a write (0) operation has been
requested. Four separate addresses are supported for stereo applications. Address
selection is via pins ADS1 and ADS2. The levels on pins ADS1 and ADS2 determine the
values of bits 1 and 2, respectively, of the device address, as detailed in Table 5. The
generic address is independent of pins ADS1 and ADS2.
Table 5.
Address selection via pins ADS1 and ADS2
ADS2 pin
voltage (V)
ADS1 pin
voltage (V)
Address
Function
0
0
01101000
for write mode
01101001
for read mode
01101010
for write mode
0
VDDD
VDDD
0
01101011
for read mode
01101100
for write mode
01101101
for read mode
for write mode
VDDD
VDDD
01101110
01101111
for read mode
don’t care
don’t care
00011100 (generic address)
for write mode
don’t care
don’t care
00011101 (generic address)
for read mode
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
11 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
11. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VBAT
battery supply voltage
on pin VBAT
0.3
+5.5
V
VBST
voltage on pin BST
0.3
+12
V
VDDP
power supply voltage
on pin VDDP
0.3
+12
V
VDDD
digital supply voltage
on pin VDDD
0.3
+1.95
V
Tj
junction temperature
-
+150
C
Tstg
storage temperature
55
+150
C
Tamb
ambient temperature
40
+85
C
VESD
electrostatic discharge voltage
according to Human Body Model (HBM)
2
+2
kV
according to Charge Device Model (CDM)
500
+500
V
12. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Rth(j-a)
thermal resistance from junction to ambient
in free air; natural convection
-
4-layer application board
40
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
Unit
K/W
© NXP B.V. 2013. All rights reserved.
12 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
13. Characteristics
13.1 DC Characteristics
Table 8.
DC characteristics
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 9.5 V, adaptive boost mode; LBST = 1 H[1];
RL = 8 [1]; LL = 40 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBAT
battery supply voltage
on pin VBAT
3
-
5.5
V
IBAT
battery supply current
on pin VBAT and in DC-to-DC converter
coil; Operating modes with load;
DC-to-DC converter in Adaptive Boost
mode (no output signal, VBAT = 3.6 V,
VDDD = 1.8 V)
-
4
-
mA
Power-down mode
-
1
5
A
VDDP
power supply voltage
on pin VDDP
3
-
9.5
V
VDDD
digital supply voltage
on pin VDDD
1.65
1.8
1.95
V
IDDD
digital supply current
on pin VDDD; Operating modes;
SpeakerBoost Protection activated
-
20
-
mA
on pin VDDD; Operating modes;
CoolFlux DSP bypassed
-
6
-
mA
on pin VDDD; Power-down mode;
BCK1 = WS1 = DATAI1 = BCK2 =
WS2 = DATAI2 = DATAI3 = 0 V
-
10
-
A
0.7VDDD -
3.6
V
-
-
0.3VDDD
V
Pins BCK1, WS1, DATA1, BCK2, WS2, DATAI2, DATAI3, ADS1, ADS2, SCL, SDA
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
Cin
input capacitance
ILI
input leakage current
[2]
-
-
3
pF
1.8 V on input pin
-
-
0.1
A
Pins DATAO, INT, push-pull output stages
VOH
HIGH-level output voltage
IOH = 4 mA
-
-
VDDD 
0.4
V
VOL
LOW-level output voltage
IOL = 4 mA
-
-
400
mV
Pins SDA, open drain outputs, external 10 k resistor to VDDD
VOH
HIGH-level output voltage
IOH = 4 mA
-
-
VDDD 
0.4
V
VOL
LOW-level output voltage
IOL = 4 mA
-
-
400
mV
VDDP = 5.3 V
-
200
-
m
Pins OUTA, OUTB
RDSon
drain-source on-state
resistance
Protection
Tact(th_prot)
thermal protection activation
temperature
130
-
150
C
Vovp(VBAT)
overvoltage protection voltage
on pin VBAT
5.5
-
6.0
V
Vuvp(VBAT)
undervoltage protection
voltage on pin VBAT
2.3
-
2.5
V
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
13 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
Table 8.
DC characteristics …continued
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 9.5 V, adaptive boost mode; LBST = 1 H[1];
RL = 8 [1]; LL = 40 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
IO(ocp)
overcurrent protection output
current
Conditions
Min
Typ
Max
Unit
2
-
-
A
9.4
9.5
9.6
V
DC-to-DC converter
VBST
voltage on pin BST
DCVO = 111; Boost mode
[1]
LBST = boost converter inductance; RL = load resistance; LL = load inductance (speaker).
[2]
This parameter is not tested during production; the value is guaranteed by design and checked during product validation.
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
14 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
13.2 AC characteristics
Table 9.
AC characteristics
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 9.5 V, adaptive boost mode; LBST = 1 H[1];
RL = 8 [1]; LL = 40 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
RL = 8 ; fs = 48 kHz
-
3.6
-
W
RL = 8 ; fs = 32 kHz
-
3.7
-
W
RL = 8 ; fs = 48 kHz
-
4.5
-
W
RL = 8 ; fs = 32 kHz
-
4.6
-
W
-
-
3
mV
[2]
-
72
-
%
[1]
-
0.03
0.1
%
-
50
-
V
-
66
-
V
-
100
-
dB
-
97
-
dB
-
75
-
dB
256
-
384
kHz
-
-
2
ms
fs = 8 kHz
-
-
27
ms
fs = 48 kHz
-
-
6
ms
Amplifier output power
Po(RMS)
RMS output power
THD+N = 1 %; CLIP = 0
THD+N = 10 %; CLIP = 0
Amplifier output; pins OUTA and OUTB
VO(offset)
output offset voltage
absolute value
Amplifier performance
po
output power efficiency
THD+N
total harmonic distortion-plus-noise Po(RMS) = 100 mW; RL = 8 ; LL = 44 H
Vn(o)
output noise voltage
Po(RMS) = 2.5 W; including DC-to-DC
converter; 100 Hz audio signal
A-weighted; DATAI1 = DATAI2 = 0 V
CoolFlux DSP bypassed
[2]
CoolFlux DSP enabled
S/N
signal-to-noise ratio
VO = 4.5 V (peak); A-weighted
CoolFlux DSP bypassed
[2]
CoolFlux DSP enabled
PSRR
fsw
power supply rejection ratio
switching frequency
Vripple = 200 mV (RMS); fripple = 217 Hz
directly coupled to the
frequency
I2S
input
Amplifier power-up, power-down and propagation delays
td(on)
turn-on delay time
PLL locked on BCK (IPLL = 0)
fs = 8 kHz to 48 kHz
PLL locked on WS (IPLL = 1)
td(off)
turn-off delay time
-
-
10
s
td(mute_off)
mute off delay time
-
1
-
ms
td(soft_mute)
soft mute delay time
-
1
-
ms
tPD
propagation delay
CoolFlux bypassed
fs = 8 kHz
-
-
3.2
ms
fs = 48 kHz
-
-
600
s
SpeakerBoost protection mode,
tLookAhead = 2 ms
TFA9890_SDS
Preliminary short data sheet
fs = 8 kHz
-
-
14
ms
fs = 48 kHz
-
-
4
ms
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
15 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
Table 9.
AC characteristics
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 9.5 V, adaptive boost mode; LBST = 1 H[1];
RL = 8 [1]; LL = 40 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Current-sensing performance
S/N
signal-to-noise ratio
IO = 1.2 A (peak); A-weighted
-
75
-
dB
Isense(acc)
sense current accuracy
IO = 0.5 A (peak)
3
-
+3
%
-
8
-
kHz
20
-
-
H
B
bandwidth
LL
load inductance
[2]
[1]
LBST = boost converter inductor; RL = load resistance; LL = load inductance (speaker).
[2]
This parameter is not tested during production; the value is guaranteed by design and checked during product validation.
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
16 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
13.3 I2S timing characteristics
Table 10. I2S bus interface characteristics; see Figure 4
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 9.5 V, adaptive boost mode; LBST = 1 H[1];
RL = 8 [1]; LL = 40 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fs
sampling frequency
on pin WS
[2]
8
-
48
kHz
fclk
clock frequency
on pin BCK
[2]
32fs
-
64fs
Hz
WS edge to BCK HIGH
[3]
10
-
-
ns
10
-
-
ns
10
-
-
ns
10
-
-
ns
set-up time
tsu
DATA edge to BCK HIGH
hold time
th
[3]
BCK HIGH to WS edge
BCK HIGH to DATA edge
[1]
LBST = boost converter inductance; RL = load resistance; LL = load inductance.
[2]
The I2S bit clock input (BCK) is used as a clock input for the DSP, as well as for the amplifier and the DC-to-DC converter. Note that both
the BCK and WS signals must be present for the clock to operate correctly.
[3]
This parameter is not tested during production; the value is guaranteed by design and checked during product validation.
BCK
th
tsu
WS
DATA
010aaa750
Fig 4.
TFA9890_SDS
Preliminary short data sheet
I2S timing
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
17 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
13.4 I2C timing characteristics
Table 11. I2C-bus interface characteristics; see Figure 5
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 9.5 V, adaptive boost mode; LBST = 1 H[1];
RL = 8 [1]; LL = 40 H[1]; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fSCL
SCL clock frequency
-
-
400
kHz
tLOW
LOW period of the SCL clock
1.3
-
-
s
tHIGH
HIGH period of the SCL clock
rise time
tr
0.6
-
-
s
SDA and SCL signals
[2]
20 + 0.1 Cb
-
-
ns
SDA and SCL signals
[2]
20 + 0.1 Cb
-
-
ns
[3]
0.6
-
-
s
tf
fall time
tHD;STA
hold time (repeated) START
condition
tSU;STA
set-up time for a repeated START
condition
0.6
-
-
s
tSU;STO
set-up time for STOP condition
0.6
-
-
s
tBUF
bus free time between a STOP and
START condition
1.3
-
-
s
tSU;DAT
data set-up time
100
-
-
ns
tHD;DAT
data hold time
0
-
-
s
0
-
50
ns
-
-
400
pF
tSP
pulse width of spikes that must be
suppressed by the input filter
Cb
capacitive load for each bus line
[4]
[1]
LBST = boost converter inductance; RL = load resistance; LL = load inductance.
[2]
Cb is the total capacitance of one bus line in pF. The maximum capacitive load for each bus line is 400 pF.
[3]
After this period, the first clock pulse is generated.
[4]
To be suppressed by the input filter.
SDA
tLOW
tBUF
tr
tf
tHD;STA
tSP
SCL
tHD;STA
P
tHD;DAT
tHIGH
tSU;DAT
S
tSU;STA
Sr
tSU;STO
P
010aaa225
Fig 5.
TFA9890_SDS
Preliminary short data sheet
I2C timing
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
18 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
14. Application information
14.1 Application diagrams
battery
LBST
1.8 V
1 μH
CBST
DATAO
RST
INT
DATAI2
WS2
BCK2
DATAI3
E6, F6, G6
BST
INB
A2
D6
A1
B1
D7
TFA9890
C6
A3
n.c.
n.c.
OUTA
B4
A6
A4
C1
D1
E1
B3
ADS1
F2
F3
E5
F5 B5
G5 B6
A5
B2
C2
C5
D2
D5
E2
F4
G4
OUTB
speaker
E4
D4
C4
E3
D3
TEST7
TEST6
TEST5
C3
TEST4
BCK1
E7, F7, G7
TEST3
I2S
A7
B7
C7
TEST2
WS1
20 μF
G1
GNDD
DATAI1
G2
GNDP
SCL
G3
F1
GNDB
I2C
100 nF
ADS2
SDA
VBAT
VDDD
100 nF
BASEBAND
PROCESSOR
10 μF
CVDDP
VDDP
CVBAT
CVDDD
010aaa817
Fig 6.
TFA9890_SDS
Preliminary short data sheet
Typical mono application (simplified)
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
19 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
LBST
1.8 V
1 μH
battery
CBST
BASEBAND
PROCESSOR
WS1
BCK1
DATAO
RST
INT
DATAI2
WS2
BCK2
G1
E6, F6, G6
BST
INB
A2
D6
A1
B1
D7
TFA9890
C6
A3
n.c.
n.c.
OUTA
B4
A6
A4
D1
E1
DATAI3
E5
F5 B5
G5 B6
B3
GNDB
F3
ADS2
ADS1
F2
speaker
A5
B2
C2
C5
D2
D5
E2
F4
G4
C1
OUTB
E4
D4
C4
E3
D3
TEST7
TEST6
TEST5
C3
TEST4
I2S
E7, F7, G7
TEST3
DATAI1
TEST2
SCL
10 μF
20 μF
A7
B7
C7
GNDD
I2C
G2
G3
F1
GNDP
SDA
100 nF
CVDDP
VDDP
100 nF
CVBAT
VBAT
VDDD
CVDDD
LBST
1.8 V
1 μH
battery
CBST
INT
DATAI2
WS2
BCK2
DATAI3
BST
INB
B1
D7
TFA9890
C6
A3
n.c.
n.c.
OUTA
B4
A6
A4
C1
D1
E1
B3
1.8 V
ADS1
F2
F3
E5
F5 B5
G5 B6
A5
B2
C2
C5
D2
D5
E2
F4
G4
OUTB
speaker
E4
D4
C4
E3
D3
TEST7
TEST6
TEST5
C3
TEST4
RST
D6
A1
TEST3
DATAO
E7, F7, G7
E6, F6, G6
TEST2
BCK1
A7
B7
C7
A2
GNDD
WS1
10 μF
20 μF
G1
GNDP
DATAI1
GNDB
SCL
G2
G3
F1
ADS2
SDA
100 nF
CVDDP
VDDP
100 nF
CVBAT
VBAT
VDDD
CVDDD
010aaa818
Fig 7.
Typical stereo application (simplified)
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
20 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
battery
LBST
1.8 V
INT
DATAI2
WS2
BCK2
DATAI3
E6, F6, G6
BST
INB
A2
D6
A1
B1
D7
TFA9890
C6
A3
n.c.
n.c.
OUTA
B4
A6
A4
C1
D1
E1
B3
ADS1
F2
F3
E5
F5 B5
G5 B6
A5
B2
C2
C5
D2
D5
E2
F4
G4
OUTB
speaker
E4
D4
C4
E3
D3
TEST7
TEST6
TEST5
C3
TEST4
RST
E7, F7, G7
TEST3
DATAO
A7
B7
C7
TEST2
data i/p
20 μF
G1
GNDD
BCK1
bit clk.
G2
GNDP
I2S
WS1
G3
F1
GNDB
word sel.
DATAI1
100 nF
ADS2
data o/p
SCL
VBAT
100 nF
SDA
I2C
VDDD
AUDIO
SOURCE 1
(I2S master)
CBST
10 μF
CVDDP
VDDP
CVBAT
CVDDD
1 μH
SECOND I2S SLAVE
DEVICE (CODEC)
data output
AUDIO
SOURCE 2
2
(I S master)
data o/p
word sel.
I2S
bit clk.
data input 1
word select 1
data input 2
word select 2
bit clock 2
data i/p
010aaa819
Fig 8.
Typical mono application with two audio sources and a second I2S slave device
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
21 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
14.2 Curves measured in reference design (demonstration board)
All measurements were taken with VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V;
LBST = 1 H; RL = 4 ; LL = 20 H; fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; CoolFlux DSP bypassed;
default settings, unless otherwise specified.
010aaa825
102
THD+N
(%)
010aaa826
1
THD+N
(%)
10
(1)
(2)
(3)
1
(1)
(2)
10-1
10-1
10-2
10-3
10-2
10-1
10-2
1
Po (W)
10
102
10
RL = 8 , VBAT = 3.6 V
103
104
fi (Hz)
105
RL = 8 , VBAT = 3.6 V
(1) fi = 6 kHz.
(1) Po = 100 mW
(2) fi = 1 kHz.
(2) Po = 500 mW
(3) fi = 100 Hz.
Fig 9.
THD plus noise as a function of output power
010aaa831
12
VBST
(V)
4
010aaa830
12
IBAT
(A)
8
Fig 10. THD plus noise as a function of frequency
VBST
(V)
4
IBAT
(V)
3.16
8
2.32
4
0
1.48
0
1.3
-4
0.64
-4
0.4
4
-8
-0.01
VBST
IBAT
-0.004
0.002
0.008
0.014
t (s)
-0.2
0.02
a. fast ramp-up
-8
-0.01
3.1
2.2
VBST
IBAT
-0.004
0.002
0.008
0.014
t (s)
-0.5
0.02
b. immediate ramp-up
Fig 11. DC-to-DC converter ramp-up behavior
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
22 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
010aaa827
1.4
G
(dB)
010aaa828
7
Po
(W)
5.6
0.7
4.2
(4)
(3)
(1)
(2)
0
2.8
-0.7
1.4
-1.4
10
102
103
104
fi (Hz)
0
105
2
RL = 8 , VBAT = 3.6 V, Po = 500 mW
2.8
3.6
4.4
5.2
VBAT (V)
6
RL = 8 , fi = 1 kHz
(1) THD+N = 10 %, no boost (Follower mode)
(2) THD+N = 1 %, no boost (Follower mode)
(3) THD+N = 10 %, boost on
(4) THD+N = 1 %, boost on
Fig 12. Normalized gain as a function of frequency
Fig 13. Output power as a function of battery supply
voltage
010aaa832
-10
PSRR
(dB)
-30
-50
-70
-90
-110
102
10
103
104
fripple (Hz)
105
RL = 8 , VBAT = 3.6 V, Vripple = 200 V(RMS) on VBAT
Fig 14. PSRR as a function of ripple frequency
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
23 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
15. Package outline
:/&63ZDIHUOHYHOFKLSVL]HSDFNDJH
EXPSV[PP
7)$
^
Q$
#
$
]
$
Q
Z#
_
_\
^
[
j
`
#
^
Z$
$
#
*
'
=
Z$
Q$
"
Z#
;
]
*
>[email protected]
!"
$
#
Q
!## !*& !#& *!' *!
!# !*" !#" *!*; #!<;
!$& !*' !#' *!*' #!<'
$
#
\
[
!'
#!'
!;#= !*= !*= !*#=
#!' !$= !' !# !"<= !#;= !#;= !#<=
!""= !#'= !#'= !#"=
Z$
Z#
Z$
Z#
ZOFVSBWIDBSR
$*q*q;
$*q=q$;
`<&<
Fig 15. Package outline TFA9890 (WLCSP49)
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
24 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
16. Soldering of WLCSP packages
16.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
16.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
16.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 16) than a PbSn process, thus
reducing the process window
• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 12.
Table 12.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 16.
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
25 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 16. Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
16.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
16.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
16.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
26 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
16.3.4 Cleaning
Cleaning can be done after reflow soldering.
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
27 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
17. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TFA9890_SDS v.1
20130517
Preliminary data sheet
-
-
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
28 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TFA9890_SDS
Preliminary short data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
29 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TFA9890_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 17 May 2013
© NXP B.V. 2013. All rights reserved.
30 of 31
TFA9890
NXP Semiconductors
9.5 V boosted audio system with adaptive sound maximizer and
speaker protection
20. Contents
1
2
3
4
5
6
7
7.1
8
9
10
10.1
11
12
13
13.1
13.2
13.3
13.4
14
14.1
14.2
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 8
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 9
I2C-bus interface and register settings . . . . . 11
TFA9890 addressing . . . . . . . . . . . . . . . . . . . 11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Thermal characteristics . . . . . . . . . . . . . . . . . 12
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13
DC Characteristics . . . . . . . . . . . . . . . . . . . . . 13
AC characteristics. . . . . . . . . . . . . . . . . . . . . . 15
I2S timing characteristics . . . . . . . . . . . . . . . . 17
I2C timing characteristics . . . . . . . . . . . . . . . . 18
Application information. . . . . . . . . . . . . . . . . . 19
Application diagrams . . . . . . . . . . . . . . . . . . . 19
Curves measured in reference design
(demonstration board) . . . . . . . . . . . . . . . . . . 22
15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 24
16
Soldering of WLCSP packages. . . . . . . . . . . . 25
16.1
Introduction to soldering WLCSP packages . . 25
16.2
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 25
16.3
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 25
16.3.1
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
16.3.2
Quality of solder joint . . . . . . . . . . . . . . . . . . . 26
16.3.3
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
16.3.4
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 28
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 29
18.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 29
18.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
18.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
18.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 30
19
Contact information. . . . . . . . . . . . . . . . . . . . . 30
20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 17 May 2013
Document identifier: TFA9890_SDS
Similar pages